Miniature probe and monitoring equipment

Abstract

The utility model discloses a miniature probe and monitoring equipment. The miniature probe comprises a first housing, a first sensor, a PCB substrate and a first sealant. The first housing defines an accommodating cavity and a first opening communicated with the accommodating cavity. The first sensor is arranged in the containing cavity, the first sensor is provided with a first surface and a second surface which are opposite, the first surface comprises a pressure measuring area, and at least the pressure measuring area is arranged corresponding to the first opening; the PCB substrate is arranged in the accommodating cavity in a penetrating manner and is in communication connection with the first sensor; the first sealant is filled in the accommodating cavity and at least seals the first opening; the miniature probe further comprises a waterproof film layer, and the waterproof film layer at least covers the surface of the first sealant at the first opening. According to the miniature probe, the surface of the miniature probe is plated with the waterproof film layer, so that the anti-corrosion and anti-permeation capabilities of the miniature probe are greatly improved.

Description

Technical Field

[0001] This utility model relates to the field of medical devices, and in particular to a miniature probe and monitoring device. Background Technology

[0002] In clinical practice and medical research, the measurement of pressure and temperature within the human body plays a crucial role. For example, critically ill patients require direct measurement of intracranial pressure, coronary artery pressure, and renal artery pressure through surgical intervention or implantation during treatment to obtain more accurate and subtle changes in vital signs of human organs. However, these areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the lesion site for measurement. Due to their small size, light weight, and low power consumption, microelectromechanical systems (MEMS) technology offers new possibilities for monitoring physiological parameters within the human body.

[0003] Most existing miniature probes use metal leads to electrically connect pressure sensors, temperature sensors, and a PCB substrate, and then encapsulate the probe tip with silicone. However, because the probe tip is constantly immersed in blood, the blood can slowly seep into the silicone and corrode the metal leads, causing malfunctions in the pressure or temperature sensors. Utility Model Content

[0004] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a miniature probe that greatly improves the corrosion resistance and impermeability of the miniature probe by coating its surface with a waterproof membrane.

[0005] This utility model also proposes a monitoring device having the above-mentioned miniature probe.

[0006] The miniature probe according to a first aspect embodiment of the present invention includes:

[0007] A first housing, the first housing defining a receiving cavity and a first opening communicating with the receiving cavity;

[0008] A first sensor is disposed in the accommodating cavity. The first sensor has a first surface and a second surface opposite to each other. The first surface includes a pressure measuring area, and at least the pressure measuring area is disposed corresponding to the first opening.

[0009] A PCB substrate, which is disposed in the accommodating cavity and is communicatively connected to the first sensor;

[0010] A first sealant is applied, which fills the accommodating cavity and at least seals the first opening.

[0011] The micro probe also includes a waterproof membrane layer, which at least covers the surface of the first sealant at the first opening.

[0012] The miniature probe according to the embodiments of this utility model has at least the following beneficial effects:

[0013] This application significantly enhances the corrosion and penetration resistance of the microprobe by coating its surface with a waterproof membrane, thereby preventing blood from seeping into the cavity and causing corrosion of the gold wire. This also significantly improves the stability of the microprobe under long-term monitoring conditions, which is beneficial for assisting medical staff in making more accurate diagnoses.

[0014] According to some embodiments of the present invention, the micro probe further includes an intermediate carrier plate, the first sensor is disposed on the intermediate carrier plate, and the intermediate carrier plate is connected to the PCB substrate;

[0015] The intermediate carrier plate is made of monocrystalline silicon or silicon dioxide.

[0016] According to some embodiments of the present invention, the first sensor is provided with a first pad, the intermediate carrier plate is provided with a second pad, and the first pad and the second pad are electrically connected by a wire.

[0017] The intermediate carrier board is further provided with a third pad, which is located at one end of the intermediate carrier board. The second pad and the third pad are electrically connected. The PCB substrate is provided with a fourth pad, which is electrically connected to the third pad via a wire.

[0018] According to some embodiments of the present invention, the first pad is disposed on the first surface, and the second surface is die bonded to the intermediate carrier plate.

[0019] According to some embodiments of the present invention, the second pad and the third pad are electrically connected by a wire;

[0020] Alternatively, the intermediate carrier board may have a pre-embedded printed circuit, and the second pad and the third pad may be electrically connected through the printed circuit.

[0021] According to some embodiments of the present invention, the first housing further includes a second opening located at one end of its axial direction, and the micro probe further includes a first conduit, the first conduit including a main body section, a necked section and an insertion section, the insertion section being connected to the main body section through the necked section, the insertion section passing through the second opening and being inserted into the receiving cavity, and the end of the first housing abutting against the necked section with the first conduit;

[0022] At least the first housing and the insertion segment are filled with a second sealant to fix the first housing and the first conduit.

[0023] According to some embodiments of the present invention, the micro probe further includes an intermediate carrier plate, the first sensor is disposed on the intermediate carrier plate, and the second sealant also covers a portion of the intermediate carrier plate and a portion of the PCB substrate to fix the intermediate carrier plate and the PCB substrate.

[0024] According to some embodiments of the present invention, the first housing is provided with a boss that supports the intermediate carrier plate, the intermediate carrier plate is disposed on the top surface of the boss, and the end of the insertion section abuts against the side wall of the boss.

[0025] According to some embodiments of the present invention, metal wires are pre-embedded in the shell wall of the main body segment.

[0026] The monitoring device according to a second aspect of the present invention includes the miniature probe described in any one of the above embodiments.

[0027] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0029] Figure 1 This is a schematic diagram of the structure of the miniature probe according to an embodiment of the present invention;

[0030] Figure 2 This is a cross-sectional view of the miniature probe according to an embodiment of the present invention;

[0031] Figure 3 for Figure 2 A top view of the miniature probe in the image;

[0032] Figure 4 This is a schematic diagram showing the connection between the intermediate carrier plate and the first sensor in an embodiment of the present invention.

[0033] Figure label:

[0034] First housing 100; accommodating cavity 110; first opening 120; second opening 130; boss 140;

[0035] First sensor 200; first surface 210; first pad 211; second surface 220;

[0036] PCB substrate 300; fourth pad 310;

[0037] First sealant 400; Second sealant 450;

[0038] Waterproof membrane layer 500;

[0039] Intermediate carrier board 600; second pad 610; third pad 620; printed circuit board 630;

[0040] Wire 700;

[0041] First catheter 800; main body 810; metal wire 811; necking section 820; insertion section 830;

[0042] Temperature sensor 900; Detailed Implementation

[0043] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0044] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationship based on the directional or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0045] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0046] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0047] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0048] In clinical practice and medical research, the measurement of pressure and temperature within the human body plays a crucial role. For example, critically ill patients require direct measurement of intracranial pressure, coronary artery pressure, and renal artery pressure through surgical intervention or implantation during treatment to obtain more accurate and subtle changes in vital signs of human organs. However, these areas are relatively narrow, and the required pressure and temperature sensors must be miniaturized to reach the lesion site for measurement. Due to their small size, light weight, and low power consumption, microelectromechanical systems (MEMS) technology offers new possibilities for monitoring physiological parameters within the human body.

[0049] Most existing miniature probes use metal leads to electrically connect pressure sensors, temperature sensors, and a PCB substrate, and then encapsulate the probe tip with silicone. However, because the probe tip is constantly immersed in blood, the blood can slowly seep into the silicone and corrode the metal leads, causing malfunctions in the pressure or temperature sensors.

[0050] To address the aforementioned problems, this application proposes a miniature probe comprising a first housing 100, a first sensor 200, a PCB substrate 300, and a first sealant 400, such as... Figure 1 As shown, the first housing 100 is the tip of the miniature probe. The first housing 100 is a hollow cylindrical structure with an arc-shaped end to avoid damage to human tissue when inserted into the human body. The material of the first housing 100 should be a biocompatible material, such as stainless steel 303 (here, "303" is a specific grade of steel and not a reference numeral in the drawings; the same applies to "stainless steel 304" mentioned later), stainless steel 304, titanium alloy, ceramics, etc. A first opening 120 communicating with the receiving cavity 110 is provided on the side wall of the first housing 100. The first sensor 200 is disposed in the receiving cavity 110 and has a first surface 210 and a second surface 220 opposite to each other. Figure 2In the illustrated embodiment, the first surface 210 is the top surface of the first sensor 200, and the second surface 220 is the bottom surface of the first sensor 200. The upper portion of the first surface 210 is the pressure measurement area, which must be directly opposite the first opening 120; that is, along the projection from top to bottom, the pressure measurement area must be located within the first opening 120. Taking the first sensor 200 as a pressure sensor as an example, when the miniature probe is inserted into the human body, intracranial pressure can be transmitted through the first opening 120 to the pressure measurement area of ​​the pressure sensor, thereby achieving the detection of intracranial pressure.

[0051] The PCB substrate 300 passes through the accommodating cavity 110 and is communicatively connected to the first sensor 200. It is understood that, in situations such as... Figure 1 In the illustrated embodiment, the miniature probe further includes an intermediate carrier board 600. The first sensor 200 is disposed on the intermediate carrier board 600, which is connected to the PCB substrate 300. The pads on the first sensor 200 are connected to the pads on the intermediate carrier board 600 via wires 700. The intermediate carrier board 600 is then connected to the PCB substrate 300 via wires 700, thus forming a signal transmission line from the first sensor 200 to the PCB substrate 300. In other embodiments (not shown in the figures), the miniature probe can also be directly disposed on the PCB substrate 300 and connected via ball bonding or wires 700.

[0052] The first sealant 400 fills the accommodating cavity 110 and at least seals the first opening 120, thereby isolating the components in the accommodating cavity 110 from the external environment. This prevents blood or tissue fluid (using blood as an example below) from seeping into the accommodating cavity 110 and causing short circuits in the components after the microprobe is inserted into the human body. Furthermore, in cases such as Figure 2 In the illustrated embodiment, the first sealant 400 covers the first sensor 200, thereby achieving fixation and protection of the first sensor 200.

[0053] To address the issue of blood penetration during long-term monitoring using the miniature probe, this application also coats the miniature probe with a waterproof membrane layer 500, such as... Figure 2 As shown, the waterproof membrane layer 500 at least covers the surface of the first sealant 400 at the first opening 120. It should be explained that the surface of the first sealant 400 refers to the side of the first sealant 400 facing the external environment. This surface of the first sealant 400 is frequently exposed to blood corrosion and penetration. Therefore, by coating it with a waterproof membrane layer 500, the anti-penetration and anti-corrosion capabilities of the first sealant 400 can be effectively improved.

[0054] It should be added that the waterproof membrane layer 500 can be parylene or other waterproof membrane layers, which can be formed by spray coating, deposition coating or other coating processes using coating equipment. The specific coating process needs to be selected according to the specific material.

[0055] Based on the above, this application greatly improves the corrosion resistance and anti-permeation capability of the micro probe by coating the surface of the micro probe with a waterproof membrane layer 500, thereby avoiding the situation where blood permeates into the accommodating cavity 110 and causes gold wire corrosion. This significantly improves the stability of the micro probe under long-term monitoring conditions and helps medical staff make more accurate diagnoses.

[0056] Considering the need for flexibility in miniature probes, the PCB substrate 300 is often made of flexible materials. For example, the PCB substrate 300 adopts a flexible circuit board structure, which can be bent to a certain extent. It is understandable that flexible circuit boards are generally thinner and have relatively poorer mechanical properties. In existing technologies, sensors are directly soldered onto flexible circuit boards, which can easily lead to adverse effects on the zero drift and time drift of the sensor due to welding thermal stress, thereby affecting the product stability and production yield of the miniature probe.

[0057] Therefore, in such Figures 1 to 4 In the illustrated embodiment, the microprobe is provided with an intermediate carrier plate 600 to connect to the first sensor 200. The intermediate carrier plate 600 is made of monocrystalline silicon or silicon dioxide, which has the characteristics of stable mechanical properties, high thermal stability, high resistivity, and low electrical loss. Furthermore, the chemical properties of the material of the intermediate carrier plate 600 are the same as or similar to those of the material of the first sensor 200. Since its coefficient of thermal expansion is similar to that of the first sensor 200, it can undergo the same expansion change as the first sensor 200 when heated during packaging, thereby reducing the impact of the packaging process on the zero drift and time drift of the first sensor 200 and avoiding problems such as output drift caused by stress.

[0058] In some embodiments, the first sensor 200 is provided with a first pad 211, and the intermediate carrier board 600 is provided with a second pad 610. The first pad 211 and the second pad 610 are electrically connected by a wire 700. It should be noted that, in cases such as... Figure 2 In the illustrated embodiment, the first pad 211 is disposed on the first surface 210 of the first sensor 200. In other embodiments, depending on the specific structure of the first sensor 200, the first pad 211 may also be disposed on the side wall of the first sensor 200. The wires 700 used to connect to the first pad 211 and the second pad 610 respectively can be metal wires 811 with good conductivity, such as gold wires or silver wires.

[0059] The intermediate carrier board 600 is also provided with a third pad 620, which is located at one end of the intermediate carrier board 600. A fourth pad 310 is provided on the PCB substrate 300. The third pad 620 and the fourth pad 310 are electrically connected by a wire 700. It should be noted that the first sensor 200 is located in the middle of the intermediate carrier board 600. Therefore, the second pad 610 is located in the middle of the intermediate carrier board 600. The third pad 620 is used to connect to the PCB substrate 300, and is thus located on the intermediate carrier board 600 closer to the end of the fourth pad 310. Figure 4 As shown, the third pad 620 is neatly arranged at the right end of the intermediate carrier board 600, which is conducive to the reasonable arrangement of the conductors 700.

[0060] It should be noted that the second pad 610 and the third pad 620 on the intermediate carrier board 600 can be electrically connected by wires 700, thus simplifying the structure. Alternatively, in some embodiments, a printed circuit 630 is pre-embedded on the intermediate carrier board 600, with the second pad 610 and the third pad 620 located at opposite ends of the printed circuit 630, thus electrically connected through the printed circuit 630. It is understood that by pre-embedding the printed circuit 630, the number of wires 700 in the accommodating cavity 110 is reduced, and the wiring in the accommodating cavity 110 is neater through the transition of the printed circuit 630, avoiding short circuits or electromagnetic interference caused by the wires 700 crossing and tangling. Furthermore, the printed circuit 630 often has a protective layer, which can effectively prevent the circuit from being corroded by blood, further improving the stability of the miniature probe.

[0061] It should be noted that the electrical connection between electronic components via wire 700 is structurally simple and the soldering process is relatively easy to implement, which helps to reduce the manufacturing cost of the miniature probe.

[0062] In some embodiments, the first pad 211 of the first sensor 200 is disposed on the first surface 210, and the second surface 220 of the first sensor 200 is connected to the intermediate carrier 600 via a die bonding process. Figure 2 In the illustrated embodiment, either the second surface 220 of the first sensor 200 or a corresponding position on the intermediate carrier plate 600 is coated with die-bonding adhesive for connection to the other. A certain pressure is applied to the first sensor 200 using a die bonder, causing a tight bond between the first sensor 200 and the intermediate carrier plate 600. The die-bonding adhesive is then cured by baking, thereby achieving a fixed connection between the first sensor 200 and the intermediate carrier plate 600. Furthermore, the die-bonding adhesive is a low-stress silicone adhesive.

[0063] In some embodiments, the pressure sensor is an absolute pressure sensor. Based on crystalline silicon micromachining technology, the absolute pressure sensor measures the minute effect of pressure on the flexural deformation of a crystalline silicon microbeam, converting this deformation into a standard electrical signal output to achieve accurate pressure measurement. It uses a vacuum reference as the reference point for the measured object, thereby eliminating the influence of ambient pressure on the output signal. The absolute pressure sensor includes a first piezoresistive resistor, a second piezoresistive resistor, a third piezoresistive resistor, and a fourth piezoresistive resistor. These four piezoresistive resistors are all located inside the absolute pressure sensor and form a Wheatstone full-bridge structure. All four arms of this structure are connected to the measured quantity, forming a differential full-bridge operation with high measurement accuracy and sensitivity. In other embodiments, the first and second piezoresistive resistors are located inside the absolute pressure sensor and form a Wheatstone half-bridge structure. The third and fourth piezoresistive resistors are located on an intermediate carrier plate 600 or on a PCB substrate 300, forming another Wheatstone half-bridge structure. This helps to reduce the size of the sensor and, consequently, the package size of the probe.

[0064] In some embodiments, the first sensor 200 is a pressure sensor. It is understood that temperature changes have a significant impact on the accuracy of pressure detection during the pressure detection process. Therefore, the miniature probe of this application also includes a temperature sensor 900, and a communication connection between the temperature sensor 900 and the pressure sensor is achieved through an intermediate carrier plate 600. This allows the temperature data detected by the temperature sensor 900 to compensate for or correct the pressure data detected by the pressure sensor, thereby reducing the impact of temperature on the performance of the pressure sensor. It should be noted that the temperature sensor 900 can be a cylindrical or sheet-shaped NTC thermistor (Negative Temperature Coefficient Thermistor), which has advantages such as high sensitivity, small size, and good stability.

[0065] Furthermore, the temperature sensor 900 is a surface-mount thin-film resistor, which includes a substrate and a thermistor film. Thermistor films are disposed on both opposite surfaces of the substrate. Preferably, it is fabricated by printing platinum films on both sides of the ceramic substrate and symmetrically arranging solder at both ends to meet the requirements of surface-mount packaging. The temperature sensor 900 can be soldered to the pads of the intermediate carrier board 600 using SMT (Surface Mount Technology) surface mount technology.

[0066] In some embodiments, such as Figures 1 to 3As shown, the first housing 100 also includes a second opening 130 located at one end of its axial direction. The microprobe also includes a first conduit 800, one end of which passes through the second opening 130 and is inserted into the first housing 100. The first conduit 800 is the main body of the microprobe and is usually made of a biocompatible material with a certain strength, such as PA (polyamide), PVC (polyvinyl chloride), PP (polypropylene), etc. In this embodiment, the first conduit 800 is a hollow conduit more than one meter long, in which a wire harness for transmitting signals is laid. The end of the first conduit 800 away from the first housing 100 is used to connect to a controller or other signal processing elements.

[0067] Specifically, such as Figure 2 As shown, the first conduit 800 includes a main body section 810 with an outer diameter consistent with that of the first housing 100, a necked section 820 with a gradually decreasing outer diameter, and an insertion section 830 with an outer diameter smaller than that of the inner diameter of the first housing 100. The main body section 810 is connected to the insertion section 830 via the necked section 820. The insertion section 830 passes through the second opening 130 and is inserted into the receiving cavity 110 of the first housing 100. The end of the first housing 100 abuts against the necked section 820. At least the inner side of the first housing 100 and the outer side of the insertion section 830 are filled with a second sealant 450 to fix the first housing 100 and the first conduit 800.

[0068] In such Figure 2 In the illustrated embodiment, a second sealant 450 is also provided on the inner side of the plug-in section 830 to wrap and protect the pads on the PCB substrate 300 and the conductors 700. In addition, the second sealant 450 also covers a portion of the intermediate carrier board 600 and a portion of the PCB substrate 300 to fix the intermediate carrier board 600 and the PCB substrate 300.

[0069] like Figure 2 As shown, both the temperature sensor 900 and the pressure sensor are encapsulated by the first sealant 400. The first sealant 400 separates the second sealant 450 from the first opening 120, thereby preventing external liquids from contacting the second sealant 450. It is understood that the first sealant 400 is preferably made of a material with good biocompatibility, insulation, good water and vapor permeability, and no significant stress, such as two-component epoxy resin, silicone resin, or greenhouse-cured silicone rubber. The second sealant 450, while meeting biocompatibility requirements, also possesses high tensile strength and is preferably made of medical-grade UV adhesive or epoxy resin.

[0070] In addition, the first housing 100 is provided with a boss 140 for supporting the intermediate carrier plate 600. The intermediate carrier plate 600 is disposed on the top surface of the boss 140, has a large contact area with the boss 140, and has a good thermal conduction effect with the intermediate carrier plate 600, thereby facilitating heat dissipation of the first sensor 200. During the insertion of the first conduit 800 into the first housing 100, the end of the insertion part can abut against the side wall of the boss 140, thereby restricting further movement of the first conduit 800 and defining the insertion position of the first conduit 800 and the first housing 100.

[0071] In some embodiments, a metal wire 811 is pre-embedded in the shell wall of the main body segment 810 of the first conduit 800. The metal wire 811 can form a magnetic shielding layer, preventing magnetic fields from penetrating and avoiding interference from external magnetic fields on the signal, thus effectively protecting the circuit. The metal wire 811 can be made of non-magnetic stainless steel, which has good magnetic compatibility.

[0072] In summary, existing microprobes used in MRI (Magnetic Resonance Imaging) examinations generate radiofrequency heating, displacement forces, torque forces, and artifacts, posing significant safety risks to patients and affecting physician judgment. Because the microprobes in the first embodiment of this application are made of materials free of iron or nickel and other magnetic materials, they meet the safety requirements for use at field strengths of 1.5T and 3.0T, do not generate excessive heat due to electromagnetic induction, and will not experience displacement or damage. This avoids safety accidents caused by damage to the microprobes during MRI examinations and does not affect the quality of MRI imaging.

[0073] A second aspect of this application also provides a monitoring device comprising the miniature probe described in any of the above embodiments. Since this monitoring device employs the technical solutions described above, it possesses at least all the beneficial effects brought about by the technical solutions described above, which will not be elaborated upon here.

[0074] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A miniature probe, characterized in that, include: A first housing, the first housing defining a receiving cavity and a first opening communicating with the receiving cavity; A first sensor is disposed in the accommodating cavity. The first sensor has a first surface and a second surface opposite to each other. The first surface includes a pressure measuring area, and at least the pressure measuring area is disposed corresponding to the first opening. A PCB substrate, which is disposed in the accommodating cavity and is communicatively connected to the first sensor; A first sealant is applied, which fills the accommodating cavity and at least seals the first opening. The micro probe also includes a waterproof membrane layer, which at least covers the surface of the first sealant at the first opening.

2. The miniature probe according to claim 1, characterized in that, The micro probe also includes an intermediate carrier plate, on which the first sensor is disposed, and the intermediate carrier plate is connected to the PCB substrate; The intermediate carrier plate is made of monocrystalline silicon or silicon dioxide.

3. The miniature probe according to claim 2, characterized in that, The first sensor is provided with a first pad, and the intermediate carrier board is provided with a second pad. The first pad and the second pad are electrically connected by a wire. The intermediate carrier board is further provided with a third pad, which is located at one end of the intermediate carrier board. The second pad and the third pad are electrically connected. The PCB substrate is provided with a fourth pad, which is electrically connected to the third pad via a wire.

4. The miniature probe according to claim 3, characterized in that, The first pad is disposed on the first surface, and the second surface is die bonded to the intermediate carrier plate.

5. The miniature probe according to claim 3, characterized in that, The second pad and the third pad are electrically connected by a wire; Alternatively, the intermediate carrier board may have a pre-embedded printed circuit, and the second pad and the third pad may be electrically connected through the printed circuit.

6. The miniature probe according to claim 1, characterized in that, The first housing further includes a second opening located at one end of its axial direction, and the micro probe further includes a first conduit, the first conduit including a main body section, a necked section and an insertion section, the insertion section being connected to the main body section through the necked section, the insertion section passing through the second opening and being inserted into the receiving cavity, and the end of the first housing and the first conduit abutting against the necked section; At least the first housing and the insertion segment are filled with a second sealant to fix the first housing and the first conduit.

7. The miniature probe according to claim 6, characterized in that, The micro probe also includes an intermediate carrier plate, on which the first sensor is disposed. The second sealant also covers a portion of the intermediate carrier plate and a portion of the PCB substrate to fix the intermediate carrier plate and the PCB substrate.

8. The miniature probe according to claim 7, characterized in that, The first housing is provided with a boss that supports the intermediate carrier plate. The intermediate carrier plate is disposed on the top surface of the boss, and the end of the plug section abuts against the side wall of the boss.

9. The miniature probe according to claim 6, characterized in that, Metal wires are pre-embedded in the shell wall of the main body section.

10. Monitoring equipment, characterized in that, include: The miniature probe as described in any one of claims 1 to 9.

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