Ceramic substrate adsorption jig and laser drilling machine

Abstract

The utility model discloses a ceramic substrate adsorption jig and a laser drilling machine, the ceramic substrate adsorption jig comprises a base and an adsorption plate arranged on the base, the top of the adsorption plate is provided with a plurality of first adsorption holes and a plurality of second adsorption holes, the first adsorption holes are located in the middle area of the adsorption plate, and the second adsorption holes are located in the middle area of the adsorption plate. The multiple second adsorption holes are located in the edge area of the adsorption plate, a first inner cavity and a second inner cavity are formed in the adsorption plate, the first inner cavity communicates with the multiple first adsorption holes, and the second inner cavity communicates with the multiple second adsorption holes; the first inner cavity is provided with a first connector used for being connected with external low-negative-pressure equipment, and the second inner cavity is provided with a second connector used for being connected with external high-negative-pressure equipment. According to the utility model, the middle area of the ceramic substrate can be prevented from sinking downwards and deforming, the edge of the ceramic substrate is prevented from tilting or displacing in the processing process, and the processing precision is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of ceramic substrate drilling equipment, specifically to a ceramic substrate adsorption fixture and a laser drilling machine. Background Technology

[0002] Ceramic substrates are widely used as packaging substrates and heat dissipation substrates for electronic components due to their excellent insulation, heat resistance, thermal conductivity, and thermal expansion coefficient that matches that of chips. During the manufacturing process of ceramic substrates, especially when performing precision machining such as laser drilling, cutting, or surface mounting, the ceramic substrate needs to be fixed on a fixture on the worktable of the processing equipment to prevent displacement or deformation during processing, thereby ensuring processing accuracy.

[0003] Existing laser drilling equipment typically uses vacuum adsorption fixtures to fix ceramic substrates. Specifically, a vacuum adsorption fixture usually includes a base and an adsorption plate. The surface of the adsorption plate has densely packed adsorption holes, and the interior of the adsorption plate contains a single vacuum chamber that communicates with all the adsorption holes. During operation, an external vacuum device evacuates the single vacuum chamber, creating a negative pressure within the adsorption holes, thereby adsorbing and fixing the ceramic substrate placed on the adsorption plate.

[0004] However, due to the use of a single air chamber structure, the adsorption force is uniform across the entire surface of the adsorption plate. When fixing some thin, large, or fragile ceramic substrates, the central area of ​​the ceramic substrate is prone to downward bending deformation, and the edges of the ceramic substrate are prone to warping. This leads to unstable adsorption, affects processing accuracy, and may even cause stress inside the ceramic substrate, resulting in breakage. Utility Model Content

[0005] In order to overcome the shortcomings of the prior art, this utility model provides a ceramic substrate adsorption fixture and a laser drilling machine, which can prevent the middle area of ​​the ceramic substrate from being concave and deformed, ensure that the ceramic substrate will not be warped or displaced during processing, and improve processing accuracy.

[0006] The technical solution adopted by this utility model to solve its technical problem is:

[0007] A ceramic substrate adsorption fixture includes a base and an adsorption plate disposed on the base. The top of the adsorption plate has a plurality of first adsorption holes and second adsorption holes. The plurality of first adsorption holes are located in the middle region of the adsorption plate, and the plurality of second adsorption holes are located in the edge region of the adsorption plate. The adsorption plate has a first inner cavity and a second inner cavity inside. The first inner cavity communicates with the plurality of first adsorption holes, and the second inner cavity communicates with the plurality of second adsorption holes. The first inner cavity has a first interface for connecting to an external low negative pressure device, and the second inner cavity has a second interface for connecting to an external high negative pressure device.

[0008] As a further improvement to the above technical solution, the top view projection of the adsorption plate is rectangular, a plurality of the first adsorption holes are distributed in a rectangular array, and a plurality of the second adsorption holes are distributed in a U-shaped array.

[0009] As a further improvement to the above technical solution, several second adsorption holes form multiple sets of U-shaped arrays of different sizes to adapt to ceramic substrates of different specifications.

[0010] As a further improvement to the above technical solution, the second inner cavity includes multiple U-shaped air intake channels, each U-shaped air intake channel corresponds to a set of U-shaped array of second adsorption holes, each U-shaped air intake channel is respectively connected to at least one second interface disposed on the side of the adsorption plate, and each U-shaped air intake channel is located at a different height inside the adsorption plate.

[0011] As a further improvement to the above technical solution, the top of the base is provided with a first groove, the bottom of the adsorption plate is provided with a second groove, the first groove and the second groove cooperate to form the first inner cavity, and the first interface is provided on the base and communicates with the first groove.

[0012] As a further improvement to the above technical solution, a dust extraction block is provided on the base, and an air extraction channel is provided inside the dust extraction block. One end of the air extraction channel is connected to an external dust extraction device. An auxiliary channel is provided inside the base, and the auxiliary channel is used to connect the first groove and the air extraction channel.

[0013] As a further improvement to the above technical solution, the number of adsorption plates is four, and the four adsorption plates are distributed in a rectangular array on the base. The number of auxiliary channels is two, and each auxiliary channel is connected to the air extraction channel and the two first grooves respectively.

[0014] As a further improvement to the above technical solution, the adsorption plate is also provided with a plurality of auxiliary adsorption holes, which are connected to the first inner cavity and are distributed at intervals with the plurality of second adsorption holes.

[0015] As a further improvement to the above technical solution, a calibration block is also provided on the base.

[0016] A laser drilling machine includes the aforementioned ceramic substrate adsorption fixture.

[0017] The beneficial effects of this utility model are as follows: This utility model provides a ceramic substrate adsorption fixture and a laser drilling machine. A small adsorption force is applied to the middle area of ​​the ceramic substrate through the first adsorption hole, so that the middle area of ​​the ceramic substrate is only gently adsorbed. At the same time, a larger adsorption force is applied to the edge area of ​​the ceramic substrate through the second adsorption hole, so that the edge area of ​​the ceramic substrate is firmly adsorbed. Thus, it is possible to prevent the middle area of ​​the ceramic substrate from sinking and deforming, ensuring that the ceramic substrate will not warp or shift during processing, thereby improving processing accuracy. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a schematic diagram of the structure of a ceramic substrate adsorption fixture provided in an embodiment of this utility model;

[0020] Figure 2 yes Figure 1 A sectional view;

[0021] Figure 3 yes Figure 1 A top view of the adsorption plate;

[0022] Figure 4 yes Figure 3 Enlarged view of point A in the middle;

[0023] Figure 5 yes Figure 3 A sectional view;

[0024] Figure 6 This is a schematic diagram of the structure of a laser drilling machine provided in an embodiment of this utility model.

[0025] Reference numerals: 110-base, 111-auxiliary channel, 120-adsorption plate, 121-first adsorption hole, 122-second adsorption hole, 123-first inner cavity, 124-U-shaped suction channel, 125-auxiliary adsorption hole, 130-dust extraction block, 131-extraction channel, 140-calibration block, 200-frame, 300-XY axis moving slide, 400-lifting assembly, 500-laser drilling assembly, 600-vision inspection assembly, 700-dust extraction assembly. Detailed Implementation

[0026] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0027] Reference Figures 1 to 5 This utility model provides a ceramic substrate adsorption fixture, including a base 110 and an adsorption plate 120 disposed on the base 110. The top of the adsorption plate 120 is provided with a plurality of first adsorption holes 121 and second adsorption holes 122. The plurality of first adsorption holes 121 are located in the middle region of the adsorption plate 120, and the plurality of second adsorption holes 122 are located in the edge region of the adsorption plate 120. The adsorption plate 120 is provided with a first inner cavity 123 and a second inner cavity. The first inner cavity 123 communicates with the plurality of first adsorption holes 121, and the second inner cavity communicates with the plurality of second adsorption holes 122. The first inner cavity 123 has a first interface for connecting an external low negative pressure device, and the second inner cavity has a second interface for connecting an external high negative pressure device.

[0028] Understandably, when processing ceramic substrates, a robotic arm or operator places the ceramic substrate to be processed on the top plane of the adsorption plate 120, so that the ceramic substrate covers the first adsorption hole 121 in the middle area and the second adsorption hole 122 in the edge area. An external low negative pressure device is activated to form a relatively low negative pressure in the first inner cavity 123, and a small adsorption force is applied to the middle area of ​​the ceramic substrate through the first adsorption hole 121, so that the middle area of ​​the ceramic substrate is only gently adsorbed. At the same time, an external high negative pressure device is activated to form a relatively high negative pressure in the second inner cavity, and a larger adsorption force is applied to the edge area of ​​the ceramic substrate through the second adsorption hole 122, so that the edge area of ​​the ceramic substrate is firmly adsorbed. This can prevent the middle area of ​​the ceramic substrate from sinking and deforming, ensuring that the ceramic substrate will not warp or shift during processing, thus improving processing accuracy.

[0029] In some preferred embodiments, the top view projection of the adsorption plate 120 is rectangular, a plurality of first adsorption holes 121 are distributed in a rectangular array, and a plurality of second adsorption holes 122 are distributed in a U-shaped array.

[0030] Understandably, when the ceramic substrate is placed on the rectangular adsorption plate 120, the stress points in the middle area of ​​the ceramic substrate are evenly distributed in a rectangular grid pattern to ensure uniform stress distribution in the middle area and avoid stress concentration; the stress points in the edge area of ​​the ceramic substrate are distributed in a U-shape, which can match the shape of the conventional rectangular ceramic substrate and prevent the edges of the ceramic substrate from lifting.

[0031] Furthermore, several second adsorption holes 122 form multiple sets of U-shaped arrays of different sizes to accommodate ceramic substrates of different specifications.

[0032] Understandably, when processing ceramic substrates of different sizes, by selecting a set of second adsorption holes 122 of the corresponding size in a U-shaped array and connecting them separately to an external high negative pressure device, the edges of the ceramic substrates of the corresponding size can be precisely adsorbed. Thus, the same adsorption fixture can be compatible with multiple specifications of ceramic substrates, eliminating the need to equip each specification of ceramic substrate with a dedicated adsorption fixture, thereby greatly reducing equipment costs and changeover time.

[0033] Furthermore, the second inner cavity includes a plurality of U-shaped air intake channels 124, each U-shaped air intake channel 124 corresponding to a set of U-shaped array of second adsorption holes 122, each U-shaped air intake channel 124 respectively corresponding to at least one second interface disposed on the side of the adsorption plate 120, and each U-shaped air intake channel 124 is located at a different height inside the adsorption plate 120.

[0034] It is understood that each U-shaped suction channel 124 is independently distributed at different heights inside the adsorption plate 120 and connected to the external high negative pressure equipment through an independent second interface. The operator can select the corresponding U-shaped suction channel 124 to connect to the external high negative pressure equipment according to the specifications of the ceramic substrate being processed, while other U-shaped suction channels 124 remain at normal pressure or closed. Therefore, the set of U-shaped arrayed second adsorption holes 122 corresponding to the currently processed ceramic substrate generates uniform suction points on its edge area, thereby preventing air leakage from the second adsorption holes 122 in other uncovered areas and reducing the load and energy consumption of the external high negative pressure equipment. Furthermore, by distributing multiple independent U-shaped suction channels 124 at different heights inside the adsorption plate 120, the second interfaces located on the sides of the adsorption plate 120 are positioned at different heights, facilitating the operator to quickly and accurately select the required second interface to connect to the external high negative pressure equipment.

[0035] In some preferred embodiments, a first groove is provided on the top of the base 110, and a second groove is provided on the bottom of the adsorption plate 120. The first groove and the second groove cooperate to form a first inner cavity 123, and a first interface is provided on the base 110 and communicates with the first groove.

[0036] It is understandable that by machining the first groove on the top of the base 110 and the second groove on the bottom of the adsorption plate 120, it is possible to avoid machining a complex closed cavity separately inside the adsorption plate 120, thereby greatly reducing the machining difficulty and manufacturing cost.

[0037] Furthermore, by setting the first interface on the base 110, the air tube connection point is located on the side or bottom of the fixture, thereby avoiding interference of the tubing with the top space of the adsorption plate 120.

[0038] To improve the sealing performance of the first inner cavity 123, a sealing ring can also be provided on the mating surface between the adsorption plate 120 and the base 110.

[0039] Furthermore, a dust extraction block 130 is provided on the base 110, and an air extraction channel 131 is provided inside the dust extraction block 130. One end of the air extraction channel 131 is connected to an external dust extraction device. An auxiliary channel 111 is provided inside the base 110, and the auxiliary channel 111 is used to connect the first groove and the air extraction channel 131.

[0040] It is understandable that dust is generated during laser drilling, and laser drilling machines are typically equipped with dust extraction devices. The external dust extraction device is connected to the internal air extraction channel 131 of the dust extraction block 130, which in turn connects to the first groove via an auxiliary channel 111. On one hand, the negative pressure generated by the dust extraction device acts on the first inner cavity 123. The operator can, according to actual needs, shut off the external low-negative-pressure device and use the dust extraction device to extract air from the first inner cavity 123, achieving adsorption of the central area of ​​the ceramic substrate, thereby reducing costs and energy consumption. On the other hand, some dust generated during laser drilling falls into the first adsorption hole 121. The dust in the first adsorption hole 121 is drawn into the first inner cavity 123 with the airflow, and then enters the dust extraction device via the auxiliary channel 111 and the air extraction channel 131. This allows for timely removal of processing dust, preventing dust from clogging the first adsorption hole 121, and fully utilizing the existing dust extraction equipment to reduce costs.

[0041] Specifically, there are four adsorption plates 120, which are arranged in a rectangular array on the base 110. There are two auxiliary channels 111, each of which is connected to the air extraction channel 131 and the two first grooves.

[0042] Understandably, a single adsorption fixture can simultaneously load four ceramic substrates, greatly improving the efficiency of a single processing operation. Furthermore, the air extraction channel 131 within the dust extraction block 130 connects to the four adsorption plates 120 via two auxiliary channels 111, thereby simplifying the internal channel structure of the base 110, reducing processing difficulty and cost, while ensuring the balance of the dust extraction airflow.

[0043] In some preferred embodiments, the adsorption plate 120 is further provided with a plurality of auxiliary adsorption holes 125, which are connected to the first inner cavity 123, and the plurality of auxiliary adsorption holes 125 and the plurality of second adsorption holes 122 are distributed at intervals.

[0044] It is understandable that when adsorbing the ceramic substrate, the second adsorption hole 122 applies a larger adsorption force to the edge area of ​​the ceramic substrate, the first adsorption hole 121 applies a smaller adsorption force to the middle area of ​​the ceramic substrate, and at the same time, the auxiliary adsorption hole 125 applies a smaller adsorption force between the middle area and the edge area of ​​the ceramic substrate to avoid sudden changes in adsorption force that could cause stress changes in the ceramic substrate.

[0045] In some preferred embodiments, a calibration block 140 is also provided on the base 110.

[0046] After the fixture is installed on the worktable of the processing equipment, the vision system on the processing equipment takes a picture of the calibration block 140 on the fixture. The position of the calibration block 140 is used to determine the accurate position of the fixture on the worktable of the equipment. The XY sliding table on the worktable adjusts the position of the fixture to ensure the relative positional accuracy between the ceramic substrate on the fixture and the processing head on the processing equipment, thereby ensuring the processing accuracy.

[0047] Reference Figure 6 This utility model embodiment also provides a laser drilling machine, including the aforementioned ceramic substrate adsorption fixture. It also includes a frame 200, an XY-axis moving slide 300, a lifting assembly 400, a laser drilling assembly 500, a vision inspection assembly 600, and a dust extraction assembly 700. The ceramic substrate adsorption fixture is mounted on the XY-axis moving slide 300. During processing, the ceramic substrate is placed on the adsorption plate 120 of the ceramic substrate adsorption fixture, which holds the ceramic substrate in place. The XY-axis moving slide 300 moves the ceramic substrate adsorption fixture below the laser drilling assembly 500. Then, the vision inspection assembly 600 calibrates the position of the ceramic substrate adsorption fixture. Subsequently, the lifting assembly 400 drives the laser drilling assembly 500 to descend to a set position, where the laser drilling assembly 500 performs laser drilling on the ceramic substrate. Simultaneously, the dust extraction assembly 700 removes dust or debris generated during the processing. In this process, several first adsorption holes 121 and second adsorption holes 122 in the adsorption plate 120 always perform vacuum adsorption on the ceramic substrate, thereby ensuring that the ceramic substrate will not be displaced and improving the accuracy of laser drilling.

[0048] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A ceramic substrate adsorption fixture, characterized in that, The device includes a base and an adsorption plate disposed on the base. The top of the adsorption plate has a plurality of first adsorption holes and second adsorption holes. The plurality of first adsorption holes are located in the middle region of the adsorption plate, and the plurality of second adsorption holes are located in the edge region of the adsorption plate. The adsorption plate has a first inner cavity and a second inner cavity inside. The first inner cavity communicates with the plurality of first adsorption holes, and the second inner cavity communicates with the plurality of second adsorption holes. The first inner cavity has a first interface for connecting to an external low negative pressure device, and the second inner cavity has a second interface for connecting to an external high negative pressure device.

2. The ceramic substrate adsorption fixture according to claim 1, characterized in that, The top view of the adsorption plate is rectangular, and a plurality of the first adsorption holes are arranged in a rectangular array, while a plurality of the second adsorption holes are arranged in a U-shaped array.

3. The ceramic substrate adsorption fixture according to claim 2, characterized in that, Several of the second adsorption holes form multiple sets of U-shaped arrays of different sizes to accommodate ceramic substrates of different specifications.

4. The ceramic substrate adsorption fixture according to claim 3, characterized in that, The second inner cavity includes multiple U-shaped air intake channels. Each U-shaped air intake channel corresponds to a set of U-shaped arrays of second adsorption holes. Each U-shaped air intake channel is connected to at least one second interface disposed on the side of the adsorption plate. Each U-shaped air intake channel is located at a different height inside the adsorption plate.

5. The ceramic substrate adsorption fixture according to claim 1, characterized in that, The base has a first groove at its top and a second groove at its bottom. The first groove and the second groove cooperate to form the first inner cavity. The first interface is located on the base and communicates with the first groove.

6. The ceramic substrate adsorption fixture according to claim 5, characterized in that, The base is provided with a dust extraction block, and the dust extraction block is provided with an air extraction channel inside. One end of the air extraction channel is connected to an external dust extraction device. The base is provided with an auxiliary channel, which is used to connect the first groove and the air extraction channel.

7. The ceramic substrate adsorption fixture according to claim 6, characterized in that, The number of adsorption plates is four, and the four adsorption plates are arranged in a rectangular array on the base. The number of auxiliary channels is two, and each auxiliary channel is connected to the air extraction channel and the two first grooves respectively.

8. The ceramic substrate adsorption fixture according to claim 1, characterized in that, The adsorption plate is also provided with a plurality of auxiliary adsorption holes, which are connected to the first inner cavity and are distributed at intervals with the plurality of second adsorption holes.

9. The ceramic substrate adsorption fixture according to claim 1, characterized in that, The base is also equipped with a calibration block.

10. A laser drilling machine, characterized in that, Includes the ceramic substrate adsorption fixture as described in any one of claims 1 to 9.

Images