Semiconductor plastic package material pretreatment device

Abstract

The utility model provides a semiconductor plastic package material pretreatment device, and relates to the technical field of semiconductor plastic package. A cleaning pipe is arranged on the cleaning box, an air pipe is arranged on the side portion of the cleaning box and communicated with the interior of the cleaning box, a fan is arranged on the air pipe, the top of the cleaning pipe is communicated with a feeding pipe, a second gate valve is arranged on the feeding pipe, and the bottom of the cleaning pipe extends out of the cleaning box. A first gate valve is arranged on the cleaning pipe at the bottom of the cleaning box, and a plurality of through holes are fully distributed in the cleaning pipe in the cleaning box. According to the utility model, the injection molding material for injection molding is pretreated, and impurities and water in the injection molding material are removed by generating air flow, so that the product quality is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor molding compound technology, specifically to a semiconductor molding compound material pretreatment device. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature falls between that of conductors and insulators. The conductivity of semiconductor materials can be altered by doping. The concentration and polarity of impurities incorporated into an intrinsic semiconductor significantly affect its conductivity. Semiconductors doped with donor impurities primarily exhibit electron-type conductivity in the conduction band, while semiconductors doped with acceptor impurities exhibit hole-type conductivity.

[0003] Semiconductor packaging refers to the process of processing tested wafers into individual chips according to product model and functional requirements. The packaging process is as follows: the wafer from the front-end wafer process is diced into small chips, and then the diced chips are glued onto the islands of the corresponding substrate (lead frame). Then, ultra-fine metal (gold, tin, copper, aluminum) wires or conductive resin are used to connect the bonding pads of the chip to the corresponding pins of the substrate to form the required circuit. Then, the individual chips are encapsulated and protected with plastic shells. After encapsulation, a series of operations are performed. After packaging, finished product testing is carried out, which usually goes through processes such as incoming inspection, testing, and packaging, and finally, the chips are stored and shipped.

[0004] Molding is a crucial process in semiconductor packaging. In existing technologies, the semiconductor with wire bonding and the lead frame are placed in a mold, and then a molding compound is injected to encapsulate the gold wires on the wafer and lead frame, protecting the components from damage, preventing gas oxidation of the internal chip, and ensuring product safety and stability. During injection molding, the injection molding compound is currently fed directly into the barrel from the hopper. The injection molding compound is heated and melted inside the barrel, and the screw rotates inside the barrel to extrude the injection molding compound. However, impurities, including dust, and moisture that may be present in the injection molding compound can affect the quality of the molded product. Utility Model Content

[0005] The purpose of this invention is to develop a semiconductor molding compound pretreatment device that pre-treats injection molding compound by generating airflow to remove impurities and moisture from the injection molding compound, thereby improving product quality.

[0006] This utility model is achieved through the following technical solution:

[0007] A semiconductor molding compound pretreatment apparatus, comprising:

[0008] Cleaning box;

[0009] Cleaning tube, located on the cleaning box;

[0010] The air duct is located on the side of the cleaning box and connects to its interior.

[0011] The fan is installed on the air duct;

[0012] The cleaning tube is connected to a feed tube at the top, and a second baffle valve is provided on the feed tube. The bottom of the cleaning tube extends out of the cleaning box, and a first baffle valve is provided on the cleaning tube at the bottom of the cleaning box. The cleaning tube inside the cleaning box is covered with several through holes.

[0013] Optionally, a rotating column coaxial with the cleaning tube is rotatably provided inside the cleaning tube, and multiple rotating rods are provided on the rotating column. A second motor connected to the rotating column is provided at the top of the cleaning tube.

[0014] Optionally, the rotating rod is perpendicular to the rotating column and arranged radially along the cleaning tube, and the rotating rod is evenly distributed on the rotating column.

[0015] Optionally, the rotating column and rotating rod have interconnected hollow structures inside. The rotating rod is covered with several air holes. An air inlet sleeve is rotatably fitted on the outer wall of the top of the rotating column. The air inlet sleeve is fixed inside the cleaning pipe by a pull rod. An air supply pipe is connected to the air inlet sleeve.

[0016] Optionally, the feed pipe is connected to the cleaning pipe at the lower part of the air inlet sleeve.

[0017] Optionally, the air intake sleeve has a hollow structure inside, the air supply pipe is connected to the hollow cavity inside the air intake sleeve, and the rotating column at the hollow cavity inside the air intake sleeve is provided with multiple through holes, and the rotating column at the upper and lower parts of the through holes is rotatably sealed with the air intake sleeve.

[0018] Optionally, the vent is provided with a gas-dispersing block, the gas-dispersing block is filled with a number of pores through which gas can pass, and the gas-dispersing block is connected to the inner wall of the vent with an elastic gas film.

[0019] Optionally, the cleaning box includes a top plate and a bottom plate, with multiple baffles provided between the edges of the top plate and the bottom plate, and the air duct is disposed on the baffles.

[0020] Optionally, the baffle gradually decreases in size from the inside of the cleaning chamber to the outside.

[0021] Optionally, the top plate and the bottom plate are rectangular, and four frustum-shaped baffles are provided between the edges of the top plate and the bottom plate. The smaller diameter end of the baffles faces outward, and the air duct is located at the smaller diameter end of the baffle.

[0022] The beneficial effects of this utility model are:

[0023] This invention enables the injection molding granules to be cleaned and dried inside a cleaning chamber, preventing residual impurities or moisture from affecting the semiconductor encapsulation effect. The inner side of the cleaning tube is the air outlet, and the cleaning chamber on the outer side of the cleaning tube is equipped with an air duct as the air outlet, allowing the airflow to disperse outwards and improving the cleaning and drying effect of the injection molding granules. During the airflow process, the rotating column drives multiple rotating rods to stir the injection molding granules, and the air dispersion block moves back and forth to push the injection molding granules on its outer side, which greatly improves the fluidity of the injection molding granules in the cleaning tube, making it easier for the airflow to blow out impurities and moisture from the injection molding granules, thereby improving the cleaning and drying effect and efficiency of the injection molding granules. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a structural diagram of the present utility model;

[0026] Figure 2 Here is a structural diagram of the rotating column and rotating rod;

[0027] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0028] Reference numerals: 1. Top plate; 2. Bottom plate; 3. Cleaning pipe; 4. First gate valve; 5. Baffle; 6. Air duct; 7. Fan; 8. Tie rod; 9. Motor; 10. Feed pipe; 11. Second gate valve; 12. Air inlet sleeve; 13. Air delivery pipe; 14. Rotating column; 15. Rotating rod; 16. Air hole; 17. Air dispersion block; 18. Air film. Detailed Implementation

[0029] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of the invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0030] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0033] like Figures 1-3 As shown, this utility model discloses a semiconductor molding compound pretreatment device, including a cleaning chamber. Before the injection molding granules enter the injection molding machine, the cleaning chamber cleans the granules, removing impurities and moisture. The cleaning chamber includes a rectangular top plate 1 and a bottom plate 2. Four quadrangular prism-shaped baffles 5 are provided between the edges of the top plate 1 and the bottom plate 2, forming a closed space inside the cleaning chamber. The smaller diameter end of the baffles 5 faces outwards and is connected to an air duct 6. A fan 7 is installed on the air duct 6. The fan 7 operates to draw air from inside the cleaning chamber, causing the internal airflow to be discharged.

[0034] The cleaning chamber is equipped with a cleaning pipe 3, which passes through the center of the top plate 1 and the bottom plate 2 of the cleaning chamber. The bottom end of the cleaning pipe 3 extends out of the cleaning chamber. A first insert valve 4 is provided on the cleaning pipe 3 below the cleaning chamber. The bottom end of the cleaning pipe 3 is connected to the barrel of the injection molding machine.

[0035] The cleaning tube 3, located inside the cleaning chamber, has a perforated structure with numerous through-holes on its surface that prevent injection molding granules from passing through. A rotating column 14, coaxial with the cleaning tube 3, is rotatably mounted inside it. The bottom end of the rotating column 14 is located at the bottom plate 2 of the cleaning chamber, and its top end is rotatably connected to the top of the cleaning tube 3. A motor 9, connected to the rotating column 14, is mounted on the outer wall of the top of the cleaning tube 3. Multiple rotating rods 15 are distributed on the outer wall of the rotating column 14, perpendicular to it and arranged radially along the cleaning tube 3. The rotating rods 15 are evenly distributed on the rotating column 14.

[0036] The rotating column 14 and rotating rod 15 have interconnected hollow structures inside. An air inlet sleeve 12 is rotatably sleeved on the outer wall of the rotating column 14 near the top of the cleaning tube 3. A pull rod 8 is connected between the air inlet sleeve 12 and the top of the cleaning tube 3 to fix it. The air inlet sleeve 12 has a hollow cavity structure inside. An air supply pipe 13 is connected to the air inlet sleeve 12. The air supply pipe 13 communicates with the hollow cavity inside the air inlet sleeve 12. The rotating column 14 at the hollow cavity inside the air inlet sleeve 12 has multiple through holes. The rotating column 14 at the top and bottom of the through holes is rotatably sealed with the air inlet sleeve 12.

[0037] Multiple air holes 16 are evenly distributed on the rotating rod 15. Each air hole 16 contains a gas dispersion block 17, which is filled with numerous pores allowing gas to pass through. An elastic gas film 18 connects the gas dispersion block 17 to the inner wall of the air hole 16. The gas supply pipe 13 performs pulsed air intake. The supplied dry gas enters the air intake sleeve 12, then enters the rotating column 14 through the through-hole and disperses into each rotating rod 15. Finally, it is dispersed into the cleaning pipe 3 through the air holes 16 and gas dispersion blocks 17 on the rotating rod 15.

[0038] Pulsed air intake, that is, dry gas is intermittently introduced into the air supply pipe 13 at a certain high pressure. When the gas is introduced into the rotating rod 15, the gas diffuser block 17 disperses the gas outward. Under the condition of a large pressure difference between the inside and outside of the rotating rod 15, the gas diffuser block 17 protrudes outward into the air hole 16. The air film 18 expands elastically in response to the gas. The outward protrusion of the gas diffuser block 17 can agitate the injection molding granules on its outer side. When the air intake stops, the pressure difference between the inside and outside of the rotating rod 15 returns to normal. The air film 18 elastically contracts and drives the gas diffuser block 17 to retract into the air hole 16. The above process is repeated to achieve the outward protrusion and retraction of the gas diffuser block 17, thereby achieving the purpose of agitating the injection molding granules on the outer side of the gas diffuser block 17.

[0039] The top of the cleaning pipe 3 is connected to the feed pipe 10, which is connected to the cleaning pipe 3 at the bottom of the air inlet sleeve 12. The feed pipe 10 is equipped with a second slide valve 11.

[0040] The injection molding granules enter the top of the cleaning tube 3 through the feed pipe 10 and fill the cleaning tube 3 above the first baffle valve 4. Then the second baffle valve 11 closes, and the motor 9 drives the rotating column 14 to rotate. The rotating column 14 drives multiple rotating rods 15 to agitate the injection molding granules in the cleaning tube 3. During this process, the blower 7 operates, causing the air pipes 6 on the four baffles 5 to draw air into the cleaning box. The air supply pipe 13 sends dry gas into the rotating column 14 and rotating rods 15 in a pulsed air intake manner. The gas is finally dispersed into the cleaning tube 3 by the air diffuser 17 and blows the injection molding granules in the cleaning tube 3. Impurities and moisture in the injection molding granules flow to the outside of the cleaning tube 3 with the airflow and are sucked out by the air pipe 6. The pulsed air intake causes the air diffuser 17 to move back and forth periodically, agitating the injection molding granules, improving the fluidity of the injection molding granules, and improving the cleaning and drying effect of the injection molding granules.

[0041] Even when no air is introduced into the air supply pipe 13, the airflow can be generated in the cleaning box by adjusting the rotation direction of the fan 7 on the air duct 6. That is, some fans 7 introduce airflow into the cleaning box and other fans 7 draw airflow out of the cleaning box. This can also generate airflow for cleaning and drying the injection plastic in the cleaning box.

[0042] This invention enables the injection molding granules to be cleaned and dried inside a cleaning chamber, preventing residual impurities or moisture on the granules from affecting the semiconductor encapsulation effect. The inner side of the cleaning tube 3 is the air outlet, and the cleaning chamber outside the cleaning tube 3 is equipped with an air duct 6 as the air outlet, which allows the airflow to spread outward, improving the cleaning and drying effect of the injection molding granules. During the airflow blowing the injection molding granules, the rotating column 14 drives multiple rotating rods 15 to stir the injection molding granules, and the air dispersion block 17 moves back and forth to push the injection molding granules on its outer side, which greatly improves the fluidity of the injection molding granules in the cleaning tube 3, making it easier for the airflow to blow out impurities and moisture in the injection molding granules, thereby improving the cleaning and drying effect and efficiency of the injection molding granules.

[0043] The above embodiments are merely preferred embodiments of this utility model and are not intended to limit the technical solutions of this utility model. Any technical solution that can be implemented based on the above embodiments without creative effort should be considered to fall within the scope of protection of this utility model patent.

Claims

1. A semiconductor molding compound material pretreatment device, characterized in that, include: Cleaning box; Cleaning tube, located on the cleaning box; The air duct is located on the side of the cleaning box and connects to its interior. The fan is installed on the air duct; The cleaning tube is connected to a feed tube at the top, and a second baffle valve is provided on the feed tube. The bottom of the cleaning tube extends out of the cleaning box, and a first baffle valve is provided on the cleaning tube at the bottom of the cleaning box. The cleaning tube inside the cleaning box is covered with several through holes.

2. The semiconductor molding compound pretreatment apparatus according to claim 1, characterized in that, The cleaning tube is equipped with a rotating column that is coaxial with it, and the rotating column is provided with multiple rotating rods. The top of the cleaning tube is provided with a second motor that is connected to the rotating column for transmission.

3. The semiconductor molding compound pretreatment apparatus according to claim 2, characterized in that, The rotating rods are perpendicular to the rotating column and arranged radially along the cleaning pipe, and the rotating rods are evenly distributed on the rotating column.

4. The semiconductor molding compound pretreatment apparatus according to claim 2, characterized in that, The rotating column and rotating rod have interconnected hollow structures inside. The rotating rod is covered with several air holes. An air inlet sleeve is rotatably fitted on the outer wall of the top of the rotating column. The air inlet sleeve is fixed inside the cleaning pipe by a pull rod. An air supply pipe is connected to the air inlet sleeve.

5. The semiconductor molding compound pretreatment apparatus according to claim 4, characterized in that, The feed pipe is connected to the cleaning pipe at the bottom of the air inlet sleeve.

6. The semiconductor molding compound pretreatment apparatus according to claim 4, characterized in that, The air intake sleeve has a hollow structure inside, and the air supply pipe is connected to the hollow cavity inside the air intake sleeve. The rotating column at the hollow cavity inside the air intake sleeve is provided with multiple through holes, and the rotating column at the upper and lower parts of the through holes is rotatably sealed with the air intake sleeve.

7. The semiconductor molding compound pretreatment apparatus according to claim 4, characterized in that, The vent is equipped with a gas-dispersing block, which is filled with several pores through which gas can pass. An elastic gas film connects the gas-dispersing block to the inner wall of the vent.

8. The semiconductor molding compound pretreatment apparatus according to any one of claims 1 to 7, characterized in that, The cleaning box includes a top plate and a bottom plate, and multiple baffles are provided between the edges of the top plate and the bottom plate. The air duct is located on the baffles.

9. The semiconductor molding compound pretreatment apparatus according to claim 8, characterized in that, The size of the shield gradually decreases from the inside to the outside of the cleaning box.

10. The semiconductor molding compound pretreatment apparatus according to claim 8, characterized in that, The top plate and bottom plate are rectangular, and four frustum-shaped baffles are provided between the edges of the top plate and bottom plate. The smaller diameter end of the baffles faces outward, and the air duct is located at the smaller diameter end of the baffle.

Images