Ceramic chopper hole measuring device

By combining the light source assembly and the micro-hole image acquisition unit, the accuracy problem of micro-hole diameter and roundness measurement is solved, and efficient and accurate measurement of ceramic cleaver holes is achieved.

CN224230934UActive Publication Date: 2026-05-12SHENYUE SEMICONDUCTOR (SHENZHEN) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENYUE SEMICONDUCTOR (SHENZHEN) CO LTD
Filing Date
2025-06-27
Publication Date
2026-05-12

AI Technical Summary

Technical Problem

Existing technologies struggle to efficiently and accurately measure the diameter and roundness of micropores, especially the central through-hole of ceramic wedges, resulting in large measurement errors and unsuitable equipment.

Method used

Using a light source assembly and a micro-hole image acquisition unit, combined with preprocessing, index matrix establishment, and calculation units, the roundness and diameter of the micro-holes are calculated by acquiring bright images of the inner holes of a ceramic chopping tool.

Benefits of technology

It improves the measurement accuracy of micropore diameter and roundness, and ensures calculation speed and measurement accuracy.

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Abstract

A ceramic chopper hole measuring device belongs to the technical field of precision manufacturing equipment, and comprises a micropore image acquisition unit used for acquiring an inner hole image of a ceramic chopper, the micropore image acquisition unit is horizontally arranged, and a ceramic chopper transmission device is arranged in front of the micropore image acquisition unit; a light source assembly is arranged in front of the ceramic chopper transmission device, the light source assembly and the micropore image acquisition unit are located on the same horizontal axis, and the light source assembly and the micropore image acquisition unit are fixed to the supporting frame; and the micropore image acquisition unit calculates and determines the roundness of the inner hole of the ceramic chopper by acquiring a light image of the inner hole of the ceramic chopper.
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Description

Technical Field

[0001] This application belongs to the field of precision manufacturing equipment technology, and specifically relates to a ceramic cleaver hole measuring device. Background Technology

[0002] With the development of integrated circuits and avionics technology, the demand for high-precision micro-hole manufacturing is constantly increasing. Examples include damping holes in hydraulic transmission systems, connecting through-holes in PCB circuit boards, film cooling holes on aircraft blade surfaces, and fuel injection holes in engine nozzles. The manufacturing precision of these micro-holes significantly affects their performance and reliability. The diameter and roundness accuracy of the micro-holes after machining are crucial indicators for evaluating the quality and performance of micro-hole processing. This is especially true for ceramic wedges used in chip soldering processes, where the nominal diameter of the central through-hole is 50μm±0.5μm with a taper of 2°. These holes are small, and the requirements for diameter and roundness accuracy during machining are significant.

[0003] Due to the size of the micropores, mechanical contact measurement methods are difficult to directly measure the diameter and roundness of micropores. Existing microscopic imaging software is also difficult to perform efficient identification and measurement of large batches of micropores, and is subject to significant measurement errors due to differences in operator skill levels and equipment measurement errors.

[0004] Existing fiber optic probe methods for measuring micro-holes with large aspect ratios include: The "fiber optic probe sensing device, sensing method, and probe preparation method based on side laser coupling" described in application number 201810316350.7 couples a laser into an optical fiber, uses the confocal detection principle to collect the light emitted from the fiber onto a photoelectric sensor, and detects the fiber displacement through an elastic diaphragm. However, the inability to directly measure the micro-hole leads to inaccurate measurements, and the need for movement during measurement further increases the risk of data loss. Therefore, improving the measurement accuracy of micro-hole diameter and roundness is a pressing issue. Utility Model Content

[0005] The purpose of this invention is to provide a ceramic cleaver hole measuring device that overcomes or solves the above-mentioned problems, or at least some of them.

[0006] To achieve the above technical objectives, the following technical solution is provided: a ceramic chopping tool hole measuring device, comprising: a micro-hole image acquisition unit for acquiring images of the inner hole of a ceramic chopping tool, the micro-hole image acquisition unit being horizontally arranged and a ceramic chopping tool transmission device being arranged in front of it;

[0007] A light source assembly is installed in front of the ceramic chopping knife transmission device. The light source assembly and the micro-hole image acquisition unit are on the same horizontal axis and are fixed on the support frame.

[0008] The micro-hole image acquisition unit calculates and determines the roundness of the inner hole of the ceramic chopping tool by acquiring a bright image of the inner hole.

[0009] In one feasible embodiment, the light source assembly includes a ring-shaped LED polarized light source and an optical diffuser plate disposed behind the ring-shaped LED polarized light source; wherein the ring-shaped LED polarized light source is fixed to a support frame by a first bracket, and the optical diffuser plate is fixed to the support frame by a second bracket.

[0010] In one feasible embodiment, the ceramic chopping knife conveying device includes a conveyor belt with a support plate mounted on a support frame underneath; wherein the conveyor belt has a slot for defining the ceramic chopping knife.

[0011] In one feasible implementation, the cross-section of the conveyor belt surface is serrated, and the groove is a bottom groove formed between the teeth.

[0012] Among the feasible approaches are:

[0013] The preprocessing unit is used to preprocess the micropore image to obtain a binarized image of the micropore;

[0014] The index matrix building unit is used to build the index matrix of the binary image of the micropores;

[0015] The horizontal micropore size acquisition unit is used to read the matrix values ​​row by row according to the index matrix of the binary image of the micropores, and obtain the length of each row of the micropores by combining the scale bar, and obtain the diameter of the micropores in the horizontal direction according to the length of each row of the micropores.

[0016] The vertical micro-pore size acquisition unit is used to read matrix values ​​column by column according to the index matrix of the binary image of the micropore, and obtain the length of each column of the micropore by combining it with the scale bar. Based on the length of each column of the micropore, the vertical micropore diameter size is obtained.

[0017] The micropore roundness calculation unit is used to calculate the roundness of micropores based on the horizontal and vertical micropore diameters.

[0018] Compared with the prior art, the present invention has the following advantages:

[0019] Illuminating the cleaving hole with a light source ensures that the micro-hole image formed within the micro-hole image acquisition unit is clear, thereby improving calculation speed or further improving the measurement accuracy of micro-hole size features. Attached Figure Description

[0020] 1. Micro-aperture image acquisition unit; 2. Ceramic cleaver transmission device; 3. Light source assembly; 4. Support frame; 21. Conveyor belt; 22. Support plate; 31. Annular LED polarizing light source; 32. Optical diffuser plate; 41. First support; 42. Second support.

[0021] Figure 1 This is a schematic diagram of the structure of this embodiment; Detailed Implementation

[0022] like Figure 1 The embodiment shown includes a ceramic cleaver hole measuring device, comprising: a micro-hole image acquisition unit for acquiring images of the inner hole of a ceramic cleaver, the micro-hole image acquisition unit being horizontally positioned and a ceramic cleaver transmission device being positioned in front of it;

[0023] A light source assembly is installed in front of the ceramic chopping knife transmission device. The light source assembly and the micro-hole image acquisition unit are on the same horizontal axis and are fixed on the support frame.

[0024] The micro-hole image acquisition unit calculates and determines the roundness of the inner hole of the ceramic chopping tool by acquiring a bright image of the inner hole.

[0025] In this embodiment, the light source assembly includes a ring-shaped LED polarized light source and an optical diffuser plate disposed behind the ring-shaped LED polarized light source; wherein, the ring-shaped LED polarized light source is fixed on the support frame by a first bracket, and the optical diffuser plate is fixed on the support frame by a second bracket.

[0026] In this embodiment, the ceramic chopping knife conveying device includes a conveyor belt, and a support plate mounted on a support frame is provided below the conveyor belt; wherein the conveyor belt is provided with a slot for defining the ceramic chopping knife.

[0027] In this embodiment, the cross-section of the conveyor belt surface is serrated, and the groove is a bottom groove formed between the teeth.

[0028] In this embodiment, the ceramic cleaver hole measuring device further includes,

[0029] The preprocessing unit is used to preprocess the micropore image to obtain a binarized image of the micropore;

[0030] The index matrix building unit is used to build the index matrix of the binary image of the micropores;

[0031] The horizontal micropore size acquisition unit is used to read the matrix values ​​row by row according to the index matrix of the binary image of the micropores, and obtain the length of each row of the micropores by combining the scale bar, and obtain the diameter of the micropores in the horizontal direction according to the length of each row of the micropores.

[0032] The vertical micro-pore size acquisition unit is used to read matrix values ​​column by column according to the index matrix of the binary image of the micropore, and obtain the length of each column of the micropore by combining it with the scale bar. Based on the length of each column of the micropore, the vertical micropore diameter size is obtained.

[0033] The micropore roundness calculation unit is used to calculate the roundness of micropores based on the horizontal and vertical micropore diameters.

[0034] The micropore image acquisition unit reads the acquired micropore images and saves the calculated horizontal and vertical micropore dimensions and the roundness of the micropores into a preset matrix. After all acquired micropore images have been calculated, this matrix is ​​read into an Excel file for subsequent calibration.

[0035] The preprocessing unit is further used to: perform brightness enhancement processing on the micro-hole image to obtain a brightness image of the micro-hole; and perform filtering, noise reduction, enhancement, and binarization processing on the brightness image of the micro-hole to obtain a binarized image of the micro-hole. Specifically, the scale bar is obtained based on the pixel distance and size of the scale on the brightness image of the micro-hole; or, the scale bar is obtained based on the pixel distance and size of the reference object on the brightness image of the micro-hole.

[0036] The grayscale image of the micro-hole is filtered, denoised, and enhanced to remove noise signals and enhance effective pixels. The resulting image is then binarized and converted to a double-precision format, providing a basis for measuring the size characteristics of large-area micro-holes. Specifically, the scale is obtained based on the pixel distance and size of the scale on the brightness image of the micro-hole; or, the scale is obtained based on the pixel distance and size of a reference object on the brightness image of the micro-hole.

[0037] The pixel distance on a scale or reference object in the brightness image of the micro-hole is obtained using a cursor, and a scale is established using the scale size or reference object size. Specifically, the horizontal micro-hole diameter is obtained based on the row lengths of the micro-holes, including: comparing the row lengths of the micro-holes, taking the first N lengths, and setting the average of the first N lengths as the horizontal micro-hole diameter; where N is an integer greater than 1. Similarly, the vertical micro-hole diameter is obtained based on the column lengths of the micro-holes, including: comparing the column lengths of the micro-holes, taking the first N lengths, and setting the average of the first N lengths as the vertical micro-hole diameter; where N is an integer greater than 1.

[0038] To better understand the micropore size feature measurement method of this utility model embodiment, a specific example is used for illustration below.

[0039] First, the acquired microporous RGB image is read in using the image reading command. This microporous RGB image can be represented as A(m, n).

[0040] The micro-aperture RGB image is converted into a luminance image, which can be represented as S(m,n).

[0041] The brightness image is filtered, denoised, and enhanced to remove noise signals from the image and enhance the pixels. The enhanced brightness image can be represented as SK(m,n).

[0042] In the brightness image interface, the pixel distance on the scale or reference object on the brightness image is obtained by using the cursor, and then a scale is established by using the scale size or the actual size of the reference object.

[0043] Based on the global threshold iteration algorithm and combined with measurement experience, the obtained brightness image is binarized, and the local edge burrs of micropores and the influence of plastic deformation are filtered out. Furthermore, the format is converted into double precision type. The binarized image can be represented as K(m, n).

[0044] Read the number of rows m and columns n of the binarized image K(m,n), and build the index matrix of the binarized image K(m,n) based on this.

[0045] A cyclic scanning method is used to read the matrix values ​​of the binarized image row by row according to the index matrix. By summing the values ​​and combining them with the scale, the length of each row of micropores is obtained.

[0046] Compare the actual lengths of all rows, take the top three maximum values, and set their average as the micropore diameter in the horizontal direction.

[0047] The method for obtaining the vertical micropore diameter is similar to that for the horizontal direction. A cyclic scanning method is used, reading the matrix values ​​of the binarized image column by column based on the index matrix. The length of each column of the micropore is then obtained by summing the values ​​and combining this with a scale bar.

[0048] Compare the actual lengths of all columns, take the three largest values, and set their average as the vertical micropore diameter.

[0049] Those skilled in the art will understand that embodiments of this invention can be provided as methods, systems, or computer program products. Therefore, this invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this invention can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0050] It should be noted that:

[0051] The algorithms and displays provided herein are not inherently related to any particular computer, virtual machine, or other device. Various general-purpose devices can also be used in conjunction with the teachings herein. The required structure for constructing such devices is apparent from the above description. Furthermore, this invention is not directed to any particular programming language. It should be understood that the contents of this invention described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing the best mode of implementation of this invention.

[0052] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the present invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0053] Similarly, it should be understood that, in order to simplify the present invention and aid in understanding one or more of the various aspects of the invention, in the above description of exemplary embodiments of the present invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this disclosure should not be construed as reflecting an intention that the claimed invention requires more features than expressly recited in each claim. Rather, as reflected in the following claims, the inventive aspect lies in fewer than all features of the single embodiment disclosed above. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of the invention.

[0054] Those skilled in the art will understand that modules in the device of the embodiments can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or device so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0055] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features included in other embodiments but not others, combinations of features from different embodiments are intended to be within the scope of this invention and form different embodiments. For example, in the following claims, any of the claimed embodiments can be used in any combination.

[0056] The various component embodiments of this utility model can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of some or all of the components in the apparatus according to embodiments of this utility model. This utility model can also be implemented as a device or apparatus program (e.g., a computer program and computer program product) for performing part or all of the methods described herein. Such an implementation of this utility model can be stored on a computer-readable medium, or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0057] The above are merely specific embodiments of this utility model. Under the teachings of this utility model, those skilled in the art can make other improvements or modifications based on the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the purpose of this utility model, and the scope of protection of this utility model should be determined by the scope of the claims.

Claims

1. A ceramic cleaver hole measuring device, characterized in that, include: A micro-hole image acquisition unit (1) for acquiring images of the inner hole of a ceramic chopping knife, wherein the micro-hole image acquisition unit (1) is horizontally arranged and a ceramic chopping knife transmission device (2) is arranged in front of it; A light source assembly (3) is provided in front of the ceramic chopping knife transmission device (2). The light source assembly (3) and the micro-hole image acquisition unit (1) are on the same horizontal axis, and the light source assembly (3) and the micro-hole image acquisition unit (1) are fixed on the support frame (4). The micro-hole image acquisition unit (1) calculates and determines the roundness of the inner hole of the ceramic chopping knife by acquiring a bright image of the inner hole.

2. The ceramic cleaver hole measuring device according to claim 1, characterized in that, The light source assembly (3) includes an annular LED polarized light source (31) and an optical diffuser plate (32) disposed behind the annular LED polarized light source (31); wherein the annular LED polarized light source (31) is fixed on the support frame (4) by a first bracket (41) and the optical diffuser plate (32) is fixed on the support frame (4) by a second bracket (42).

3. The ceramic cleaver hole measuring device according to claim 2, characterized in that, The ceramic chopping knife transmission device (2) includes a transmission belt (21), and a support plate (22) is provided below the transmission belt (21) on the support frame (4); wherein the transmission belt (21) is provided with a slot for defining the ceramic chopping knife.

4. The ceramic cleaver hole measuring device according to claim 3, characterized in that, The cross-section of the surface of the conveyor belt (21) is sawtooth-shaped, and the groove is a bottom groove formed between the teeth.

5. The ceramic cleaver hole measuring device according to claim 1 or 4, characterized in that, Also includes: A preprocessing unit is used to preprocess the micropore image to obtain a binarized image of the micropore; An index matrix establishment unit is used to establish an index matrix for the binarized image of the micropores; The horizontal micropore size acquisition unit is used to read matrix values ​​row by row according to the index matrix of the binary image of the micropore, and obtain the length of each row of the micropore by combining it with the scale bar, and obtain the horizontal micropore diameter size according to the length of each row of the micropore. The vertical micro-hole size acquisition unit is used to read matrix values ​​column by column according to the index matrix of the binary image of the micro-hole, and obtain the length of each column of the micro-hole by combining it with the scale bar, and obtain the vertical micro-hole diameter size according to the length of each column of the micro-hole; The micropore roundness calculation unit is used to calculate the roundness of the micropore based on the micropore diameter in the horizontal direction and the micropore diameter in the vertical direction.