Circuit board module and electronic equipment
By setting spacer slots, through slots, and through holes on the circuit board, the hot airflow path is optimized, solving the problem of cold soldering or incomplete soldering of components in the surface mount soldering process, improving the soldering quality and protecting the safety of components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GUANGZHOU SHIKUN ELECTRONICS TECH CO LTD
- Filing Date
- 2025-04-23
- Publication Date
- 2026-05-12
AI Technical Summary
In existing surface mount soldering processes, cold solder joints or incomplete solder joints are prone to occur between components and circuit boards, and increasing the soldering temperature can easily burn out the components.
By setting spacer slots and through slots on the circuit board, increasing through holes, and extending the distance between components and the circuit board soldering part, the heat conduction of the hot airflow in the soldering furnace to the soldering part is enhanced. The design of spacer slots and through slots optimizes the hot airflow path and increases the soldering temperature.
It effectively solves the problems of cold soldering and incomplete soldering, improves the welding effect, and protects the safety of components.
Smart Images
Figure CN224233895U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board technology, and in particular to a circuit board module and electronic device. Background Technology
[0002] PCBA circuit boards for electronic devices typically have a variety of components soldered on them. Traditional soldering techniques involve inserting through-hole components onto the circuit board, a method that is slow. To address this, current technology has evolved to surface mount soldering (SMT) processes, where the component's soldering area and the circuit board's soldering area are soldered together using a surface-to-surface contact method. This soldering method is fast and efficient.
[0003] However, the inventors of this application have discovered that surface mount soldering processes are prone to the following problems: at normal soldering temperatures, the temperatures of the two solder joints are relatively low, making it easy for components and circuit boards to experience cold solder joints or incomplete soldering. Increasing the temperature in the soldering oven can easily burn out the components. Therefore, how to improve the soldering effect while ensuring the safety of components is an urgent problem to be solved. Utility Model Content
[0004] This application provides a circuit board module and electronic device that can effectively improve the soldering effect between surface mount components and circuit boards while ensuring the safety of surface mount components.
[0005] In a first aspect, one technical solution adopted in the embodiments of this application is: providing a circuit board module, including a first circuit board and a surface mount assembly. The first circuit board includes at least two first soldering portions, which are spaced apart along a first direction and separated by a first spacer groove. The surface mount assembly includes surface mount components and a second circuit board, with the surface mount components disposed on the second circuit board. The second circuit board includes at least two second soldering portions, which are spaced apart along the first direction and separated by a second spacer groove. The first soldering portions are soldered to the second soldering portions, and the first spacer groove communicates with the second spacer groove.
[0006] In some embodiments, along the second direction, the length L1 of the first spacer groove and the length L2 of the second spacer groove satisfy: L1≥L2, and the second direction is perpendicular to the first direction.
[0007] In some embodiments, along the second direction, a welding port is provided on the side of the second welding portion away from the surface mount component, and the distance L3 between the welding port and the surface mount component satisfies: L3≥8mm, and the second direction is perpendicular to the first direction.
[0008] In some embodiments, the first circuit board has a through first receiving groove and a first through groove, the surface mount components are housed in the first receiving groove, and along the second direction, the first through groove is located between the first receiving groove and the first spacer groove, and a portion of the second circuit board is exposed to the first through groove.
[0009] In some embodiments, the first through slot connects the first receiving slot and the first spacer slot.
[0010] In some embodiments, at least a portion of the wall of the first receiving groove abuts against the sidewall of the surface mount component.
[0011] In some embodiments, the first welding part is provided with a plurality of first through holes, and the second circuit board avoids at least a portion of the first through holes; and / or, the second welding part is provided with a plurality of second through holes, and at least a portion of the second through holes communicates with the first through groove.
[0012] In some embodiments, the first weld portion includes a first heat-conducting element, and a first through hole is disposed in the first heat-conducting element; and / or, the second weld portion includes a second heat-conducting element, and a second through hole is disposed in the second heat-conducting element.
[0013] In some embodiments, along the first direction, the width K1 of the first spacer groove satisfies: K1≥3mm, the width K2 of the second spacer groove satisfies: K2≥3mm; and / or, the diameter D1 of the first through hole satisfies: 0.2mm≤D1≤1mm, and the diameter D2 of the second through hole satisfies: 0.2mm≤D2≤1mm.
[0014] Secondly, another technical solution adopted in the embodiments of this application is to provide an electronic device, including a circuit board module.
[0015] The beneficial effects of the embodiments of this application are as follows: Firstly, by extending the distance between the surface mount components and the second solder joint of the second circuit board, the heat absorption of the surface mount components on the second solder joint of the second circuit board is reduced, thereby increasing the heat absorption of the solder joint of the second circuit board. Secondly, a first spacer groove is provided on the first circuit board, and a spacer groove is provided on the second circuit board. The first spacer groove and the second spacer groove are connected so that the hot airflow in the welding furnace can pass through the first spacer groove and the second spacer groove, thereby increasing the heat of the first solder joint of the first circuit board and the second solder joint of the second circuit board. Thirdly, a first through-slot is provided on the first circuit board, and the first through-slot is partially corresponding to the second circuit board, so that the hot airflow can blow onto the second circuit board, further increasing the heat of the second solder joint. Fourthly, a first through-hole is provided on the first solder joint, and a second through-hole is provided on the second solder joint, which is beneficial to increase the heat conduction of the hot airflow to the first solder joint and the second solder joint, thereby increasing the welding temperature of the two. Through the above structural settings, the phenomenon of cold soldering or poor soldering between surface mount components and circuit boards can be effectively solved, thereby improving the welding effect. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the specific embodiments of this application, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.
[0017] Figure 1 This is an exploded view of the circuit board module according to an embodiment of this application;
[0018] Figure 2 This is an exploded view of the circuit board module according to another embodiment of this application;
[0019] Figure 3 This is a schematic diagram of the circuit board module according to an embodiment of this application;
[0020] Figure 4 This is a schematic diagram of the circuit board module from another perspective in an embodiment of this application. Detailed Implementation
[0021] To facilitate understanding of this application, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," etc., used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.
[0023] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.
[0024] Surface mount soldering (SMT) is a method of soldering components to circuit boards using surface-to-surface contact in a high-temperature soldering oven. This method is fast and efficient. However, the inventors of this application have discovered that existing SMT soldering processes are prone to the following problems: at normal soldering temperatures, the temperatures of both the surface mount component's soldering area and the circuit board's soldering area are relatively low, and the surface mount components have a strong heat absorption capacity, making them susceptible to cold solder joints or incomplete solder joints. Increasing the soldering temperature in the oven can easily burn out the components.
[0025] To resolve the above issues, please refer to [link / reference]. Figures 1 to 4 This application provides a circuit board module 100, which includes a first circuit board 10 and a surface mount assembly 20, wherein the surface mount assembly 20 includes surface mount components 21 and a second circuit board 22. The circuit board module 100 of this application increases the heat conduction of hot airflow in the soldering furnace to the first soldering part 11 and the second soldering part 221 by appropriately adding through slots to the first circuit board 10 and the second circuit board 22, adding through holes to the first soldering part 11 and the second soldering part 221, and extending the distance between the surface mount components 21 and the soldering part of the second circuit board 22. This effectively solves the problem of cold soldering or incomplete soldering between the surface mount components 21 and the first circuit board 10 while protecting the surface mount components 21, thus improving the soldering quality of the circuit board module 100.
[0026] In some embodiments, please refer to Figure 1 For ease of description, the first circuit board 10 and the second circuit board 22 in this application both have a first direction X, a second direction Y, and a third direction Z that are perpendicular to each other. The third direction Z can also be understood as the thickness direction of the first circuit board 10 and the second circuit board 22. The first circuit board 10 and the second circuit board 22 are stacked on the third direction Z (e.g., Figure 3 (As shown).
[0027] Please see Figure 1 and Figure 2 The first circuit board 10 includes at least two first solder joints 11, which are spaced apart along a first direction X and separated by a first spacer groove 12. The first spacer groove 12 penetrates the first circuit board 10, meaning the two first solder joints 11 are spaced apart along the first direction X. The surface mount assembly 20 includes a surface mount component 21 and a second circuit board 22. The surface mount component 21 is disposed on the second circuit board 22 and electrically connected to it. As an example, the surface mount component 21 can be a surface mount transformer.
[0028] The second circuit board 22 includes at least two second solder portions 221, which are spaced apart along a first direction X and separated by a second spacer groove 224. The second spacer groove 224 penetrates the second circuit board 22, meaning the two second solder portions 221 are spaced apart along the first direction X. A first solder portion 11 is used for soldering to the second solder portions 221, and the first spacer groove 12 communicates with the second spacer groove 224 (e.g., ...). Figure 3 (As shown). In some embodiments, along the first direction X, the width K1 of the first spacer 12 satisfies: K1≥3mm. The width K2 of the second spacer 224 satisfies: K2≥3mm.
[0029] With the above structure, when the circuit board module 100 is placed in the welding furnace for heating and welding, compared with the prior art structure that does not have the first spacer groove 12 and the second spacer groove 224, the hot air flow in the welding furnace of this embodiment can be blown to the first welding part 11 and the second welding part 221 through the first spacer groove 12 and the second spacer groove 224, increasing the heat of the first welding part 11 and the second welding part 221, and realizing the effective welding of the two.
[0030] In some embodiments, along the second direction Y, the length L1 of the first spacer 12 can be less than the length L2 of the second spacer 224. In this embodiment, after the second circuit board 22 is stacked with the first circuit board 10, the space connecting the first spacer 12 and the second spacer 224 is relatively small, and the flow rate of hot gas in the welding furnace through the first spacer 12 and the second spacer 224 is limited. Therefore, in a preferred embodiment, please refer to... Figure 2 and Figure 3 Along the second direction Y, the length L1 of the first spacer 12 and the length L2 of the second spacer 224 satisfy: L1 ≥ L2. With this structure, even after the first circuit board 10 and the second circuit board 22 are stacked, the first spacer 12 and the second spacer 224 can still enclose a large space for the heating airflow to flow towards the first welding part 11 and the second welding part 221, increasing their temperature and facilitating welding. In some embodiments, along the second direction Y, the length L1 of the first spacer 12 satisfies: L1 ≥ 6 mm. The length L2 of the second spacer 224 satisfies: L2 ≥ 3 mm.
[0031] In some embodiments, please refer to Figure 2Along the second direction Y, a solder joint 222 is provided on the side of the second soldering part 221 away from the surface mount component 21. During soldering, solder is added to the solder joint 222 so that the solder connects the first soldering part 11 and the second soldering part 221 at high temperature to form an electrical connection. The distance L3 between the solder joint 222 and the surface mount component 21 satisfies: L3 ≥ 8 mm. The heat absorption capacity of the surface mount component 21 in the soldering oven is stronger than the heat absorption capacity of the second soldering part 221 on the second circuit board 22. If the distance between the solder joint 222 and the surface mount component 21 is too close, the heat on the second circuit board 22 will transfer from the second soldering part 221 to the surface mount component 21, resulting in insufficient soldering temperature at the second soldering part 221. In this embodiment of the application, by extending the distance between the welding joint 222 and the surface mount component 21, the heat transfer from the second welding part 221 to the surface mount component 21 can be effectively reduced, ensuring that the second welding part 221 has a higher welding temperature, and effectively solving the problem of cold welding in the first welding part 11 and the second welding part 221.
[0032] In some embodiments, please refer to Figure 1 and Figure 4 The first circuit board 10 has a through first receiving groove 13 and a first through groove 14. Along the second direction Y, the first through groove 14 is located between the first receiving groove 13 and the first spacer groove 12. When the first circuit board 10 and the second circuit board 22 are stacked, a portion of the surface mount component 21 is housed in the first receiving groove 13, and a portion of the second circuit board 22 is exposed to the first through groove 14. When the circuit board module 100 is placed in a soldering oven, the structure of the first through groove 14 exposing a portion of the second circuit board 22 allows hot airflow from the side of the first circuit board 10 away from the second circuit board 22 to be blown towards the second circuit board 22 through the first through groove 14, thereby increasing the temperature of the second circuit board 22.
[0033] Since the first through slot 14 is located between the first spacer slot 12 and the first receiving slot 13, the position of the second circuit board 22 exposed by the first through slot 14 corresponds to the position between the second solder part 221 and the surface mount component 21. That is, the temperature of the second circuit board 22 between the second solder part 221 and the surface mount component 21 can be increased to reduce the heat transfer from the second solder part 221 to the surface mount component 21, and even allow the heat from the second circuit board 22 to be conducted to the second solder part 221, thereby increasing the temperature of the second solder part 221.
[0034] In some embodiments, the first through slot 14 can be provided independently. In other embodiments, such as Figure 1As shown. The first through groove 14 connects the first receiving groove 13 and the first spacer groove 12. With the above arrangement, on the one hand, the difficulty of forming the first spacer groove 12, the first through groove 14 and the first receiving groove 13 on the first circuit board 10 can be reduced, and the processing efficiency can be improved; on the other hand, the space of the first through groove 14 can be increased, so that more hot air can flow to the second circuit board 22, thereby increasing the temperature of the second circuit board 22 and the second solder joint 221.
[0035] In some embodiments, at least a portion of the first receiving groove 13 abuts against the sidewall of the surface mount component 21, which enables the surface mount assembly 20 to be quickly positioned and assembled with the first circuit board 10. That is, when the surface mount component 21 is placed in the first receiving groove 13, the first soldering part 11 and the second soldering part 221 can complete the positioning connection, thereby improving assembly efficiency and soldering accuracy.
[0036] In some embodiments, please refer to Figure 3 and Figure 4 The first welding portion 11 is provided with a plurality of first through holes 111, and / or the second welding portion 221 is provided with a plurality of second through holes 223. Through this structure, without affecting the contact between the first welding portion 11 and the second welding portion 221, the surface area of the first welding portion 11 and the second welding portion 221 is increased. This allows the hot airflow in the welding furnace to increase heat conduction to the first welding portion 11 through the first through holes 111, and similarly, the hot airflow can increase heat conduction to the second welding portion 221 through the second through holes 223, thereby increasing the temperature of the first welding portion 11 and the second welding portion 221. It is understood that the number of first through holes 111 and the number of second through holes 223 can be one, two, three, or more.
[0037] In some embodiments, please refer to Figure 4 When the first circuit board 10 and the second circuit board 22 are stacked in the third direction Z, the second circuit board 22 avoids at least a portion of the first through hole 111, meaning that at least a portion of the first through hole 111 on the first welded part 11 is not blocked by the second circuit board 22, so that hot airflow can smoothly pass through the first through hole 111 to heat the first welded part 11. Similarly, a portion of the second welded part 221 is exposed in the first through groove 14, and at least a portion of the second through hole 223 communicates with the first through groove 14. Hot airflow in the welding furnace can pass through the first through groove 14 and circulate in the second through hole 223 to heat the second welded part 221. With the above structure, hot airflow can flow through the first through hole 111 and the second through hole 223, which can further increase the heat conduction to the first welded part 11 and the second welded part 221. As an example, the diameter D1 of the first through hole 111 satisfies: 0.2mm ≤ D1 ≤ 1mm, and the diameter D2 of the second through hole 223 satisfies: 0.2mm ≤ D2 ≤ 1mm.
[0038] In some embodiments, the first weld portion 11 includes a first heat-conducting element, and a first through-hole 111 is disposed on the first heat-conducting element; and / or, the second weld portion 221 includes a second heat-conducting element, and a second through-hole 223 is disposed on the second heat-conducting element. By providing materials with better thermal conductivity on the first weld portion 11 and the second weld portion 221 respectively, and by having the first through-hole 111 and the second through-hole 223 formed on the heat-conducting materials, the temperature of the first weld portion 11 and the second weld portion 221 is further increased, thereby improving the welding quality of both. As an example, the first heat-conducting element and the second heat-conducting element can be metallic copper.
[0039] This application also provides an embodiment of an electronic device, which includes the circuit board module 100 described above. For the specific structure and function of the circuit board module 100, please refer to the above embodiments, which will not be repeated here.
[0040] In this application embodiment, the circuit board module 100 firstly increases the heat absorption of the second solder joint 221 of the second circuit board 22 by extending the distance between the surface mount component 21 and the second solder joint 221 of the second circuit board 22. Secondly, a first spacer groove 12 is provided on the first circuit board 10, and a spacer groove is provided on the second circuit board 22. The first spacer groove 12 and the second spacer groove 224 are connected so that the hot air flow in the soldering furnace can pass through the first spacer groove 12 and the second spacer groove 224, thereby increasing the heat absorption of the first solder joint 11 of the first circuit board 10 and the second solder joint 221 of the second circuit board 22. The heat of the second welding part 221 is reduced; thirdly, a first through slot 14 is provided on the first circuit board 10, and the first through slot 14 is partially corresponding to the second circuit board 22, so that hot air can be blown to the second circuit board 22, further increasing the heat of the second welding part 221; fourthly, a first through hole 111 is provided on the first welding part 11, and a second through hole 223 is provided on the second welding part 221, which is conducive to increasing the heat conduction of hot air to the first welding part 11 and the second welding part 221, and increasing the welding temperature of the two. Through the above structural settings, the phenomenon of cold soldering or poor soldering between the surface mount component 21 and the circuit board can be effectively solved, and the welding effect can be improved.
[0041] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. A circuit board module, characterized in that, include: The first circuit board includes at least two first soldering portions, which are spaced apart along a first direction and separated by a first gap groove. The surface mount assembly includes surface mount components and a second circuit board. The surface mount components are disposed on the second circuit board. The second circuit board includes at least two second solder joints. The two second solder joints are spaced apart along a first direction and separated by a second spacer groove. The first solder joint is soldered to the second solder joint, and the first spacer groove is connected to the second spacer groove.
2. The circuit board module according to claim 1, characterized in that, Along the second direction, the length L1 of the first spacer groove and the length L2 of the second spacer groove satisfy: L1≥L2, and the second direction is perpendicular to the first direction.
3. The circuit board module according to claim 1, characterized in that, Along the second direction, the second welding part has a welding port on the side away from the surface mount component, and the distance L3 between the welding port and the surface mount component satisfies: L3≥8mm, and the second direction is perpendicular to the first direction.
4. The circuit board module according to claim 1, characterized in that, The first circuit board has a through first receiving groove and a first through groove. The surface mount components are housed in the first receiving groove. Along the second direction, the first through groove is located between the first receiving groove and the first spacer groove. A portion of the second circuit board is exposed to the first through groove. The second direction is perpendicular to the first direction.
5. The circuit board module according to claim 4, characterized in that, The first through slot connects the first receiving slot and the first spacer slot.
6. The circuit board module according to claim 4, characterized in that, At least a portion of the wall of the first receiving groove abuts against the sidewall of the patch component.
7. The circuit board module according to claim 4, characterized in that, The first welding part is provided with a plurality of first through holes, and the second circuit board avoids at least a portion of the first through holes; and / or, the second welding part is provided with a plurality of second through holes, and at least a portion of the second through holes communicate with the first through groove.
8. The circuit board module according to claim 7, characterized in that, The first welded portion includes a first heat-conducting element, and the first through hole is disposed in the first heat-conducting element; and / or, the second welded portion includes a second heat-conducting element, and the second through hole is disposed in the second heat-conducting element.
9. The circuit board module according to claim 7, characterized in that, Along the first direction, the width K1 of the first spacer groove satisfies: K1≥3mm, and the width K2 of the second spacer groove satisfies: K2≥3mm; and / or, The diameter D1 of the first through hole satisfies: 0.2mm≤D1≤1mm, and the diameter D2 of the second through hole satisfies: 0.2mm≤D2≤1mm.
10. An electronic device, characterized in that, Includes the circuit board module as described in any one of claims 1-9.