Circuit board lead-tin welding equipment with precise positioning function

Abstract

The utility model relates to the technical field of circuit boards, in particular to circuit board lead-tin welding equipment with an accurate positioning function, which comprises four translation parts and pressing parts arranged on the translation parts, the moving part is arranged on the translation part; the driving mechanism comprises a rotating part arranged below the translation part and a driving part arranged on one side of the rotating part; according to the circuit board lead-tin welding equipment with the precise positioning function, the circuit board body is placed through the supporting table, the screw rods are rotated correspondingly to enable the sliding blocks to move towards the center of the supporting table till the side walls of the sliding blocks abut against the side walls of the circuit board body correspondingly, and horizontal movement of the circuit board body is limited; the rack is pulled to drive the gear to rotate, so that the lead screw rotates, the movable plate in threaded connection with the lead screw moves upwards, the sliding rod moves upwards and abuts against the pressing plate, the pressing plate rotates with the fixed block as the circle center till the buffer balls abut against the upper wall of the circuit board body, and lead-tin welding of the circuit board body can be conducted by pulling the rack.

Description

Technical Field

[0001] This application relates to the technical field of circuit boards, and more particularly to lead-tin soldering equipment for circuit boards with precise positioning function. Background Technology

[0002] A circuit board, also known as a printed circuit board, is an indispensable basic component in electronic devices. A circuit board is a printed circuit board on an insulating substrate, with interconnecting lines and printed components formed according to a predetermined design. It is manufactured using electronic printing techniques to achieve electrical connections between electronic components.

[0003] Lead-tin soldering of circuit boards is mainly based on the principle that lead-tin alloy solder melts when heated to its melting point. With the help of flux, it wets the pads of the circuit board and the leads of electronic components, fills the gaps between connections, and forms a strong, conductive connection point after cooling and solidification. This soldering method utilizes atomic diffusion and metallurgical bonding between metals to achieve electrical and mechanical connections.

[0004] However, existing circuit boards only limit horizontal movement during lead-tin soldering. In the soldering process, the circuit board may move vertically, leading to soldering errors. Utility Model Content

[0005] In view of the aforementioned problem that existing circuit boards may move vertically during soldering, this application is made.

[0006] Therefore, the purpose of this utility model is to provide a circuit board lead-tin soldering equipment with precise positioning function, which aims to limit the vertical movement of the circuit board during soldering.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: including,

[0008] The clamping mechanism includes four translation parts, a clamping part disposed on the translation parts, and a moving part disposed on the translation parts;

[0009] The driving mechanism includes a rotating part disposed below the translation part and a driving part disposed on one side of the rotating part;

[0010] The driving unit drives the rotating unit to rotate, the moving unit moves upward, and the pressing unit rotates to limit the movement.

[0011] As a preferred embodiment of the circuit board lead-tin welding equipment with precise positioning function described in this utility model, the translation part is provided with a support mechanism, the support mechanism includes a support platform, a circuit board body disposed on the support platform, and a sliding part disposed on the support platform.

[0012] As a preferred embodiment of the circuit board lead-tin soldering equipment with precise positioning function described in this utility model, the sliding part includes four sliding grooves disposed on the support platform, and sliding blocks slidably disposed in the sliding grooves.

[0013] As a preferred embodiment of the circuit board lead-tin welding equipment with precise positioning function described in this utility model, the sliding part further includes a movable groove disposed on both sides of the sliding groove, and a movable block disposed in the movable groove and fixed to the sliding block.

[0014] As a preferred embodiment of the circuit board lead-tin welding equipment with precise positioning function described in this utility model, the translation part includes a sleeve fixedly disposed on the side wall of the sliding block, and a screw rotatably disposed on the side wall of the sleeve. The screw passes through the side wall of the sliding groove and is threadedly connected to it.

[0015] As a preferred embodiment of the circuit board lead-tin soldering equipment with precise positioning function described in this utility model, the pressing part includes a fixed block fixedly disposed on the upper wall of the sliding block, a pressing plate rotatably disposed on the upper wall of the fixed block, and a buffer ball fixedly disposed on the lower wall of the pressing plate.

[0016] As a preferred embodiment of the circuit board lead-tin soldering equipment with precise positioning function described in this utility model, the moving part includes a sliding rod slidably disposed in the sleeve, and a moving plate fixedly disposed on the lower wall of the sliding rod, wherein the moving plate is cross-shaped.

[0017] As a preferred embodiment of the circuit board lead-tin welding equipment with precise positioning function described in this utility model, the rotating part includes a lead screw rotatably disposed on the lower wall of the support platform, a gear fixedly sleeved on the lead screw, and the lead screw passing through the center of the moving plate and threadedly connected thereto.

[0018] As a preferred embodiment of the circuit board lead-tin welding equipment with precise positioning function described in this utility model, the driving unit includes a T-shaped groove disposed on the lower wall of the support platform, and a T-shaped plate slidably disposed in the T-shaped groove.

[0019] As a preferred embodiment of the circuit board lead-tin welding equipment with precise positioning function described in this utility model, the driving unit further includes a rack fixedly disposed on the lower wall of the T-shaped plate, and the rack meshes with the gear.

[0020] The beneficial effects of this utility model are as follows: By placing the circuit board body on the support platform, rotating the four screws causes the four sliding blocks to move towards the center of the support platform until the side walls of the sliding blocks abut against the side walls of the circuit board body, thus limiting the horizontal movement of the circuit board body; pulling the rack drives the gear meshing with it to rotate, thereby rotating the lead screw, and the moving plate threadedly connected to the lead screw moves upward, and the four sliding rods move upward, abutting against the pressing plate, causing it to rotate around the fixed block as the center, until the buffer balls abut against the upper wall of the circuit board body. Pulling the rack allows for lead-tin soldering of the circuit board body. Compared with the traditional method, the vertical movement of the circuit board body is limited, improving the yield of the circuit board. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0022] Figure 1 This is a first-person view schematic diagram of the overall structure of the circuit board lead-tin welding equipment with precise positioning function according to this utility model.

[0023] Figure 2 This is a second-view overall structural diagram of the circuit board lead-tin welding equipment with precise positioning function according to this utility model.

[0024] Figure 3 This utility model relates to a circuit board lead-tin soldering equipment with precise positioning function. Figure 1 Enlarged schematic diagram of the structure at point A in the middle.

[0025] Figure 4 This utility model relates to a circuit board lead-tin soldering equipment with precise positioning function. Figure 2 Enlarged schematic diagram of the structure at point B. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0029] Secondly, this utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of this utility model. In addition, actual manufacturing should include the three-dimensional spatial dimensions of length, width, and depth.

[0030] Example 1, referring to 1-4, is the first embodiment of this utility model, providing a circuit board lead-tin soldering device with precise positioning function. This device includes...

[0031] The clamping mechanism 2 includes four translation parts 21. A support mechanism 1 is provided on each translation part 21. The support mechanism 1 includes a support platform 11, a circuit board body 12 provided on the support platform 11, and a sliding part 13 provided on the support platform 11.

[0032] The sliding part 13 includes four sliding grooves 131 disposed on the support platform 11, and sliding blocks 132 slidably disposed in the sliding grooves 131. The sliding part 13 also includes moving grooves 133 disposed on both sides of the sliding grooves 131, and moving blocks 134 disposed in the moving grooves 133 and fixed to the sliding blocks 132.

[0033] The translation part 21 includes a sleeve 211 fixedly disposed on the side wall of the sliding block 132, and a screw 212 rotatably disposed on the side wall of the sleeve 211. The screw 212 passes through the side wall of the sliding groove 131 and is threadedly connected to it.

[0034] The translation part 21 is provided with a pressing part 22. The pressing part 22 includes a fixed block 221 fixedly disposed on the upper wall of the sliding block 132, a pressing plate 222 rotatably disposed on the upper wall of the fixed block 221, and a buffer ball 223 fixedly disposed on the lower wall of the pressing plate 222. The buffer ball 223 is disposed near the center of the support platform 11.

[0035] The translation part 21 is provided with a moving part 23, which includes a sliding rod 231 slidably disposed in the sleeve 211 and a moving plate 232 fixedly disposed on the lower wall of the sliding rod 231. The moving plate 232 is cross-shaped. The sliding rod 231 can move upward to abut against the pressing plate 222 and cause it to rotate.

[0036] A drive mechanism 3 is provided below the support platform 11, including a rotating part 31 located below the translation part 21. The rotating part 31 includes a lead screw 311 rotatably mounted on the lower wall of the support platform 11 and a gear 312 fixedly sleeved on the lead screw 311. The lead screw 311 passes through the center of the moving plate 232 and is threadedly connected to it.

[0037] A drive unit 32 is provided on one side of the rotating part 31. The drive unit 32 includes a T-shaped groove 322 provided on the lower wall of the support platform 11, and a T-shaped plate 323 slidably provided in the T-shaped groove 322. The drive unit 32 also includes a rack 321 fixedly provided on the lower wall of the T-shaped plate 323, and the rack 321 meshes with a gear 312.

[0038] During use, the circuit board body 12 is first placed on the support platform 11, and the four screws 212 are rotated to move the four sliding blocks 132 toward the center of the support platform 11 until the side walls of the sliding blocks 132 abut against the side walls of the circuit board body 12, thereby limiting the horizontal movement of the circuit board body 12.

[0039] Pulling the rack 321 drives the gear 312 that meshes with it to rotate, thereby rotating the lead screw 311. The moving plate 232, which is threadedly connected to the lead screw 311, moves upward, and the four sliding rods 231 move upward, pressing against the clamping plate 222, causing it to rotate around the fixed block 221 as the center, until the buffer balls 223 all press against the upper wall of the circuit board body 12. Pulling the rack 321 allows for lead-tin soldering of the circuit board body 12. This device limits the vertical movement of the circuit board body 12, improving the yield of the circuit board.

[0040] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments without departing from the scope of this invention. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims. Furthermore, for the purpose of providing a concise description of the exemplary embodiments, not all features of the actual embodiments (i.e., those features not relevant to the currently considered best mode for carrying out this invention, or those features not relevant to implementing this invention) may be omitted.

[0041] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A circuit board lead-tin soldering equipment with precise positioning function, characterized in that: include, The clamping mechanism (2) includes four translation parts (21), a clamping part (22) disposed on the translation parts (21), and a moving part (23) disposed on the translation parts (21). The drive mechanism (3) includes a rotating part (31) disposed below the translation part (21) and a drive part (32) disposed on one side of the rotating part (31). The driving part (32) drives the rotating part (31) to rotate, the moving part (23) moves upward, and the pressing part (22) rotates to limit the movement.

2. The circuit board lead-tin soldering equipment with precise positioning function according to claim 1, characterized in that: The translation part (21) is provided with a support mechanism (1), which includes a support platform (11), a circuit board body (12) provided on the support platform (11), and a sliding part (13) provided on the support platform (11).

3. The circuit board lead-tin soldering equipment with precise positioning function according to claim 2, characterized in that: The sliding part (13) includes four sliding grooves (131) disposed on the support platform (11) and sliding blocks (132) slidably disposed in the sliding grooves (131).

4. The circuit board lead-tin soldering equipment with precise positioning function according to claim 3, characterized in that: The sliding part (13) further includes a moving groove (133) disposed on both sides of the sliding groove (131), and a moving block (134) disposed in the moving groove (133) and fixed to the sliding block (132).

5. The circuit board lead-tin soldering equipment with precise positioning function according to claim 3 or 4, characterized in that: The translation part (21) includes a sleeve (211) fixedly disposed on the side wall of the sliding block (132) and a screw (212) rotatably disposed on the side wall of the sleeve (211). The screw (212) is disposed through the side wall of the sliding groove (131) and threadedly connected to it.

6. The circuit board lead-tin soldering equipment with precise positioning function according to claim 5, characterized in that: The pressing part (22) includes a fixed block (221) fixedly disposed on the upper wall of the sliding block (132), a pressing plate (222) rotatably disposed on the upper wall of the fixed block (221), and a buffer ball (223) fixedly disposed on the lower wall of the pressing plate (222).

7. The circuit board lead-tin soldering equipment with precise positioning function according to claim 6, characterized in that: The moving part (23) includes a sliding rod (231) slidably disposed in the sleeve (211) and a moving plate (232) fixedly disposed on the lower wall of the sliding rod (231). The moving plate (232) is cross-shaped.

8. The circuit board lead-tin soldering equipment with precise positioning function according to claim 7, characterized in that: The rotating part (31) includes a lead screw (311) rotatably disposed on the lower wall of the support platform (11) and a gear (312) fixedly sleeved on the lead screw (311). The lead screw (311) passes through the center of the moving plate (232) and is threadedly connected to it.

9. The circuit board lead-tin soldering equipment with precise positioning function according to claim 8, characterized in that: The drive unit (32) includes a T-shaped groove (322) disposed on the lower wall of the support platform (11) and a T-shaped plate (323) slidably disposed in the T-shaped groove (322).

10. The circuit board lead-tin soldering equipment with precise positioning function according to claim 9, characterized in that: The drive unit (32) also includes a rack (321) fixedly disposed on the lower wall of the T-shaped plate (323), the rack (321) meshing with the gear (312).

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