Bearing device and semiconductor process chamber

Abstract

The utility model discloses a bearing device and a semiconductor process chamber, the disclosed bearing device (01) comprises a plurality of bearing boats (10) which are stacked in sequence, at least one of two adjacent bearing boats (10) is provided with a spacing part (16), and the spacing part (16) is provided with a plurality of through holes (20). The two adjacent bearing boats (10) are supported and matched through the at least two spacing parts (16) and are distributed at intervals through the at least two spacing parts (16); and the at least two spacing parts (16) are distributed at intervals. According to the scheme, the problem that in the background technology, the semiconductor sheet process uniformity is poor due to the fact that the bearing boats are stacked and supported through the mounting bases can be solved.

Description

Technical Field

[0001] This application belongs to the field of semiconductor process equipment technology, specifically relating to a carrier device and a semiconductor process chamber. Background Technology

[0002] Chemical vapor deposition (CVD) equipment plays a crucial role in semiconductor manufacturing processes. In the specific process, semiconductor wafers are placed on a carrier boat and moved in and out of the process space. Taking solar cell production as an example, the silicon wafers (a specific semiconductor material) used to manufacture solar cells are placed on the carrier boat and then transported to the CVD equipment's process space to deposit a silicon nitride film. The silicon nitride film reduces reflection, thereby improving the photoelectric conversion efficiency of the solar cell.

[0003] To improve process throughput, related technologies in chemical vapor deposition (CVD) aim to increase the size of the carrier boat to accommodate more semiconductor wafers per process, but the effect is limited. Other technologies involve stacking carrier boats to increase the number of semiconductor wafers per process; however, the mounting brackets between the carrier boats provide support, but these brackets can obstruct the flow of process gases between the carrier boats, affecting process uniformity and ultimately leading to poor semiconductor wafer processing results. Utility Model Content

[0004] This utility model discloses a carrier device and a semiconductor process chamber to solve the problem in the background art where the carrier boats are stacked and supported by mounting bases, which leads to poor uniformity of semiconductor wafer processing.

[0005] To solve the above-mentioned technical problems, this application provides the following technical solution:

[0006] In a first aspect, this utility model discloses a support device, which includes a plurality of support boats stacked sequentially, wherein at least one of two adjacent support boats is provided with a spacer member, and the two adjacent support boats are supported and cooperated by at least two spacer members and are spaced apart by the at least two spacer members; the at least two spacer members are spaced apart.

[0007] Secondly, this utility model discloses a semiconductor process chamber, which includes a chamber body and the support device described in the first aspect. The chamber body has a process space, and the support device is disposed in the process space.

[0008] The supporting device disclosed in this embodiment of the utility model has the following technical effects:

[0009] The carrier device disclosed in this embodiment of the utility model is designed so that adjacent carrier boats are separated by at least two spacer members. This allows the process gas in the gap between adjacent carrier boats to flow through the spacer members during the process, thereby improving the flow capacity of the process gas in the carrier device and making the process gas flow field in the carrier device more uniform. This results in better process uniformity of the semiconductor wafer loaded in the carrier device. Attached Figure Description

[0010] Figure 1 This is a structural schematic diagram of a bearing device disclosed in an embodiment of this utility model;

[0011] Figure 2 This is a partial structural schematic diagram of another bearing device disclosed in an embodiment of this utility model;

[0012] Figure 3 yes Figure 1 The diagram shows the structure from other perspectives;

[0013] Figure 4 This is a partial structural schematic diagram of the semiconductor process chamber disclosed in an embodiment of this utility model;

[0014] Figure 5 This is a partial structural schematic diagram of the semiconductor process chamber disclosed in an embodiment of this utility model;

[0015] Figures 6 to 9 These are exploded schematic diagrams of parts of the load-bearing devices with different structures.

[0016] Explanation of reference numerals in the attached figures:

[0017] 01-Bearing device, 10-Bearing boat, 11-Boat piece, 12-Conductive structure, 13-Sheet groove, 14-First connecting structure, 15-Second connecting structure, 16-Spacer component, 161-Spacer body, 162-Connecting protrusion, 17-Insulating boat foot, 18-Conductive boat foot, 101-Odd-numbered boat pieces, 102-Even-numbered boat pieces, 103-First sub-conductive structure, 104-Second sub-conductive structure, 111-First boat ear, 112-Second boat ear, 113-First electrical connection block, 114-Second electrical connection block, 1211-Plug-in slot, 1212-Plug-in protrusion

[0018] 02-Cavity body, 021-Process space, 022-Front-end electrode, 023-Rear-end electrode, 024-Support rod. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0020] The technical solutions disclosed in the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0021] Please refer to Figures 1 to 9 This utility model discloses a carrier device 01. The carrier device 01 can be used as part of a semiconductor process chamber. The semiconductor process chamber is part of semiconductor process equipment, which may be chemical vapor deposition equipment, etc.

[0022] The carrier device 01 disclosed in this embodiment of the present invention includes a plurality of carrier boats 10 stacked in sequence. The plurality of carrier boats 10 may be two carrier boats 10 or more (two or more) carrier boats 10. This embodiment of the present invention does not limit the number of carrier boats 10 included in the carrier device 01.

[0023] At least one of two adjacent support boats 10 is provided with a spacer member 16. The two adjacent support boats 10 are supported and engaged by at least two spacer members 16 and are spaced apart by the at least two spacer members 16. The at least two spacer members 16 are spaced apart, meaning that all spacer members 16 located between the two adjacent support boats 10 do not contact each other, thereby creating a gap between the spacer members 16 between the two adjacent support boats 10.

[0024] That is, the spacers 16 between two adjacent carrier boats 10 are spaced apart to form a first gap, and the two adjacent carrier boats 10 are separated by the spacers 16 between them, so that a second gap is formed between the two adjacent carrier boats 10, and the first gap and the second gap are connected.

[0025] The carrier device 01 disclosed in this embodiment of the present invention is designed such that adjacent carrier boats 10 are separated by at least two spacer members 16, which are spaced apart. This allows the process gas in the gap between adjacent carrier boats 10 to flow through the spacer members 16 during the process, thereby improving the flow capacity of the process gas in the carrier device 01 and making the process gas flow field in the carrier device 01 more uniform. This results in better process uniformity of the semiconductor wafer loaded in the carrier device 01, for example, enabling the coating of the semiconductor wafer to have better uniformity.

[0026] In this embodiment of the invention, the spacer 16 functions as a spacer, thereby creating a second gap between two adjacent support boats 10. In one embodiment, the spacer 16 can be an insulating component. In this case, two adjacent support boats 10 can be insulated from each other by the spacer 16, which also serves to support the upper support boat.

[0027] When the spacer 16 is an insulating component, among the multiple carrier boats 10 included in the carrier device 01, the lowermost carrier boat 10 has at least two conductive boat feet 18 for connecting to radio frequency. The rear end of the multiple carrier boats 10 is provided with a radio frequency jack, so that the other carrier boats 10 can be connected to radio frequency from the rear end. The front end and the rear end of the carrier boat 10 are the two ends of the carrier boat 10 distributed along its length direction.

[0028] The rear end of the lowest carrier boat can also be equipped with an RF jack to facilitate subsequent boat replacement or temporary changes to the electrode feeding method.

[0029] It should be noted that after the carrier boat 10 is placed in the semiconductor process chamber, the front end of the carrier boat 10 faces the chamber opening of the semiconductor process chamber, and the rear end of the carrier boat 10 faces away from the chamber opening of the semiconductor process chamber. In the embodiment where the semiconductor process chamber is a horizontal furnace, after the carrier boat 10 is placed in the horizontal furnace, the front end of the carrier boat 10 faces the furnace opening of the horizontal furnace, and the rear end of the carrier boat 10 faces away from the furnace opening of the horizontal furnace. Compared with the prior art where all carrier boats 10 are connected to the electrical terminals of the RF power supply via their rear ends, in this structure, the lowermost carrier boat 10 does not need to be connected to the RF power supply via its rear end. This reduces the need for extensive alignment work when connecting the carrier device 01 to the electrical terminals of the RF power supply in the rear direction, making the connection process easier.

[0030] In this embodiment of the invention, each carrier boat 10 includes multiple boat pieces 11 and multiple conductive structures 12. In each carrier boat 10, one of two adjacent boat pieces 11 is an odd-numbered boat piece 101, and the other is an even-numbered boat piece 102. All odd-numbered boat pieces 101 and all even-numbered boat pieces 102 in each carrier boat 10 are electrically connected through corresponding conductive structures 12. That is, in each carrier boat 10, all odd-numbered boat pieces 101 are electrically connected through their corresponding conductive structures 12, thereby making all odd-numbered boat pieces 101 have the same potential, and all even-numbered boat pieces 102 are electrically connected through their corresponding conductive structures 12, thereby making all even-numbered boat pieces 102 have the same potential. It should be noted that in each carrier boat 10, odd-numbered boat pieces 101 and even-numbered boat pieces 102 are insulated from each other, that is, odd-numbered boat pieces 101 and even-numbered boat pieces 102 are not electrically connected. Each of the two adjacent boats 11 is provided with a sheet groove 13 facing the other. The sheet groove 13 is used to place semiconductor sheets (such as silicon wafers) during semiconductor processing.

[0031] The semiconductor process chamber of this embodiment includes a radio frequency (RF) power supply. Odd-numbered wafers 101 are electrically connected to a first terminal of the RF power supply, and even-numbered wafers 102 are electrically connected to a second terminal of the RF power supply at a different potential. In this configuration, adjacent wafers 11 within each carrier 10 have different potentials during semiconductor processing, thereby enabling the semiconductor wafer located between two adjacent wafers 11 to undergo semiconductor processing within an electric field formed by the adjacent odd-numbered wafers 101 and even-numbered wafers 102. It should be noted that one of the first and second terminals is used for RF positive input, and the other for RF negative input.

[0032] In the carrier device 01 disclosed in this embodiment of the present utility model, the spacer 16 between two adjacent carrier boats 10 can be distributed in groups, each group of spacer 16 can include at least two spacer 16, and each group of spacer 16 can be distributed at intervals in the width direction of the carrier boat 10.

[0033] In one embodiment, the spacer members 16 between two adjacent support boats 10 are distributed in a group. To improve the stability of the support, the spacer members 16 between two adjacent support boats 10 can be distributed in multiple groups. Multiple groups of spacer members 16 can be distributed along the length direction of the support boat 10. Specifically, multiple groups of spacer members 16 can be evenly distributed along the length direction of the support boat 10, and each group of spacer members 16 is spaced apart along the width direction of the support boat 10, thereby forming the second gap mentioned above. It should be noted that the direction in which the support device 01 enters and exits the semiconductor process chamber through the chamber opening of the semiconductor process chamber can be considered as the length direction of the support boat 10. The arrangement direction of the boat pieces 11 in each support boat 10 can be considered as the width direction of the support boat 10. The length direction of the support boat 10 is perpendicular to the width direction of the support boat 10, and is also perpendicular to the stacking direction of the support boats 10.

[0034] To improve stacking stability, in one embodiment, the spacer 16 connecting one of two adjacent carrier boats 10 may be provided with an insertion slot 1211, and the other with an insertion protrusion 1212 protruding along the stacking direction of the carrier boats 10. The two adjacent carrier boats 10 are positioned and engaged by the insertion of the insertion protrusion 1212 into the insertion slot 1211. In another embodiment, the spacer 16 connecting one of two adjacent carrier boats 10 may be provided with an insertion protrusion 1212 protruding in the stacking direction, and the other with an insertion slot 1211. The two adjacent carrier boats 10 are positioned and engaged by the insertion of the insertion protrusion 1212 into the insertion slot 1211.

[0035] To further improve stacking stability, there can be multiple insertion slots 1211 and multiple insertion protrusions 1212. Multiple insertion protrusions 1212 can be inserted one-to-one into multiple insertion slots 1211. Alternatively, adjacent support boats 10 can be positioned by the insertion of one insertion slot 1211 and one insertion protrusion 1212. This embodiment of the invention does not limit the number of insertion protrusions 1212 and insertion slots 1211 between adjacent support boats 10.

[0036] In this embodiment of the invention, the shapes of the insertion groove 1211 and the insertion protrusion 1212 are adapted to each other. This embodiment does not limit the specific shapes of the insertion groove 1211 and the insertion protrusion 1212. In one embodiment, the insertion groove 1211 can be a through groove extending along the length of the support boat 10. In another embodiment, the insertion groove 1211 can be a closed groove formed by connecting the inner walls of multiple grooves end-to-end. A closed groove 1211 can restrict the insertion protrusion 1212 in more directions, thereby achieving better positioning with the insertion protrusion 1212 and further improving the stability of stacking adjacent support boats 10.

[0037] As described above, at least one of two adjacent support boats 10 is provided with a spacer 16. In one embodiment, only the upper support boat 10 of the two adjacent support boats 10 is provided with at least two spacer 16, while the lower support boat 10 is not provided with a spacer 16. In another embodiment, only the lower support boat 10 of the two adjacent support boats 10 is provided with at least two spacer 16, while the upper support boat 10 is not provided with a spacer 16. In yet another embodiment, both adjacent support boats 10 are provided with spacer 16. Each of the two adjacent support boats 10 may have at least one spacer 16, and of course, each support boat 10 may have two or more spacer 16; this embodiment of the present invention does not impose any limitation.

[0038] Two adjacent support boats 10 are supported and cooperated by at least two spacer members 16. As described above, the support device 01 disclosed in this utility model embodiment may include a plurality of boat pieces 11 and a plurality of conductive structures 12. The at least two spacer members 16 between two adjacent support boats 10 may be supported between the boat pieces 11 of the two adjacent support boats 10 or between the conductive structures 12 of the two adjacent support boats 10. This utility model embodiment does not impose any limitations.

[0039] Because the boat piece 11 is relatively thin, to prevent deformation of the boat piece 11, the spacer member 16 can be connected to the conductive structure 12 of the supporting boat 10. In each supporting boat 10, one of two adjacent boat pieces 11 is an odd-numbered boat piece 101, and the other is an even-numbered boat piece 102. All odd-numbered boat pieces 101 and all even-numbered boat pieces 102 in each supporting boat 10 are electrically connected through corresponding conductive structures 12; the at least two spacer members 16 are supported between the conductive structures 12 of two adjacent supporting boats 10.

[0040] In this embodiment of the present invention, the conductive structure 12 can have various structures, and this embodiment of the present invention does not impose any limitations. This embodiment of the present invention discloses a conductive structure 12 with a specific structure, which may include a first sub-conductive structure 103 and a second sub-conductive structure 104.

[0041] In the conductive structure 12 connecting the odd-numbered planks 101, the first sub-conductive structure 103 is electrically connected to all the odd-numbered planks 101 within the support boat 10 at the bottom of the first end of the support boat 10, and the second sub-conductive structure 104 is electrically connected to all the odd-numbered planks 101 within the support boat 10 at the top of the second end of the support boat 10. This conductive structure 12 allows for multiple electrical connections between all the odd-numbered planks 101 within the support boat 10, thereby improving the stability of the electrical connections between all the odd-numbered planks 101 within the support boat 10.

[0042] In the conductive structure 12 connecting the even-numbered boat pieces 102, the first sub-conductive structure 103 electrically connects all the even-numbered boat pieces 102 at the bottom of the second end of the supporting boat 10, and the second sub-conductive structure 104 electrically connects all the even-numbered boat pieces 102 at the top of the first end of the supporting boat 10. Similarly, this conductive structure 12 allows all the even-numbered boat pieces 102 within the supporting boat 10 to be electrically connected at multiple points, thereby improving the stability of the electrical connections of all the even-numbered boat pieces 102 within the supporting boat 10.

[0043] In two adjacent support boats 10, the at least two spacer members 16 are supported between the first sub-conductive structure 103 of the upper support boat 10 and the second sub-conductive structure 104 of the lower support boat 10. It should be noted that the first end of the support boat 10 is one of the front end and the rear end of the support boat 10, and the second end of the support boat 10 is the other of the front end and the rear end of the support boat 10.

[0044] In a further embodiment, in the conductive structure 12 connecting the odd number of boat pieces 101, the first sub-conductive structure 103 and the second sub-conductive structure 104 can be respectively connected at two opposite corners of the odd number of boat pieces 101; in the conductive structure 12 connecting the even number of boat pieces 102, the first sub-conductive structure 103 and the second sub-conductive structure 104 can be respectively connected at two opposite corners of the even number of boat pieces 102.

[0045] Since one of the two adjacent boat pieces 11 in each carrier boat 10 is an odd-numbered boat piece 101 and the other is an even-numbered boat piece 102, and the odd-numbered boat pieces 101 and even-numbered boat pieces 102 have different potentials during semiconductor processing, the conductive structure 12 that electrically connects the odd-numbered boat pieces 101 needs to be insulated from the even-numbered boat pieces 102 in the same carrier boat 10. Similarly, the conductive structure 12 that electrically connects the even-numbered boat pieces 102 needs to be insulated from the odd-numbered boat pieces 101 in the same carrier boat 10. To facilitate insulation, in a further embodiment, the bottom of the odd-numbered boat piece 101 located at the first end of the carrier boat 10 and the bottom of the even-numbered boat piece 102 located at the second end of the carrier boat 10 are both electrically connected to a first boat ear 111 protruding along the length direction, and the top of the even-numbered boat piece 102 located at the first end of the carrier boat 10 and the top of the odd-numbered boat piece 101 located at the second end of the carrier boat 10 are both electrically connected to a second boat ear 112 protruding along the length direction. The first boat ear 111 is electrically connected to the corresponding first sub-conductive structure 103, and the second boat ear 112 is electrically connected to the corresponding second sub-conductive structure 104.

[0046] In this embodiment, the arrangement of the first lug 111 and the second lug 112 makes it easy for the conductive structure 12 of the odd-numbered boat pieces 101 to not contact the even-numbered boat pieces 102, thereby achieving the purpose of insulation. It also makes it easy for the conductive structure 12 of the even-numbered boat pieces 102 to not contact the odd-numbered boat pieces 101, thereby achieving the purpose of insulation.

[0047] In this embodiment of the invention, the first sub-conductive structure 103 and the second sub-conductive structure 104 can have various structures. In one embodiment, the first sub-conductive structure 103 is an integral conductive base. The conductive base can extend multiple fins to be electrically connected to all odd-numbered tabs 101 or even-numbered tabs 102, respectively. Simultaneously, all odd-numbered tabs 101 or even-numbered tabs 102 electrically connected to the conductive base can be supported on the conductive base. Similarly, the structure of the second sub-conductive structure 104 can be the same as that of the first sub-conductive structure 103.

[0048] In another embodiment, the first sub-conductive structure 103 may include a plurality of first electrical connection blocks 113 arranged in a row and respectively sandwiched between the first lugs 111 corresponding to the odd-numbered boat pieces 101 or between the first lugs 111 corresponding to the even-numbered boat pieces 102. Two adjacent odd-numbered boat pieces 101 can be electrically connected by a corresponding first electrical connection block 113 located between the first lugs 111 of the odd-numbered boat pieces 101, and two adjacent even-numbered boat pieces 102 can be electrically connected by a corresponding first electrical connection block 113 located between the first lugs 111 of the even-numbered boat pieces 102. Similarly, the second sub-conductive structure 104 may include a plurality of second electrical connection blocks 114 arranged in a row and respectively sandwiched between the second lugs 112 corresponding to the odd-numbered boat pieces 101 or between the second lugs 112 corresponding to the even-numbered boat pieces 102. Two adjacent odd-numbered boat pieces 101 can be electrically connected through a corresponding second electrical connection block 114 located between the second lugs 112 of the two adjacent odd-numbered boat pieces 101, and two adjacent even-numbered boat pieces 102 can be electrically connected through a corresponding second electrical connection block 114 located between the second lugs 112 of the two adjacent even-numbered boat pieces 102. It should be noted that the embodiments of this utility model do not limit the specific structure of the first sub-conductive structure 103 and the second sub-conductive structure 104.

[0049] The carrier boat 10 disclosed in this embodiment may further include at least one first connecting structure 14. The first connecting structure 14 is used to fix all the boat pieces 11 in the carrier boat 10 together, while ensuring that adjacent boat pieces 11 are insulated. In one embodiment, the first connecting structure 14 may include a first bolt, a first nut, and a plurality of insulating blocks (e.g., ceramic blocks). Adjacent boat pieces 11 in the carrier boat 10 can be insulated from each other by an insulating block. After the first bolt passes through all the boat pieces 11 and insulating blocks in the carrier boat 10, it is threadedly locked with the first nut, thereby fixing all the boat pieces 11 and all the insulating blocks in the carrier boat 10 between the first nut and the nut of the first bolt.

[0050] To improve the stability of the fastening, each carrier boat 10 may include multiple first connecting structures 14, which are distributed at different locations on the carrier boat 10, thereby achieving fastening at multiple local locations on the carrier boat 10. Under the fastening of the first connecting structures 14, multiple first electrical connecting blocks 113 are clamped and fixed between the first boat ears 111, and multiple second electrical connecting blocks 114 are clamped and fixed between the second boat ears 112.

[0051] To prevent the first electrical connection block 113 from potentially falling off, and also to prevent the second electrical connection block 114 from potentially falling off, the carrier boat 10 disclosed in this embodiment of the invention may further include multiple second connection structures 15. Each first sub-conductive structure 103 and each second sub-conductive structure 104 is equipped with at least one second connection structure 15. The second connection structure 15 may include a second bolt and a second nut. The second bolt passes through all the first lugs 111 and the first electrical connection blocks 113 or the second lugs 112 and the second electrical connection blocks 114, and is threadedly fixed to the second nut. This ensures that all the first lugs 111 and the first electrical connection blocks 113 are fastened between the corresponding second bolt nut and the second nut, and also ensures that all the second lugs 112 and the second electrical connection blocks 114 are fastened between the corresponding second bolt nut and the second nut. This structure allows the second bolt to pass through the first electrical connection blocks 113 or the second electrical connection blocks 114, thereby preventing the first electrical connection blocks 113 or the second electrical connection blocks 114 from potentially falling off. At the same time, this method enables the conductive structure 12 to achieve a more stable connection with the odd number of boat pieces 101 or the even number of boat pieces 102, thereby enabling the conductive structure 12 to achieve a more stable conductive support between two adjacent carrier boats 10.

[0052] In one alternative configuration, to facilitate support and engagement with the upper support boat 10, the top edge of the second lug 112 in the lower support boat 10 can be flush with the top edges of the odd-numbered boat pieces 101 and even-numbered boat pieces 102 in the same support boat 10. This structure allows the second sub-conductive structure 104 located at the top of the lower support boat 10 to be closer to the upper support boat 10, thus facilitating support and engagement with the spacer member 16 on the first sub-conductive structure 103 of the upper support boat 10.

[0053] In a further embodiment, in two adjacent support boats 10, the second electrical connection block 114 in the lower support boat 10 may be no lower than the top edge of the odd-numbered boat pieces 101 and even-numbered boat pieces 102 of the lower support boat 10, thereby making the second sub-conductive structure 104 closer to the upper support boat 10, thus making it easier to achieve support and cooperation with the spacer member 16 provided on the first sub-conductive structure 103 of the upper support boat 10.

[0054] In this embodiment of the invention, the spacer 16 can be fixedly connected to the carrier boat 10 by means of bonding, snap-fitting, or connecting with connectors. This embodiment of the invention does not limit the specific connection method between the spacer 16 and the carrier boat 10. In one embodiment, the spacer 16 may include a spacer body 161 and a connecting protrusion 162. The first end of the connecting protrusion 162 can be fixedly connected to the spacer body 161, and the second end of the connecting protrusion 162 can be inserted into the conductive structure 12 of the carrier boat 10. The spacer body 161 is used to separate two adjacent carrier boats 10.

[0055] Optionally, the spacer body 161 and the connecting protrusion 162 can be an integral structure or separate structural components that are fixedly connected by welding, bonding, or connecting parts. This embodiment of the utility model does not impose any limitations.

[0056] In an embodiment where the support boat 10 includes a second connecting structure 15, the second end of the connecting protrusion 162, which is inserted into the conductive structure 12 of the support boat 10, may have a through hole, through which a second bolt may pass. This structure can better prevent the connecting protrusion 162 from falling out of the conductive structure 12.

[0057] Please refer to Figure 2In another embodiment, the connecting protrusion 162 can act as a first electrical connection block 113 and be clamped and fixed to achieve connection with the conductive structure 12. In an embodiment where the spacer 16 is an insulating component, the connecting protrusion 162 acts as a first electrical connection block 113, and the spacer body 161 is made of insulating material. In this case, two adjacent carrier boats 10 are insulated from each other by the spacer body 161. In another embodiment, the connecting protrusion 162 is also made of insulating material. The connecting protrusion 162 replaces a first electrical connection block 113 and is clamped between two adjacent odd-numbered boat pieces 101 or two adjacent even-numbered boat pieces 102. In this case, the second connecting structure 15 can be designed as a component made of conductive material, thereby replacing the replaced first electrical connection block 113 when passing through the connecting protrusion 162 to electrically connect two adjacent odd-numbered boat pieces 101 or two adjacent even-numbered boat pieces 102. It should be noted that the embodiments of this utility model do not limit the specific fixing method of the spacer 16.

[0058] Based on the carrier device 01 disclosed in the present utility model embodiment, the present utility model embodiment discloses a semiconductor process chamber. The disclosed semiconductor process chamber includes a chamber body 02 and the carrier device 01 described in the above embodiment. The chamber body 02 is provided with a process space 021, and the carrier device 01 is disposed in the process space 021.

[0059] When the process space 021 is opened, the carrier device 01 can enter and exit the process space 021. Before the semiconductor process, the carrier device 01, which carries semiconductor wafers (e.g., silicon wafers), enters the process space 021. After the semiconductor process, the carrier device 01, which carries semiconductor wafers, is removed from the process space 021.

[0060] Please refer to Figure 4 The semiconductor process chamber disclosed in this embodiment may further include a support mechanism, which may include two spaced-apart support rods 024. Among the multiple carrier boats 10 of the carrier device 01, the lowermost carrier boat 10 may include conductive boat feet 18. The electrodes for providing radio frequency (RF) power to the lowermost carrier boat 10 can be introduced from the two support rods 024 and electrically connected to the odd-numbered boat pieces 101 and even-numbered boat pieces 102 of the lowermost carrier boat 10 via the corresponding conductive boat feet 18. In this structure, the lowermost carrier boat 10 can introduce RF from its front end; therefore, the electrode that mates with the conductive boat feet 18 of the lowermost carrier boat 10 can be considered as the front-end electrode 022.

[0061] In an embodiment where the spacer 16 is an insulating component, thereby achieving insulation isolation between two adjacent carrier boats 10, the carrier boats 10 included in the carrier device 01, excluding the lowest carrier boat 10, can introduce radio frequency from the rear end of the carrier boat 10. These carrier boats 10 can be provided with radio frequency jacks, and the electrodes of the radio frequency power supply that cooperate with these carrier boats 10 can be inserted into the radio frequency jacks to achieve radio frequency input. The electrodes inserted into the radio frequency jacks from the rear end of the carrier boat 10 can be considered as rear electrode 023.

[0062] In the carrier device 01 disclosed in this embodiment of the present invention, the lowermost carrier boat 10 may further include insulating boat feet 17. The insulating boat feet 17 only serve a supporting function, thereby allowing the lowermost carrier boat 10 to receive support from more points on the two support rods 024, thus improving the stability of the support. In other embodiments, the insulating boat feet 17 included in the lowermost carrier boat 10 may be replaced by conductive boat feet 18, thereby enabling multi-point radio frequency access while ensuring the stability of the support provided by the two support rods 024 to the carrier device 01.

[0063] The above embodiments of this application focus on describing the differences between the various embodiments. As long as the different features of the various embodiments are not contradictory, they can be combined to form more specific embodiments. For the sake of brevity, they will not be described in detail here.

[0064] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A supporting device, characterized in that, It includes a plurality of carrier boats (10) stacked in sequence, wherein at least one of two adjacent carrier boats (10) is provided with a spacer (16), and the two adjacent carrier boats (10) are supported and engaged by at least two spacer (16) and are spaced apart by the at least two spacer (16); the at least two spacer (16) are spaced apart.

2. The bearing device according to claim 1, characterized in that, The spacer (16) is an insulating component, and two adjacent carrier boats (10) are insulated and isolated by the spacer (16).

3. The bearing device according to claim 2, characterized in that, Among the plurality of carrier boats (10), the carrier boat (10) located at the bottom has a conductive boat foot (18) for accessing radio frequency; the carrier boats (10) other than the bottom carrier boat (10) are provided with radio frequency jacks at their rear ends; the front end and the rear end of the carrier boat (10) are the two ends of the carrier boat (10) distributed along its length direction.

4. The bearing device according to claim 1, characterized in that, The spacer members (16) are distributed in multiple groups along the length of the carrier boat (10), each group of spacer members (16) includes at least two spacer members (16), and each group of spacer members (16) is distributed at intervals along the width of the carrier boat (10).

5. The bearing device according to claim 1, characterized in that, One of the two adjacent carrier boats (10) is connected to a spacer (16) with a slot (1211) and the other is provided with a protrusion (1212). The two adjacent carrier boats (10) are positioned and engaged by inserting the protrusion (1212) into the slot (1211).

6. The bearing device according to claim 5, characterized in that, The two adjacent carrier boats (10) are positioned and fitted by a one-to-one insertion of a plurality of insertion protrusions (1212) and a plurality of insertion slots (1211).

7. The bearing device according to claim 5, characterized in that, The insertion groove (1211) is a through groove that runs through the length of the support boat (10); or, the insertion groove (1211) is a closed groove formed by connecting the inner walls of multiple grooves end to end.

8. The bearing device according to claim 1, characterized in that, Each of the carrier boats (10) includes multiple boat pieces (11) and multiple conductive structures (12). In each of the carrier boats (10), one of two adjacent boat pieces (11) is an odd-numbered boat piece (101) and the other is an even-numbered boat piece (102). All the odd-numbered boat pieces (101) and all the even-numbered boat pieces (102) in each of the carrier boats (10) are electrically connected through the corresponding conductive structure (12); The at least two spacer members (16) are supported between the conductive structures (12) of the two adjacent carrier boats (10).

9. The bearing device according to claim 8, characterized in that, The conductive structure (12) includes a first sub-conductive structure (103) and a second sub-conductive structure (104); wherein: In the conductive structure (12) connecting the odd-numbered boat pieces (101), the first sub-conductive structure (103) is electrically connected to all the odd-numbered boat pieces (101) at the bottom of the first end of the support boat (10), and the second sub-conductive structure (104) is electrically connected to all the odd-numbered boat pieces (101) at the top of the second end of the support boat (10); in the conductive structure (12) connecting the even-numbered boat pieces (102), the first sub-conductive structure (103) is electrically connected to all the even-numbered boat pieces (102) at the bottom of the second end of the support boat (10), and the second sub-conductive structure (104) is electrically connected to all the even-numbered boat pieces (102) at the top of the first end of the support boat (10). The first end and the second end of the carrier boat (10) are the two ends of the carrier boat (10) distributed along its length direction; in two adjacent carrier boats (10), the at least two spacer members (16) are supported between the first sub-conductive structure (103) of the upper carrier boat (10) and the second sub-conductive structure (104) of the lower carrier boat (10).

10. The bearing device according to claim 9, characterized in that, The bottom of the odd-numbered boat pieces (101) at the first end of the supporting boat (10) and the bottom of the even-numbered boat pieces (102) at the second end of the supporting boat (10) are both electrically connected to a first boat lug (111) protruding along the length direction; the top of the odd-numbered boat pieces (101) at the first end of the supporting boat (10) and the top of the even-numbered boat pieces (102) at the second end of the supporting boat (10) are both electrically connected to a second boat lug (112) protruding along the length direction. The first boat ear (111) is electrically connected to the corresponding first sub-conductive structure (103), and the second boat ear (112) is electrically connected to the corresponding second sub-conductive structure (104).

11. The bearing device according to claim 10, characterized in that, The first sub-conductive structure (103) includes a plurality of first electrical connection blocks (113) arranged in a row and respectively sandwiched between the first boat ears (111) corresponding to the odd-numbered boat pieces (101) or between the first boat ears (111) corresponding to the even-numbered boat pieces (102).

12. The bearing device according to claim 10, characterized in that, In the two adjacent carrier boats (10), the top edge of the second boat ear (112) in the lower carrier boat (10) is flush with the top edges of the odd-numbered boat piece (101) and the even-numbered boat piece (102).

13. The bearing device according to claim 12, characterized in that, The second sub-conductive structure (104) includes a plurality of second electrical connection blocks (114) arranged in a row and respectively sandwiched between the second boat ears (112) corresponding to the odd-numbered boat pieces (101) or between the second boat ears (112) corresponding to the even-numbered boat pieces (102); in two adjacent carrier boats (10), the second electrical connection block (114) in the lower carrier boat (10) is not lower than the top edge of the odd-numbered boat pieces (101) and the even-numbered boat pieces (102) of the lower carrier boat (10).

14. The bearing device according to claim 8, characterized in that, The spacer component (16) includes a spacer body (161) and a connecting protrusion (162). The first end of the connecting protrusion (162) is fixedly connected to the spacer body (161), and the second end of the connecting protrusion (162) is inserted into the conductive structure (12) of the carrier boat (10).

15. A semiconductor process chamber, characterized in that, The device includes a chamber body (02) and a support device (01) according to any one of claims 1-14, wherein the chamber body (02) is provided with a process space (021) and the support device (01) is disposed in the process space (021).

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