Semiconductor packaging fixing clamp with adjustable fork arms

Abstract

The utility model is mainly used for the back section packaging process of a semiconductor chip, and relates to a semiconductor packaging fixing clamp with an adjustable fork arm, which comprises a first clamping arm, a second clamping arm and an elastic piece, and the elastic piece is arranged between the first clamping arm and the second clamping arm and provides clamping force for mutual clamping of the end parts of the first clamping arm and the second clamping arm; a hinge part is arranged on the first clamping arm, the hinge part is rotationally connected with the first fork arm and the second fork arm, and the included angle between the first fork arm and the second fork arm is adjusted through the hinge part; fixing parts are respectively arranged at the end parts of the first fork arm and the second fork arm, clamping planes are arranged at the positions, opposite to the fixing parts, of the second clamping arm, and a semiconductor to be packaged is clamped through the fixing parts and the clamping planes. The fixing clamp is used for replacing a pressing block and a screw for jacking, a complicated jig and a complicated clamp do not need to be customized according to the size of a chip, and in addition, uniform pressing force can be exerted on the semiconductors to be packaged or a plurality of semiconductors to be packaged can be clamped at the same time through the forked arms.

Description

Technical Field

[0001] This utility model relates to semiconductor packaging technology and is mainly applied to the back-end packaging stage of semiconductor packaging process, especially the fixing tool used in the sealing or capping process of semiconductor packaging. Background Technology

[0002] Gold-tin sealing or gold-tin capping processes are commonly used in the back-end packaging stage of semiconductor packaging, especially in the sealing or lid attach process. They are mainly used to ensure the airtightness and stability of the chip after packaging, prevent external moisture or other contaminants from entering the package, and protect the chip's function and performance.

[0003] In a typical gold-solder bonding process, a gravity block is designed to apply pressure based on the chip's shape, and a cover plate is used to lock it in place. Sufficient pressure is also applied above the cover plate to prevent defects such as solder voids or solder overflow at the solder joint. However, as the solder pad melts, the screws securing the cover plate can loosen, causing uneven stress and affecting solder flow, leading to voids or solder overflow at the solder joint. Furthermore, since the gravity block and the fixture for placing the chip need to be custom-made according to the chip size, different chip sizes require corresponding fixtures and gravity blocks, resulting in higher costs.

[0004] Therefore, in order to solve the above problems, a simple and convenient technical solution is needed. Utility Model Content

[0005] To address the aforementioned problems, this utility model proposes a semiconductor packaging clamp with adjustable fork arms, comprising a first clamping arm, a second clamping arm, and an elastic element. The elastic element is characterized in that it is disposed between the first and second clamping arms, providing a clamping force to hold the ends of the first and second clamping arms together; a hinge portion is provided on the first clamping arm, rotatably connecting the first and second fork arms, allowing adjustment of the included angle between the first and second fork arms; a fixing portion is provided at the end of the first and second fork arms, and a clamping plane is provided on the second clamping arm opposite to the fixing portion, clamping the semiconductor to be packaged via the fixing portion and the clamping plane.

[0006] Furthermore, the second clamping arm is T-shaped, including the main arm and the clamping plane, with the width of the clamping plane being greater than that of the main arm.

[0007] Furthermore, a flexible pad is provided on the surface of the fixing part that contacts the semiconductor to be packaged.

[0008] Furthermore, the fixing part has a U-shaped structure.

[0009] Furthermore, the other ends of the first clamping arm and the second clamping arm are provided with force-applying parts. After force is applied to the force-applying parts, the fork arm of the first clamping arm separates from the second clamping arm.

[0010] Furthermore, the elastic element is a torsion spring.

[0011] Furthermore, the elastic element is detachably connected to either the first or second clamping arm.

[0012] Furthermore, fixing ears are provided at the positions where the elastic elements are installed on the first clamping arm and the second clamping arm, and the fixing ears are used to fix the elastic elements.

[0013] The beneficial effects of this utility model are as follows:

[0014] 1. By using a fixing clamp instead of pressure blocks and screws, there is no need to customize complex jigs and fixtures according to the chip size. The fixing clamp can provide a constant clamping force for the chip cover.

[0015] 2. The adjustable fork arm can be used to adjust the clamping position according to the size of the semiconductor to be packaged, so that the semiconductor to be packaged is subjected to uniform force, or multiple semiconductors to be packaged can be clamped at the same time.

[0016] 3. The elastic element is detachable, and different elastic elements with different elastic forces can be replaced according to the clamping force. At the same time, it is also convenient to replace the aging or fatigued elastic elements. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the first embodiment of the present utility model.

[0019] Figure Labels

[0020] 1 First clamping arm

[0021] 10. Force-exerting part

[0022] 11. Hinge

[0023] 12 First fork arm

[0024] 13 Second Fork Arm

[0025] 14 Fixing part

[0026] 2 Second clamping arm

[0027] 21 Main Arm

[0028] 22 Clamping plane

[0029] 3. Elastic components

[0030] 31 Fixed Ear Detailed Implementation

[0031] The following specific embodiments illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification.

[0032] In the following description, reference is made to the accompanying drawings, which depict several embodiments of the present application. It should be understood that other embodiments may also be used, and changes in mechanical composition, structure, electrical, and operation may be made without departing from the spirit and scope of this disclosure. The following detailed description should not be considered limiting, and the scope of the embodiments of the present application is defined only by the claims of the published patent. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the present application. Spatially related terms, such as “upper,” “lower,” “left,” “right,” “below,” “below,” “lower part,” “above,” “upper part,” etc., may be used herein to illustrate the relationship between one element or feature shown in the figures and another element or feature.

[0033] Although the terms first, second, etc., are used in some instances herein to describe various elements or parameters, these elements or parameters should not be limited by these terms. These terms are used only to distinguish one element or parameter from another. For example, a first end may be referred to as a second end, and similarly, a second end may be referred to as a first end, without departing from the scope of the various described embodiments. Both first end and second end are descriptions of an end, but they are not the same end unless the context otherwise clearly indicates otherwise.

[0034] Furthermore, as used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms “comprising,” “including,” indicate the presence of the stated feature, step, operation, element, component, item, kind, and / or group, but do not preclude the presence, occurrence, or addition of one or more other features, steps, operations, elements, components, items, kinds, and / or groups. The terms “or” and “and / or” as used herein are interpreted as inclusive, or mean any one or any combination thereof. Thus, “A, B, or C” or “A, B, and / or C” means “any one of: A; B; C; A and B; A and C; B and C; A, B, and C.” Exceptions to this definition occur only when combinations of elements, functions, steps, or operations are inherently mutually exclusive in some way.

[0035] Please refer to Figure 1 This utility model proposes a fixing clamp for semiconductor packaging with fork arms, including a first clamping arm 1, a second clamping arm 2 and an elastic member 3. The elastic member 3 is disposed between the first clamping arm 1 and the second clamping arm 2 to provide a clamping force for the ends of the first clamping arm 1 and the second clamping arm 2 to clamp each other. In this embodiment, the elastic member 3 is a torsion spring.

[0036] A hinge portion 11 is provided on the first clamping arm, which rotatably connects the first fork arm 12 and the second fork arm 13. The included angle between the first fork arm 12 and the second fork arm 13 can be adjusted through the hinge portion 11. A fixing portion 14 is provided at the end of the first fork arm 12 and the second fork arm 13 respectively. A clamping plane 22 is provided on the second clamping arm 2 opposite to the fixing portion 14. The semiconductor to be packaged is clamped by the fixing portion 14 and the clamping plane 22. In this embodiment, in order to match the included angle between the first fork arm 12 and the second fork arm 13, the second clamping arm 2 is T-shaped. The second clamping arm 2 includes a main arm 21 and a clamping plane 22, the width of which is greater than that of the main arm 21.

[0037] Furthermore, the fixing part 14 is a U-shaped structure bent towards the clamping plane 22, and a flexible pad (not shown in the figure) is provided on the surface of the U-shaped structure that contacts the semiconductor to be packaged. When the size of the semiconductor to be packaged is large, the included angle between the first fork arm 12 and the second fork arm 13 can be reduced, and the two forks can be clamped on the semiconductor to be packaged, so that the clamping force on the semiconductor to be packaged can be evenly distributed. In addition, if the size of the semiconductor to be packaged is small, different semiconductors to be packaged can be placed on the clamping plane 22, and different semiconductors to be packaged can be clamped by the first fork arm 12 and the second fork arm 13 respectively, which can improve the efficiency of fixing the semiconductor to be packaged.

[0038] The other ends of the first clamping arm 1 and the second clamping arm 2 are provided with force-applying parts 10 and 20. After force is applied to the force-applying parts 10 and 20, the fork arm 11 of the first clamping arm 1 separates from the clamping plane 21 of the second clamping arm 2.

[0039] Furthermore, a fixing ear 31 is provided at the position where the elastic element 3 is installed on the first clamping arm 1 and the second clamping arm 2, and the elastic element 31 is fixed on the fixing ear 31, so that the elastic element 3 is detachably connected to the first clamping arm 1 or the second clamping arm 2.

[0040] This invention utilizes a fixing clamp to replace traditional pressure blocks and screws, eliminating the need for custom-made complex fixtures and jigs based on chip size. The fixing clamp provides a constant clamping force on the chip cover, reducing fixture manufacturing costs, simplifying operation, and significantly shortening chip fixing time. Furthermore, multiple adjustable forks allow for simultaneous clamping of large-sized semiconductors or multiple smaller semiconductors. The elastic elements are detachable, allowing for replacement with elements of varying elasticity to adjust clamping force, and also facilitating the replacement of aged or fatigued elastic elements.

[0041] In this utility model, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0042] The above are preferred embodiments of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A semiconductor packaging clamp with adjustable fork arms, comprising a first clamping arm, a second clamping arm, and an elastic element, characterized in that, The elastic element is disposed between the first clamping arm and the second clamping arm to provide a clamping force for the ends of the first clamping arm and the second clamping arm to clamp each other; The first clamping arm is provided with a hinge, which rotatably connects the first fork arm and the second fork arm, and the included angle between the first fork arm and the second fork arm can be adjusted through the hinge. The first fork arm and the second fork arm are respectively provided with a fixing part at their ends, and the second clamping arm is provided with a clamping plane at a position opposite to the fixing part, so that the semiconductor to be packaged is clamped by the fixing part and the clamping plane.

2. A fixing clip for semiconductor packaging with adjustable fork arms according to claim 1, characterized in that, The second clamping arm is T-shaped, including a main arm and the clamping plane, the width of which is greater than that of the main arm.

3. A semiconductor packaging clamp with adjustable fork arms according to any one of claims 1-2, characterized in that, A flexible pad is provided on the surface of the fixing part that contacts the semiconductor to be packaged.

4. A semiconductor packaging clamp with adjustable fork arms according to claim 3, characterized in that, The fixing part has a U-shaped structure.

5. A fixing clip for semiconductor packaging with adjustable fork arms according to claim 1, characterized in that, The other end of the first clamping arm and the second clamping arm is provided with a force-applying part. After force is applied to the force-applying part, the fork arm of the first clamping arm separates from the second clamping arm.

6. A semiconductor packaging clamp with adjustable fork arms according to claim 1, characterized in that, The elastic element is a torsion spring.

7. A semiconductor packaging clamp with adjustable fork arms according to claim 1, characterized in that, The elastic element is detachably connected to either the first clamping arm or the second clamping arm.

8. A semiconductor packaging clamp with adjustable fork arms according to claim 1, characterized in that, A fixing lug is provided at the position where the elastic element is installed on the first clamping arm and the second clamping arm, and the fixing lug is used to fix the elastic element.

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