Wafer lifting device and semiconductor equipment
By installing an isolation component between the lifting support and the lifting platform, the problems of wear and particulate contamination in the prior art are solved, extending the service life of the device and reducing particulate contamination caused by wear between the two components, resulting in a more stable service life and improved wafer process quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- CHENGDU HIGH-TECH JIN SCI&TECH CO LTD
- Filing Date
- 2025-06-11
- Publication Date
- 2026-05-12
AI Technical Summary
Existing ejector pins and lifting platforms wear down due to material differences and frequent movement during long-term use, leading to particle contamination and affecting wafer process quality.
An isolator is installed between the lifting support and the lifting platform to reduce direct contact and wear. Materials with matching hardness, such as sapphire or hard alloy, are used to reduce friction, increase the contact area, and protect the lifting platform through the isolator.
有效减少了磨损和颗粒污染，延长了装置的使用寿命，提高了晶圆的工艺品质，保证了晶圆的工艺品质，延长了顶针单元和升降平台的使用寿命，同时减少了因二者磨损产生的颗粒污染，保证了晶的工艺品质，提高了晶的工艺品质。
Smart Images
Figure CN224234174U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer lifting device and semiconductor equipment. Background Technology
[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.
[0003] In the semiconductor manufacturing process, continuous rising and falling motions are required to transfer the wafer between different process locations.
[0004] However, during long-term use, due to differences in materials and frequent movement, the contact points between the existing ejector pins and lifting platforms are prone to wear. This wear can generate particulate contamination, thereby affecting the process quality of the wafer. Utility Model Content
[0005] The purpose of this invention is to at least solve the problem of particulate contamination caused by wear at the contact point between the ejector pin and the lifting platform. This objective is achieved through the following technical solution:
[0006] The first aspect of this utility model provides a wafer lifting device, comprising:
[0007] A lifting mechanism includes a lifting platform and a drive component connected to the lifting platform, the drive component being used to drive the lifting platform to move up and down in the height direction;
[0008] Multiple ejector pin units are spaced apart on the lifting platform. Each ejector pin unit includes a retainer and a lifting support. The retainer is disposed on the lifting platform, and the lifting support is disposed on the retainer. The lifting support is used to support the wafer.
[0009] An isolating element is disposed at one end of the lifting support member facing the lifting platform, and the isolating element is used to isolate the lifting support member from the lifting platform.
[0010] The wafer lifting device of this utility model effectively reduces direct contact and wear between the lifting support and the lifting platform during the lifting process by setting an isolation component between them. This extends the service life of the ejector pin unit and the lifting platform, while also reducing particulate contamination caused by wear between the two components, thereby reducing contamination on the wafer surface and ensuring the process quality of the wafer.
[0011] In addition, the wafer lifting device according to this utility model may also have the following additional technical features:
[0012] In some embodiments of this utility model, the hardness of the isolation member is the same as the hardness of the lifting support member, and is greater than the hardness of the lifting platform.
[0013] In some embodiments of this utility model, the isolation member includes an isolation pad, and the material of the isolation pad is the same as that of the lifting support member.
[0014] In some embodiments of this utility model, the insulating gasket is a sapphire gasket.
[0015] In some embodiments of this utility model, the ejector pin unit further includes a fixing cover covering the outside of the fixer, wherein the length of the isolation member in the horizontal direction is less than the length of the fixing cover in the horizontal direction and greater than the length of the fixer in the horizontal direction.
[0016] In some embodiments of this utility model, the fixture includes a fixed base and a limiting part. The limiting part is disposed at the end of the fixed base away from the lifting platform. The limiting part and the fixed base are provided with a first through hole through them along the height direction. The lifting support member passes through the first through hole.
[0017] In some embodiments of this utility model, the limiting part includes a constant diameter section and an expanded diameter section coaxially connected. The constant diameter section is connected to the end of the fixed base away from the lifting platform, and the expanded diameter section is connected to the end of the constant diameter section away from the fixed base. The first through hole passes through the opposite ends of the constant diameter section and the expanded diameter section along the axial direction.
[0018] In some embodiments of this utility model, the inner diameter of the expanded diameter section is the same as the inner diameter of the equal diameter section, and the outer diameter of the expanded diameter section gradually increases from the end connected to the equal diameter section to the end away from the equal diameter section.
[0019] In some embodiments of this utility model, the wafer lifting device further includes a base, which is spaced apart on the top of a plurality of ejector pin units along the height direction. A second through hole is provided on the base along the height direction, and the lifting support is movably disposed in the second through hole.
[0020] Another aspect of this invention provides a semiconductor device, including a chamber and a wafer lifting device as described in any of the preceding claims, the wafer lifting device being disposed inside the chamber. Attached Figure Description
[0021] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:
[0022] Figure 1 A schematic diagram of the structure of a wafer lifting device (in a rising state) according to an embodiment of the present invention is shown.
[0023] Figure 2 for Figure 1 Enlarged view of point A in the middle;
[0024] Figure 3 A schematic diagram of a wafer lifting device (in a descending state) according to an embodiment of the present invention is shown.
[0025] The attached figures are labeled as follows:
[0026] 100. Wafer lifting device;
[0027] 11. Lifting platform; 12. Drive components;
[0028] 2. Ejector pin unit; 21. Fixer; 211. Fixing base; 212. Limiting part; 2121. Equal diameter section; 2122. Expanded diameter section; 22. Lifting support; 23. Fixing cover;
[0029] 3. Isolation components;
[0030] 4. Wafers;
[0031] 5. Base. Detailed Implementation
[0032] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
[0033] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.
[0034] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.
[0035] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations.
[0036] In semiconductor manufacturing, wafer transport and processing are crucial steps. Ejector pins and lifting platforms are essential components in the reaction chamber of semiconductor equipment used to support and transport wafers. During wafer production, ejector pins need to continuously rise and fall to transfer the wafer between different process locations.
[0037] In related technologies, ejector pins and lifting platforms are prone to wear during long-term use due to material differences and frequent movement. This wear not only damages the contact points between the ejector pins and the lifting platform but also generates particulate contamination, thus affecting the wafer's process quality. Furthermore, wear can cause changes in the relative position of the wafer on the substrate, increasing the risk of wafer slippage and severely impacting semiconductor production yield and equipment lifespan.
[0038] In view of this, this embodiment provides a wafer lifting device 100, which aims to reduce direct contact and wear between the lifting support 22 and the lifting platform 11 by setting an isolation member 3 between the lifting support 22 and the lifting platform 11, thereby reducing particulate contamination, extending the service life of the device and improving the process quality of the wafer 4, thus solving the above-mentioned technical problems.
[0039] like Figures 1 to 3 As shown, according to an embodiment of the present invention, a wafer lifting device 100 is proposed, including a lifting mechanism, multiple ejector pin units 2 and an isolation component 3.
[0040] The lifting mechanism includes a lifting platform 11 and a drive component 12 connected to the lifting platform 11. The drive component 12 can be a motor, a cylinder, or a hydraulic cylinder, etc. The drive end of the drive component 12 is connected to the bottom surface of the lifting platform 11, and the drive component 12 drives the lifting platform 11 to rise or fall along the height direction.
[0041] Multiple ejector pin units 2 are spaced apart on the lifting platform 11. These ejector pin units 2 can be spaced apart circumferentially on the top surface of the lifting platform 11, and can be arranged in various ways, including but not limited to welding, riveting, bonding, or simply being placed on the top surface of the lifting platform 11. Each ejector pin unit 2 includes a retainer 21 and a lifting support 22. The retainer 21 is mounted on the lifting platform 11, and the lifting support 22 is mounted on the retainer 21. The retainer 21 is used to fix the lifting support 22 to the lifting platform 11, ensuring the stability of the ejector pin unit 2 during lifting. The lifting support 22 includes an ejector pin, with a support portion at the top of the ejector pin. The top of the support portion has a support surface, on which the wafer 4 is placed, and the support surface provides support for the wafer 4. The cross-sectional shape formed by the multiple support units is circular. The diameter of the wafer 4 is slightly larger than the diameter of the circle formed by the multiple lifting support units 22, allowing the wafer 4 to rest on the support surface at the top of the multiple lifting support units 22 during lifting, thus ensuring the balance and stability of the wafer 4 during the lifting process.
[0042] An isolator 3 is disposed at the end of the lifting support 22 facing the lifting platform 11, and is used to isolate the lifting support 22 from the lifting platform 11. In a conventional wafer lifting device 100, the lifting support 22 is in direct contact with the lifting platform 11. Frequent lifting movements can cause wear between the two, resulting in particulate contamination and affecting the quality of the wafer 4. By setting the isolator 3, wear between the lifting support 22 and the lifting platform 11 can be effectively reduced, particulate contamination can be reduced, the service life of the lifting support 22 and the lifting platform 11 can be extended, the risk of wafer 4 positional misalignment can be reduced, and the stability and accuracy of the wafer 4 during the lifting process can be guaranteed.
[0043] The wafer lifting device 100 of this utility model effectively reduces the direct contact and wear between the lifting support 22 and the lifting platform 11 during the lifting process by setting an isolation component 3 between the lifting support 22 and the lifting platform 11, thereby extending the service life of the ejector pin unit 2 and the lifting platform 11. At the same time, it reduces particulate contamination caused by wear of the two, thereby reducing contamination on the surface of the wafer 4 and ensuring the process quality of the wafer 4.
[0044] In some embodiments of this invention, the hardness of the isolator 3 is the same as that of the lifting support 22, and greater than that of the lifting platform 11. The lifting support 22 is typically made of high-hardness materials, such as sapphire or hard alloy. These materials have high hardness and low coefficient of friction, enabling them to maintain good performance during frequent lifting movements. The material of the isolator 3 should be the same as or similar to that of the lifting support 22 to ensure hardness matching. When the hardness of the isolator 3 and the lifting support 22 is the same, the contact friction between them will be significantly reduced. This is because when materials with similar hardness come into contact, the wear of the surface microstructure and the generation of fatigue cracks will be reduced. This hardness matching can effectively reduce wear and extend the service life of the components. By selecting a material for the isolator 3 with a hardness greater than that of the lifting platform 11, the lifting platform 11 can be effectively protected. When the lifting support 22 contacts the lifting platform 11 through the isolator 3, the high hardness of the isolator 3 can withstand most of the wear, thereby reducing the wear of the lifting platform 11, extending the service life of the lifting platform 11, and also reducing particulate contamination caused by the wear of the lifting platform 11.
[0045] In some embodiments of this utility model, the isolation member 3 includes an isolation pad, and the material of the isolation pad is the same as that of the lifting support member 22.
[0046] In this embodiment, the lifting support 22 is made of sapphire, the isolation gasket is also made of sapphire, and the lifting platform 11 is made of ceramic. Sapphire is a material with extremely high hardness (Mohs hardness of 9), possessing excellent wear resistance and chemical stability. Furthermore, the hardness of sapphire is greater than that of ceramic (Mohs hardness of 6), and this increased hardness significantly reduces frictional damage. Selecting an isolation gasket made of the same material as the lifting support 22 ensures consistency in their physical and chemical properties, resulting in similar hardness and coefficients of friction, thereby reducing wear and preventing positional changes caused by wear. The thickness of the isolation gasket can be adjusted according to the actual length of the lifting support 22.
[0047] In some embodiments of this utility model, the ejector pin unit 2 further includes a fixing cover 23 covering the outside of the fixer 21. The length of the isolation member 3 in the horizontal direction is less than the length of the fixing cover 23 in the horizontal direction, but greater than the length of the fixer 21 in the horizontal direction.
[0048] The fixing cover 23 is placed over the outside of the fixing device 21, protecting the fixing device 21 and the lifting support 22. This ensures the overall stability of the ejector pin unit 2 during lifting and lowering, and prevents external impurities and particles from entering the ejector pin unit 2, reducing wear and malfunctions caused by external contamination. In this embodiment, both the fixing device 21 and the fixing cover 23 are cylindrical, so the shape of the isolation gasket is also circular. The length of the isolation element 3 is designed to be less than the length of the fixing cover 23, that is, the diameter of the isolation gasket is less than the diameter of the fixing cover 23. This allows the isolation gasket to be completely covered by the fixing cover 23, protecting the isolation element 3 from the influence of the external environment and reducing damage to the isolation element 3 caused by external factors (such as dust, particles, etc.). The length of the isolator 3 is designed to be greater than the length of the fixture 21, that is, the diameter of the isolator pad is greater than the diameter of the fixture 21. This allows the isolator 3 to completely cover the contact area between the fixture 21 and the lifting support 22, effectively isolating the direct contact between the lifting support 22 and the fixture 21, thereby further reducing wear. At the same time, it improves the stability of the lifting support 22 during the lifting process and reduces vibration or loosening caused by unstable contact.
[0049] During the lifting process, since the lifting support 22 and the lifting platform 11 are relatively stationary, the friction force generated is static friction force, μ (friction coefficient) = F (friction force) / N (pressure applied to the two objects perpendicular to the contact surface). By setting a larger diameter isolation pad, the contact area with the lifting platform 11 is increased, thereby reducing the pressure. The friction coefficient of the isolation pad (0.2) is less than the ceramic friction coefficient (1.0). According to the formula, F (friction force) becomes smaller after setting the isolation pad, thereby improving the friction damage between the lifting support 22 and the lifting platform 11.
[0050] In some embodiments of this utility model, the fixture 21 includes a fixed base 211 and a limiting part 212. The limiting part 212 is disposed at the end of the fixed base 211 away from the lifting platform 11. The limiting part 212 and the fixed base 211 are provided with a first through hole through them along the height direction. The lifting support member 22 passes through the first through hole.
[0051] Specifically, the limiting part 212 includes a constant-diameter section 2121 and an expanded-diameter section 2122 coaxially connected. The constant-diameter section 2121 is connected to the end of the fixed base 211 away from the lifting platform 11, and the expanded-diameter section 2122 is connected to the end of the constant-diameter section 2121 away from the fixed base 211. A first through hole passes through the opposite ends of the constant-diameter section 2121 and the expanded-diameter section 2122 along the axial direction. The limiting part 212 is located at the end of the fixed base 211 away from the lifting platform 11 to limit the movement range of the lifting support 22, ensuring that the lifting support 22 will not undergo excessive displacement or loosening during the lifting process, thereby improving the reliability and safety of the device. The inner diameter of the first through hole matches the outer diameter of the lifting support 22 to ensure that the lifting support 22 can move smoothly within the first through hole, while reducing gaps and improving movement accuracy. The first through hole can provide a movement path for the lifting support 22 and also plays a guiding role, ensuring that the lifting support 22 always maintains linear movement during the lifting process, reducing offset and vibration, thereby improving the stability of wafer 4 transmission.
[0052] In some embodiments of this utility model, the inner diameter of the expanded diameter section 2122 is the same as the inner diameter of the equal diameter section 2121, and the outer diameter of the expanded diameter section 2122 gradually increases from the end connected to the equal diameter section 2121 to the end away from the equal diameter section 2121. The fact that the inner diameter of the expanded diameter section 2122 is the same as the inner diameter of the equal diameter section 2121 ensures that the lifting support member 22 does not experience additional resistance or restriction when passing through the expanded diameter section 2122, reducing instability in movement caused by changes in inner diameter, thereby ensuring the continuity and consistency of the lifting support member 22 throughout the entire movement path. The expanded diameter section 2122 is connected to the end of the equal diameter section 2121 away from the fixed base 211. Its outer diameter gradually increases from the end connected to the equal diameter section 2121 to the end away from the equal diameter section 2121. This design of the expanded diameter section 2122 forms a conical structure. When the lifting support 22 approaches the limit position, the top of the expanded diameter section 2122 will contact other external structures, thereby limiting the further rise of the lifting support 22. This can play a buffering role, reduce impact force, protect the lifting support 22 and the limit part 212, and improve the reliability and safety of the equipment.
[0053] In some embodiments of this utility model, the wafer lifting device 100 further includes a base 5, which is spaced apart on the top of multiple ejector pin units 2 along the height direction. A second through hole is provided on the base 5 along the height direction, and a lifting support member 22 is movably disposed within the second through hole. The position of the second through hole corresponds to the position of the multiple lifting support members 22, and the inner diameter of the second through hole matches the outer diameter of the lifting support member 22, ensuring that the lifting support member 22 can move smoothly up and down within the second through hole, while reducing gaps and improving movement accuracy. The second through hole provides guidance and limiting for the lifting support member 22, ensuring its linear movement during the lifting process and further improving movement accuracy.
[0054] During the transfer of wafer 4, the isolator 3 is installed between the lifting support 22 and the lifting platform 11. After the isolator 3 is installed, the height of the lifting support 22 needs to be confirmed, the lifting motion needs to be tested, and the wafer 4 needs to be transferred cyclically. During the rising process of wafer 4, if... Figure 1 As shown, wafer 4 is placed on base 5. A cylinder drives the lifting platform 11 upwards, which in turn drives multiple ejector pin units 2 connected to the lifting platform 11 upwards as well. The lifting support 22 rises until it penetrates the second through-hole and contacts the bottom surface of wafer 4. As the lifting platform 11 continues to rise, the lifting support 22 lifts wafer 4 off base 5, thus completing the lifting of wafer 4. During the descent of wafer 4, as... Figure 3 As shown, the cylinder drives the lifting platform 11 to move downward, which in turn drives the multiple ejector pin units 2 connected to the lifting platform 11 to move downward together. The lifting support 22 descends to the bottom of the wafer 4 and contacts the base 5. As the lifting platform 11 continues to descend, the wafer 4 is placed on the base 5 from the lifting support 22, thus completing the descent of the wafer 4.
[0055] The second aspect of this invention provides a semiconductor device, including a chamber and the aforementioned wafer lifting device 100, which is disposed inside the chamber. During wafer 4 manufacturing, the wafer 4 is fed into the chamber via a transfer robot or transfer track. At this time, the wafer lifting device 100 is in its initial position, the lifting platform 11 is in its lowest position, and the multiple ejector pin units 2 are in a retracted state. The transfer robot places the wafer 4 on the base 5, ensuring that the center of the wafer 4 is aligned with the center of the circle formed by the lifting support members 22 of the multiple ejector pin units 2. The drive unit 12 starts operating, driving the lifting platform 11 to rise in the height direction. The rise of the lifting platform 11, in turn, drives the ejector pin units 2 to rise. The lifting support members 22 rise until they contact the wafer 4 and fully support the wafer 4. At this time, the wafer 4 is stably supported on the lifting support members 22, ready for subsequent processing. The lifting platform 11 continues to rise, lifting the wafer 4 to a predetermined height so that the transfer robot or transfer track can move the wafer 4 to the next processing position. Wafer 4 is transferred to the process location within the chamber (such as the deposition chamber, etching chamber, etc.) for corresponding processing, such as thin film deposition, etching, and photolithography. After the processing is completed, a transfer robot or transfer track moves wafer 4 back above the wafer lifting device 100, and the lifting platform 11 and ejector unit 2 are ready to receive wafer 4. The drive unit 12 drives the lifting platform 11 to descend, which in turn drives the lifting support 22 to descend through the second through hole of the base 5, placing wafer 4 smoothly on the base 5. The transfer robot removes the processed wafer 4 from the base 5, completing the unloading process of wafer 4. After the wafer lifting device 100 completes unloading, the lifting platform 11 descends to its initial position, the ejector unit 2 retracts, and one work cycle is completed.
[0056] The wafer lifting device 100 of this utility model effectively reduces the direct contact and wear between the lifting support 22 and the lifting platform 11 during the lifting process by setting an isolation component 3 between the lifting support 22 and the lifting platform 11, thereby extending the service life of the ejector pin unit 2 and the lifting platform 11. At the same time, it reduces particulate contamination caused by wear of the two, thereby reducing contamination on the surface of the wafer 4 and ensuring the process quality of the wafer 4.
[0057] The above description is merely a preferred embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A wafer lifting device, characterized in that, include: A lifting mechanism includes a lifting platform and a drive component connected to the lifting platform, the drive component being used to drive the lifting platform to move up and down in the height direction; Multiple ejector pin units are spaced apart on the lifting platform. Each ejector pin unit includes a retainer and a lifting support. The retainer is disposed on the lifting platform, and the lifting support is disposed on the retainer. The lifting support is used to support the wafer. An isolating element is disposed at one end of the lifting support member facing the lifting platform, and the isolating element is used to isolate the lifting support member from the lifting platform.
2. The wafer lifting device according to claim 1, characterized in that, The hardness of the isolation component is the same as that of the lifting support component, and greater than that of the lifting platform.
3. The wafer lifting device according to claim 1, characterized in that, The isolation component includes an isolation pad, and the material of the isolation pad is the same as that of the lifting support component.
4. The wafer lifting device according to claim 3, characterized in that, The insulating pad is a sapphire pad.
5. The wafer lifting device according to any one of claims 1 to 4, characterized in that, The ejector pin unit also includes a fixing cover covering the outside of the retainer. The length of the isolation member in the horizontal direction is less than the length of the fixing cover in the horizontal direction, but greater than the length of the retainer in the horizontal direction.
6. The wafer lifting device according to any one of claims 1 to 4, characterized in that, The fixture includes a fixed base and a limiting part. The limiting part is disposed at the end of the fixed base away from the lifting platform. The limiting part and the fixed base are provided with a first through hole along the height direction, and the lifting support is disposed through the first through hole.
7. The wafer lifting device according to claim 6, characterized in that, The limiting part includes a constant diameter section and an enlarged diameter section coaxially connected. The constant diameter section is connected to the end of the fixed base away from the lifting platform, and the enlarged diameter section is connected to the end of the constant diameter section away from the fixed base. The first through hole passes through the opposite ends of the constant diameter section and the enlarged diameter section along the axial direction.
8. The wafer lifting device according to claim 7, characterized in that, The inner diameter of the expanded diameter section is the same as the inner diameter of the constant diameter section, and the outer diameter of the expanded diameter section gradually increases from the end connected to the constant diameter section to the end away from the constant diameter section.
9. The wafer lifting device according to any one of claims 1 to 4, characterized in that, The wafer lifting device also includes a base, which is spaced at the top of a plurality of ejector pin units along the height direction. A second through hole is provided on the base along the height direction, and the lifting support is movably disposed in the second through hole.
10. A semiconductor device, characterized in that, It includes a chamber and a wafer lifting device as described in any one of claims 1 to 9, wherein the wafer lifting device is disposed inside the chamber.