Heat exchanger, heat dissipation device, charging pile and liquid cooling equipment

Abstract

The embodiment of the utility model provides a heat exchanger, a heat dissipation device, a charging pile and liquid cooling equipment, and relates to the technical field of liquid cooling heat dissipation. The heat exchanger comprises a heat dissipation component, a first liquid collection component, a controller and a pressure control component. The heat dissipation component is provided with a heat dissipation flow channel, the first liquid collection component is provided with a first liquid collection cavity, the first liquid collection component is connected with the heat dissipation component, and the first liquid collection cavity is communicated with the heat dissipation flow channel. The controller is arranged in the first liquid collecting cavity and used for controlling the cooling capacity provided by the heat exchanger. Wherein the first liquid collecting component is provided with a pressure control component, and the pressure control component is used for controlling the pressure in the first liquid collecting cavity within a preset range. Therefore, the size of the heat dissipation device can be reduced.

Description

Technical Field

[0001] This application relates to the field of liquid cooling technology, and more particularly to a heat exchanger, a heat dissipation device, a charging pile, and a liquid cooling equipment. Background Technology

[0002] Liquid cooling, as a highly efficient heat dissipation method, is widely used in charging, data centers, and other scenarios. A liquid cooling device is any device capable of liquid cooling. It includes a heat-generating component and a liquid-cooled heat exchanger for dissipating heat from the heat-generating component. The liquid-cooled heat exchanger and the heat dissipation device form a coolant circulation loop. The heat generated by the heat-generating component is absorbed by the coolant within the liquid-cooled heat exchanger and then carried by the coolant to the heat dissipation device for further cooling.

[0003] In related technologies, heat dissipation devices used for liquid cooling are often quite large. Therefore, how to reduce the size of heat dissipation devices has become an urgent problem to be solved in the field of liquid cooling technology. Utility Model Content

[0004] This application provides a heat exchanger, a heat dissipation device, a charging pile, and a liquid cooling equipment, which can make the heat dissipation device smaller in size.

[0005] A first aspect of this application provides a heat exchanger including a heat dissipation component, a first liquid collection component, a controller, and a pressure control component. The heat dissipation component has a heat dissipation channel, and the first liquid collection component has a first liquid collection chamber. The first liquid collection component is connected to the heat dissipation component, and the first liquid collection chamber communicates with the heat dissipation channel. The controller is disposed within the first liquid collection chamber and is used to control the cooling capacity provided by the heat exchanger. The first liquid collection component is equipped with a pressure control component, which is used to control the pressure within the first liquid collection chamber within a preset range.

[0006] The heat exchanger provided in this embodiment of the application, by setting a pressure control component in the first liquid collection component, can control the pressure of the first liquid collection chamber within a preset range. The gas contained in the first liquid collection chamber can be compressed or expanded under the control of the pressure control component to balance the pressure within the first liquid collection chamber, so that the gas contained in the first liquid collection chamber can be used to achieve a buffering function. By placing the controller in the first liquid collection chamber, the first liquid collection component can serve to load and protect the controller. At this time, in addition to serving as the confluence or diversion of the heat dissipation flow channel, the first liquid collection component also serves as a buffer tank and an electrical control box. The electrical control box, buffer tank, and the first liquid collection component of the heat exchanger are integrated into one unit. Thus, there is no need to set up a buffer tank or an electrical control box separately from the heat exchanger, which can result in a high degree of integration of the heat dissipation device and help reduce the size of the heat dissipation device. In addition, since there is no need to set up a buffer tank and an electrical control box separately from the heat exchanger, the number of structural components of the heat dissipation device can be reduced, which helps to reduce the cost of the heat dissipation device.

[0007] For example, the heat dissipation channel is used to contain the coolant, the first liquid collection chamber is used to contain the coolant and gas, and the controller is immersed in the coolant, which is an insulating coolant. By immersing the controller in the coolant, the size of the first liquid collection component can be reduced. Furthermore, since the controller is submerged in the coolant, dust accumulation on its surface is less likely, improving its reliability. Additionally, because dust accumulation is less likely on the controller's surface, a protective layer is unnecessary, reducing the controller's cost. Moreover, immersion in the coolant allows the heat generated by the controller to be transferred to the coolant more efficiently and dissipated through a heat exchanger, resulting in better heat dissipation performance.

[0008] In some possible implementations, the first liquid collection chamber is located above the heat dissipation channel, and the upper end of the heat dissipation channel communicates with the first liquid collection chamber. This makes the flow of coolant between the first liquid collection chamber and the heat dissipation channel less susceptible to the influence of gas contained within the first liquid collection chamber, facilitating coolant flow between them. Furthermore, installing pressure control components or other structures on the first liquid collection component is less affected by the heat dissipation components, making it easier to install such components or structures. Additionally, it allows the first liquid collection component to be opened when coolant is present in the coolant circulation loop, facilitating operations such as injecting coolant into the first liquid collection chamber and maintaining the components or devices within it.

[0009] In some possible implementations, the first liquid collecting component has a pressure relief port, and the pressure control component includes a safety valve located at the pressure relief port. Thus, when the pressure in the first liquid collecting chamber is too high, the safety valve can open, allowing pressure to be released through the pressure relief port and the safety valve. This achieves pressure control within the first liquid collecting chamber, enabling the first liquid collecting component to buffer pressure changes in the coolant circulation loop while also ensuring good safety, as it is less prone to damage due to overpressure in the first liquid collecting chamber.

[0010] In some possible implementations, the first liquid collecting component has an assembly hole through which an electrical connector passes. The electrical connector is fixed and sealed to the first liquid collecting component, and the controller is electrically connected to the electrical connector. This facilitates the electrical connection between the controller inside the first liquid collecting chamber and devices outside the first liquid collecting component. Furthermore, by providing an electrical connector that passes through the cavity wall of the first liquid collecting chamber, sealing the connection between the electrical connector and the first liquid collecting component is easier and less prone to failure, thus improving the sealing of the first liquid collecting chamber.

[0011] In some possible implementations, the first liquid collecting component has a connecting hole, and the first liquid collecting chamber is connected to the heat dissipation channel through the connecting hole. The controller is fixedly disposed inside the first liquid collecting chamber and spaced apart from the connecting hole. This makes it less likely that the controller disposed inside the first liquid collecting chamber will affect the connection between the first liquid collecting chamber and the heat dissipation channel, thus facilitating the connection between the first liquid collecting chamber with the internal controller and the heat dissipation channel.

[0012] In some possible implementations, the controller is fixedly connected to the first liquid collecting component via a connecting part, with the controller and the cavity wall of the first liquid collecting chamber spaced apart. This minimizes mutual interference between the controller and components or devices mounted on the cavity wall of the first liquid collecting chamber, allowing for more flexible arrangement of components or devices on the cavity wall of the first liquid collecting chamber. It also facilitates flexible arrangement of the controller within the first liquid collecting chamber, thereby enabling greater flexibility in the shape and dimensions of the first liquid collecting component in all directions. Furthermore, the presence of an assembly gap between the cavity wall of the first liquid collecting chamber and the controller facilitates the easy assembly of the controller into the first liquid collecting chamber.

[0013] In some possible implementations, the first liquid collection component includes a housing and a plate. The housing has an opening and a connecting hole, located on different sides of the housing. The plate is detachably connected to the housing, and the plate covers the opening. The housing and the plate together form a first liquid collection chamber. A heat dissipation component is fixed and sealed to the housing at the connecting hole, and the heat dissipation channel communicates with the inner cavity of the housing through the connecting hole. This facilitates the maintenance of devices such as controllers installed within the first liquid collection chamber.

[0014] In some possible implementations, the controller is fixedly connected to the board. This allows the controller to be lifted when the board is opened from the opening, facilitating maintenance of the controller.

[0015] In some possible implementations, the controller is fixedly connected to the board via a connecting component, with the controller and the board spaced apart. This makes it less likely for the controller and the components or devices mounted on the board to interfere with each other.

[0016] In some possible implementations, the controller and housing are spaced apart to minimize mutual interference between the controller and components or devices mounted on the housing. Furthermore, an assembly gap exists between the housing and the controller, facilitating the assembly of the controller, which is fixedly connected to the board, into the housing.

[0017] In some possible implementations, the electrical connection connector is located on the plate body, and the electrical connection connector is fixed and sealed to the plate body. In this way, when the plate body is opened from the opening, the electrical connection connector and the controller are less likely to shift, which facilitates a stable connection between the electrical connection connector and the controller.

[0018] In some possible implementations, the first liquid collecting component has a liquid injection port with a plug at the port. The plug is detachably connected to the first liquid collecting component and seals the injection port. Thus, when the coolant level in the first liquid collecting chamber is low and needs to be replenished, the plug can be opened to inject coolant into the chamber, making replenishment convenient and facilitating the replenishment of the coolant circulation loop. After replenishment is complete, the plug can be used to seal the injection port, thus sealing the first liquid collecting chamber to ensure proper coolant circulation and provide a buffering function.

[0019] In some examples, the projection of the controller is located outside the projection of the injection port in the direction of the extension of the centerline of the injection port. This makes it less likely for the controller to be displaced or malfunction due to the impact of the injected coolant when adding coolant through the injection port.

[0020] In some possible implementations, the heat exchanger further includes a second liquid collecting component having a second liquid collecting chamber. The first and second liquid collecting components are respectively connected to both ends of the heat dissipation component. One end of the heat dissipation channel communicates with the first liquid collecting chamber, and the other end of the heat dissipation channel communicates with the second liquid collecting chamber. By providing the second liquid collecting component, it is convenient to connect multiple heat dissipation channels to the liquid-cooled heat exchange assembly, so as to connect multiple heat dissipation channels to the coolant circulation loop.

[0021] In some possible implementations, the volume of the first liquid collecting chamber is larger than that of the second liquid collecting chamber, so that part of the first liquid collecting chamber can contain the coolant circulating in the coolant circulation loop, and part can contain gas, thereby facilitating the buffering of pressure changes in the coolant circulation loop through the first liquid collecting component. In addition, the larger volume of the first liquid collecting chamber can contain a larger volume of gas, so that the first liquid collecting component can have a better buffering effect.

[0022] In some possible implementations, the second liquid collecting chamber is located below the heat dissipation channel, and the lower end of the heat dissipation channel communicates with the second liquid collecting chamber. At least one of the heat exchanger's inlet and outlet is located in the second liquid collecting component and communicates with the second liquid collecting chamber. When the heat exchanger's inlet is located in the second liquid collecting component and communicates with the second liquid collecting chamber, the coolant enters the heat exchanger through the second liquid collecting chamber located at the lower part of the heat exchanger, and then enters the first liquid collecting chamber through the heat dissipation channel. This makes the flow of coolant into the first liquid collecting chamber less susceptible to the influence of gas within the first liquid collecting chamber, facilitating the flow of coolant into the first liquid collecting chamber. When the heat exchanger's outlet is located in the second liquid collecting component and communicates with the second liquid collecting chamber, the coolant in the first liquid collecting chamber flows through the heat dissipation channel to the second liquid collecting chamber located at the lower part of the heat exchanger, and then flows out of the heat exchanger through the second liquid collecting chamber located at the lower part of the heat exchanger. This makes it less likely that gas within the first liquid collecting chamber will be used to extract the coolant by the drive pump, resulting in better efficiency and stability of the drive pump operation.

[0023] A second aspect of this application provides a heat dissipation device, which includes a heat exchanger as described in any of the above embodiments. The heat exchanger's heat dissipation channels are used to contain coolant, its first liquid collection chamber is used to contain coolant and gas, and its controller is immersed in the coolant. The coolant is an insulating coolant.

[0024] A third aspect of this application provides a charging pile, which includes a pile body and a heat dissipation device as described in any of the above embodiments, the heat dissipation device being disposed within the pile body. The heat dissipation channel of the heat dissipation device contains coolant, the first liquid collection chamber of the heat dissipation device contains coolant and gas, and the controller of the heat dissipation device is immersed in the coolant.

[0025] A fourth aspect of this application provides a liquid cooling device, which includes a liquid cooling heat exchange assembly and a heat dissipation device as described in any of the above embodiments. The liquid cooling heat exchange assembly forms a coolant circulation loop with the heat exchanger of the heat dissipation device. The heat dissipation channels of the liquid cooling heat exchange assembly and the heat dissipation device contain coolant, the first liquid collection chamber of the heat dissipation device contains coolant and gas, and the controller of the heat dissipation device is immersed in the coolant.

[0026] The liquid cooling equipment also includes a heat-generating component, which is used to dissipate heat from the heat-generating component. For example, the heat-generating component can be in direct contact with the liquid cooling heat exchanger or through a heat-conducting medium, allowing the coolant in the liquid cooling heat exchanger to absorb the heat generated by the heat-generating component. Alternatively, the heat-generating component can be disposed within the liquid cooling heat exchanger, with at least a portion of it immersed in the coolant within the liquid cooling heat exchanger, allowing the coolant in the liquid cooling heat exchanger to absorb the heat generated by the heat-generating component.

[0027] For example, a liquid-cooled heat exchange assembly includes a liquid-cooled heat exchange component, which has a liquid supply channel and a liquid return channel. Coolant is contained within the liquid-cooled heat exchange component, the liquid supply channel, and the liquid return channel. The inlet of the liquid-cooled heat exchange component is connected to the outlet of the liquid supply channel, and the outlet of the liquid-cooled heat exchange component is connected to the inlet of the liquid return channel. A heat exchanger has a liquid inlet and a liquid outlet. The liquid inlet of the heat exchanger is connected to the outlet of the liquid return channel via a liquid return connector, and the liquid outlet of the heat exchanger is connected to the inlet of the liquid supply channel via a liquid supply connector. The liquid-cooled heat exchange component, the liquid return channel, the heat exchanger, and the liquid supply channel form a coolant circulation loop.

[0028] In some examples, the coolant within the liquid-cooled heat exchange component can be used to dissipate heat from at least a portion of the heat-generating component.

[0029] In some examples, the coolant in the supply channel can be used to dissipate heat from parts of the heat-generating components.

[0030] In some examples, the coolant in the return channel can be used to dissipate heat from parts of the heat-generating components.

[0031] In some possible implementations, the liquid cooling device is a server, and the heat-generating components include at least one of a processor and memory. The liquid cooling heat exchange components are used to dissipate heat from at least one of the processor and memory. For example, the processor may be a central processing unit.

[0032] In some examples of servers where liquid cooling equipment is used, the coolant within the liquid cooling heat exchange components can be used to dissipate heat from at least one of the processor and memory.

[0033] In some possible implementations, the liquid cooling device is the charging host, the heat-generating component is the charging module, and the liquid cooling heat exchange component is used to dissipate heat from the charging module.

[0034] In some examples where the liquid-cooled device is the charging host, the coolant within the liquid-cooled heat exchange component can be used to dissipate heat from the charging module.

[0035] In some possible implementations, the liquid cooling device is a charging terminal, the heat-generating component includes at least one of a power terminal and a power line, and the liquid cooling heat exchange component is used to dissipate heat from at least one of the power terminal and the power line.

[0036] In some examples of liquid-cooled devices used as charging terminals, the coolant within the liquid-cooled heat exchange components can be used to dissipate heat from the power terminals, and the coolant in at least one of the supply and return channels can be used to dissipate heat from the power lines. Attached Figure Description

[0037] Figure 1 A schematic diagram of a liquid cooling device provided in an embodiment of this application;

[0038] Figure 2 A schematic diagram of another liquid cooling device provided in an embodiment of this application;

[0039] Figure 3 A schematic diagram of a heat dissipation device provided in an embodiment of this application;

[0040] Figure 4 A schematic diagram from one perspective of another heat dissipation device provided in an embodiment of this application;

[0041] Figure 5 for Figure 4 A schematic diagram of the heat dissipation device provided in the image from another perspective;

[0042] Figure 6 A schematic diagram of a heat exchanger provided in an embodiment of this application;

[0043] Figure 7 for Figure 6 A cross-sectional view of the AA plane;

[0044] Figure 8 for Figure 7 Enlarged view of the middle S section;

[0045] Figure 9 for Figure 6 A cross-sectional view of the BB plane;

[0046] Figure 10 for Figure 6 The exploded view of the heat exchanger provided in the image.

[0047] Explanation of reference numerals in the attached figures:

[0048] 10. Charging pile; 11. Pile body; 12. Heat dissipation device; 13. Power supply components;

[0049] 20. Heating element; 21. Power terminal; 22. Power wire;

[0050] 30. Liquid-cooled heat exchange assembly; 31. Liquid-cooled heat exchange component; 32. Liquid supply channel; 33. Liquid return channel;

[0051] 100. Heat exchanger;

[0052] 110. First liquid collection component; 111. First liquid collection chamber; 112. Injection port; 113. Pressure relief port; 114. Connecting hole; 115. Assembly hole; 116. Housing; 117. Plate; 118. Opening;

[0053] 120. Heat dissipation components; 121. Heat dissipation channels;

[0054] 130. Second liquid collection component; 131. Second liquid collection chamber;

[0055] 140. Liquid discharge port; 150. Liquid inlet; 160. Liquid outlet;

[0056] 210. Plug; 220. Pressure control component; 221. Safety valve; 230. Liquid level sensor; 240. Liquid level gauge; 250. Electrical connection connector;

[0057] 300. Controller; 310. Connecting components;

[0058] 400, frame; 500, fan; 600, drive pump;

[0059] 710. Liquid inlet connector; 720. Liquid outlet connector; 730. Liquid supply connector; 740. First connecting pipe; 750. Second connecting pipe; 760. Liquid return connector; 770. Third connecting pipe;

[0060] 810, First temperature sensor; 820, Pressure sensor; 830, Second temperature sensor;

[0061] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0062] The terminology used in the implementation section of this application is only for explaining specific embodiments of this application and is not intended to limit this application. The implementation of the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0063] This application provides a liquid cooling device, which may include, but is not limited to, devices that can perform liquid cooling heat dissipation such as charging terminals, charging hosts, and servers. In other words, the liquid cooling device may include, but is not limited to, liquid-cooled charging terminals, liquid-cooled charging hosts, and liquid-cooled servers.

[0064] Figure 1 This is a schematic diagram of a liquid cooling device provided in an embodiment of this application. Figure 1 In the image, the solid arrow points in the direction of coolant flow.

[0065] like Figure 1As shown, the liquid cooling device includes a heating element 20, a liquid cooling heat exchange component 30, and a heat dissipation device 12. The liquid cooling heat exchange component 30 is used to cool the heating element 20. The inlet of the liquid cooling heat exchange component 30 is connected to the outlet of the heat dissipation device 12, and the outlet of the liquid cooling heat exchange component 30 is connected to the inlet of the heat dissipation device 12. The liquid cooling heat exchange component 30 and the heat dissipation device 12 form a coolant circulation loop. The coolant circulation loop contains coolant, which can circulate within the loop. In other words, both the liquid cooling heat exchange component 30 and the heat dissipation device 12 contain coolant, which can circulate between them. The heat generated by the heating element 20 can be absorbed by the coolant in the liquid cooling heat exchange component 30. After absorbing the heat generated by the heating element 20, the coolant in the liquid cooling heat exchange component 30 can flow into the heat dissipation device 12 for heat dissipation.

[0066] In some examples, the liquid-cooled heat exchange component 30 can be in direct contact with the heating component 20, or the liquid-cooled heat exchange component 30 can be in contact with the heating component 20 through a heat-conducting medium. In this case, the heating component 20 can be located outside the liquid-cooled heat exchange component 30.

[0067] In some examples, the heating element 20 may be disposed within the liquid-cooled heat exchange assembly 30, and at least a portion of the heating element 20 may be immersed in the coolant within the liquid-cooled heat exchange assembly 30.

[0068] In the example where the liquid cooling device is a server, the heat-generating component 20 may include at least one of the server's central processing unit (CPU), memory, etc., and the liquid cooling heat exchange component 30 is used to dissipate heat from at least one of the central processing unit, memory, etc.

[0069] In the example where the liquid-cooled device is the charging host, the heat-generating component 20 may include the charging module of the charging host, etc., and the liquid-cooled heat exchange component 30 is used to dissipate heat from the charging module, etc.

[0070] In the example where the liquid cooling device is a charging terminal, the heat-generating component 20 may include at least one of the power terminal 21, power line 22, etc. of the charging terminal, and the liquid cooling heat exchange component 30 is used to dissipate heat from at least one of the power terminal, power line, etc.

[0071] The following explanation uses a liquid-cooled device as the charging terminal as an example.

[0072] Figure 2 This is a schematic diagram of another liquid cooling device provided in an embodiment of this application.

[0073] like Figure 2As shown, when the liquid cooling device is a charging terminal, the liquid cooling device may include a charging pile 10. The charging pile 10 includes a pile body 11, a power supply component 13 and a heat dissipation device 12. The power supply component 13 and the heat dissipation device 12 are located inside the pile body 11.

[0074] For example, the heating component 20 includes a power terminal 21 and a power line 22. One end of the power line 22 is electrically connected to the power supply component 13, and the other end of the power line 22 is electrically connected to the power terminal 21. That is, the power supply component 13 is electrically connected to the power terminal 21 through the power line 22. The power supply component 13 can be electrically connected to the mains power supply through a charging host. The charging host can convert the current provided by the mains power supply into the current required for charging and deliver it to the power terminal 21 through the power supply component 13 and the power line 22. The power terminal 21 is used to output electrical energy.

[0075] For example, the liquid-cooled heat exchange assembly 30 may include a liquid-cooled heat exchange component 31. The liquid-cooled heat exchange assembly 30 has a liquid supply channel 32 and a liquid return channel 33. The inlet of the liquid supply channel 32 is connected to the outlet of the heat dissipation device 12, and the outlet of the liquid supply channel 32 is connected to the inlet of the liquid-cooled heat exchange component 31, so that the inlet of the liquid-cooled heat exchange component 31 is connected to the outlet of the heat dissipation device 12 through the liquid supply channel 32. The inlet of the liquid return channel 33 is connected to the outlet of the liquid-cooled heat exchange component 31, and the outlet of the liquid return channel 33 is connected to the inlet of the heat dissipation device 12, so that the outlet of the liquid-cooled heat exchange component 31 is connected to the inlet of the heat dissipation device 12 through the liquid return channel 33. The liquid-cooled heat exchange component 31 and the heat dissipation device 12 are connected through the liquid supply channel 32 and the liquid return channel 33 to form a coolant circulation loop. The liquid-cooled heat exchange component 31, the liquid supply channel 32, and the liquid return channel 33 all contain coolant.

[0076] For example, the liquid-cooled heat exchange component 31 is located at the power terminal 21. The coolant provided by the heat dissipation device 12 flows into the liquid-cooled heat exchange component 31 through the liquid supply channel 32. The coolant flowing into the liquid-cooled heat exchange component 31 is used to absorb the heat generated by the power terminal 21. After absorbing the heat generated by the power terminal 21 in the liquid-cooled heat exchange component 31, the coolant can flow back to the heat dissipation device 12 through the liquid return channel 33 for heat dissipation, thereby realizing liquid cooling heat dissipation of the power terminal 21. At this time, the inlet of the liquid supply channel 32 can be used as the inlet of the liquid-cooled heat exchange component 30, and the outlet of the liquid return channel 33 can be used as the outlet of the liquid-cooled heat exchange component 30.

[0077] For example, the liquid-cooled heat exchange component 31 can be in direct contact with the power terminal 21, or the liquid-cooled heat exchange component 31 can be in contact with the power terminal 21 through a heat-conducting medium, so that the heat generated by the power terminal 21 can be transferred to the coolant in the liquid-cooled heat exchange component 31 more efficiently.

[0078] For example, the liquid-cooled heat exchange component 31 may include one or more of the following: liquid cooling plate, liquid cooling pipe, etc.

[0079] For example, the coolant flowing in the supply channel 32 and the return channel 33 can absorb the heat of the power line 22 for heat dissipation of the power line 22.

[0080] When the liquid-cooled device is used as a charging terminal, it includes a charging gun. The charging gun comprises a heating element 20 and a liquid-cooled heat exchange component 30. In other words, the heating element 20 and the liquid-cooled heat exchange component 30 are components used to form the charging gun, which is a liquid-cooled charging gun. The charging gun can be plugged into a vehicle, and after plugging it in, the charging pile 10 can charge the vehicle through the charging gun. In some examples, the liquid-cooled device can be a supercharging device, with a single charging gun having a charging power greater than or equal to 480 kW.

[0081] For example, the charging gun includes a charging head and a cable. A power terminal 21 and a liquid-cooled heat exchange component 31 are disposed on the charging head. The cable includes a power line 22 and has a liquid supply channel 32 and a liquid return channel 33.

[0082] In some examples, the cable includes a supply tube and a return tube, the inner cavity of the supply tube forming a supply channel 32 and the inner cavity of the return tube forming a return channel 33.

[0083] For example, the supply pipe and the return pipe can be in direct contact with the power line 22 or in contact through a heat-conducting medium.

[0084] In other examples, the cable may have a partition that can separate the cable to form a supply channel 32 and a return channel 33.

[0085] In the example where the liquid cooling device is a server, the coolant in the liquid cooling heat exchange component 31 can be used to dissipate heat from at least one of the central processing unit, memory, etc., and the coolant in the liquid cooling heat exchange component 31 can absorb the heat generated by at least one of the central processing unit, memory, etc.

[0086] In the example where the liquid-cooled device is the charging host, the coolant in the liquid-cooled heat exchange component 31 can be used to dissipate heat from the charging module, etc. In other words, the coolant in the liquid-cooled heat exchange component 31 can absorb the heat generated by the charging module, etc.

[0087] Figure 3 This is a schematic diagram of a heat dissipation device provided in an embodiment of this application. Figure 3 In the diagram, solid arrows point in the direction of coolant flow, dashed arrows point in the direction of airflow, and dotted lines connect two components to indicate electrical connection. Figure 3The diagram only shows the location of each component to illustrate the working principle of the heat dissipation device. Figure 3 The positions of the various components are not limited.

[0088] like Figure 3 As shown, the heat dissipation device 12 includes a heat exchanger 100, which contains coolant. The heat exchanger 100 has a liquid inlet 150 (e.g., Figure 6 (as shown) and outlet 160 (as shown) Figure 9 As shown in the diagram, the inlet 150 of the heat exchanger 100 is connected to the outlet of the liquid-cooled heat exchange component 30, and the outlet 160 of the heat exchanger 100 is connected to the inlet of the liquid-cooled heat exchange component 30. The heat exchanger 100 is used to form a coolant circulation loop with the liquid-cooled heat exchange component 30. The coolant can circulate between the heat exchanger 100 and the liquid-cooled heat exchange component 30. The inlet 150 of the heat exchanger 100 is used to allow coolant to flow into the heat exchanger 100. The coolant that has absorbed the heat generated by the heat-generating component 20 can flow into the heat exchanger 100 from the inlet 150 of the heat exchanger 100 to dissipate heat. The outlet 160 of the heat exchanger 100 is used to allow the coolant in the heat exchanger 100 to flow out of the heat exchanger 100. After dissipating heat in the heat exchanger 100, the coolant can flow out from the outlet 160 of the heat exchanger 100 and then flow back into the liquid-cooled heat exchange component 30.

[0089] For example, the inlet 150 of the heat exchanger 100 can be connected to the outlet of the return channel 33, and the outlet 160 of the heat exchanger 100 can be connected to the inlet of the supply channel 32. The heat exchanger 100, the supply channel 32, the liquid-cooled heat exchange component 31, and the return channel 33 are used to form a coolant circulation loop.

[0090] For example, the heat dissipation device 12 further includes a return connector 760 and a supply connector 730, with the heat exchanger 100 connected in series between the return connector 760 and the supply connector 730. The inlet 150 of the heat exchanger 100 is connected to the return connector 760, which is used to connect to the outlet of the liquid-cooled heat exchange assembly 30, so that the inlet 150 of the heat exchanger 100 can be connected to the outlet of the liquid-cooled heat exchange assembly 30 through the return connector 760. For example, the inlet 150 of the heat exchanger 100 can be connected to the outlet of the return channel 33 through the return connector 760. The outlet 160 of the heat exchanger 100 is connected to the supply connector 730, which is used to connect to the inlet of the liquid-cooled heat exchange assembly 30, so that the outlet 160 of the heat exchanger 100 can be connected to the inlet of the liquid-cooled heat exchange assembly 30 through the supply connector 730. For example, the liquid outlet 160 of the heat exchanger 100 can be connected to the inlet of the liquid supply channel 32 through the liquid supply connector 730. The liquid return connector 760 can be used as the inlet of the heat dissipation device 12, and the liquid supply connector 730 can be used as the outlet of the heat dissipation device 12, making it easier to assemble and disassemble the heat dissipation device 12 and the liquid-cooled heat exchange assembly 30.

[0091] In some examples, the heat exchanger 100 is provided with a liquid inlet connector 710 at the liquid inlet 150. The liquid inlet 150 of the heat exchanger 100 is connected and communicated with the liquid return connector 760 through the liquid inlet connector 710, which makes it easier to disassemble and assemble the liquid inlet 150 of the heat exchanger 100.

[0092] In other examples, the return connector 760 may be located at the inlet 150 of the heat exchanger 100, that is, the return connector 760 may be located on the heat exchanger 100.

[0093] For example, the heat exchanger 100 is provided with a liquid outlet connector 720 at the liquid outlet 160. The liquid outlet 160 of the heat exchanger 100 is connected and communicated with the liquid supply connector 730 through the liquid outlet connector 720, which makes it easier to disassemble and assemble the liquid outlet 160 of the heat exchanger 100.

[0094] For example, the heat dissipation device 12 also includes a drive pump 600, which is connected in series with the heat exchanger 100 between the liquid supply connector 730 and the liquid return connector 760. The drive pump 600 is used to drive the coolant to circulate in the coolant circulation loop.

[0095] In some examples, the drive pump 600 can be located between the outlet 160 and the supply connector 730 of the heat exchanger 100. For instance, the drive pump 600 can be located between the outlet connector 720 and the supply connector 730, with the outlet connector 720 connected to the inlet of the drive pump 600 and the outlet of the drive pump 600 connected to the supply connector 730. The outlet 160 of the heat exchanger 100 is connected to the supply connector 730 via the outlet connector 720 and the drive pump 600. In this way, the coolant dissipates heat within the heat exchanger 100 before flowing to the drive pump 600. The coolant temperature at the drive pump 600 is lower, reducing the likelihood of leakage at the drive pump 600, outlet connector 720, and supply connector 730, thus ensuring higher reliability of the coolant circulation loop. Furthermore, the lower coolant temperature also allows for higher driving efficiency of the drive pump 600.

[0096] For example, the inlet of the drive pump 600 can be connected to the outlet connector 720 via the first connecting pipe 740, and the outlet of the drive pump 600 can be connected to the supply connector 730 via the second connecting pipe 750. In this case, the outlet 160 of the heat exchanger 100 can be connected to the supply connector 730 via the outlet connector 720, the first connecting pipe 740, the drive pump 600, and the second connecting pipe 750. This makes it convenient to connect the drive pump 600, the heat exchanger 100, and the supply connector 730, facilitating their connection. Furthermore, the relative positions of the drive pump 600, the heat exchanger 100, and the supply connector 730 are less critical, allowing for more flexible arrangement of the drive pump 600 and the supply connector 730.

[0097] For example, both the first connecting pipe 740 and the second connecting pipe 750 can be flexible hoses, making the connection and arrangement of the first connecting pipe 740 and the second connecting pipe 750 more convenient.

[0098] In other examples, the drive pump 600 may also be located between the liquid inlet 150 and the return connector 760 of the heat exchanger 100. For example, the drive pump 600 may be located between the liquid inlet connector 710 and the return connector 760, with the return connector 760 connected to the inlet of the drive pump 600 and the outlet of the drive pump 600 connected to the liquid inlet connector 710. The return connector 760 is connected to the liquid inlet 150 of the heat exchanger 100 through the drive pump 600 and the liquid inlet connector 710.

[0099] The following explanation uses the example of a drive pump 600 located between the outlet 160 and the supply connector 730 of the heat exchanger 100.

[0100] like Figure 3 As illustrated, the heat dissipation device 12 also includes a fan 500, which drives airflow at the heat exchanger 100 to improve the heat dissipation efficiency of the heat exchanger 100. In some examples, the fan 500 may blow air toward the heat exchanger 100. In other examples, the fan 500 may draw air away from the heat exchanger 100.

[0101] like Figure 3 As shown, in some examples, the heat dissipation device 12 may also include a controller 300. The controller 300 can be used to control the cooling capacity provided by the heat dissipation device 12. Specifically, the controller 300 can be used to control the cooling capacity provided by the heat exchanger 100, so that the heat dissipation device 12 can provide the required cooling capacity to the liquid-cooled heat exchange assembly 30.

[0102] For example, the controller 300 is electrically connected to the drive pump 600. The controller 300 can be used to control the drive pump 600 so as to control the flow rate of the coolant flowing through the heat exchanger 100, thereby controlling the cooling capacity provided by the heat dissipation device 12. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the drive pump 600.

[0103] For example, the controller 300 is electrically connected to the fan 500. The controller 300 can be used to control the fan 500 so as to adjust the airflow speed at the heat exchanger 100 by adjusting the speed of the fan 500, thereby controlling the cooling capacity provided by the heat dissipation device 12. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the fan 500.

[0104] For example, the controller 300 can be electrically connected to both the drive pump 600 and the fan 500. The controller 300 can be used to control the drive pump 600 and the fan 500 to control the cooling capacity provided by the heat dissipation device 12 by controlling the speed of the fan 500 and the flow rate of the coolant flowing through the heat exchanger 100. In other words, the controller 300 can control the cooling capacity provided by the heat dissipation device 12 through the fan 500 and the drive pump 600.

[0105] For example, controller 300 can be used to obtain the speed of fan 500 and the speed of drive pump 600.

[0106] In some examples, to achieve automatic control of the fan 500 and the drive pump 600, the heat dissipation device 12 may further include a first temperature sensor 810 and a second temperature sensor 830. The first temperature sensor 810 is used to collect the temperature of the coolant flowing into the inlet 150 of the heat exchanger 100, and the second temperature sensor 830 is used to collect the temperature of the coolant flowing out of the outlet 160 of the heat exchanger 100. Both the first temperature sensor 810 and the second temperature sensor 830 are electrically connected to the controller 300, which is used to acquire the temperatures collected by the first temperature sensor 810 and the second temperature sensor 830. The controller 300 is also used to control at least one of the fan 500 and the drive pump 600 based on the temperature collected by at least one of the first temperature sensor 810 and the second temperature sensor 830.

[0107] For example, the controller 300 can be used to control the fan 500 and drive the pump 600 based on the temperature collected by the first temperature sensor 810 and the temperature collected by the second temperature sensor 830, so as to adjust the speed of the fan 500 and the flow rate of the coolant flowing into the liquid cooling heat exchange component 30, thereby adapting to different operating conditions of the liquid cooling equipment.

[0108] The heat dissipation device 12 also includes a pressure sensor 820, which is used to collect the pressure in the coolant circulation loop. The pressure sensor 820 is electrically connected to the controller 300. The controller 300 is used to acquire the pressure collected by the pressure sensor 820 so as to monitor the pressure in the coolant circulation loop and generate corresponding instructions based on the pressure in the coolant circulation loop.

[0109] For example, the controller 300 can be used to form a status command for indicating the working status of the coolant circulation loop based on at least one of the following parameters: the temperature collected by the first temperature sensor 810, the temperature collected by the second temperature sensor 830, the pressure collected by the pressure sensor 820, the speed of the fan 500, and the speed of the drive pump 600. The working status of the coolant circulation loop may include a normal status and a fault status.

[0110] The liquid cooling device also includes a device controller (not shown). For example, the charging pile 10 may include a device controller, which is a device independent of the heat dissipation device 12. The controller 300 of the heat dissipation device 12 is electrically connected to the device controller. The controller 300 of the heat dissipation device 12 is also used to send a status command that indicates the working state of the coolant circulation loop to the device controller. The device controller can generate corresponding control commands based on the acquired status command.

[0111] Figure 4 This is a schematic diagram from one perspective of another heat dissipation device provided in an embodiment of this application. Figure 5 for Figure 4 The diagram shows another perspective of the heat dissipation device provided. In the diagram, the x-direction is the first direction, the y-direction is the second direction, and the z-direction is the third direction. The first direction is the length direction of the heat dissipation device 12, the second direction is the width direction of the heat dissipation device 12, and the third direction is the height direction of the heat dissipation device 12.

[0112] For example, the length direction of the heat exchanger 100 can be the same as the length direction of the heat dissipation device 12, the width direction of the heat exchanger 100 can be the same as the width direction of the heat dissipation device 12, and the height direction of the heat exchanger 100 can be the same as the height direction of the heat dissipation device 12. That is, the first direction can also be the length direction of the heat exchanger 100, the second direction can also be the width direction of the heat exchanger 100, and the third direction can also be the height direction of the heat exchanger 100.

[0113] like Figure 4 , Figure 5 As shown, for example, the heat dissipation device 12 also includes a frame 400, and the heat exchanger 100, fan 500 and drive pump 600 can all be fixedly connected to the frame 400.

[0114] For example, the fan 500 and the drive pump 600 may be respectively located on both sides of the heat exchanger 100 in the first direction.

[0115] For example, the heat dissipation device 12 may include a plurality of fans 500. For instance, the heat dissipation device 12 may include two fans 500 arranged along a third direction.

[0116] In some examples, the inlet connector 710 is connected to the return connector 760 via a third connecting pipe 770. That is, one end of the third connecting pipe 770 is connected to the inlet connector 710, and the other end is connected to the return connector 760. In this case, the inlet 150 of the heat exchanger 100 is connected to the return connector 760 via the inlet connector 710 and the third connecting pipe 770. This allows for greater flexibility in the location of the inlet 150 of the heat exchanger 100 and facilitates the connection between the heat exchanger 100 and the return connector 760. For example, if the return connector 760 needs to be located above or on the upper part of the heat exchanger 100, the inlet 150 located at the lower part of the heat exchanger 100 can be connected to the return connector 760 above or on the upper part of the heat exchanger 100 via the third connecting pipe 770.

[0117] For example, the third connecting pipe 770 is a flexible hose, which makes the connection and arrangement of the third connecting pipe 770 more convenient.

[0118] For example, the liquid supply connector 730 and the liquid return connector 760 are located on the upper part of the heat dissipation device 12.

[0119] For example, the first temperature sensor 810 can be located at the return connector 760. The return connector 760 can support the first temperature sensor 810. When the return connector 760 is located above the heat dissipation device 12, the arrangement of the first temperature sensor 810 is not easily affected by the supporting components, drive pump 600, etc. at the bottom of the heat dissipation device 12, and the arrangement of the first temperature sensor 810 is more convenient.

[0120] For example, the second temperature sensor 830 can be located at the liquid supply connector 730. The liquid supply connector 730 can support the second temperature sensor 830. When the liquid supply connector 730 is located above the heat dissipation device 12, the arrangement of the second temperature sensor 830 is not easily affected by the supporting components, drive pump 600, etc. at the bottom of the heat dissipation device 12, and the arrangement of the second temperature sensor 830 is more convenient.

[0121] For example, the pressure sensor 820 can be located at the liquid supply connector 730, which can support the pressure sensor 820. When the liquid supply connector 730 is located above the heat dissipation device 12, the arrangement of the pressure sensor 820 is not easily affected by the supporting components and drive pump 600 at the bottom of the heat dissipation device 12, and the arrangement of the pressure sensor 820 is more convenient.

[0122] In some examples, the return connector 760 has multiple ports, which can be connected to the outlets of multiple liquid-cooled heat exchange components 30, respectively. For example, the multiple ports of the return connector 760 can be connected to multiple return channels 33, allowing the coolant in the multiple liquid-cooled heat exchange components 30 to flow into the heat exchanger 100 for heat dissipation. For example, the return connector 760 has two ports, and the charging pile 10 is equipped with two charging guns. The two ports of the return connector 760 are respectively connected to the outlets of the return channels 33 of the two charging guns.

[0123] In some examples, the liquid supply connector 730 has multiple ports, which can be connected to the inlets of multiple liquid-cooled heat exchange components 30 respectively. For example, the multiple ports of the liquid supply connector 730 can be connected to multiple return channels 33 respectively, so that the heat exchanger 100 can supply coolant to multiple liquid-cooled heat exchange components 30. For example, the liquid supply connector 730 has two ports, and the charging pile 10 is equipped with two charging guns. The two ports of the liquid supply connector 730 are respectively connected to the inlets of the liquid supply channels 32 of the two charging guns.

[0124] For example, the liquid supply connector 730 and the liquid return connector 760 can be integrated into a single adapter. That is, the heat dissipation device 12 may include an adapter, which includes the liquid supply connector 730 and the liquid return connector 760. The adapter can be located on the upper part of the heat dissipation device 12. In this case, the first temperature sensor 810, the second temperature sensor 830, and the pressure sensor 820 can all be located on the adapter.

[0125] In some examples, the heat exchanger 100 also has a drain port 140 located at the bottom of the heat exchanger 100. When it is necessary to drain the coolant from the heat exchanger 100, the coolant can be drained through the drain port 140.

[0126] Figure 6 This is a schematic diagram of a heat exchanger provided in an embodiment of this application. Figure 7 for Figure 6 Sectional view of plane AA. Figure 8 for Figure 7 Enlarged view of the S-section.

[0127] like Figures 6-8 As shown in the embodiment of this application, the heat exchanger 100 includes a heat dissipation component 120, which has a heat dissipation channel 121. The heat dissipation channel 121 contains coolant, and the coolant flowing into the heat dissipation channel 121 can dissipate heat through the heat dissipation component 120.

[0128] For example, fan 500 is used to drive airflow at heat dissipation component 120 to improve the heat dissipation efficiency of heat dissipation component 120.

[0129] For example, the heat dissipation component 120 has multiple heat dissipation channels 121 arranged side by side. For instance, the heat dissipation component 120 may include multiple heat dissipation pipes arranged side by side, each heat dissipation pipe may have one or more heat dissipation channels 121, and heat dissipation fins may be provided between two adjacent heat dissipation pipes, and the two adjacent heat dissipation pipes may be connected by the heat dissipation fins between them.

[0130] For example, the heat pipe can be a flat pipe.

[0131] For example, the heat dissipation component 120 includes a plurality of heat dissipation pipes arranged side by side along a second direction, each heat dissipation pipe having a plurality of heat dissipation channels 121 arranged side by side along a first direction, the two ends of the heat dissipation channels 121 extending along a third direction.

[0132] In this embodiment, the heat exchanger 100 further includes a first liquid collecting component 110, which has a first liquid collecting chamber 111 containing coolant. The first liquid collecting component 110 is connected to the heat dissipation component 120, and the first liquid collecting chamber 111 is connected to the heat dissipation channel 121. The first liquid collecting chamber 111 is used for the convergence or diversion of multiple heat dissipation channels 121, so that the coolant can dissipate heat in the multiple heat dissipation channels 121. In addition, by setting the first liquid collecting component 110, it is also convenient to connect the multiple heat dissipation channels 121 to the liquid-cooled heat exchange assembly 30, so as to connect the multiple heat dissipation channels 121 to the coolant circulation loop.

[0133] For example, the first liquid collecting component 110 is disposed at one end of the heat dissipation component 120 and is fixedly connected to one end of the heat dissipation component 120. For example, the first liquid collecting component 110 is disposed at one end of the heat dissipation pipe and is fixedly connected to one end of the heat dissipation pipe.

[0134] For example, the first liquid collecting component 110 has a connecting hole 114, and the heat dissipation component 120 is fixed and sealed to the first liquid collecting component 110 at the connecting hole 114. The first liquid collecting cavity 111 is connected to the heat dissipation channel 121 through the connecting hole 114.

[0135] In some examples where the heat dissipation component 120 includes multiple heat dissipation pipes arranged side by side, the first liquid collection component 110 has multiple connecting holes 114 corresponding to the heat dissipation pipes. The heat dissipation pipes are fixed and sealed to the first liquid collection component 110 at the corresponding connecting holes 114. All heat dissipation channels 121 of the heat dissipation pipes are connected to the first liquid collection chamber 111 through the corresponding connecting holes 114.

[0136] like Figure 6 , Figure 7As shown, in some examples, the heat exchanger 100 further includes a second liquid collecting component 130, which has a second liquid collecting chamber 131 containing coolant. The second liquid collecting component 130 is connected to the heat dissipation component 120. One end of the heat dissipation channel 121 is connected to the first liquid collecting chamber 111, and the other end of the heat dissipation channel 121 is connected to the second liquid collecting chamber 131. The second liquid collecting chamber 131 is used for the convergence or divergence of multiple heat dissipation channels 121. By setting the second liquid collecting component 130, it is convenient to connect multiple heat dissipation channels 121 to the liquid-cooled heat exchange assembly 30, so as to connect multiple heat dissipation channels 121 to the coolant circulation loop.

[0137] For example, the second liquid collecting component 130 is disposed at the other end of the heat dissipation component 120 and is fixedly connected to the other end of the heat dissipation component 120. For instance, the second liquid collecting component 130 is disposed at the other end of the heat dissipation pipe and is fixedly connected to the other end of the heat dissipation pipe.

[0138] like Figure 6 , Figure 7 As shown in this embodiment, the first liquid collecting component 110 is provided with a pressure control component 220, which is used to control the pressure in the first liquid collecting chamber 111 within a preset range. In addition to coolant, the first liquid collecting chamber 111 also contains gas, that is, the first liquid collecting chamber 111 includes a first space for containing coolant and a second space for containing gas, and the first liquid collecting chamber 111 is not completely filled with coolant.

[0139] Thus, by providing a pressure control component 220 in the first liquid collecting component 110, the pressure control component 220 can control the pressure of the first liquid collecting chamber 111 within a preset range. The gas contained in the first liquid collecting chamber 111 can be compressed or expanded under the control of the pressure control component 220 to balance the pressure within the first liquid collecting chamber 111, allowing the gas contained in the first liquid collecting chamber 111 to achieve a buffering function. In other words, the first liquid collecting component 110 with the pressure control component 220 can buffer pressure changes in the coolant circulation loop. At this time, in addition to being used for the convergence or diversion of multiple heat dissipation channels 121, the first liquid collecting component 110 can also act as a buffer tank. In other words, the buffer tank is integrated with the first liquid collecting component 110 of the heat exchanger 100, thus eliminating the need for a separate buffer tank outside the heat exchanger 100, resulting in a higher degree of integration of the heat dissipation device 12 and facilitating a reduction in the size of the heat dissipation device 12. Furthermore, since there is no need to set up a buffer tank independent of the heat exchanger 100, the number of structural components of the heat dissipation device 12 can be reduced, which helps to reduce the cost of the heat dissipation device 12.

[0140] The size of the first space for containing coolant and the second space for containing gas vary with the amount of coolant contained in the first liquid collection chamber 111.

[0141] For example, the gas contained in the first liquid chamber 111 can be air.

[0142] For example, the volume of the first liquid collecting chamber 111 can be larger than the volume of the second liquid collecting chamber 131, so that part of the first liquid collecting chamber 111 can contain the coolant circulating in the coolant circulation loop, and part can contain gas, thereby facilitating the buffering of pressure changes in the coolant circulation loop through the first liquid collecting component 110. In addition, the larger volume of the first liquid collecting chamber 111 can contain a larger volume of gas, so that the first liquid collecting component 110 can have a better buffering effect.

[0143] For example, in the third direction, the size of the first liquid collecting component 110 is larger than the size of the second liquid collecting component 130, so that the first liquid collecting cavity 111 can have a larger volume. In addition, the larger size of the first liquid collecting component 110 in the third direction is beneficial to leaving a second space for accommodating gas in the upper part of the first liquid collecting cavity 111.

[0144] For example, in the first direction, the size of the first liquid collecting component 110 is larger than the size of the second liquid collecting component 130, and the size of the first liquid collecting component 110 is larger than the size of the heat dissipation component 120, so that the first liquid collecting cavity 111 can have a larger volume. In addition, the larger size of the first liquid collecting component 110 in the first direction is beneficial for arranging devices or components such as pressure control component 220 on the first liquid collecting component 110.

[0145] like Figure 6 As shown, in some possible embodiments, the first liquid collection component 110 has a pressure relief port 113 (e.g., Figure 10 As shown in the figure, the pressure control component 220 includes a safety valve 221 located at the pressure relief port 113.

[0146] In this way, when the pressure in the first liquid collecting chamber 111 is too high, the safety valve 221 can be opened, and the pressure can be released through the pressure relief port 113 and the safety valve 221 to control the pressure in the first liquid collecting chamber 111. This allows the first liquid collecting component 110 to buffer the pressure changes in the coolant circulation loop, while also ensuring good safety and preventing damage from overpressure in the first liquid collecting chamber 111.

[0147] For example, when the safety valve 221 is opened, the gas in the first liquid collection chamber 111 can be discharged through the pressure relief port 113 and the safety valve 221.

[0148] For example, the pressure relief port 113 can be located at the top of the first liquid collecting component 110. For instance, the pressure relief port 113 can be located on the top wall of the first liquid collecting component 110, so that when the pressure in the first liquid collecting chamber 111 is within a preset range, the coolant in the first liquid collecting chamber 111 is less likely to leak at the pressure relief port 113. In addition, when the safety valve 221 is open, the coolant is also less likely to be discharged through the pressure relief port 113.

[0149] In some possible implementations, the pressure control component 220 may include a pressure regulating valve for controlling the pressure of the first liquid collecting chamber 111 based on the pressure switch within the first liquid collecting chamber 111. For example, the pressure regulating valve may close when the pressure in the first liquid collecting chamber 111 is within a preset range, and open when the pressure in the first liquid collecting chamber 111 is too high or too low.

[0150] like Figure 6 As shown, in some possible embodiments, the first liquid collection component 110 has a liquid inlet 112 (e.g., Figure 10 As shown in the figure, a plug 210 is provided at the injection port 112. The plug 210 is detachably connected to the first liquid collection component 110 and the plug 210 seals the injection port 112.

[0151] Thus, when the coolant in the first liquid collection chamber 111 is low and needs to be replenished, the plug 210 can be opened to replenish the first liquid collection chamber 111, making it convenient to replenish the coolant circulation loop. After replenishing the first liquid collection chamber 111, the plug 210 can be used to seal the injection port 112 to achieve a seal on the first liquid collection chamber 111, facilitating the circulation of coolant in the coolant circulation loop and providing a buffering function.

[0152] For example, the injection port 112 may be located at the top of the first liquid collection component 110. For instance, the injection port 112 may be located on the top wall of the first liquid collection component 110, so that the liquid in the first liquid collection chamber 111 is not easy to leak from the injection port 112.

[0153] like Figure 6 As shown, in some possible embodiments, the first liquid collecting component 110 is further provided with a level gauge 240, which is used to display the liquid level of the first liquid collecting chamber 111 so that the user can grasp the liquid level in the first liquid collecting chamber 111 and thus facilitate the user to control the liquid level in the first liquid collecting chamber 111.

[0154] For example, the level gauge 240 is connected to the first liquid collection chamber 111.

[0155] For example, the level gauge 240 may include an upper connector, a lower connector, and a transparent tube. The upper connector is located at the top of the first liquid collecting component 110 and communicates with the space at the top of the first liquid collecting chamber 111. The lower connector is located at the bottom of the first liquid collecting component 110 and communicates with the space at the bottom of the first liquid collecting chamber 111. The two ends of the transparent tube are connected to the upper connector and the lower connector, respectively. The upper end of the transparent tube communicates with the space at the top of the first liquid collecting chamber 111 through the upper connector, and the lower end of the transparent tube communicates with the space at the bottom of the first liquid collecting chamber 111 through the lower connector. Utilizing the principle of communicating vessels, the liquid level of the first liquid collecting chamber 111 can be displayed through the transparent tube.

[0156] like Figure 6 As shown, in some possible embodiments, the first liquid collecting component 110 is further provided with a liquid level sensor 230, which is used to detect the liquid level of the first liquid collecting chamber 111.

[0157] In this way, by detecting the liquid level in the first liquid collection chamber 111 through the liquid level sensor 230, it is convenient to monitor the liquid level in the first liquid collection chamber 111 and generate corresponding instructions based on the liquid level in the first liquid collection chamber 111, which is conducive to realizing automated control.

[0158] For example, the liquid level sensor 230 is electrically connected to the controller 300. The liquid level sensor 230 is used to generate a first signal when the liquid level in the first liquid collection chamber 111 is lower than a preset liquid level, and to generate a second signal when the liquid level in the first liquid collection chamber 111 is higher than or equal to the preset liquid level. The controller 300 is used to acquire the first signal and the second signal, and to generate a status command to indicate the status of the first liquid collection chamber 111 based on the first signal and the second signal. The status of the first liquid collection chamber 111 may include a normal status and a low liquid status. This facilitates timely detection of low liquid status in the first liquid collection chamber 111.

[0159] For example, the liquid level sensor 230 may be disposed on the bottom wall or the top wall of the first liquid collection component 110.

[0160] In some possible implementations, the first liquid collecting component 110 is located above the heat dissipation component 120, that is, the first liquid collecting cavity 111 is located above the heat dissipation channel 121, and the upper end of the heat dissipation channel 121 is connected to the first liquid collecting cavity 111.

[0161] In this way, the flow of coolant between the first liquid collecting chamber 111 and the heat dissipation channel 121 is less affected by the gas contained in the first liquid collecting chamber 111, and the flow of coolant between the first liquid collecting chamber 111 and the heat dissipation channel 121 is relatively easy. Furthermore, the installation of components or structures such as the pressure control component 220, the injection port 112, and the level gauge 240 on the first liquid collecting component 110 is less affected by the heat dissipation component 120, and it is easier to install such components or structures on the first liquid collecting component 110. Additionally, it facilitates opening the first liquid collecting component 110 when coolant is present in the coolant circulation loop, enabling operations such as injecting coolant into the first liquid collecting chamber 111 and maintaining the components or devices within the first liquid collecting chamber 111.

[0162] For example, a portion of the first liquid collecting component 110 protrudes from the heat dissipation component 120 in a first direction so as to facilitate the installation of a device or component such as a liquid level sensor 230 on the bottom wall of the first liquid collecting component 110.

[0163] like Figure 7 As shown in this embodiment, the controller 300 is located inside the first liquid collection chamber 111.

[0164] In this way, the first liquid collecting component 110 can serve to load and protect the controller 300. Besides being used for the convergence or diversion of multiple heat dissipation channels 121 and buffering pressure changes in the coolant circulation loop, the first liquid collecting component 110 also functions as an electrical control box. In other words, the electrical control box, buffer tank, and the first liquid collecting component 110 of the heat exchanger 100 are integrated into one unit. Thus, there is no need for a separate buffer tank or electrical control box separate from the heat exchanger 100, further improving the integration of the heat dissipation device 12 and facilitating a further reduction in its size. Furthermore, since there is no need for a separate buffer tank and electrical control box separate from the heat exchanger 100, the number of structural components in the heat dissipation device 12 can be further reduced, further lowering its cost.

[0165] For example, by placing the controller 300 inside the first liquid collection chamber 111, the size of the heat dissipation device 12 can be reduced while keeping the size of the first liquid collection chamber 111 unchanged. Conversely, while keeping the size of the heat dissipation device 12 unchanged, the space within the heat dissipation device 12 used for buffering can be increased to improve the buffering effect.

[0166] The coolant is an insulating coolant such as cooling oil or fluorinated liquid, which makes the controller 300 less prone to short circuits due to contact with the coolant.

[0167] For example, the controller 300 is submerged in the coolant, meaning it is completely submerged, which helps to reduce the size of the first coolant collecting component 110. Furthermore, because the controller 300 is submerged, dust accumulation on its surface is less likely, improving its reliability. Additionally, the lack of dust accumulation eliminates the need for a protective layer, reducing the controller 300's cost. Moreover, submersion in the coolant allows for efficient heat transfer to the coolant and dissipation through the heat exchanger 100, resulting in better heat dissipation performance.

[0168] For example, controller 300 can be a control board.

[0169] For example, the gas in the first liquid collection chamber 111 is located above the coolant in the first liquid collection chamber 111, so that there is no need to install a component to separate the coolant and the gas in the first liquid collection chamber 111, which makes the structure in the first liquid collection chamber 111 simpler and facilitates the installation of the controller 300 in the first liquid collection chamber 111.

[0170] For example, the controller 300 is fixedly disposed within the first liquid collection chamber 111, making the assembly of the controller 300 more stable and less likely to cause problems such as the controller 300 moving relative to the first liquid collection component 110 and affecting the components within the first liquid collection chamber 111. Furthermore, the controller 300 is less likely to malfunction due to collisions with the first liquid collection component 110 or the components within the first liquid collection chamber 111. Additionally, it facilitates a stable electrical connection for the controller 300.

[0171] For example, the distance between the controller 300 and the bottom wall of the first liquid collection chamber 111 is smaller than the distance between the controller 300 and the top wall of the first liquid collection chamber 111, making it easier to completely immerse the controller 300 with less coolant. Furthermore, while the controller 300 is submerged in coolant, a larger space can be left in the upper part of the first liquid collection chamber 111 to accommodate gas, thus giving the first liquid collection chamber 111 better buffering performance.

[0172] For example, the controller 300 is spaced apart from the communication hole 114.

[0173] In this way, the controller 300 is less likely to affect the connection between the first liquid collection chamber 111 and the heat dissipation channel 121, making it easier to achieve the connection between the first liquid collection chamber 111 and the heat dissipation channel 121, which is equipped with the controller 300 inside.

[0174] For example, the controller 300 and the cavity wall on the side of the first liquid collection chamber 111 with the communication hole 114 are spaced apart to facilitate the communication between the communication hole 114 and various parts inside the first liquid collection chamber 111, so as to make full use of the first liquid collection chamber 111.

[0175] The drive pump 600, fan 500, first temperature sensor 810, pressure sensor 820 and second temperature sensor 830 are all located outside the heat exchanger 100.

[0176] In some possible implementations, the first liquid collecting component 110 has an assembly hole 115, an electrical connection connector 250 is provided in the assembly hole 115, the electrical connection connector 250 is fixed and sealed to the first liquid collecting component 110, the controller 300 is electrically connected to the electrical connection connector 250, and the electrical connection connector 250 is electrically connected to devices outside the first liquid collecting component 110, so that the controller 300 can be electrically connected to devices outside the first liquid collecting component 110 through the electrical connection connector 250.

[0177] This facilitates the electrical connection between the controller 300 inside the first liquid collection chamber 111 and devices such as the drive pump 600 and fan 500 outside the first liquid collection component 110. Furthermore, by providing an electrical connection connector 250 that passes through the cavity wall of the first liquid collection chamber 111, the sealing at the connection point between the electrical connection connector 250 and the first liquid collection component 110 is easier and less prone to failure, thus improving the sealing of the first liquid collection chamber 111.

[0178] For example, a portion of the electrical connector 250 is located inside the first liquid collection chamber 111 and is electrically connected to the controller 300, while another portion of the electrical connector 250 is located outside the first liquid collection component 110 and is electrically connected to devices outside the first liquid collection component 110. For instance, the portion of the electrical connector 250 outside the first liquid collection component 110 is electrically connected to the drive pump 600, the fan 500, the first temperature sensor 810, the second temperature sensor 830, and the pressure sensor 820.

[0179] For example, the controller 300 can be connected to the electrical connection connector 250 via a connection cable.

[0180] In some examples, the electrical connector 250 is located on the top wall of the first liquid collection component 110, so that the coolant in the first liquid collection chamber 111 is not easily leaked from the connection between the electrical connector 250 and the first liquid collection component 110.

[0181] In other examples, the electrical connection 250 may also be located on the side wall or bottom wall of the first liquid collection component 110.

[0182] In some other possible embodiments, the first liquid collecting component 110 has a wire hole through which an electrical connecting wire is passed. The electrical connecting wire is fixed and sealed to the first liquid collecting component 110. Part of the electrical connecting wire is located inside the first liquid collecting cavity 111 and is electrically connected to the controller 300. Part of the electrical connecting wire is located outside the first liquid collecting component 110 and is electrically connected to a device outside the first liquid collecting component 110, so that the controller 300 can be electrically connected to a device outside the first liquid collecting component 110 through the electrical connecting wire.

[0183] Figure 9 for Figure 6 A cross-sectional view of the BB plane.

[0184] like Figure 9 As shown, for example, the controller 300 and the injection port 112 are spaced apart, so that the controller 300 is less likely to affect the injection through the injection port 112.

[0185] For example, the controller 300 and the plug 210 are spaced apart, so that the installation of the controller 300 and the plug 210 does not easily affect each other.

[0186] For example, the controller 300 and the first liquid collection chamber 111 are spaced apart on the side of the chamber wall where the liquid inlet 112 and the plug 210 are located.

[0187] In some possible implementations, the projection of the controller 300 is located outside the projection of the injection port 112 in the direction of extension of the centerline of the injection port 112, so that when coolant is added through the injection port 112, the controller 300 is less likely to be displaced or malfunction due to the impact of the added coolant.

[0188] For example, when the injection port 112 is located on the top wall of the first liquid collecting component 110, the projection of the controller 300 is outside the projection of the injection port 112 along the height direction of the heat dissipation device 12.

[0189] For example, the controller 300 and the pressure control component 220 are spaced apart, so that the installation of the controller 300 and the pressure control component 220 is less likely to interfere with each other. For example, the controller 300 and the safety valve 221 are spaced apart, so that the installation of the controller 300 and the safety valve 221 is less likely to interfere with each other.

[0190] For example, the controller 300 and the first liquid collection chamber 111 are spaced apart on the side of the chamber wall where the pressure control component 220 is located.

[0191] For example, the controller 300 and the pressure relief port 113 are spaced apart, so that the controller 300 is less likely to affect the pressure relief through the pressure relief port 113.

[0192] For example, the controller 300 is spaced apart from the cavity wall on the side of the first liquid collection chamber 111 where the pressure relief port 113 is located.

[0193] In some possible implementations, the projection of the controller 300 is located outside the projection of the pressure relief port 113 in the direction of extension of the centerline of the pressure relief port 113, so that the installation of the safety valve 221 and the controller 300 does not easily affect each other.

[0194] For example, when the pressure relief port 113 is located on the top wall of the first liquid collection component 110, the projection of the controller 300 is outside the projection of the pressure relief port 113 along the height direction of the heat dissipation device 12.

[0195] For example, the controller 300 and the liquid level sensor 230 are spaced apart, so that the installation of the controller 300 and the liquid level sensor 230 is less likely to interfere with each other.

[0196] For example, the controller 300 and the first liquid collection chamber 111 are spaced apart on the side where the liquid level sensor 230 is located.

[0197] For example, on a horizontal plane, the liquid level sensor 230 and the controller 300 are staggered, so that the detection of the liquid level in the first liquid collection chamber 111 by the liquid level sensor 230 is not easily affected by the controller 300.

[0198] For example, the controller 300 and the electrical connection connector 250 are spaced apart, so that the installation of the controller 300 and the electrical connection connector 250 does not easily affect each other.

[0199] For example, the controller 300 and the first liquid collection chamber 111 are spaced apart on the side of the chamber wall where the electrical connection connector 250 is located.

[0200] like Figure 9 As shown, in some examples, the controller 300 is fixedly connected to the first liquid collection component 110 via the connecting component 310, so that the cavity wall of the first liquid collection chamber 111 connected to the controller 300 is spaced apart from the controller 300.

[0201] For example, one end of the connecting component 310 is fixedly connected to the controller 300, and the other end of the connecting component 310 is fixedly connected to the first liquid collecting component 110.

[0202] For example, the controller 300 is fixedly connected to the top wall of the first liquid collection component 110 via the connecting component 310, and the controller 300 is suspended inside the first liquid collection chamber 111.

[0203] For example, the connecting component 310 may include a plurality of connecting posts spaced apart, and the controller 300 may be fixedly connected to the first liquid collecting component 110 through the plurality of connecting posts spaced apart.

[0204] Figure 10 for Figure 6 The exploded view of the heat exchanger provided in the image.

[0205] like Figure 9 , Figure 10 As shown, in some possible embodiments, the first liquid collecting component 110 includes a housing 116 and a plate 117. The housing 116 has an opening 118 and a communicating hole 114, which are located on different sides of the housing 116. The plate 117 is detachably connected to the housing 116, and the plate 117 covers the opening 118. The housing 116 and the plate 117 enclose a first liquid collecting cavity 111. The heat dissipation component 120 is fixed and sealed to the housing 116 at the communicating hole 114, and the heat dissipation channel 121 communicates with the inner cavity of the housing 116 through the communicating hole 114.

[0206] This makes it easier to maintain devices such as the controller 300 installed in the first liquid collection chamber 111.

[0207] For example, the opening 118 and the connecting hole 114 are located on opposite sides of the housing 116. For instance, the opening 118 is located at the top of the housing 116, the connecting hole 114 is located at the bottom wall of the housing 116, the plate 117 is located at the top of the housing 116, the heat dissipation component 120 is fixedly connected to the bottom wall of the housing 116, the housing 116 is used to form the bottom wall and at least part of the side wall of the first liquid collecting component 110, and the plate 117 is used to form at least part of the top wall of the first liquid collecting component 110, so that the coolant in the first liquid collecting chamber 111 is not easy to leak at the opening 118, and it is also convenient to open the plate 117 when there is coolant in the first liquid collecting chamber 111.

[0208] For example, a seal is provided between the housing 116 and the plate 117, and the housing 116 and the plate 117 are sealed together by the seal. For example, the seal can be a sealing ring.

[0209] For example, the housing 116 and the plate 117 can be fixedly connected by fasteners such as bolts, so that the housing 116 and the plate 117 are fixed more securely.

[0210] For example, the level gauge 240 is located in the housing 116, so that the level gauge 240 does not easily affect the disassembly and assembly of the plate 117 and the housing 116.

[0211] In some examples, housing 116 has a liquid inlet 112 and plug 210 is disposed on housing 116. In other examples, plate 117 has a liquid inlet 112 and plug 210 is disposed on plate 117.

[0212] In some examples, pressure control component 220 is located in housing 116, for example, housing 116 has a pressure relief port 113, and safety valve 221 is located in housing 116.

[0213] In other examples, pressure control component 220 is provided on plate 117, for example, plate 117 has pressure relief port 113, and safety valve 221 is provided on plate 117.

[0214] For example, the plate 117 forms a portion of the cavity wall on the side of the first liquid collecting cavity 111 with the opening 118, and the housing 116 forms a portion of the cavity wall on the side of the first liquid collecting cavity 111 with the opening 118, so that the size of the opening 118 is small, which is beneficial to the sealing of the first liquid collecting cavity 111. For example, the plate 117 forms a portion of the top wall of the first liquid collecting cavity 111, and the housing 116 forms a portion of the top wall of the first liquid collecting cavity 111.

[0215] In some possible implementations, the controller 300 is fixedly connected to the plate 117. In this way, when the plate 117 is opened from the opening 118, the controller 300 can be lifted up, making it easier to maintain the controller 300.

[0216] For example, the controller 300 is fixedly connected to the board 117 via the connecting component 310. The controller 300 and the board 117 are spaced apart, so that the components or devices installed on the controller 300 and the board 117 are less likely to interfere with each other.

[0217] For example, the controller 300 is spaced apart from the housing 116, making it less likely for the components or devices mounted on the controller 300 and the housing 116 to interfere with each other. In addition, there is an assembly gap between the housing 116 and the controller 300, making it easier to assemble the controller 300, which is fixedly connected to the plate 117, into the housing 116.

[0218] In some examples, the orthographic projection of the controller 300 on the plate 117 lies within the orthographic projection of the opening 118 on the plate 117.

[0219] In this way, the controller 300 can be removed from the opening 118 when the board 117 is opened, which facilitates the maintenance of the controller 300.

[0220] In some possible implementations, the electrical connector 250 is provided on the plate body 117. That is, the mounting hole 115 is located on the plate body 117, and the electrical connector 250 is fixed and sealed to the plate body 117.

[0221] In this way, when the plate 117 is opened from the opening 118, the electrical connector 250 and the controller 300 are less likely to shift, which is conducive to a stable connection between the electrical connector 250 and the controller 300.

[0222] In some possible implementations, the controller 300 is spaced apart from the cavity wall of the first liquid collecting chamber 111, meaning that the controller 300 is spaced apart from each side cavity wall of the first liquid collecting chamber 111. This provides assembly gaps between the controller 300 and each side cavity wall of the first liquid collecting chamber 111, facilitating the assembly of the controller 300 within the first liquid collecting chamber 111. Furthermore, the placement of devices or components on each side cavity wall of the first liquid collecting chamber 111 is less affected by the controller 300, allowing for more flexible arrangement of devices or components on the first liquid collecting component 110. This also facilitates the flexible arrangement of the controller 300 within the first liquid collecting chamber 111, thereby enabling greater flexibility in the shape and dimensions of the first liquid collecting component 110 in all directions.

[0223] In the example where the controller 300 is spaced apart from the cavity wall of the first liquid collection chamber 111 and the first liquid collection component 110 includes a plate 117 and a housing 116, the controller 300 is spaced apart from both the plate 117 and the housing 116.

[0224] In some examples, the second liquid collection component 130 is located below the heat dissipation component 120, that is, the second liquid collection chamber 131 is located below the heat dissipation channel 121, and the lower end of the heat dissipation channel 121 is connected to the second liquid collection chamber 131.

[0225] In the example where the second liquid collecting component 130 is located below the heat dissipation component 120, the drain port 140 is located on the second liquid collecting component 130 and is connected to the second liquid collecting chamber 131.

[0226] In some examples where the second liquid collecting component 130 is located below the heat dissipation component 120, at least one of the liquid inlet 150 and the liquid outlet 160 of the heat exchanger 100 is located in the second liquid collecting component 130 and communicates with the second liquid collecting chamber 131.

[0227] Thus, when the inlet 150 of the heat exchanger 100 is located in the second liquid collecting component 130 and communicates with the second liquid collecting chamber 131, the coolant enters the heat exchanger 100 through the second liquid collecting chamber 131 located at the lower part of the heat exchanger 100, and then enters the first liquid collecting chamber 111 through the heat dissipation channel 121. This makes it easier for the coolant to flow into the first liquid collecting chamber 111, as it is less affected by the gas in the first liquid collecting chamber 111. When the outlet 160 of the heat exchanger 100 is located at the second liquid collection component 130 and communicates with the second liquid collection chamber 131, the coolant in the first liquid collection chamber 111 flows through the heat dissipation channel 121 to the second liquid collection chamber 131 located at the bottom of the heat exchanger 100, and flows out of the heat exchanger 100 through the second liquid collection chamber 131 located at the bottom of the heat exchanger 100. This makes it difficult for the gas in the first liquid collection chamber 111 to be extracted by the drive pump 600, resulting in better efficiency and stability of the drive pump 600.

[0228] In some examples, the inlet 150 of the heat exchanger 100 is located in the second liquid collecting component 130 and communicates with the second liquid collecting chamber 131, while the outlet 160 of the heat exchanger 100 is located in the first liquid collecting component 110 and communicates with the first liquid collecting chamber 111. The outlet 160 of the heat exchanger 100 is located at the bottom of the first liquid collecting component 110, for example, at the bottom wall of the first liquid collecting component 110, so that the coolant in the first liquid collecting chamber 111 can flow out from the bottom of the first liquid collecting chamber 111. In this case, the structure of the heat exchanger 100 is relatively simple and the cost is low. In addition, the structure inside the first liquid collecting chamber 111 is relatively simple, which makes it easy to use the entire first liquid collecting chamber 111 to buffer the pressure changes in the coolant circulation loop, resulting in a better buffering effect on the pressure changes in the coolant circulation loop. Furthermore, the simple structure inside the first liquid collecting chamber 111 also makes it easy to install the controller 300 inside the first liquid collecting chamber 111.

[0229] In other examples, the outlet 160 of the heat exchanger 100 is located in the second liquid collecting component 130 and communicates with the second liquid collecting chamber 131, while the inlet 150 of the heat exchanger 100 is located in the first liquid collecting component 110 and communicates with the first liquid collecting chamber 111. The inlet 150 of the heat exchanger 100 is located at the bottom of the first liquid collecting component 110, for example, at the bottom wall of the first liquid collecting component 110, so that the coolant can flow in from the bottom of the first liquid collecting chamber 111. In this case, the structure of the heat exchanger 100 is relatively simple and the cost is low. In addition, the structure inside the first liquid collecting chamber 111 is relatively simple, which makes it easy to use the entire first liquid collecting chamber 111 to buffer pressure changes in the coolant circulation loop, resulting in a better buffering effect. Furthermore, the simple structure inside the first liquid collecting chamber 111 also makes it easy to install the controller 300 inside the first liquid collecting chamber 111.

[0230] In some other examples, the second liquid collection chamber 131 is provided with a partition, which divides the second liquid collection chamber 131 into a first sub-chamber and a second sub-chamber. Part of the heat dissipation channel 121 connects the first sub-chamber and the first liquid collection chamber 111, and part of the heat dissipation channel 121 connects the second sub-chamber and the first liquid collection chamber 111. The liquid inlet 150 and the liquid outlet 160 of the heat exchanger 100 are both located in the second liquid collection component 130. The liquid inlet 150 of the heat exchanger 100 is connected to the first sub-chamber, and the liquid outlet 160 of the heat exchanger 100 is connected to the second sub-chamber. After entering the heat exchanger 100, the coolant first flows into the first sub-cavity, then flows through the heat dissipation channel 121 connected to the first sub-cavity to the first liquid collection chamber 111. The coolant in the first liquid collection chamber 111 flows through the heat dissipation channel 121 connected to the second sub-cavity to the second sub-cavity, and then flows out of the heat exchanger 100 from the outlet 160. This allows for a longer flow path for the coolant within the heat exchanger 100, facilitating sufficient heat dissipation. Furthermore, it allows for a faster flow rate of the coolant in the coolant circulation loop, which is beneficial for efficient heat dissipation of the heat-generating components 20. Additionally, the relatively simple structure of the first liquid collection chamber 111 facilitates the buffering of pressure changes in the coolant circulation loop, resulting in a better buffering effect. Moreover, the simple structure of the first liquid collection chamber 111 also facilitates the installation of the controller 300 within it.

[0231] For example, the first sub-cavity and the second sub-cavity can be arranged along a second direction. In the second direction, a portion of the heat dissipation channel 121 and the first sub-cavity are located on the same side of the partition and communicate with the first sub-cavity, and a portion of the heat dissipation channel 121 and the second sub-cavity are located on the same side of the partition and communicate with the second sub-cavity.

[0232] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0233] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0234] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of this application, and are not intended to limit them; although the embodiments of this application have been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat exchanger (100), characterized in that, include: The heat dissipation component (120) has a heat dissipation channel (121); The first liquid collecting component (110) has a first liquid collecting cavity (111), the first liquid collecting component (110) is connected to the heat dissipation component (120), and the first liquid collecting cavity (111) is connected to the heat dissipation channel (121); A controller (300) is disposed in the first liquid collection chamber (111), and the controller (300) is used to control the cooling capacity provided by the heat exchanger (100); The first liquid collection component (110) is provided with a pressure control component (220), which is used to control the pressure in the first liquid collection chamber (111) within a preset range.

2. The heat exchanger (100) according to claim 1, characterized in that, The first liquid collecting component (110) has an assembly hole (115), and an electrical connection connector (250) is provided in the assembly hole (115). The electrical connection connector (250) is fixed and sealed to the first liquid collecting component (110), and the controller (300) is electrically connected to the electrical connection connector (250).

3. The heat exchanger (100) according to claim 1, characterized in that, The first liquid collecting component (110) has a connecting hole (114); The first liquid collection chamber (111) is connected to the heat dissipation channel (121) through the connecting hole (114), and the controller (300) is fixedly installed in the first liquid collection chamber (111) and spaced apart from the connecting hole (114).

4. The heat exchanger (100) according to claim 1, characterized in that, The controller (300) is fixedly connected to the first liquid collection component (110) via a connecting component (310), and the controller (300) is spaced apart from the cavity wall of the first liquid collection chamber (111).

5. The heat exchanger (100) according to any one of claims 1-4, characterized in that, The first liquid collecting component (110) includes a housing (116) and a plate (117); The housing (116) has an opening (118) and a connecting hole (114), the opening (118) and the connecting hole (114) being located on different sides of the housing (116); The plate (117) is detachably connected to the shell (116), the plate (117) covers the opening (118), and the shell (116) and the plate (117) surround to form the first liquid collection cavity (111); The heat dissipation component (120) is fixed and sealed to the housing (116) at the communication hole (114), and the heat dissipation channel (121) is connected to the inner cavity of the housing (116) through the communication hole (114).

6. The heat exchanger (100) according to claim 5, characterized in that, The controller (300) is fixedly connected to the plate (117).

7. The heat exchanger (100) according to any one of claims 1-4, characterized in that, The first liquid collecting component (110) has a liquid injection port (112), and a plug (210) is provided at the liquid injection port (112). The plug (210) is detachably connected to the first liquid collecting component (110), and the plug (210) blocks the liquid injection port (112).

8. A heat dissipation device (12), characterized in that, Includes the heat exchanger (100) as described in any one of claims 1-7; The heat exchanger (100) has a heat dissipation channel (121) for containing coolant, a first liquid collection chamber (111) for containing coolant and gas, and a controller (300) for being immersed in coolant. The coolant is an insulating coolant.

9. A charging pile (10), characterized in that, It includes a pile body (11) and a heat dissipation device (12) as described in claim 8, wherein the heat dissipation device (12) is disposed within the pile body (11).

10. A liquid cooling device, characterized in that, It includes a liquid-cooled heat exchange assembly (30) and a heat dissipation device (12) as described in claim 8; The liquid-cooled heat exchange assembly (30) is used to form a coolant circulation loop with the heat exchanger (100) of the heat dissipation device (12); The liquid-cooled heat exchange assembly (30) and the heat dissipation device (12) contain coolant in their heat dissipation channels (121), the first liquid collection chamber (111) of the heat dissipation device (12) contains the coolant and gas, and the controller (300) of the heat dissipation device (12) is immersed in the coolant. The coolant is an insulating coolant.

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