Infrared thermal imaging thermodetector for electrical cabinet

Abstract

The utility model discloses an infrared thermal imaging thermodetector for an electrical cabinet, which comprises a shell, the outer side of the rear wall of the shell is provided with heat dissipation fins, and the inner side of the rear wall of the shell is provided with a heat dissipation boss which forms heat conduction with the heat dissipation fins by means of the shell wall; the integrated circuit board is arranged in the inner cavity of the shell and located at the position close to the rear wall of the shell. And one surface of the heat-conducting silica gel sheet is attached to the heating component of the integrated circuit board, and the other surface of the heat-conducting silica gel sheet is attached to the heat dissipation boss. A traditional fan heat dissipation scheme is abandoned, the heat dissipation fins are arranged on the outer side of the rear wall of the shell, and then the heat conduction silica gel sheet and the heat dissipation boss are arranged, so that heat of a heating component is conducted to the heat dissipation fins through the heat conduction silica gel sheet, the heat dissipation boss and the shell wall; the heat conduction silica gel sheet and the heat dissipation boss form a heat dissipation channel which is in direct contact with a heating component, so that heat of the heating component can be quickly conducted to the heat dissipation fins, the heat dissipation effect is improved, and the problem that an existing temperature measurer is large in appearance size due to a heat dissipation fan is solved.

Description

Technical Field

[0001] This utility model relates to the field of electrical safety monitoring technology for electrical cabinets, and in particular to an infrared thermal imaging temperature measuring instrument for electrical cabinets. Background Technology

[0002] Infrared thermal imaging thermometers are typically installed in electrical cabinets. Their core function is to monitor the temperature status of electrical equipment in real time, detect potential faults in a timely manner, and thus improve the operational safety and reliability of the equipment.

[0003] However, existing infrared thermal imaging thermometers have significant technical limitations. Existing heat dissipation solutions mostly rely on forced air cooling systems, which can ensure heat dissipation efficiency, but lead to an increase in equipment size and insufficient space adaptability when installed in the limited space of electrical cabinets. Secondly, the lens module lacks active vibration reduction design, which is prone to displacement deviation in the vibration environment of equipment operation, resulting in dynamic blurring of the acquired images and affecting the accuracy of temperature field analysis.

[0004] Therefore, this application proposes an infrared thermal imaging thermometer for electrical cabinets that can reduce the size of the device while ensuring heat dissipation performance and effectively prevent dynamic ambiguity caused by vibration. Utility Model Content

[0005] The technical problem to be solved by this utility model is to improve the existing infrared thermal imaging thermometer in order to reduce the size of the thermometer.

[0006] The technical solution adopted by this utility model to solve its technical problem is: to provide an infrared thermal imaging temperature measuring instrument for electrical cabinets, which includes:

[0007] The housing has heat dissipation fins on the outer side of the rear wall and heat dissipation protrusions on the inner side of the rear wall that conduct heat through the housing wall and the heat dissipation fins.

[0008] An integrated circuit board is disposed in the inner cavity of the housing and located near the rear wall of the housing;

[0009] A thermally conductive silicone pad has one side attached to the heat-generating component of the integrated circuit board and the other side attached to the heat dissipation protrusion.

[0010] The heat dissipation protrusions are multiple in number, and the position of each heat dissipation protrusion corresponds one-to-one with the corresponding heat-generating component on the integrated circuit board. The height of each heat dissipation protrusion is adapted to the protrusion height of the corresponding heat-generating component on the integrated circuit board.

[0011] Furthermore, the infrared thermal imaging thermometer of this utility model also includes a temperature measuring device and a buffer shock absorption device.

[0012] The temperature measuring device is disposed in the inner cavity of the housing; the temperature measuring device includes a visible light lens module, the lens of the visible light lens module protrudes from the front wall of the housing, and the lens barrel extends perpendicularly to the front wall of the housing into the inner cavity of the housing;

[0013] The buffer and shock absorption device is disposed in the inner cavity of the housing; the buffer and shock absorption device includes a first mounting post, a first fixing plate, a first connecting screw, and a spring; there are multiple first mounting posts that are arranged around the periphery of the visible light lens module, and one end of the first mounting post is fixed to the front wall of the housing, and the other end extends perpendicularly to the front wall of the housing into the inner cavity of the housing; the first fixing plate is installed at the end of the first mounting post by the first connecting screw, and there is a gap between the first connecting screw and the first mounting post to reserve space for the back and forth movement of the first fixing plate. At the same time, the first fixing plate is relatively fixed to the visible light lens module; there are multiple springs that are respectively sleeved around the periphery of each of the first mounting posts, one end of the spring abuts against the front wall of the housing, and the other end abuts against the first fixing plate.

[0014] Furthermore, the temperature measuring device also includes an infrared lens module;

[0015] The infrared lens module is located on the side of the visible light lens module, and the lens of the infrared lens module also protrudes from the front wall of the housing.

[0016] Furthermore, the infrared lens module is fixed to the housing via a second mounting post and a second fixing plate;

[0017] The second mounting posts are multiple and arranged around the periphery of the infrared lens module. One end of the second mounting post is fixed to the front wall of the housing, and the other end extends perpendicularly to the front wall of the housing into the inner cavity of the housing. The second fixing plate is locked to the end of the second mounting post by the second connecting screw, and the second fixing plate is fixed relative to the infrared lens module.

[0018] Furthermore, the temperature measuring device also includes an illumination lamp for providing illumination to the visible light lens module; the illumination lamp is fixed to the front wall of the housing.

[0019] Furthermore, the infrared thermal imaging thermometer of this invention also includes a partition plate;

[0020] The partition plate is fixed in the inner cavity of the housing to separate the integrated circuit board from the temperature measuring device, thereby reducing electromagnetic interference between them.

[0021] Furthermore, the partition is made of antistatic acrylic material.

[0022] Furthermore, the partition plate is fixed to the housing via a third mounting post; there are multiple third mounting posts, one end of which is fixed to the front wall of the housing, and the other end is connected to the partition plate via a third connecting screw.

[0023] Furthermore, the infrared thermal imaging thermometer of this utility model also includes a wiring port; the wiring port is disposed on the bottom wall of the housing and connected to a corresponding component in the inner cavity of the housing.

[0024] Furthermore, the infrared thermal imaging thermometer of this invention also includes an angle adjustment device;

[0025] The angle adjustment device includes a ball joint shaft and a mounting base; one end of the ball joint shaft is fixed to the outer side of the rear wall of the housing, and the other end has a spherical body; the bottom of the mounting base is used to be fixedly connected to the cabinet wall of the electrical cabinet, and the other end is provided with a spherical groove; wherein, the spherical body is embedded in the spherical groove and can be adjusted at an angle relative to the spherical groove.

[0026] The beneficial effects of this utility model are as follows:

[0027] This utility model discloses an infrared thermal imaging thermometer for electrical cabinets. It abandons the traditional fan-based cooling solution and optimizes the heat dissipation structure by installing heat dissipation fins on the outer rear wall of the housing, followed by thermally conductive silicone pads and heat dissipation protrusions. This allows heat from the heating components to be conducted through the silicone pads, protrusions, and housing wall to the heat dissipation fins, where it is then dissipated. The silicone pads and protrusions create a direct heat dissipation channel with the heating components, enabling rapid heat transfer to the heat dissipation fins and improving cooling efficiency. This heat dissipation structure effectively solves the problem of the large size of existing thermometers due to the inclusion of cooling fans.

[0028] In addition, this invention also incorporates a buffer and shock absorption device for the visible light lens module, which solves the problem that the visible light lens module is easily affected by vibration, and improves the applicability and measurement accuracy of the temperature measuring instrument in electrical cabinets. Attached Figure Description

[0029] Figure 1 This is a structural diagram of the infrared thermal imaging thermometer for electrical cabinets provided by this utility model;

[0030] Figure 2 yes Figure 1 A view from the rear angle;

[0031] Figure 3 It is a display Figure 1 Cross-sectional view of the internal structure;

[0032] Figure 4 yes Figure 1 A diagram showing the internal structure behind the concealed front wall of the casing;

[0033] Figure 5 yes Figure 1 Exploded view;

[0034] Figure 6 yes Figure 5 A view from the rear angle;

[0035] Figure 7 yes Figure 1 A schematic diagram of the internal components of the middle shell. Detailed Implementation

[0036] The present invention will be further described in detail below with reference to specific embodiments, but the implementation of the present invention is not limited thereto.

[0037] See Figures 1 to 7 This utility model provides an infrared thermal imaging temperature measuring instrument for electrical cabinets, which includes a housing 100, an integrated circuit board 200, and a thermally conductive silicone sheet 300.

[0038] Regarding the housing 100, heat dissipation fins 111 are provided on the outer side of the rear wall 110 of the housing, and heat dissipation bosses 112 are provided on the inner side of the rear wall 110 of the housing, which form heat conduction with the heat dissipation fins 111 through the housing wall (see Figure 3 and Figure 5 ).

[0039] The integrated circuit board 200 is disposed in the inner cavity 1a of the housing and is located near the rear wall 110 of the housing (see...). Figure 3 and Figure 5 ).

[0040] One side of the thermally conductive silicone pad 300 is attached to the heat-generating component 210 of the integrated circuit board 200, and the other side is attached to the heat dissipation boss 112 (see...). Figure 3 and Figure 6 ).

[0041] Among them, see Figure 3 and Figure 5 There are multiple heat dissipation protrusions 112, and the position of each heat dissipation protrusion 112 corresponds one-to-one with the corresponding heat-generating component 210 on the integrated circuit board 200. The height of each heat dissipation protrusion 112 is adapted to the protrusion height of the corresponding heat-generating component 210 on the integrated circuit board 200. That is, some heat-generating components 210 protrude slightly higher, while others protrude slightly lower. The protrusion height of different heat dissipation protrusions 112 may vary and needs to be adapted to the corresponding heat-generating component 210. If the heat-generating component 210 protrudes higher, the heat dissipation protrusion 112 needs to protrude lower, and vice versa.

[0042] The aforementioned heat dissipation component 112 generally refers to various chips on the integrated circuit board 200, which are usually the components that generate the most heat on the entire integrated circuit board 200.

[0043] The aforementioned infrared thermal imaging thermometer for electrical cabinets abandons the traditional fan-based cooling solution. Instead, it optimizes the heat dissipation structure by installing heat dissipation fins 111 on the outer side of the rear wall 110 of the housing, followed by thermally conductive silicone pads 200 and heat dissipation protrusions 112. This allows heat from the heating element 210 to be conducted through the thermally conductive silicone pads 200, heat dissipation protrusions 112, and the housing wall to the heat dissipation fins 111, where it is dissipated. The thermally conductive silicone pads 200 and heat dissipation protrusions 112 create a direct heat dissipation channel with the heating element 210, enabling rapid heat transfer to the heat dissipation fins 111 and improving heat dissipation efficiency. This heat dissipation structure effectively solves the problem of the large size of traditional thermometers due to the inclusion of cooling fans.

[0044] In another embodiment, the present invention also includes a temperature measuring device 400 and a buffer and shock absorption device 500.

[0045] The temperature measuring device 400 is disposed in the inner cavity 1a of the housing. (See also...) Figure 3 and Figure 4 The temperature measuring device 400 includes a visible light lens module 410, the lens of which protrudes from the front wall 120 of the housing (see...). Figure 1 The lens barrel extends perpendicularly to the front wall 120 of the housing into the inner cavity 1a of the housing (see...). Figure 3 ).

[0046] The buffer and shock absorption device 500 is disposed in the inner cavity 1a of the housing. See also Figure 4 and Figure 5 The buffer and shock absorption device 500 includes a first mounting post 510, a first fixing plate 520, a first connecting screw 530, and a spring 540. Four first mounting posts 510 are arranged around the periphery of the visible light lens module 410, with one end fixed to the front wall 120 of the housing and the other end extending perpendicularly into the inner cavity 1a of the housing. The first fixing plate 520 is mounted on the end of the first mounting post 510 by the first connecting screw 530, with a gap between the first connecting screw 530 and the first mounting post 510 (i.e., the nut of the first connecting screw 530 is not tightly pressed against the end of the first mounting post 510, but has a gap), providing space for the back-and-forth movement of the first fixing plate 520. Simultaneously, the first fixing plate 520 is relatively fixed to the visible light lens module 410. The springs 540 are four in number and are respectively sleeved around the periphery of each first mounting post 510. One end of the spring 540 abuts against the front wall 120 of the housing, and the other end abuts against the first fixing plate 520.

[0047] The aforementioned buffer and shock absorption device 500 can effectively reduce the vibration amplitude of the visible light lens module 410, thereby achieving a buffering and shock absorption effect. When the temperature measuring instrument is installed in the electrical cabinet, the vibration generated when the electrical cabinet is working will be transmitted to the visible light lens module 410, which will in turn drive the first fixed plate 520 to vibrate together. At this time, the spring 540 will absorb and buffer the vibration energy through its own deformation, thereby reducing the vibration amplitude transmitted to the visible light lens module 410 and achieving a buffering and shock absorption effect.

[0048] Typically, the temperature measuring device 400 also includes an infrared lens module 420. See also Figure 3 and Figure 4 The infrared lens module 420 is located on the side of the visible light lens module 410, and the lens of the infrared lens module 420 also protrudes from the front wall 120 of the housing.

[0049] Furthermore, the infrared lens module 420 is fixed to the housing 100 via the second mounting post 610 and the second fixing plate 620.

[0050] Specifically, such as Figure 4 and Figure 5 Four second mounting posts 610 are arranged around the periphery of the infrared lens module 420, with one end of each post fixed to the front wall 120 of the housing and the other end extending perpendicularly into the inner cavity 1a of the housing. The second fixing plate 620 is secured by second connecting screws 630 (see...). Figure 6 It is locked to the end of the second mounting post 610, and the second fixing plate 620 is fixed relative to the infrared lens module 420.

[0051] Typically, to avoid insufficient lighting inside the electrical cabinet, the temperature measuring device 400 also includes a lighting lamp 430 for providing illumination to the visible light lens module 410, and the lighting lamp 430 is fixed to the front wall 120 of the housing.

[0052] The temperature measurement principle of the aforementioned temperature measuring device is as follows: Visible light images of the object are acquired through the visible light lens module 410. Image processing technology is used to extract feature information of the target area from the image, such as color, shape, and location. Then, infrared thermal imaging technology is combined to measure the temperature of the target area. This temperature measurement method overcomes the problem of accurately determining the measurement area in traditional infrared temperature measurement, improving the accuracy and reliability of temperature measurement. With data transmission and display, the highest, lowest, and average temperatures of the area can be displayed in real time. Furthermore, the highest temperature of a specific area can be plotted in real time to form a historical temperature curve for later reference.

[0053] Preferred, see Figure 5The housing 100 consists of two parts, with the front wall 120 being a separate part that is detachably connected to the other part (the part having the housing cavity 1a) by screws.

[0054] In another embodiment, the temperature measuring instrument of this invention also includes a partition plate 710. See also Figure 3 The partition plate 710 is fixed in the inner cavity 1a of the housing and separates the integrated circuit board 200 from the temperature measuring device 400 to reduce electromagnetic interference between them.

[0055] Preferably, the partition plate 710 is made of antistatic acrylic material. Although acrylic material itself does not have antistatic properties and has a high surface resistivity, making it prone to static electricity accumulation, it can be made to have antistatic properties through special processing techniques. For example, by adding antistatic agents, surface coating, or film coating techniques, acrylic material can be given excellent antistatic function. When applied to this utility model, it effectively prevents electromagnetic interference caused by electrostatic discharge and protects the normal operation of electronic equipment.

[0056] Preferably, the partition plate 710 is fixed to the housing 100 by a third mounting post 720. See details below. Figure 3 and Figure 5 There are four third mounting posts 720, which are correspondingly arranged at the four corners of the partition plate 710. One end of the third mounting post 720 is fixed to the front wall 120 of the housing, and the other end is fixed by the third connecting screw 730 (see...). Figure 6 The partition plate 710 is fixed relative to the front wall 120 of the housing.

[0057] In addition, the thermometer of this utility model also includes a wiring port 800, which is disposed on the bottom wall 130 of the housing and connected to the corresponding component in the inner cavity 1a of the housing.

[0058] In another embodiment, the thermometer of this invention also includes an angle adjustment device 900. See also... Figures 1 to 3 The angle adjustment device 900 includes a ball joint shaft 910 and a mounting base 920. One end of the ball joint shaft 910 is fixed to the outer side of the rear wall 110 of the housing, and the other end has a spherical body 911. The bottom of the mounting base 920 can be fixedly connected to the cabinet wall of the electrical cabinet by screws, and the other end is provided with a spherical groove 921. The spherical body 911 is embedded in the spherical groove 921 and can be adjusted at an angle relative to the spherical groove 921.

[0059] During installation, the bottom of the mounting base 920 is fixedly connected to the wall of the electrical cabinet with screws, thereby fixing the thermometer in the electrical cabinet. After installation, the angle of the thermometer can be adjusted by rotating the ball joint shaft 910, allowing the spherical body 911 to rotate in the spherical groove 921, so that the visible light lens module 410 and the infrared lens module 420 of the temperature measuring device 400 are aligned with the area to be measured.

[0060] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An infrared thermal imaging temperature measuring instrument for electrical cabinets, characterized in that, It includes a housing (100) and a shock-absorbing device (500). The outer side of the rear wall (110) of the housing is provided with heat dissipation fins (111), and the inner side of the rear wall (110) of the housing is provided with heat dissipation bosses (112) that form heat conduction with the heat dissipation fins (111) through the housing wall. An integrated circuit board (200) is disposed in the inner cavity (1a) of the housing and located near the rear wall (110) of the housing; A thermally conductive silicone pad (300) has one side attached to the heat-generating component (210) of the integrated circuit board (200), and the other side attached to the heat dissipation boss (112); There are multiple heat dissipation protrusions (112), and the position of each heat dissipation protrusion (112) corresponds one-to-one with the corresponding heat-generating component (210) on the integrated circuit board (200). The height of each heat dissipation protrusion (112) is adapted to the protrusion height of the corresponding heat-generating component (210) on the integrated circuit board (200). The buffer and shock absorption device (500) is disposed in the inner cavity (1a) of the housing; the buffer and shock absorption device (500) includes a first mounting post (510), a first fixing plate (520), a first connecting screw (530) and a spring (540); one end of the first mounting post (510) is fixed on the front wall (120) of the housing, and the other end extends perpendicularly to the front wall (120) into the inner cavity (1a) of the housing; the first fixing plate (520) is mounted on the end of the first mounting post (510) by the first connecting screw (530), and there is a gap between the first connecting screw (530) and the first mounting post (510) to reserve space for the back and forth movement of the first fixing plate (520); there are multiple springs (540) and they are respectively sleeved on the periphery of each of the first mounting posts (510), one end of the spring (540) abuts against the front wall (120) of the housing, and the other end abuts against the first fixing plate (520).

2. The infrared thermal imaging thermometer for electrical cabinets according to claim 1, characterized in that, It also includes a temperature measuring device (400); The temperature measuring device (400) is disposed in the inner cavity (1a) of the housing; the temperature measuring device (400) includes a visible light lens module (410), the lens of the visible light lens module (410) protrudes from the front wall (120) of the housing, and the lens barrel extends perpendicularly to the front wall (120) of the housing into the inner cavity (1a) of the housing; there are multiple first mounting posts (510) and they are arranged around the periphery of the visible light lens module (410), and the first fixing plate (520) is fixed relative to the visible light lens module (410).

3. The infrared thermal imaging thermometer for electrical cabinets according to claim 2, characterized in that, The temperature measuring device (400) also includes an infrared lens module (420); The infrared lens module (420) is located on the side of the visible light lens module (410), and the lens of the infrared lens module (420) also protrudes from the front wall (120) of the housing.

4. The infrared thermal imaging temperature measuring instrument for electrical cabinets according to claim 3, characterized in that, The infrared lens module (420) is fixed to the housing (100) by the second mounting post (610) and the second fixing plate (620); The second mounting posts (610) are multiple and arranged around the periphery of the infrared lens module (420). One end of the second mounting post (610) is fixed to the front wall (120) of the housing, and the other end extends perpendicularly to the front wall (120) of the housing into the inner cavity (1a) of the housing. The second fixing plate (620) is locked to the end of the second mounting post (610) by the second connecting screw (630), and the second fixing plate (620) is fixed relative to the infrared lens module (420).

5. The infrared thermal imaging temperature measuring instrument for electrical cabinets according to claim 4, characterized in that, The temperature measuring device (400) also includes an illumination lamp (430) for providing illumination to the visible light lens module (410); the illumination lamp (430) is fixed on the front wall (120) of the housing.

6. The infrared thermal imaging temperature measuring instrument for electrical cabinets according to claim 5, characterized in that, It also includes a partition plate (710); The partition plate (710) is fixed in the inner cavity (1a) of the housing to separate the integrated circuit board (200) from the temperature measuring device (400) in order to reduce electromagnetic interference between them.

7. The infrared thermal imaging thermometer for electrical cabinets according to claim 6, characterized in that, The partition plate (710) is made of antistatic acrylic material.

8. The infrared thermal imaging temperature measuring instrument for electrical cabinets according to claim 7, characterized in that, The partition plate (710) is fixed to the housing (100) by a third mounting post (720); there are multiple third mounting posts (720), one end of which is fixed to the front wall (120) of the housing, and the other end is connected to the partition plate (710) by a third connecting screw (730).

9. The infrared thermal imaging temperature measuring instrument for electrical cabinets according to any one of claims 1 to 8, characterized in that, It also includes a wiring port (800); the wiring port (800) is disposed on the bottom wall (130) of the housing and connected to a corresponding component in the inner cavity (1a) of the housing.

10. The infrared thermal imaging temperature measuring instrument for electrical cabinets according to any one of claims 1 to 8, characterized in that, It also includes an angle adjustment device (900); The angle adjustment device (900) includes a ball joint shaft (910) and a mounting base (920); one end of the ball joint shaft (910) is fixed to the outer side of the rear wall (110) of the housing, and the other end has a spherical body (911); the bottom of the mounting base (920) is used to be fixedly connected to the cabinet wall of the electrical cabinet, and the other end is provided with a spherical groove (921); wherein, the spherical body (911) is embedded in the spherical groove (921) and can be angled relative to the spherical groove (921).

Images