Thermal management system and PCB processing equipment

Abstract

The utility model discloses a thermal management system and PCB processing equipment. The heat management system is suitable for the PCB processing equipment, the PCB processing equipment comprises an electric control box, the heat management system comprises a cooling assembly, and the cooling assembly is located beside or below the electric control box. The cooling assembly is arranged beside or below the electric control box, so that cooling water is effectively prevented from leaking into the electric control box, the possibility that electrical elements in the electric control box are damaged due to short circuit is greatly reduced, normal operation of the electrical elements is guaranteed, and the equipment failure occurrence frequency is reduced. Production accidents caused by short circuit damage of electrical elements are prevented, a safer production environment is provided for operators, and economic losses caused by production interruption caused by the accidents are reduced.

Description

Technical Field

[0001] This application belongs to the field of cooling technology, and in particular relates to a thermal management system and PCB processing equipment. Background Technology

[0002] In the industrial manufacturing sector, especially in mechanical equipment that requires efficient heat dissipation, such as CNC machine tools and machining centers, the layout and design of cooling equipment and electrical control boxes are one of the important factors in ensuring the stable operation of the equipment.

[0003] In existing technology, cooling components such as cooling pipes are typically placed on top of the equipment's crossbeams, with the electrical control box positioned beside the crossbeams and the cooling components above the control box. This layout makes good use of the space above the crossbeams and the control box. However, when a cooling pipe breaks and leaks, the leaking cooling water may flow into the control box, causing a short circuit and damage to the electrical components within, resulting in a production accident. Utility Model Content

[0004] The technical problem this application aims to solve is as follows: In the prior art, cooling components such as cooling pipes are arranged on the top of the equipment's crossbeam, while the electrical control box is arranged on the side of the crossbeam. When the cooling pipes are damaged and leak water, the leaked cooling water may flow into the electrical control box, causing short circuits and damage to the electrical components in the control box, resulting in production accidents. This application provides a thermal management system and PCB processing equipment.

[0005] To address the aforementioned issues, this application provides a thermal management system applicable to PCB processing equipment. The PCB processing equipment includes an electrical control box, and the thermal management system includes a cooling component located beside or below the electrical control box.

[0006] Optionally, in the first direction, the cooling component is spaced apart from the electrical control box, and the cooling component is located below the electrical control box.

[0007] Optionally, the thermal management system further includes a partition plate, wherein in the first direction, the electrical control box is arranged above the partition plate, and the cooling assembly is arranged below the partition plate.

[0008] Optionally, the electrical control box has a partition plate, and the cooling assembly is arranged below the partition plate.

[0009] Optionally, the thermal management system further includes a support frame, on which the partition plate and the cooling components are arranged.

[0010] Optionally, the PCB processing equipment further includes a crossbeam, the electrical control box is arranged on one side of the crossbeam along a second direction, and the cooling assembly is adapted to be arranged below the crossbeam.

[0011] According to the thermal management system provided in this application embodiment, the cooling components are arranged beside or below the electrical control box, changing the traditional design of arranging cooling pipes and other cooling components on the equipment beams and the top of the electrical control box. When the cooling components leak, because the cooling components are located beside or below the electrical control box, the cooling water will leak downwards due to gravity and will not flow towards the electrical control box. This effectively isolates the direct contact between the cooling system and the electrical control box, thereby greatly reducing the risk of short circuit damage to the electrical components of the electrical control box caused by cooling water leakage.

[0012] This application provides a PCB processing equipment, including a crossbeam and a thermal management system as described above. The electrical control box is arranged on one side of the crossbeam along a second direction; the cooling component is arranged on one side of the crossbeam along the second direction, or the cooling component is arranged below the crossbeam, and the first direction is perpendicular to the second direction.

[0013] Optionally, the electrical control box and the crossbeam are arranged at intervals along the second direction.

[0014] Optionally, the PCB processing equipment further includes a processing component connected to one end of the crossbeam away from the electrical control box. The cooling component includes an inlet pipe, a cooling pipe, and an outlet pipe connected in sequence. The inlet pipe and the outlet pipe are both arranged below the electrical control box, and the cooling pipe is connected to at least one end of the processing component.

[0015] Optionally, the PCB processing equipment further includes a protective cover, the electrical control box has a protective cover, the PCB processing equipment is provided with a support frame and a partition plate connected to each other, the support frame extends along the first direction, the partition plate extends along the second direction, one end of the support frame away from the partition plate is connected to the protective cover, and one end of the partition plate away from the support frame is connected to the protective cover, the support frame, the partition plate and the protective cover together form the protective cover.

[0016] According to the PCB processing equipment provided in this application embodiment, the cooling component is positioned relatively low to the electrical control box, whether it is arranged on one side of the crossbeam along the second direction or below the crossbeam. This ensures that when the cooling pipes rupture and leak, the cooling water will flow away from the electrical control box due to gravity, significantly reducing the possibility of cooling water flowing into the control box and causing short circuits in electrical components, thus improving the stability and safety of the equipment operation. The cooling component can be arranged in various ways, either on one side of the crossbeam along the second direction or below the crossbeam, providing greater flexibility in the overall layout of the PCB processing equipment. A more suitable cooling component arrangement can be selected based on the specific structure of the equipment, space constraints, and heat dissipation requirements to optimize the overall performance of the equipment. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a side view of a portion of the structure of a PCB processing equipment provided in one embodiment of this application;

[0019] Figure 2 This is a rear view of a portion of the structure of a PCB processing equipment provided in one embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the PCB processing equipment provided in one embodiment of this application.

[0021] The reference numerals in the accompanying drawings are as follows:

[0022] 10. Crossbeam; 20. Processing components; 30. Protective cover;

[0023] 1. Electrical control box; 11. Protective cover; 111. Divider plate; 2. Cooling assembly; 21. Liquid inlet pipe; 22. Liquid outlet pipe; 3. Support frame; 5. Cooling connector. Detailed Implementation

[0024] To make the technical problems, technical solutions, and beneficial effects solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0025] In the description of this application, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0026] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0027] like Figure 1 and Figure 2 As shown, one embodiment of this application provides a thermal management system applicable to PCB processing equipment. The PCB processing equipment includes an electrical control box 1, and the thermal management system includes a cooling component 2, which is located beside or below the electrical control box 1. Short circuits in electrical components caused by cooling water leakage are a common production accident in PCB processing equipment. By arranging the cooling component 2 beside or below the electrical control box 1, it effectively prevents cooling water leakage from flowing into the electrical control box 1, avoiding damage to electrical components due to short circuits, and significantly improving the safety and reliability of the equipment.

[0028] In one embodiment, in a first direction, the cooling component 2 and the electrical control box 1 are spaced apart, and the cooling component is located below the electrical control box. In this embodiment, the first direction is a vertical direction, or, the first direction is an external direction. Figure 1 The Z-axis, vertically spaced layout effectively isolates the cooling components in physical space. Even if the cooling component 2 is damaged or ages, causing leakage, the leaked cooling water will flow downwards due to gravity, preventing it from splashing or spreading directly into the electrical control box 1 above. This fundamentally eliminates the risk of cooling water entering the electrical control box 1, avoiding damage to electrical components due to moisture or short circuits, and ensuring the stable operation of the equipment's electrical system.

[0029] In one embodiment, the thermal management system further includes a partition plate 111. In a first direction, the electrical control box 1 is arranged above the partition plate 111, and the cooling assembly 2 is arranged below the partition plate 111. In this embodiment, the partition plate 111 acts as a physical barrier between the electrical control box 1 and the cooling assembly 2, effectively isolating the cooling water from the electrical components inside the electrical control box 1. When the cooling pipe is damaged and leaks, the partition plate 111 can prevent cooling water from entering the electrical control box 1, thereby avoiding the risk of damage to the electrical components due to short circuits.

[0030] In one embodiment, the electrical control box 1 has a partition plate 111, and the cooling assembly 2 is arranged below the partition plate 111. In this embodiment, the partition plate 111 effectively isolates the cooling water from the electrical components inside the electrical control box 1. When the cooling pipe is damaged and leaks, the partition plate 111 can prevent the cooling water from entering the interior of the electrical control box 1, thereby avoiding the risk of damage to the electrical components due to short circuits.

[0031] In one embodiment, the thermal management system further includes a support frame 3, on which the partition plate 111 and the cooling assembly 2 are arranged. In this embodiment, the support frame 3 provides a stable mounting base for the partition plate 111 and the cooling assembly 2, ensuring they remain in a fixed position during equipment operation and do not shift due to vibration or impact. This helps reduce the risk of failure due to component loosening or displacement, improving the stability and safety of the entire thermal management system. Integrating the partition plate 111 and the cooling assembly 2 together via the support frame 3 simplifies the installation process. Integrating the partition plate 111 and the cooling assembly 2 together via the support frame 3 reduces internal clutter. This improves the integration of the equipment, resulting in a cleaner and more aesthetically pleasing appearance.

[0032] In one embodiment, the PCB processing equipment further includes a crossbeam 10, an electrical control box 1 disposed on one side of the crossbeam 10 along a second direction, and a cooling assembly 2 adapted to be disposed below the crossbeam 10. In this embodiment, the second direction is a front-to-back direction, or, the second direction is an auxiliary direction. Figure 1 The cooling component 2 is positioned in the X direction. By placing it on one side of the crossbeam 10, operators can work in a relatively open space during installation, eliminating the need for installation in narrow or complex areas inside the equipment, thus reducing installation difficulty and improving efficiency. Positioning the cooling component 2 below the crossbeam 10 ensures that the coolant flows within it during operation. In the event of leakage or splashing, the coolant will be deflected downwards by the crossbeam 10, preventing direct splashing onto other critical components, especially the electrical control system. This effectively avoids electrical short circuits and corrosion caused by coolant, ensuring safe operation of the equipment.

[0033] According to the thermal management system provided in this application embodiment, the cooling component 2 is arranged below the electrical control box 1, which changes the traditional design where the cooling components 2, such as cooling pipes, are arranged on top of the equipment beam 10 and the electrical control box 1 is arranged beside the beam 10. When the cooling component 2 leaks, because the cooling component 2 is located below the electrical control box 1, the cooling water will leak downwards due to gravity and will not flow towards the electrical control box 1. This effectively isolates the direct contact between the cooling system and the electrical control box 1, thereby greatly reducing the risk of short circuit damage to the electrical components of the electrical control box 1 caused by cooling water leakage.

[0034] This application provides a PCB processing equipment, including a crossbeam 10 and a thermal management system as described in the above embodiment. An electrical control box 1 is arranged on one side of the crossbeam 10 along a second direction; a cooling component 2 is arranged on one side of the crossbeam 10 along the second direction, or the cooling component 2 is arranged below the crossbeam 10, with the first direction perpendicular to the second direction. In this embodiment, the PCB processing equipment can be a drilling machine. The cooling component 2 is located below the electrical control box 1, and the cooling component 2 can be located below the crossbeam 10, or on one side of the crossbeam 10 along the second direction. Utilizing the principle of gravity, this effectively prevents cooling water from flowing to the electrical control box 1 when the cooling component 2 is damaged, reducing the risk of short-circuit damage to electrical components, reducing production accidents, and improving equipment operating safety.

[0035] In one embodiment, the electrical control box 1 and the crossbeam 10 are arranged at intervals along a second direction. In this embodiment, the interval arrangement creates a certain space between the electrical control box 1 and the crossbeam 10, reducing heat conduction from the crossbeam 10 to the electrical control box 1 and preventing the heat generated by the crossbeam 10 during operation from being directly transferred to the electrical control box 1, thereby effectively reducing the temperature inside the electrical control box 1. The interval arrangement also creates better air circulation conditions around the electrical control box 1, which helps dissipate heat and further improves the heat dissipation effect.

[0036] like Figures 1 to 3As shown, in one embodiment, the PCB processing equipment further includes a processing component 20, which is connected to the end of the crossbeam 10 away from the electrical control box 1. A cooling component 2 includes an inlet pipe 21, a cooling pipe, and an outlet pipe 22 connected in sequence. Both the inlet pipe 21 and the outlet pipe 22 are located below the electrical control box 1, and the cooling pipe is connected to at least one end of the processing component 20. In this embodiment, the cooling component 2 is composed of the inlet pipe 21, the cooling pipe, and the outlet pipe 22 connected in sequence, forming a highly efficient cooling circuit. The inlet pipe 21 and the outlet pipe 22 are both located below the electrical control box 1, which prevents leaked coolant from flowing into the electrical control box 1 when the inlet pipe 21 and the outlet pipe 22 wear down, thus improving equipment safety. Simultaneously, the cooling pipe is connected to at least one end of the processing component 20, enabling direct cooling of the processing component 20. The PCB processing equipment also includes a bed, with the crossbeam 10 mounted on the bed via a mounting base. The processing assembly 20 may include a spindle and a drive assembly (e.g., a linear motor). The spindle is used to process the workpiece placed on the bed. A thermal management system cools the spindle assembly and the linear motor, thereby improving the overall stability of the equipment. A cooling channel may be provided in the processing assembly 20, with cooling pipes connected to one or both ends of the cooling channel. This allows coolant to flow within the cooling channel, absorbing the heat generated by the processing assembly 20. The coolant then enters the cooling assembly 2 through the outlet end of the cooling channel, completing the cooling of the processing assembly 20, and flows to the desired location (e.g., a coolant recovery device). In other embodiments, the inlet pipe 21 and the outlet pipe 22 are spaced apart, with the inlet pipe 21 located either inside or outside the outlet pipe 22.

[0037] like Figure 3As shown, in one embodiment, the PCB processing equipment further includes a protective cover 30, and the electrical control box 1 has a protective cover 11. The PCB processing equipment is provided with a support frame 3 and a partition plate 111 connected to each other. The support frame 3 extends along a first direction, and the partition plate 111 extends along a second direction. One end of the support frame 3 away from the partition plate 111 is connected to the protective cover 30, and the other end of the partition plate 111 away from the support frame 3 is connected to the protective cover 30. The support frame 3, the partition plate 111, and the protective cover 30 together form the protective cover 11. In this embodiment, the protective cover 30 provides an additional protective layer for the operator, effectively preventing injury to personnel from splashes, debris, or other potential hazards that may be generated during processing. The electrical control box 1 has a protective cover 11, which further protects the electrical components inside the electrical control box 1 from damage caused by external dust, moisture, or accidental collisions, improving the safety and reliability of the equipment. Integrating the protective cover 11 of the electrical control box 1 onto the protective cover 30 allows part of the structure of the electrical control box 1 to directly contact the external environment, facilitating heat dissipation of the electrical control box 1. Meanwhile, the design of integrating at least part of the control box structure with the machine cover allows the control box and the machine cover to share a portion of the structure, which can reduce the use of profiles and lower production costs.

[0038] According to the PCB processing equipment provided in this application embodiment, the cooling component 2 is positioned relatively low to the electrical control box 1, whether it is arranged on one side of the crossbeam 10 along the second direction or below the crossbeam 10. This ensures that when the cooling pipes are damaged and leak, the cooling water will flow away from the electrical control box 1 due to gravity, greatly reducing the possibility of cooling water flowing into the electrical control box 1 and causing short circuits in electrical components, thus improving the stability and safety of the equipment operation. The cooling component 2 can be arranged in two ways: either on one side of the crossbeam 10 along the second direction or below the crossbeam 10, providing greater flexibility in the overall layout of the PCB processing equipment. A more suitable arrangement of the cooling component 2 can be selected based on the specific structure of the equipment, space constraints, and heat dissipation requirements to optimize the overall performance of the equipment.

[0039] In one embodiment, both the inlet pipe 21 and the outlet pipe 22 are equipped with cooling connectors 5, and the cooling pipes are connected to the cooling assembly 2 through the cooling connectors 5. By using connectors, the connection between the inlet pipe 21 and the outlet pipe 22 and the cooling channel is simpler and faster. At the same time, the connectors can use materials and connection methods with good sealing performance (such as threaded connections, flange connections, etc.), which can effectively prevent coolant leakage at the connection points and improve the overall sealing performance and reliability of the cooling system.

[0040] In one embodiment, there are multiple cooling components 2 arranged along a second direction. In this embodiment, arranging multiple cooling components 2 along the second direction significantly increases the contact area between the coolant and the heat source of the equipment, thereby improving heat dissipation efficiency. This allows heat to be absorbed and transferred more evenly, avoiding localized overheating and further improving the uniformity of heat dissipation.

[0041] In one embodiment, at least a portion of the structure of the electrical control box 1 is adapted to be arranged above the top surface of the crossbeam 10. In this embodiment, the electrical control box 1 is located above and behind the crossbeam 10. Arranging the electrical control box 1 above the top surface of the crossbeam 10, so that the electrical control box 1 is away from the cooling assembly 2, can effectively avoid damage to the electrical components inside the electrical control box 1 caused by coolant leakage. At the same time, placing the electrical control box 1 above and behind the crossbeam 10 can reduce the impact of mechanical vibration generated by the cooling assembly 2 during operation on the electrical control box 1, and reduce the risk of loosening or damage to electrical components due to vibration.

[0042] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A thermal management system suitable for PCB processing equipment, the PCB processing equipment including an electrical control box, characterized in that, The thermal management system includes a cooling component, which is spaced apart from the electrical control box in a first direction, and is located below the electrical control box. The thermal management system further includes a partition plate, wherein in the first direction, the electrical control box is arranged above the partition plate and the cooling assembly is arranged below the partition plate; or, the electrical control box has a partition plate and the cooling assembly is arranged below the partition plate.

2. The thermal management system according to claim 1, characterized in that, The thermal management system also includes a support frame, on which the partition plate and the cooling components are arranged.

3. The thermal management system according to claim 1, characterized in that, The PCB processing equipment also includes a crossbeam, the electrical control box is arranged on one side of the crossbeam along the second direction, and the cooling assembly is arranged below the crossbeam.

4. A PCB processing equipment, characterized in that, The system includes a crossbeam and a thermal management system as described in any one of claims 1-3, wherein the electrical control box is arranged on one side of the crossbeam along the second direction; the cooling assembly is arranged on one side of the crossbeam along the second direction, or the cooling assembly is arranged below the crossbeam, wherein the first direction is perpendicular to the second direction.

5. The PCB processing equipment according to claim 4, characterized in that, The electrical control box and the crossbeam are arranged at intervals along the second direction.

6. The PCB processing equipment according to claim 5, characterized in that, The PCB processing equipment also includes a processing component connected to one end of the crossbeam away from the electrical control box. The cooling component includes an inlet pipe, a cooling pipe, and an outlet pipe connected in sequence. The inlet pipe and the outlet pipe are both arranged below the electrical control box. The cooling pipe is connected to at least one end of the processing component.

7. The PCB processing equipment according to claim 4, characterized in that, The PCB processing equipment also includes a protective cover. The electrical control box has a protective cover. The PCB processing equipment is provided with a support frame and a partition plate connected to each other. The support frame extends along the first direction, and the partition plate extends along the second direction. One end of the support frame away from the partition plate is connected to the protective cover, and one end of the partition plate away from the support frame is connected to the protective cover. The support frame, the partition plate, and the protective cover together form the protective cover.

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