Mounting equipment and mounting system

Abstract

The utility model relates to the technical field of chip mounting, in particular to mounting equipment and a mounting system. The surface mounting equipment comprises a plurality of surface mounting workbenches, a carrier device, an adsorption device and a dispensing device, the plurality of surface mounting workbenches are arranged at intervals, each surface mounting workbench is provided with a surface mounting position, and the surface mounting position is used for bearing a first surface mounting piece; the carrier device comprises a bearing table, the bearing table is provided with a plurality of bearing positions, and the plurality of bearing positions are used for bearing the second surface-mounted parts; the adsorption device is driven by the first driving mechanism, and the first driving mechanism drives the adsorption device to move between the plurality of mounting workbenches and the carrier device so as to transfer the second mounting piece to the first mounting piece; the glue dispensing device is driven by the second driving mechanism, and the second driving mechanism drives the glue dispensing device to carry out glue dispensing operation so as to attach the second surface-mounted part to the first surface-mounted part. The mounting system comprises the mounting equipment. The mounting equipment and the mounting system are high in overall processing efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting technology, and in particular to a mounting device and mounting system. Background Technology

[0002] Chip mounting refers to the process of precisely placing electronic components (usually chips) into designated locations on a substrate. With advancements in technology and demand, automated mounting equipment has become mainstream. Automated mounting equipment includes pick-and-place machines, which can mount chips and other small components onto substrates at high speed and precision. Automated mounting equipment significantly improves production efficiency, reduces human error, and ensures soldering quality.

[0003] The chip mounting process typically includes steps such as positioning, pick-up, movement, placement, and soldering. Existing mounting equipment usually only has one processing station, and the next chip can only be mounted after all the steps of one chip mounting process are completed. During this process, because different steps require different processing devices (for example, the pick-up step requires a pick-up device, and the soldering step requires a soldering device), some processing devices will be idle during the entire chip mounting process, resulting in low overall processing efficiency and increased processing costs. Utility Model Content

[0004] The main purpose of this utility model is to propose a mounting equipment and mounting system, which aims to solve the technical problem of low overall processing efficiency of existing mounting equipment, resulting in increased processing costs.

[0005] To achieve the above objectives, this utility model proposes a mounting device, comprising:

[0006] Multiple mounting worktables are arranged at intervals, and each mounting worktable is provided with a mounting position for receiving the first mounting component;

[0007] A carrier device, the carrier device including a support platform, the support platform being provided with a plurality of support positions, the plurality of support positions being used to receive a second mounting component;

[0008] An adsorption device is driven by a first driving mechanism, which drives the adsorption device to move between a plurality of mounting worktables and the carrier device to transfer the second mounting piece to the first mounting piece.

[0009] A dispensing device, which is driven by a second drive mechanism, which drives the dispensing device to move between a plurality of mounting worktables to attach the second mounting component to the first mounting component.

[0010] In some embodiments, the vehicle device includes:

[0011] A rotating mechanism configured to drive the support platform to rotate circumferentially;

[0012] The ejector mechanism is driven by a third drive mechanism, which drives the ejector mechanism to move toward or away from the support platform to lift or lower the second mounting component.

[0013] In some embodiments, the mounting equipment includes a detection device, the detection device comprising:

[0014] A first detection element is configured to acquire the position of the second patch adsorbed by the adsorption device;

[0015] A second detection element is disposed opposite to the first detection element, and the second detection element is configured to acquire the position of the solder joint on the first mount at the mounting position.

[0016] In some embodiments, the mounting equipment includes a control device that controls the adsorption device to move based on the position detection result of the second mounting component by the first detection element and the position detection result of the solder joint by the second detection element, so that the adsorption device drives the second mounting component to a calibrated position.

[0017] In some embodiments, the first detection element includes a first light source and a first camera. The first light source is configured to emit a first light path for illuminating the second mounting component. The first camera is configured to receive the light from the first light path to generate a position image of the second mounting component for the control device.

[0018] The second detection element includes a second light source and a second camera. The second light source is configured to emit a second light path for illuminating the solder joint, and the second camera is configured to receive the light from the second light path to generate a position image of the solder joint for the control device.

[0019] In some embodiments, the detection device includes a housing with a receiving cavity, and both the first detection element and the second detection element are disposed within the receiving cavity.

[0020] In some embodiments, the mounting apparatus includes an adhesive fixing device driven by a fourth drive mechanism, which drives the adhesive fixing device to move toward or away from the dispensing points of the first mount and the second mount.

[0021] In some embodiments, a baffle is provided on the side of the adhesive fixing device near the dispensing device.

[0022] In some embodiments, the mounting equipment includes a plurality of loading and unloading devices, which correspond to a plurality of mounting worktables, and each loading and unloading device is used to load and unload materials onto each mounting worktable.

[0023] Correspondingly, this utility model also proposes a mounting system, which includes the mounting equipment described in any of the above embodiments.

[0024] Compared with the prior art, the beneficial effects of this utility model are:

[0025] In this invention, multiple placement worktables are provided, each capable of placing a first and a second component. An adsorption device and a dispensing device move alternately between the worktables, sequentially completing the corresponding processing operations. This structure and processing mode effectively shortens the downtime of each processing device while waiting for processing, allowing for uninterrupted processing between the worktables. This improves the overall processing efficiency of the placement equipment and reduces production time costs.

[0026] The application of the above-mentioned mounting equipment and mounting system can help improve the production efficiency of the production line and realize mass production. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the overall structure of a mounting device provided in an embodiment of the present invention;

[0029] Figure 2 for Figure 1 A magnified view of a section at point A in the middle;

[0030] Figure 3 for Figure 1 A magnified view of a section at point B in the middle;

[0031] Figure 4 This is a schematic diagram of the structure of the mounting equipment at the mounting workbench according to an embodiment of the present invention;

[0032] Figure 5 This is a schematic diagram of the detection device in a mounting device provided in an embodiment of the present invention.

[0033] Explanation of icon numbers:

[0034] 10. Placement equipment;

[0035] 100. Mounting workbench;

[0036] 110. Mounting position;

[0037] 200. Vehicle assembly;

[0038] 210. Support platform; 220. Rotating mechanism; 230. Ejector pin mechanism;

[0039] 211. Bearing position;

[0040] 300. Adsorption device;

[0041] 400. Dispensing device;

[0042] 500. Detection device;

[0043] 510. First detection element; 520. Second detection element;

[0044] 600. Adhesive fixing device;

[0045] 610. Baffle;

[0046] 700. Loading and unloading device.

[0047] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0048] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0049] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0050] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or," "and / or," or "and / or" throughout the text implies three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where A and B are simultaneously satisfied. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0051] Chip mounting refers to the process of precisely placing electronic components (usually chips) into designated locations on a substrate. With advancements in technology and demand, automated mounting equipment has become mainstream. Automated mounting equipment includes pick-and-place machines, which can mount chips and other small components onto substrates at high speed and precision. Automated mounting equipment significantly improves production efficiency, reduces human error, and ensures soldering quality.

[0052] The chip mounting process typically includes steps such as positioning, pick-up, movement, placement, and soldering. Existing mounting equipment usually only has one processing station, and the next chip can only be mounted after all the steps of one chip mounting process are completed. During this process, because different steps require different processing devices (for example, the pick-up step requires a pick-up device, and the soldering step requires a soldering device), some processing devices will be idle during the entire chip mounting process, resulting in low overall processing efficiency and increased processing costs.

[0053] Based on this, in order to solve the technical problem of low overall processing efficiency and increased processing costs of existing mounting equipment 10, referring to Figures 1 to 5This utility model provides a mounting device 10, which includes multiple mounting worktables 100, a carrier device 200, an adsorption device 300, and a dispensing device 400. The multiple mounting worktables 100 are spaced apart, and each mounting worktable 100 has a mounting position 110 for receiving a first mounting component (e.g., a substrate). The carrier device 200 includes a support platform 210 with multiple support positions 211 for receiving second mounting components (e.g., chips). It should be noted that the multiple support positions 211 can receive the same type of second mounting component to increase the storage capacity of the support platform 210. Alternatively, the multiple support positions 211 can receive different types of second mounting components to facilitate mounting different types of second mounting components onto the first mounting component. The adsorption device 300 is driven by a first driving mechanism (e.g., a drive motor or a drive cylinder), which drives the adsorption device 300 to move between multiple placement worktables 100 and the carrier device 200 to transfer the second mounting component to the first mounting component. Specifically, the adsorption device 300 may include an adsorption port capable of generating a vacuum negative pressure, which allows the second mounting component to be adsorbed and transferred, ensuring that the second mounting component is not damaged or contaminated during the transfer process. The dispensing device 400 is driven by a second driving mechanism (e.g., a drive motor or a drive cylinder), which drives the dispensing device 400 to move between multiple placement worktables 100 to adhere the second mounting component to the first mounting component.

[0054] Specifically, in this embodiment, the mounting equipment 10 includes two mounting worktables 100 as an example. The two mounting worktables 100 are a first mounting worktable 100 and a second mounting worktable 100, respectively. First, the first mounting worktable 100 and the second mounting worktable 100 can respectively load the first mounting component. Then, the suction device 300 picks up the second mounting component from the support platform 210 and moves the second mounting component towards the first mounting worktable 100. After the second mounting component and the first mounting component are positioned, the suction device 300 lowers the picked-up second mounting component onto the first mounting component, realizing the initial bonding between the first mounting component and the second mounting component on the first mounting worktable 100. Finally, the dispensing device 400 moves towards the first mounting worktable 100 and dispenses adhesive onto the first mounting component and the second mounting component on the first mounting worktable 100, realizing the fixed connection between the first mounting component and the second mounting component.

[0055] While the dispensing device 400 processes the first and second mounting components on the first mounting worktable 100, the adsorption device 300 picks up the second mounting component from the support table 210 and moves it closer to the second mounting worktable 100. After the second and first mounting components are positioned correctly, the adsorption device 300 lowers the picked-up second mounting component onto the first mounting component, achieving initial bonding between the first and second mounting components on the second mounting worktable 100. After the dispensing of adhesive to the first and second mounting components on the first mounting worktable 100 is completed, the dispensing device 400 immediately moves closer to the second mounting worktable 100 to dispense adhesive to the first and second mounting components on the second mounting worktable 100. While the dispensing device 400 processes the first and second mounting parts on the second mounting worktable 100, the suction device 300 picks up the second mounting part and moves it towards the first mounting worktable 100, thus loading the second mounting part onto the first mounting worktable 100. This process repeats, with the suction device 300 and the dispensing device 400 alternating between the first and second mounting worktables 100 to ensure that the processed parts on the first and second mounting worktables are mounted synchronously.

[0056] In the mounting equipment 10 provided in this embodiment, multiple mounting worktables 100 are provided. Each of the multiple mounting worktables 100 can perform mounting between the first mounting component and the second mounting component. The adsorption device 300 and the dispensing device 400 move alternately between the multiple mounting worktables 100, completing the corresponding processing operations in sequence. By adopting the above structure and processing mode, the downtime of each processing device while waiting for processing can be effectively shortened, allowing each processing device to process without interruption between the multiple mounting worktables 100. This helps to improve the overall processing efficiency of the mounting equipment 10 and reduce the time cost consumed during production.

[0057] In other embodiments, multiple placement worktables 100 are driven by a drive mechanism (e.g., a drive motor or a drive cylinder), enabling the multiple placement worktables 100 to move sequentially toward or away from the dispensing device 400. Taking a placement device 10 having two placement worktables 100 as an example, the two placement worktables 100 are a first placement worktable and a second placement worktable. First, the first placement worktable moves toward the dispensing device 400, allowing the first placement component carried on the first placement worktable to undergo dispensing at the dispensing device 400. After the first placement component on the first placement worktable completes the dispensing operation, the first placement worktable moves away from the dispensing device 400, so that the first placement component on the first placement worktable can undergo subsequent operation processes. As the first mounting table moves away from the dispensing device 400, the second mounting table moves towards the dispensing device 400. This allows the first mounting component on the second mounting table to be dispensed at the dispensing device 400. After the first mounting component on the second mounting table has completed the dispensing operation, the second mounting table moves away from the dispensing device 400 to facilitate subsequent processing of the first mounting component on the second mounting table. This process repeats, with the first and second mounting tables alternating between the first and second mounting tables, ensuring that the dispensing device 400 can simultaneously dispense the first mounting components on both tables.

[0058] In some embodiments, refer to Figure 1 and Figure 3 The carrier device 200 includes a rotating mechanism 220 and a pin mechanism 230. The rotating mechanism 220 is configured to drive the carrier platform 210 to rotate circumferentially. If multiple bearing positions 211 of the carrier platform 210 receive the same type of second mounting component, when the second mounting component on one of the bearing positions 211 is emptied, the rotating mechanism 220 drives the carrier platform 210 to rotate circumferentially, causing another bearing position 211 filled with the second mounting component to rotate to a position close to the adsorption device 300, so that the adsorption device 300 can continuously pick up the second mounting component, ensuring the continuity of mounting and thus improving overall production efficiency. If multiple bearing positions 211 of the bearing platform 210 receive different types of second mounting parts, the rotating mechanism 220 drives the bearing platform 210 to rotate circumferentially, so that the bearing positions 211 with different types of second mounting parts can all rotate to a position close to the adsorption device 300, so that the adsorption device 300 can pick up different second mounting parts according to different mounting requirements, thereby improving the applicability of the mounting equipment 10 and reducing mounting costs.

[0059] The ejector mechanism 230 is driven by a third drive mechanism (e.g., a drive motor or a drive cylinder). The third drive mechanism drives the ejector mechanism 230 to move towards or away from the support platform 210 to lift or lower the second mounting component. When the adsorption device 300 moves towards the support platform 210 to pick up the second mounting component, the ejector mechanism 230 lifts the second mounting component, thereby shortening the travel distance of the adsorption device 300 and reducing the structural design requirements of the adsorption device 300. After the adsorption device 300 picks up the second mounting component, the ejector mechanism 230 lowers the second mounting component, thereby enabling the support platform 210 to support the second mounting component and ensuring the positioning stability of the second mounting component.

[0060] The cooperation between the rotating mechanism 220 and the ejector mechanism 230 facilitates the adsorption device 300 to pick up the second mounting part, thereby improving the working efficiency and accuracy of the adsorption device 300.

[0061] In some embodiments, refer to Figure 1 and Figure 5 The mounting equipment 10 includes a detection device 500, which includes a first detection element 510 and a second detection element 520. The first detection element 510 is configured to detect the position of the second mounting component adsorbed by the adsorption device 300. The second detection element 520 is disposed opposite to the first detection element 510 and is configured to detect the position of the solder joint on the first mounting component at the mounting position 110.

[0062] Specifically, in this embodiment, before the second mounting component is initially attached to the solder joints of the first mounting component, the first detection element 510 can accurately correct the position of the second mounting component, and the second detection element 520 can accurately correct the position of the solder joints on the first mounting component. By comparing the positions of the solder joints on the second and first mounting components, the mounting accuracy between the second mounting component and the solder joints is improved. Furthermore, since the detection device 500 provided in this embodiment can simultaneously acquire the positions of the first and second mounting components, there is no need for operators to repeatedly adjust the position or angle of the detection device 500. This effectively avoids the problem of mechanical errors caused by multiple movements, thus affecting the positioning accuracy. In other words, the positioning accuracy of the detection device 500 of this application is high.

[0063] In some embodiments, the mounting equipment 10 includes a control device that controls the adsorption device 300 to move based on the position detection result of the second mounting component by the first detection element 510 and the position detection result of the solder joint by the second detection element 520, so that the adsorption device 300 drives the second mounting component to a calibrated position.

[0064] Specifically, in this embodiment, when a positional deviation occurs between the second mounting component and the solder joint, the control device controls the adsorption device 300 to move, causing the adsorption device 300 to adjust the second mounting component to the calibrated position. Once the second mounting component is positioned, the adsorption device 300 can move the second mounting component closer to the first mounting component, causing the second mounting component to adhere to the solder joint of the first mounting component. This adjustment method helps improve the adhesion accuracy between the second mounting component and the solder joint, thereby improving the product mounting quality.

[0065] Alternatively, in other embodiments, when a positional deviation occurs between the second mount and the solder joint, the control device controls the mounting stage 100 to move, causing the mounting stage 100 to adjust the first mount to the calibrated position. After the first mount is positioned, the mounting stage 100 can move the first mount closer to the second mount, so that the second mount is attached to the solder joint of the first mount.

[0066] In some embodiments, the first detection element 510 includes a first light source and a first camera. The first light source is configured to emit a first light path for illuminating the second mounting component, and the first camera is configured to receive the light from the first light path to generate a position image of the second mounting component for the control device. Similarly, the second detection element 520 includes a second light source and a second camera. The second light source is configured to emit a second light path for illuminating the solder joint, and the second camera is configured to receive the light from the second light path to generate a position image of the solder joint for the control device.

[0067] Specifically, in this embodiment, the control device can simultaneously receive the position image of the second mounting component acquired by the first camera, and the position image of the solder joint acquired by the second camera. By comparing the position image of the second mounting component and the position image of the solder joint, the control device can quickly and accurately generate a position adjustment strategy for either the second mounting component or the first mounting component, thereby improving the alignment accuracy between the second mounting component and the first mounting component. More preferably, the control device may include a display screen, on which the position images of the second mounting component and the solder joint can be directly displayed. The position images on the display screen allow operators to intuitively determine the alignment between the second mounting component and the first mounting component, thus facilitating the selection of appropriate adjustment strategies based on actual production needs.

[0068] In some embodiments, the detection device 500 includes a housing with a receiving cavity, in which the first detection element 510 and the second detection element 520 are both disposed. Specifically, in this embodiment, the housing provides protection for the first detection element 510 and the second detection element 520, ensuring that the first detection element 510 and the second detection element 520 are not damaged, thereby extending the service life of the first detection element 510 and the second detection element 520 and ensuring the detection accuracy of the first detection element 510 and the second detection element 520.

[0069] In some embodiments, refer to Figure 1 and Figure 2 The mounting equipment 10 includes an adhesive application device 600, which is driven by a fourth drive mechanism (e.g., a drive motor or a drive cylinder). The fourth drive mechanism drives the adhesive application device 600 to move towards or away from the dispensing point of the first and second mounters. For example, the adhesive application device 600 may emit light of a specific wavelength to improve the drying efficiency of the adhesive at the dispensing point of the first and second mounters. It is understood that the adhesive application device 600 may also be other types of structural equipment.

[0070] Specifically, in this embodiment, compared to using natural drying at the dispensing points of the first and second mounting components, by setting up the adhesive fixing device 600, on the one hand, the drying speed at the dispensing points of the first and second mounting components can be quickly increased, the waiting time for the adhesive to dry can be shortened, and the mounting efficiency of the first and second mounting components can be improved; on the other hand, the mounting stability of the first and second mounting components can be improved, ensuring that the first and second mounting components are firmly bonded together, thereby improving the production quality of the product.

[0071] In some embodiments, refer to Figure 1 and Figure 2 A baffle 610 is provided on the side of the adhesive fixing device 600 near the dispensing device 400. Specifically, in this embodiment, by providing a baffle 610 between the dispensing device 400 and the adhesive fixing device 600, the adhesive fixing device 600 can be effectively prevented from acting on the dispensing port of the dispensing device 400, thereby preventing the formation of dry glue at the dispensing port and causing blockage, which would affect the processing efficiency of the mounting equipment 10.

[0072] In some embodiments, refer to Figure 1 and Figure 4The mounting equipment 10 includes multiple loading / unloading devices 700, each corresponding to a multiple mounting worktable 100. Each loading / unloading device 700 is used to load / unload workpieces onto each mounting worktable 100. Specifically, in this embodiment, each loading / unloading device 700 can automatically place workpieces onto the corresponding mounting worktable 100, or accurately retrieve completed workpieces from the corresponding mounting worktable 100, improving the mounting efficiency and accuracy. Through the coordinated work of multiple loading / unloading devices 700 and multiple mounting worktables 100, the mounting equipment 10 can simultaneously perform loading / unloading operations on multiple mounting worktables 100, significantly improving the overall mounting efficiency and production automation level.

[0073] The mounting equipment 10 provided in this application is multifunctional and highly compatible, capable of supporting mounting processes for both chips and lenses. Specifically, the first and second mounting components can be either chips or lenses. For chip processing, the mounting equipment 10 includes a pin mechanism 230, which facilitates the suction device 300 in picking up the chip. For lens processing, the mounting equipment 10 includes an adhesive bonding device 600, which enables stable bonding of the lens.

[0074] Correspondingly, another embodiment of this utility model also provides a mounting system, which includes the mounting equipment 10 in any of the above embodiments. Specifically, in this embodiment, the mounting system using the mounting equipment 10 is beneficial to improving the production efficiency of the production line and realizing mass production.

[0075] Thanks to the improvements to the mounting equipment 10 described above, the mounting system of this embodiment has the same technical effects as the mounting equipment 10 described above, which will not be repeated here.

[0076] It should be noted that other contents of the mounting equipment 10 and mounting system disclosed in this utility model can be found in the prior art, and will not be repeated here.

[0077] The above are merely preferred embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the inventive concept of this utility model and the contents of this utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A mounting device, characterized in that, include: Multiple mounting worktables are arranged at intervals, and each mounting worktable is provided with a mounting position for receiving the first mounting component; A carrier device, the carrier device including a support platform, the support platform being provided with a plurality of support positions, the plurality of support positions being used to receive a second mounting component; An adsorption device is driven by a first driving mechanism, which drives the adsorption device to move between a plurality of mounting worktables and the carrier device to transfer the second mounting piece to the first mounting piece. A dispensing device, which is driven by a second drive mechanism, which drives the dispensing device to move between a plurality of mounting worktables to attach the second mounting component to the first mounting component.

2. The mounting equipment according to claim 1, characterized in that, The vehicle device includes: A rotating mechanism configured to drive the support platform to rotate circumferentially; The ejector mechanism is driven by a third drive mechanism, which drives the ejector mechanism to move toward or away from the support platform to lift or lower the second mounting component.

3. The mounting equipment according to claim 1, characterized in that, The mounting equipment includes a detection device, which includes: A first detection element is configured to acquire the position of the second patch adsorbed by the adsorption device; A second detection element is disposed opposite to the first detection element, and the second detection element is configured to acquire the position of the solder joint on the first mount at the mounting position.

4. The mounting equipment according to claim 3, characterized in that, The mounting equipment includes a control device. Based on the position detection result of the second mounting component by the first detection element and the position detection result of the solder joint by the second detection element, the control device controls the adsorption device to move so that the adsorption device drives the second mounting component to a calibrated position.

5. The mounting equipment according to claim 4, characterized in that, The first detection element includes a first light source and a first camera. The first light source is configured to emit a first light path for illuminating the second mounting component. The first camera is configured to receive the light from the first light path to generate a position image of the second mounting component for the control device. The second detection element includes a second light source and a second camera. The second light source is configured to emit a second light path for illuminating the solder joint, and the second camera is configured to receive the light from the second light path to generate a position image of the solder joint for the control device.

6. The mounting equipment according to claim 3, characterized in that, The detection device includes a housing with a receiving cavity, and the first detection element and the second detection element are both disposed within the receiving cavity.

7. The mounting equipment according to claim 1, characterized in that, The mounting equipment includes an adhesive fixing device, which is driven by a fourth drive mechanism. The fourth drive mechanism drives the adhesive fixing device to move toward or away from the dispensing point of the first mounting component and the second mounting component.

8. The mounting equipment according to claim 7, characterized in that, A baffle is provided on the side of the adhesive fixing device near the dispensing device.

9. The mounting equipment according to claim 1, characterized in that, The mounting equipment includes multiple loading and unloading devices, which correspond to multiple mounting worktables. Each loading and unloading device is used to load and unload materials onto each mounting worktable.

10. A mounting system, characterized in that, Includes the mounting equipment as described in any one of claims 1 to 9.

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