Heating bed body and heating mattress
By using a thin-plate heated bed structure, combined with heat dissipation positions and connecting grooves, the problem of poor temperature controllability and low safety of existing heated beds is solved. It achieves temperature zone control and safe power connection, and is suitable for heated beds and mattresses.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FOSHAN XINHAORUI TECH CO LTD
- Filing Date
- 2025-07-30
- Publication Date
- 2026-05-19
AI Technical Summary
Existing heating beds suffer from poor temperature controllability, low circuit safety, complex structure, and the risk of water leakage.
The mattress features a thin, plate-like heated bed structure, including a frame base, heating plate assembly, and main board assembly. Through the design of heat dissipation positions and connecting slots, it achieves temperature zone control and safe power connection, forming an integrated mattress product when combined with a soft pad.
It achieves a heating bed body with high temperature controllability, strong safety and simple structure, suitable for heating beds and mattress products, meeting the comfort temperature requirements of different parts, and has the characteristics of simple installation and maintenance.
Smart Images

Figure CN224251053U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of bedding technology, specifically to a heated bed body and a heated mattress. Background Technology
[0002] With the improvement of living standards, people no longer rely on heavy bedding in the cold winter and are more willing to invest in home appliances. Heated beds, which can provide warmth through their own electric heating, are an effective way to keep warm while sleeping in winter. In the current technology, heated beds mainly use traditional thermal resistance heating beds. However, thermal resistance heating beds have poor temperature controllability and low circuit safety, and there are frequent reports of fires caused by the use of thermal resistance heating beds.
[0003] The prior art patent document CN105877277B discloses a self-heating frame bed; it uses a heating water supply structure to provide a heated bed body in a water heating manner, which has the technical defects of relatively complex structural connection and risk of water leakage.
[0004] The prior art patent document CN 218735046 U discloses a structural design of a novel thin-plate heating element. Utility Model Content
[0005] The purpose of this utility model is to overcome the shortcomings of the prior art and provide a heated bed body and heated mattress.
[0006] A heating bed body includes: a frame base plate, a first mounting position adapted to a first heating plate is provided on the upper side of the frame base plate, a main board mounting space is provided on the upper side of the frame base plate next to the first mounting position, the main board mounting space is used to position and assemble a main board assembly, and the main board mounting space is connected to the first mounting position; a power connection position is provided on the outer periphery of the frame base plate, the power connection position is connected to the main board mounting space, and the power connection end of the main board assembly is located at the power connection position; a heating plate assembly is positioned and mounted on the upper side of the frame base plate, the heating plate assembly includes a positioning front plate, the positioning front plate is provided with a plate mounting port corresponding to the first mounting position and a main board opening corresponding to the main board mounting space, and the first heating plate is mounted on the plate mounting port.
[0007] Furthermore, the frame base plate is recessed with several heat dissipation positions corresponding to the first mounting position.
[0008] Furthermore, a connecting channel is provided between the motherboard mounting space and its adjacent heat dissipation positions; a connecting groove is recessed on the first mounting position between two adjacent heat dissipation positions.
[0009] Furthermore, each heat dissipation position is separated by a positioning ridge; a connecting groove is provided on the positioning ridge between two adjacent heat dissipation positions to form a connection; an adhesive groove is provided on the upper side of the positioning ridge along its extension direction; nine heat dissipation positions are arranged in a 3x3 grid in the first installation position, and each positioning ridge is arranged in a grid pattern.
[0010] Furthermore, the frame base plate is rectangular in shape, and along its length, the frame base plate is sequentially provided with a blank space, a first mounting position, and a motherboard mounting space.
[0011] Furthermore, the power connection point is connected to the first mounting position via the power connection slot, and the power connection point is connected to the motherboard mounting space via the first mounting position.
[0012] Furthermore, the first heating plate is arranged in three sections along the length of the frame base plate to form a first heating zone, a second heating zone, and a third heating zone.
[0013] Furthermore, the four corners of the lower part of the frame base plate are connected to support bed legs.
[0014] The heated mattress is designed as described above with a heated mattress body. The heated mattress body has a soft pad on its upper side that matches the outline of the frame base plate. The heated mattress body and the soft pad are wrapped together by a mattress cover. The mattress cover has an opening for connecting to the power source corresponding to the power source location.
[0015] The beneficial effects of this utility model are as follows:
[0016] Based on the frame base plate structure, combined with the application of a thin-plate first heating plate structure, a thin-plate bed frame structure can be effectively organized and installed with the main board. This structure satisfies heating function control while replacing traditional, heavy, thermally resistant heating bed frames as a heating bedding product. Furthermore, by combining it with a soft mattress, it can be sold as a standalone mattress product, meeting the demand for heated mattresses. Attached Figure Description
[0017] Figure 1 This is an exploded view of the structure of the heating bed of this utility model;
[0018] Figure 2 for Figure 1 A partial schematic diagram of part A.
[0019] Figure label:
[0020] Frame base plate 1, open space 10, positioning screw hole 101, first mounting position 11, motherboard mounting space 12, power connection position 13, heat dissipation position 14, connecting channel 15, connecting groove 16, positioning ridge 17, adhesive groove 18, power connection groove 19.
[0021] Heating plate assembly 2, positioning front plate 21, plate mounting port 211, main board opening 212, first heating plate 22, first heating zone 221, second heating zone 222, third heating zone 223, mounting hole 23, main board assembly 3, power connection terminal 31, bolt 4. Detailed Implementation
[0022] To make the technical solution, purpose and advantages of this utility model clearer, the following explanation is given in conjunction with the accompanying drawings and embodiments.
[0023] like Figures 1 to 2 As shown, this utility model provides a heated bed frame with a flat and thin overall structure, occupying a small volume, and having a neat and aesthetically pleasing appearance. It can be used as the bed surface of a heated bed or the heating part of a heated mattress.
[0024] The heating bed structure includes a frame base plate 1. A first mounting position 11 adapted to a first heating plate 22 is provided on the upper side of the frame base plate 1. A main board mounting space 12 is provided on the upper side of the frame base plate 1 next to the first mounting position 11. The main board mounting space 12 is used to position and assemble a main board assembly 3. The main board mounting space 12 is connected to the first mounting position 11. A power connection position 13 is provided on the outer periphery of the frame base plate 1. The power connection position 13 is connected to the main board mounting space 12. The power connection end 31 of the main board assembly 3 is located at the power connection position 13, thereby meeting the application requirements of the main board assembly 3 for external power connection.
[0025] Heating plate assembly 2 is positioned and mounted on the upper side of the frame base plate 1. The heating plate assembly 2 includes a positioning front plate 21. The positioning front plate 21 is provided with a plate mounting port 211 corresponding to the first mounting position 11 and a motherboard opening 212 corresponding to the motherboard mounting space 12. The first heating plate 22 is mounted on the plate mounting port 211. After mounting, the first heating plate 22 is flush with the end face of the positioning front plate 21.
[0026] By setting the first mounting position 11, the main board mounting space 12, and the power connection position 13 on the frame base plate 1, the power connection organization and control application requirements for the heating bed body to be installed on the first heating plate 22 can be effectively formed; and in the heating plate assembly 2, the combination of the positioning front plate 21 and the first heating plate 22 is adapted and combined for installation on the frame base plate 1, providing a simple and effective installation structure method, ensuring that the heating bed body has the design characteristics of efficient structural installation and simple maintenance.
[0027] The frame base plate 1 is rectangular in shape. Along its length, the frame base plate 1 is provided with a clearance space 10, a first mounting position 11, and a mainboard mounting space 12. In the first mounting position 11, the corresponding first heating plate 22, along the length of the frame base plate 1, can be arranged in three sections to form a first heating zone 221, a second heating zone 222, and a third heating zone 223 based on an independent plate heating layout.
[0028] With the above structural design, the open space 10 serves as the sleeping position for the user's head, avoiding direct heat generation and potential sleep risks. Furthermore, based on the three heating zones, separate heating is provided for the user's shoulder and back area, waist area, and leg area, meeting the different comfort temperature requirements of various users for their respective body parts.
[0029] In practical applications, the first heating zone 221, the second heating zone 222 and the third heating zone 223 are all controlled by the control motherboard for temperature adjustment. In order to meet the requirements of wiring and heat dissipation, the frame base plate 1 is recessed and provided with several heat dissipation positions 14 corresponding to the first mounting position 11.
[0030] Specifically, nine heat dissipation positions 14 are arranged in a 3x3 grid on the first mounting position 11, corresponding to the three sub-regions. Each heat dissipation position 14 is separated by positioning edges 17, which are arranged in a grid pattern. On the first mounting position 11, a connecting groove 16 is provided on the positioning edge 17 between two adjacent heat dissipation positions 14 to form a connection. In the same heat-generating area, the connecting groove 16 includes a first through groove extending along the width direction; in adjacent heat-generating areas, the connecting groove 16 includes a second through groove extending along the length direction. A connecting channel 15 is provided between the motherboard mounting space 12 and the adjacent heat dissipation positions 14. The connecting channel 15 corresponds to the three heat dissipation positions 14 in the third heat-generating area 223 and is configured as three groups.
[0031] Based on the organization of the connecting slots 16 and connecting channels 15 in each heat dissipation position 14 and their connection to the motherboard mounting space 12, the corresponding motherboard assembly 3 can extend connecting wires through the connecting channels 15 and connecting slots 16 to connect to the power connection positions 13 located in each of the first heat dissipation area 221, the second heat dissipation area 222, and the third heat dissipation area 223, respectively, thus satisfying the electrical connection requirements of the motherboard assembly 3 to different power connection positions 13 in the first heat dissipation plate 22. The power connection position 13 can optionally be located on one side of the width direction of the open space 10. The power connection position 13 is connected to the heat dissipation position 14 of the first mounting position 11 through the connecting slots 16 and connecting channels 15 in the first mounting position 11, thus the power connection position 13 can be effectively connected to the motherboard mounting space 12.
[0032] An adhesive groove 18 is provided on the upper side of the positioning ridge 17 along its extension direction. In the assembly application, the first heating plate 22 is bonded to the plate mounting opening 211 on its outer periphery by adhesive, while the lower side of the first heating plate 22 is adhered to the position of each positioning ridge 17 by adhesive in each adhesive groove 18, thus completing the fixed bonding assembly of the first heating plate 22.
[0033] For the positioning assembly application of the positioning front plate 21 and the frame base plate 1, in this embodiment, multiple mounting holes 23 can be arranged on the outer periphery of the positioning front plate 21, and multiple positioning screw holes 101 can be provided on the frame base plate 1. By means of bolt connection in the prior art, bolts 4 are threaded through the mounting holes 23 on the upper side of the heating bed and screwed into the positioning screw holes 101 to form a fixed connection between the positioning front plate 21 and the frame base plate 1.
[0034] Based on the above-mentioned heating bed structure, a thin plate-shaped heating bed is provided.
[0035] Based on this, and considering the structural design that allows for bed elevation, the four corners of the lower part of the frame base plate 1 are connected to support bed legs. As a preferred structural design, the frame base plate 1 may optionally have screw holes on its lower side. Depending on the actual connection stability requirements, the screw holes can be used to connect external support bed legs via screw-in connectors, or directly screwed to the support bed legs, thus providing a heated bed application with elevated support bed legs.
[0036] On the other hand, based on the application requirement of a heated mattress to adapt to existing bed frames, a soft pad that matches the outline shape of the frame base plate 1 is provided on the upper side of the heated mattress body. The heated mattress body and the soft pad are wrapped together with a mattress cover to form an integrated package. Through the above structural form, the heated mattress can effectively generate heat based on the structural setting of the heated mattress body, and the integrated packaging setting can meet the application requirements of product integration and sales.
[0037] The mattress cover has a power connection opening corresponding to the power connection position 13, for connecting an external power source to the power connection terminal 31 of the mainboard component 3. Depending on manufacturing costs and control requirements, the mainboard component 3 can be configured with physical buttons for button-type control or wirelessly controlled via a mobile phone or other remote control device.
[0038] The above description is only a preferred embodiment of the present utility model. For those skilled in the art, modifications can still be made to the embodiments without departing from the first principle of the present utility model, and the corresponding modifications should also be considered within the protection scope of the present utility model.
Claims
1. A heated bed, characterized in that, include: A frame base plate has a first mounting position adapted to the first heating plate on its upper side. A motherboard mounting space is provided on the upper side of the frame base plate next to the first mounting position. The motherboard mounting space is used to position and assemble a motherboard assembly. The motherboard mounting space is connected to the first mounting position. A power connection position is provided on the outer periphery of the frame base plate. The power connection position is connected to the motherboard mounting space. The power connection terminal of the motherboard assembly is located at the power connection position. A heating plate assembly is positioned and mounted on the upper side of the frame base plate. The heating plate assembly includes a positioning front plate, which has a plate mounting port corresponding to the first mounting position and a motherboard opening corresponding to the motherboard mounting space. The first heating plate is mounted on the plate mounting port.
2. The heating bed body as described in claim 1, characterized in that, The frame base plate is recessed with several heat dissipation positions corresponding to the first mounting position.
3. The heating bed body as described in claim 2, characterized in that, A connecting channel is provided between the motherboard mounting space and its adjacent heat dissipation position; a connecting groove is recessed between two adjacent heat dissipation positions on the first mounting position.
4. The heating bed body as described in claim 3, characterized in that, Each heat dissipation position is separated by a positioning ridge; a connecting groove is provided on the positioning ridge between two adjacent heat dissipation positions to form a connection; an adhesive groove is provided on the upper side of the positioning ridge along its extension direction; nine heat dissipation positions are arranged in a 3x3 grid in the first installation position, and the positioning ridges are arranged in a grid pattern.
5. The heating bed body as described in any one of claims 1 to 4, characterized in that, The frame base plate is rectangular in shape, and along its length, the frame base plate is provided with a blank space, a first mounting position, and a motherboard mounting space in sequence.
6. The heating bed body as described in claim 5, characterized in that, The power connection point is connected to the first mounting position via the power connection slot, and the power connection point is connected to the motherboard mounting space via the first mounting position.
7. The heating bed body as described in claim 5, characterized in that, The first heating plate is arranged in three sections along the length of the frame base plate to form a first heating zone, a second heating zone, and a third heating zone.
8. The heating bed body as described in any one of claims 5 to 7, characterized in that, The four corners of the lower part of the frame base plate are connected to support bed legs.
9. A heated mattress, characterized in that, The heating bed body as described in any one of claims 1 to 8 is provided on the upper side of the heating bed body, with a soft pad adapted to the outline shape of the frame base plate. The heating bed body and the soft pad are integrally packaged with a mattress cover. The mattress cover is provided with an electrical connection opening corresponding to the electrical connection position.