Magnetron sputtering integrated equipment combined with molecular pump

Abstract

The utility model discloses magnetron sputtering integrated equipment combined with a molecular pump, which comprises a rack, the lower part of the rack is a coating area, and the upper part of the rack is a control area; the magnetron sputtering integrated equipment is placed in a vacuum coating chamber from top to bottom, the coating area is located in the vacuum coating chamber, and the control area is located above the vacuum coating chamber; at least one group of rotating cathodes are arranged in the coating area, and gas supply assemblies are arranged on the side surfaces of the rotating cathodes; and a molecular pump is arranged in the control area, and an air suction port of the molecular pump penetrates through the rack to be communicated with the coating area. According to the magnetron sputtering integrated equipment, the molecular pump is designed in the control area, so that the molecular pump and the magnetron sputtering equipment are integrated, compared with a traditional external molecular pump, the coating space of the magnetron sputtering equipment is not occupied, and more space can be provided for sputtering more base materials or base materials with larger sizes.

Description

Technical Field

[0001] This utility model relates to the field of vacuum sputtering technology, and in particular to an integrated magnetron sputtering device that combines a molecular pump. Background Technology

[0002] Magnetron sputtering thin film deposition technology is a type of physical vapor deposition, widely used in materials science, optics, surface physics, and other disciplines. Continuous improvements in magnetron sputtering technology and the demand for high-quality thin films have further promoted its development. In the optical industry, magnetron sputtering is used to manufacture various optical thin films, low-emissivity glass, and transparent conductive glass. However, because vacuum-type experimental equipment requires a certain level of vacuum within the equipment to operate normally, frequent opening and closing of the cavity consumes a significant amount of time for starting and stopping the equipment, resulting in reduced operator efficiency and insufficient continuous operating time.

[0003] Multi-target magnetron sputtering technology, equipped with DC and RF power supplies, can form multi-metal and non-metal films, enriching the practical application of magnetron sputtering technology and improving the application range of magnetron sputtering for preparing multi-component and composite thin films.

[0004] Most existing multi-target magnetron sputtering equipment uses multi-stage pumps (rotary vane pump-Roots pump-molecular pump) to ensure the vacuum level inside the equipment. The last stage of the multi-stage pump is usually a molecular pump, but it is mostly external. This causes the molecular pump to occupy the coating space of the magnetron sputtering equipment, resulting in limited coating space and thus affecting the coating efficiency. Utility Model Content

[0005] The purpose of this invention is to provide an integrated magnetron sputtering device that combines a molecular pump, in order to overcome the deficiencies in the prior art.

[0006] To solve the above-mentioned technical problems, this utility model provides an integrated magnetron sputtering device combined with a molecular pump, including a frame, the lower part of which is a coating area and the upper part is a control area; the integrated magnetron sputtering device is placed from top to bottom into a vacuum coating chamber, wherein the coating area is located inside the vacuum coating chamber and the control area is located above the vacuum coating chamber;

[0007] The coating area is provided with at least one set of rotating cathodes, and a gas supply component is provided on the side of the rotating cathodes;

[0008] A molecular pump is provided in the control area, and the suction port of the molecular pump passes through the frame and communicates with the coating area;

[0009] The coating area is also equipped with a drive assembly, an air supply valve island, and a cooling water assembly.

[0010] The drive assembly drives the target cylinder inside the rotating cathode to rotate;

[0011] The gas supply valve island is connected to the gas supply assembly via a gas supply pipeline, continuously supplying process gas to the coating area;

[0012] The cooling water assembly is connected to the rotating cathode and the air supply assembly via water supply pipelines, respectively, to provide cooling water to both.

[0013] Preferably, two sets of rotating cathodes are arranged in parallel within the coating area, and each set of rotating cathodes is equipped with an independent driving component, which drives the target cylinder inside the rotating cathode to rotate.

[0014] Preferably, the gas supply components are arranged in two groups, symmetrically on both sides of the rotating cathode.

[0015] Preferably, the outlet of the molecular pump is connected in sequence to an external Roots pump and a rotary vane pump via a vacuum tube; the inlet of the molecular pump in the coating area is provided with louvers.

[0016] Preferably, the louvers are located between the two sets of rotating cathodes to extract air and excess process gas from the coating area;

[0017] The louver includes a window frame and window slats that are spaced and obliquely inserted into the window frame. The uniformity of vacuuming is adjusted by the spaced and obliquely inserted window slats.

[0018] Preferably, the air supply assembly includes a cooling plate and an air supply plate stacked in sequence, with one side of the air supply plate facing the rotating cathode and the other side in contact with the cooling plate.

[0019] Preferably, the gas supply plate is provided with a plurality of gas supply channels, the gas supply channels are graded gas supply channels, and a plurality of first gas supply ports are formed at the end of the gas supply channels along the length direction of the gas supply plate to continuously supply process gas toward the rotating cathode.

[0020] Preferably, the gas supply plate is provided with at least one gas supply mixing chamber, and the gas supply mixing chamber is also provided with a plurality of second gas supply ports arranged along the length direction of the gas supply plate to continuously supply process gas toward the rotating cathode.

[0021] Preferably, an air supply flange is provided above the air supply plate, one end of which is connected to the air supply pipeline of the air supply valve island, and the other end is connected to the air supply channel.

[0022] Preferably, the cooling plate has a circulating cooling channel on the side away from the air supply plate, and the circulating cooling channel is connected to the water supply pipeline of the cooling water assembly.

[0023] Compared with the prior art, the beneficial effects of this utility model are:

[0024] 1. This integrated magnetron sputtering equipment integrates the molecular pump within the control area, making the molecular pump and the magnetron sputtering equipment a single unit. Compared with traditional external molecular pumps, it does not occupy the coating space of the magnetron sputtering equipment, allowing it to have more space to sputter more or larger substrates.

[0025] 2. The gas supply plate in this integrated magnetron sputtering equipment is equipped with a cooling plate. The cooling medium circulating in the circulating cooling channel cools the gas supply plate, thereby preventing the gas supply plate from deforming due to heat, ensuring the accuracy of the position of each gas supply port, and thus ensuring the uniformity of gas supply to all parts of the workpiece, further improving the quality of sputtering coating. Attached Figure Description

[0026] Figure 1 This is a first-person view structural diagram of an integrated magnetron sputtering device that combines a molecular pump;

[0027] Figure 2 This is a second-view structural schematic diagram of a magnetron sputtering integrated device combining a molecular pump;

[0028] Figure 3 This is a schematic diagram of the internal structure of a magnetron sputtering integrated device that combines a molecular pump;

[0029] Figure 4 This is a front view of the interior of an integrated magnetron sputtering device that combines a molecular pump;

[0030] Figure 5 This is a top view of the interior of a magnetron sputtering integrated device that combines a molecular pump;

[0031] Figure 6 This is an installation diagram of the molecular pump provided by this utility model;

[0032] Figure 7 This is a schematic diagram showing the position of the molecular pump louvers provided by this utility model;

[0033] Figure 8 This is a schematic diagram of the structure of the molecular pump louver provided by this utility model;

[0034] Figure 9 This is a schematic diagram of the gas supply component provided by this utility model;

[0035] Figure 10 This is a front view of the gas supply component provided by this utility model;

[0036] Figure 11 This is a schematic diagram of the structure of the gas supply plate provided by this utility model.

[0037] In the diagram: 1. Frame; 2. Coating area; 3. Control area; 4. Rotating cathode; 5. Gas supply assembly; 501. Cooling plate; 5011. Circulating cooling channel; 502. Gas supply plate; 5021. Gas supply channel; 5022. First gas supply port; 5023. Gas supply mixing chamber; 5024. Second gas supply port; 5025. Gas supply flange; 6. Molecular pump; 601. Vacuum tube; 602. Louver; 6021. Window frame; 6022. Window slat; 7. Drive assembly; 8. Gas supply valve island; 9. Cooling water assembly. Detailed Implementation

[0038] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0039] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0040] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. Example

[0041] This invention provides an integrated magnetron sputtering device combining a molecular pump. Please refer to [link / reference]. Figure 1-5The device includes a frame 1, with a coating area 2 at the bottom and a control area 3 at the top. The magnetron sputtering integrated equipment is placed from top to bottom into a vacuum coating chamber, wherein the coating area 2 is located inside the vacuum coating chamber, and the control area 3 is located above the vacuum coating chamber. At least one set of rotating cathodes 4 are provided in the coating area 2, and a gas supply component 5 is provided on the side of the rotating cathodes 4.

[0042] The control area 3 is equipped with a molecular pump 6, the suction port of which passes through the frame 1 and communicates with the coating area 2. The coating area 2 is also equipped with a drive assembly 7, a gas supply valve island 8, and a cooling water assembly 9. The drive assembly 7 drives the target cylinder inside the rotating cathode 4 to rotate. The gas supply valve island 8 is connected to the gas supply assembly 5 through a gas supply pipeline to continuously supply process gas to the coating area 2. The cooling water assembly 9 is connected to both the rotating cathode 4 and the gas supply assembly 5 through a water supply pipeline to provide cooling water to both.

[0043] This integrated magnetron sputtering equipment incorporates the molecular pump within the control zone, making the molecular pump and magnetron sputtering equipment a single unit. Compared to traditional external molecular pumps, it does not occupy the coating space of the magnetron sputtering equipment, allowing it to have more space to sputter more or larger substrates.

[0044] Specifically, two sets of rotating cathodes 4 are arranged in parallel within the coating area 2, and each set of rotating cathodes 4 is equipped with an independent drive component 7, which drives the target cylinder inside the rotating cathode 4 to rotate.

[0045] In this embodiment, the gas supply components 5 are arranged in two groups, symmetrically on both sides of the rotating cathode 4.

[0046] Specifically, the outlet of the molecular pump 6 is connected in sequence to an external Roots pump and a rotary vane pump via a vacuum tube 601; the molecular pump 6 is equipped with a louver 602 at the inlet of the coating area 2. The coating area is evacuated under the sequential action of the rotary vane pump, the Roots pump, and the molecular pump.

[0047] Furthermore, such as Figure 8 As shown, the louver 602 is located between the two sets of rotating cathodes 4 and is used to extract air and excess process gas in the coating area 2. The louver 602 includes a window frame 6021 and window slats 6022 that are spaced and obliquely inserted in the window frame 6021. The uniformity of vacuuming is adjusted by the spaced and obliquely inserted window slats 6022.

[0048] Specifically, such as Figure 9-10The air supply assembly 5 includes a cooling plate 501 and an air supply plate 502 stacked in sequence. One side of the air supply plate 502 faces the rotating cathode 4, and the other side is in contact with the cooling plate 501.

[0049] For further details, please refer to Figure 11 The gas supply plate 502 is provided with a plurality of gas supply channels 5021. The gas supply channels 5021 are graded gas supply channels, and a plurality of first gas supply ports 5022 are formed at the end of the gas supply channels 5021 along the length direction of the gas supply plate 502, which continuously supply process gas toward the rotating cathode 4.

[0050] In this embodiment, the gas supply plate 502 is provided with at least one gas supply mixing chamber 5023, and the gas supply mixing chamber 5023 is also provided with a plurality of second gas supply ports 5024 arranged along the length direction of the gas supply plate 502, which continuously supply process gas toward the rotating cathode 4.

[0051] Furthermore, an air supply flange 5025 is provided above the air supply plate 502. One end of the air supply flange 5025 is connected to the air supply pipeline of the air supply valve island 8, and the other end is connected to the air supply channel 5021.

[0052] For further information, please refer to [link / reference]. Figure 9 The cooling plate 501 is provided with a circulating cooling channel 5011 on the side away from the air supply plate 502, and the circulating cooling channel 5011 is connected to the water supply pipeline of the cooling water assembly 9.

[0053] The gas supply plate in this integrated magnetron sputtering equipment is equipped with a cooling plate. The cooling medium circulating in the circulating cooling channel cools the gas supply plate, thereby preventing it from deforming due to heat and ensuring the accuracy of the position of each gas supply port. This ensures the uniformity of gas supply to all parts of the workpiece and further improves the quality of sputtering coating.

[0054] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. An integrated magnetron sputtering device combining a molecular pump, characterized in that, Includes a frame (1), the lower part of which is a coating area (2) and the upper part is a control area (3); the magnetron sputtering integrated equipment is placed from top to bottom into a vacuum coating chamber, wherein the coating area (2) is located inside the vacuum coating chamber and the control area (3) is located above the vacuum coating chamber; At least one set of rotating cathodes (4) are provided in the coating area (2), and a gas supply assembly (5) is provided on the side of the rotating cathodes (4). The control area (3) is equipped with a molecular pump (6), and the suction port of the molecular pump (6) passes through the frame (1) and communicates with the coating area (2); The coating area (2) is also equipped with a drive assembly (7), an air supply valve island (8), and a cooling water assembly (9). The drive assembly (7) drives the target cylinder inside the rotating cathode (4) to rotate; The gas supply valve island (8) is connected to the gas supply assembly (5) through a gas supply pipeline to continuously supply process gas to the coating area (2); The cooling water assembly (9) is connected to the rotating cathode (4) and the air supply assembly (5) respectively through water supply pipelines to provide cooling water to both.

2. The integrated magnetron sputtering device combining a molecular pump as described in claim 1, characterized in that, Two sets of rotating cathodes (4) are arranged in parallel within the coating area (2), and each set of rotating cathodes (4) is equipped with an independent drive assembly (7), which drives the target cylinder inside the rotating cathode (4) to rotate.

3. The magnetron sputtering integrated device combining a molecular pump as described in claim 2, characterized in that, The gas supply components (5) are arranged in two groups, symmetrically on both sides of the rotating cathode (4).

4. The magnetron sputtering integrated device combining a molecular pump as described in claim 2, characterized in that, The outlet of the molecular pump (6) is connected in sequence to an external Roots pump and a rotary vane pump through a vacuum tube (601); the molecular pump (6) is provided with a louver (602) at the air inlet of the coating area (2).

5. The magnetron sputtering integrated device combining a molecular pump as described in claim 4, characterized in that, The louvers (602) are located between the two sets of rotating cathodes (4) to extract air and excess process gas from the coating area (2); The louver (602) includes a window frame (6021) and window slats (6022) that are spaced and obliquely inserted in the window frame (6021). The uniformity of vacuuming is adjusted by the spaced and obliquely inserted window slats (6022).

6. The magnetron sputtering integrated device combining a molecular pump as described in claim 1, characterized in that, The gas supply assembly (5) includes a cooling plate (501) and a gas supply plate (502) stacked in sequence. One side of the gas supply plate (502) faces the rotating cathode (4), and the other side is in contact with the cooling plate (501).

7. The magnetron sputtering integrated device combining a molecular pump as described in claim 6, characterized in that, The gas supply plate (502) is provided with a plurality of gas supply channels (5021). The gas supply channels (5021) are graded gas supply channels, and a plurality of first gas supply ports (5022) are formed at the end of the gas supply channels (5021) along the length direction of the gas supply plate (502) to continuously supply process gas toward the rotating cathode (4).

8. The magnetron sputtering integrated device combining a molecular pump as described in claim 6, characterized in that, The gas supply plate (502) is provided with at least one gas supply mixing chamber (5023), and the gas supply mixing chamber (5023) is also provided with a plurality of second gas supply ports (5024) arranged along the length direction of the gas supply plate (502) to continuously supply process gas toward the rotating cathode (4).

9. The magnetron sputtering integrated device combining a molecular pump as described in claim 7, characterized in that, An air supply flange (5025) is provided above the air supply plate (502). One end of the air supply flange (5025) is connected to the air supply pipeline of the air supply valve island (8), and the other end is connected to the air supply channel (5021).

10. The magnetron sputtering integrated device combining a molecular pump as described in claim 6, characterized in that, The cooling plate (501) is provided with a circulating cooling channel (5011) on the side away from the air supply plate (502), and the circulating cooling channel (5011) is connected to the water supply pipeline of the cooling water assembly (9).

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