Cathode tool clamp for horizontal electroplating of single wafer

Abstract

The utility model discloses a cathode tool clamp for horizontal electroplating of a single wafer, which comprises a base plate, a clamping part, a clamping part, a clamping part and a clamping part, and is characterized in that the base plate comprises a main body part and a mounting part connected with the main body part; the pressing ring comprises a pressing part and an assembling part connected with the pressing part, the pressing part is used for pressing the main body part, and the assembling part is used for being connected with the mounting part; and the conducting ring comprises a ring body part and conducting teeth arranged on the inner circumferential side wall of the ring body part, the ring body part is located between the main body part and the pressing part, and the conducting teeth are located on the main body part and used for supporting the wafer. The clamp provided by the utility model solves the problems of low operation efficiency, poor wafer positioning precision, edge over-plating and the like of the existing cathode tool clamp of the single-chip horizontal electroplating equipment, and improves the production efficiency and yield of wafer electroplating.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a fixture for horizontal electroplating of cathodes on a single wafer. Background Technology

[0002] A single-wafer horizontal electroplating cathode fixture is used to load wafers and immerse them in the electroplating solution. It is driven by a rotary drive mechanism above the electroplating chamber to eliminate the influence of uneven electric field distribution within the chamber on the uniformity of the plating thickness. However, traditional fixtures require circumferentially distributed screws to fix the locking disc to the fixture body after loading the wafer. This fixing method has significant problems: low wafer positioning accuracy, poor component changeover efficiency, and a tendency for over-plating at wafer edges due to abnormal current distribution. These problems severely restrict the overall production efficiency and yield of wafer electroplating.

[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content

[0004] The purpose of this invention is to provide a fixture for horizontal electroplating of cathodes on single wafers, which can overcome the problems of low operating efficiency, poor wafer positioning accuracy, and overplating at the edges of existing fixtures, thereby improving the production efficiency and yield of wafer electroplating.

[0005] To achieve the above objectives, the technical solution provided by a specific embodiment of this utility model is as follows:

[0006] A fixture for horizontal electroplating of cathodes on a single wafer, comprising:

[0007] The chassis includes a main body and a mounting section connected to the main body;

[0008] A pressing ring includes a pressing part and an assembly part connected to the pressing part. The pressing part is used to press the main body part, and the assembly part is used to connect to the mounting part.

[0009] A conductive ring includes a ring body and conductive teeth disposed on the inner peripheral sidewall of the ring body. The ring body is located between a main body and a pressing part, and the conductive teeth are located on the main body for supporting a wafer.

[0010] In one or more embodiments of this utility model, the conductive tooth is inclined at a certain angle between its center line and its normal line on the inner circumference of the conductive ring.

[0011] In one or more embodiments of this utility model, the angle between the center line of the conductive tooth and its normal line on the inner circumference of the conductive ring is 15°-16°.

[0012] In one or more embodiments of the present invention, the main body portion includes a base portion, an inclined portion and a horizontal portion in sequence along the direction away from the mounting portion, the ring portion is located on the base portion, and the conductive teeth include inclined teeth adapted to the inclined portion and horizontal teeth adapted to the horizontal portion.

[0013] In one or more embodiments of this utility model, the end of the horizontal portion is provided with a protrusion, and the top of the protrusion is rounded.

[0014] In one or more embodiments of this utility model, the periphery of the bottom surface of the end of the horizontal portion is inclined.

[0015] In one or more embodiments of this utility model, a sealing ring is provided between the main body and the conductive ring, and a protruding sealing portion is provided on the periphery of the sealing ring near the center, and the top end of the sealing portion is used to fit against the wafer.

[0016] In one or more embodiments of this utility model, a positioning ring is provided between the sealing ring and the conductive ring, the positioning ring is provided with a positioning post, and the ring body of the conductive ring is provided with a positioning hole adapted to the positioning post.

[0017] In one or more embodiments of this utility model, the sealing ring is provided with a receiving groove, and the positioning ring is located in the receiving groove.

[0018] In one or more embodiments of this utility model, the mounting part and the assembly part are connected by screws, and a sealing groove is provided on the top surface of the assembly part, and a sealing ring is provided in the sealing groove.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] 1. The sealing ring end adopts a double-peaked raised sealing structure, which forms a double sealing barrier in contact with the wafer, effectively preventing the electroplating solution from seeping in.

[0021] 2. The conductive ring is installed between the pressing ring and the positioning ring and is positioned by the positioning post on the positioning ring. Its tooth shape is a parallelogram-like structure, which is arranged at a fixed angle on the circumference and has rounded corners at the end. It can be used for conductive wiring inside various types of wafers, guides electric field lines to enter the wafer surface at a gentler angle, optimizes current distribution, and suppresses edge effects.

[0022] 3. The chassis serves to shape and support the sealing ring. Its bottom surface near the inner diameter adopts an inclined guide surface and rounded corner transition design to reduce the impact force of liquid flow and guide the flow direction, ensuring that the electroplated layer on the wafer surface is uniform and stable. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of a single-wafer horizontal electroplating cathode tooling fixture in one embodiment of the present invention;

[0025] Figure 2 This is an exploded view of a single-wafer horizontal electroplating cathode tooling fixture according to one embodiment of the present invention;

[0026] Figure 3 This is a cross-sectional view of a single-wafer horizontal electroplating cathode fixture according to an embodiment of the present invention. Figure 1 ;

[0027] Figure 4 This is a cross-sectional view of a single-wafer horizontal electroplating cathode fixture according to an embodiment of the present invention. Figure 2 ;

[0028] Figure 5 for Figure 4 Enlarged view of section A;

[0029] Figure 6 This is a partial schematic diagram of the conductive ring;

[0030] Figure 7 This is a top view of the conductive ring;

[0031] Figure 8 for Figure 7 Enlarged view of section B;

[0032] Explanation of key figure labels:

[0033] 1. Chassis; 11. Main body; 111. Base body; 112. Inclined part; 113. Horizontal part; 114. Protrusion; 12. Mounting part; 121. Sealing groove; 122. Sealing ring; 2. Sealing ring; 21. Sealing part; 22. Protruding ring; 221. Receiving groove; 3. Positioning ring; 31. Positioning post; 4. Conductive ring; 41. Ring body; 410. Positioning hole; 42. Conductive teeth; 421. Inclined teeth; 422. Horizontal teeth; 5. Pressing ring; 51. Pressing part; 511. Pressing part; 52. Assembly part; 521. Hexagonal countersunk screw; 6. Wafer. Detailed Implementation

[0034] To enable those skilled in the art to better understand the technical solutions of this utility model, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of this utility model.

[0035] like Figure 1 and Figure 2 As shown, in one embodiment of the present invention, a fixture for horizontal electroplating cathode of a single wafer includes an annular base 1, a sealing ring 2, a positioning ring 3, a conductive ring 4, and a pressing ring 5. The conductive ring 4 is located between the base 1 and the pressing ring 5, and is fixed by clamping the base 1 and the pressing ring 5.

[0036] Reference Figure 3 The chassis 1 includes a main body 11 and a mounting part 12 provided on the main body 11. The pressing ring 5 includes a pressing part 51 and an assembly part 52 connected to the pressing part 51. The mounting part 12 and the assembly part 52 are connected by a hexagonal countersunk screw 521. Meanwhile, the top surface of the mounting part 12 is provided with a sealing groove 121, and a sealing ring 122 is provided in the sealing groove 121. The sealing ring 122 seals the gap between the chassis 1 and the pressing ring 5.

[0037] The main body 11 of the chassis 1 includes a base 111, an inclined portion 112, and a horizontal portion 113 in sequence along the direction away from the mounting portion 12. The bottom periphery of the end of the horizontal portion 113 is inclined, which can guide the liquid flow and reduce the impact force of the liquid on the surface of the wafer 6, ensuring the stability of the electroplating process. The end of the horizontal portion 113 is provided with a protrusion 114, the top of which is rounded. The rounded corner can work together with the inclined surface of the bottom of the horizontal portion 113 to reduce the impact force of the liquid flow and guide the flow direction, ensuring that the electroplated layer on the surface of the wafer 6 is uniform and stable.

[0038] Reference Figure 4 and Figure 5 The main body 11 has a sealing ring 2 located below the conductive ring 4. The sealing ring 2 has a shape including horizontal portions on both sides and an inclined portion in the middle of the two horizontal portions, so as to adapt to the shape of the main body 11 and fit better on the main body 11, so that the base 1 can play a role in shaping and supporting the sealing ring 2. The sealing ring 2 has a sealing portion 21 near the inner circumference of the sealing ring 2. The sealing portion 21 has a double-peaked convex structure, and its top surface is used to contact the wafer 6, which can form a double sealing barrier and effectively prevent the electroplating solution from penetrating.

[0039] The sealing ring 2 has two protruding rings 22 on its outer horizontal portion, forming a receiving groove 221 between them. A positioning ring 3 is provided between the sealing ring 2 and the conductive ring 4, and the positioning ring 3 is located in the receiving groove 221. The conductive ring 4 includes a ring body 41 and conductive teeth 42 provided on the ring body 41, with the conductive teeth 42 evenly distributed on the inner peripheral sidewall of the ring body 41. Figure 6 The ring body 41 has a positioning hole 410, and the positioning ring 3 is provided with a positioning post 31 for inserting into the positioning hole 410. The conductive ring 4 is positioned by the cooperation of the positioning post 31 and the positioning hole 410.

[0040] The pressing part 51 has a pressing part 511 on its side, which is used to press the ring body 41 onto the positioning ring 3, thereby fixing the conductive ring 4. The pressing part 51 of the pressing ring 5 is inclined towards the center of the pressing ring 5. The top surface contour of the conductive tooth 42 fits with the bottom contour of the pressing part 51, and the bottom surface of the conductive tooth 42 fits onto the sealing ring 2. The conductive tooth 42 includes an inclined tooth 421 and a horizontal tooth 422. The horizontal tooth 422 fits onto the horizontal portion of the inner circumference of the sealing ring 2 for direct contact with the wafer 6.

[0041] Reference Figures 6-8 The conductive teeth 42 have a parallelogram-like design and are arranged at a certain angle on the circumference, with rounded corners at their ends. Specifically, taking the normal line where the center line of the conductive teeth 42 intersects the inner circumference of the conductive ring 4 as a reference, the angle α between the center line of the conductive teeth 42 and the normal line ranges from 15° to 16°. In this embodiment, the angle α is specifically 15.30°. The inclined arrangement of the conductive teeth 42 can be applied to conductive wiring inside various types of wafers 6, guiding electric field lines to enter the surface of wafer 6 at a gentler angle, thereby achieving a more uniform current distribution and significantly suppressing edge effects.

[0042] In summary, the fixture of this invention allows the wafer to be placed directly on the conductive teeth during use, achieving precise positioning of the wafer. At the same time, the evenly distributed conductive teeth on the circumference improve current distribution, reduce the possibility of over-plating at the wafer edges, and the inclined design of the conductive teeth further optimizes current distribution and suppresses power supply effects. Combined with the sealing effect of the sealing ring and the guiding effect of the chassis on the liquid flow direction, the electroplated layer on the wafer surface is uniform and stable, greatly improving the overall production efficiency and yield of wafer electroplating.

[0043] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A fixture for horizontal electroplating cathodes on a single wafer, characterized in that, include: The chassis includes a main body and a mounting section connected to the main body; A pressing ring includes a pressing part and an assembly part connected to the pressing part. The pressing part is used to press the main body part, and the assembly part is used to connect to the mounting part. A conductive ring includes a ring body and conductive teeth disposed on the inner peripheral sidewall of the ring body. The ring body is located between a main body and a pressing part, and the conductive teeth are located on the main body for supporting a wafer.

2. The single wafer horizontal electroplating cathode tooling fixture of claim 1, wherein, The conductive teeth are inclined at a certain angle between their center line and the normal line on the inner circumference of the conductive ring.

3. The single wafer horizontal electroplating cathode tooling fixture of claim 2, wherein, The angle between the centerline of the conductive tooth and its normal on the inner circumference of the conductive ring is 15°-16°.

4. The single wafer horizontal electroplating cathode tooling fixture of claim 1, wherein, The main body includes a base, an inclined portion and a horizontal portion in sequence along the direction away from the mounting portion. The ring portion is located on the base portion. The conductive teeth include inclined teeth adapted to the inclined portion and horizontal teeth adapted to the horizontal portion.

5. The single wafer horizontal electroplating cathode tooling fixture of claim 4, wherein, The horizontal part has a protrusion at its end, and the top of the protrusion is rounded.

6. The single wafer horizontal electroplating cathode tooling fixture of claim 4, wherein, The bottom edge of the end of the horizontal section is inclined.

7. The single wafer horizontal electroplating cathode tooling fixture of claim 1, wherein, A sealing ring is provided between the main body and the conductive ring. The sealing ring has a protruding sealing part on its periphery near the center. The top of the sealing part is used to fit the wafer.

8. The single wafer horizontal electroplating cathode tooling fixture of claim 7, wherein, A positioning ring is provided between the sealing ring and the conductive ring, and a positioning post is provided on the positioning ring. The ring body of the conductive ring is provided with a positioning hole that matches the positioning post.

9. The single wafer horizontal electroplating cathode tooling fixture of claim 8, wherein, The sealing ring is provided with a receiving groove, and the positioning ring is located in the receiving groove.

10. The single wafer horizontal electroplating cathodework fixture clamp of claim 1, wherein, The mounting part and the assembly part are connected by screws. The top surface of the assembly part is provided with a sealing groove, and a sealing ring is provided in the sealing groove.

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