Flat pipe heat tracing device capable of increasing heat transfer area

Abstract

The utility model discloses a flat pipe heat tracing device for increasing heat transfer area, which relates to the technical field of pipeline heat tracing and comprises a heat-traced pipeline, a flat heat tracing pipe and a high-heat-conductivity alloy component, the flat heat tracing pipe is circumferentially wrapped along the outer wall of the heat-traced pipeline, a heat transfer fitting cambered surface is arranged on the inner side of the flat heat tracing pipe, and the high-heat-conductivity alloy component is arranged on the heat transfer fitting cambered surface. The high-thermal-conductivity alloy assemblies are symmetrically distributed on the two sides of the flat heat tracing pipe, each high-thermal-conductivity alloy assembly comprises a heat transfer base plate, a heat expansion wing plate and a transition arc angle, the heat transfer base plates are attached to the outer wall of the flat heat tracing pipe, and the heat expansion wing plates extend outwards from the bottoms of the heat transfer base plates and are tightly attached to the heat-traced pipeline. Under the condition that the original size of the flat heat tracing pipe is not changed, the heat transfer contact area can be expanded without changing the width of the flat heat tracing pipe by introducing the high heat conduction alloy assembly between the flat heat tracing pipe and the heat-traced pipeline, and the problem that the pressure bearing capacity is reduced due to the fact that the size of the flat heat tracing pipe is too large is avoided.

Description

Technical Field

[0001] This utility model relates to the field of pipeline heat tracing technology, specifically a flat pipe heat tracing device that increases the heat transfer area. Background Technology

[0002] In the field of pipeline heat tracing, as industrial production demands increasingly higher requirements for medium temperature stability and energy utilization efficiency, traditional round or strip heat tracing structures are gradually becoming insufficient to meet the needs due to their limited heat transfer area. The flat structure of flat tubes allows them to form a larger contact area with the outer wall of the pipe being heat-traced, increasing the heat transfer per unit length and making the temperature distribution on the pipe surface more uniform. At the same time, the compact shape of flat tubes makes it easier to fit complex pipeline routes, reducing the layout difficulty of the heat tracing system.

[0003] However, existing flat tube heat tracing technology cannot increase the contact area with the pipeline by increasing the width of the flat tube when further increasing the heat transfer area. This will lead to a significant decrease in the pressure-bearing capacity of the flat tube. In the heat tracing system, the flat tube needs to be fixed to the pipeline surface by a clamping structure. When the width is too large, stress concentration is easily generated on both sides of the edge under the action of clamping force, which will cause the pipe wall to deform and crack. Especially in high pressure and high temperature environments, it may cause safety accidents such as media leakage. In order to address the above problems, a flat tube heat tracing device that increases the heat transfer area is proposed. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a flat tube heat tracing device that increases the heat transfer area, thus solving the problems in the prior art where the increased width of the flat tube heat tracing device leads to a decrease in pressure bearing capacity and stress concentration causing deformation or rupture of the pipe wall.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a flat tube heat tracing device for increasing heat transfer area, comprising a heat-traced pipe, a flat heat tracing pipe, and a high thermal conductivity alloy assembly, characterized in that:

[0006] The flat heat tracing tube is arranged to cover the outer wall of the pipe to be heated in a circumferential manner. The inner side of the flat heat tracing tube is provided with a heat transfer and bonding arc surface, which makes the flat heat tracing tube fit tightly against the pipe to be heated.

[0007] The high thermal conductivity alloy components are symmetrically distributed on both sides of the flat heat tracing pipe, including a heat transfer substrate and a heat expansion wing. The heat transfer substrate is attached to the outer wall of the flat heat tracing pipe, and the heat expansion wing extends outward from the bottom of the heat transfer substrate. The bottom arc surface of the heat expansion wing is connected with the bottom arc surface of the heat transfer attachment arc surface with the same curvature, so that the heat expansion wing is tightly attached to the heat-traced pipe.

[0008] A transition arc angle is also provided between the heat transfer substrate and the heat expansion wing plate. The transition arc angle is located on the inner side of the heat expansion wing plate and between the heat expansion wing plate and the flat heat tracing pipe. The transition arc angle includes an outer arc surface and a bottom arc surface. The outer arc surface of the transition arc angle is closely fitted with the arc surface of the bottom corner of the flat heat tracing pipe, so that the transition arc angle can be embedded in the lower side of the bottom corner of the flat heat tracing pipe. The bottom arc surface of the transition arc angle is continuously connected with the heat transfer fitting arc surface. The bottom arc structure of the heat expansion wing plate and the bottom arc surface of the transition arc angle are together fitted to the outer wall of the heat-traced pipe.

[0009] A thermally conductive adhesive layer is also provided between two adjacent high thermal conductivity alloy components. The thermally conductive adhesive layer attaches the high thermal conductivity alloy components to the outer wall of the heat-traced pipe. At the same time, the thermally conductive adhesive layer is used to absorb the differential expansion of the flat heat-tracing pipe and the high thermal conductivity alloy components at high temperatures.

[0010] The curvature of the heat transfer bonding arc surface is consistent with the curvature of the outer wall of the heat-traced pipe.

[0011] The heat transfer substrate, heat expansion fins, and transition arc angle of the high thermal conductivity alloy component are integrally formed.

[0012] The heat transfer substrate and the flat heat tracing pipe are fixedly connected by a heat-conducting medium layer.

[0013] The heat-expanding wing plate has a triangular cross-section, with its top edge connected to the heat transfer substrate and its bottom edge being an arc-shaped edge that matches the arc surface of the flat heat tracing pipe.

[0014] All connections and edges of the high thermal conductivity alloy component are transitioned by arc-shaped surfaces.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] I. This utility model expands the contact area on both sides of the flat heat tracing pipe by using a high thermal conductivity alloy component. Without changing the original size of the flat heat tracing pipe, by introducing a high thermal conductivity alloy component between the flat heat tracing pipe and the pipe being traced, the heat transfer contact area can be expanded without changing the width of the flat heat tracing pipe itself, thus avoiding the problem of reduced pressure bearing capacity of the flat heat tracing pipe due to excessive size.

[0017] Second, the integrated molding process of the high thermal conductivity alloy component of this utility model improves the overall compressive strength, and all the connections and edges of the high thermal conductivity alloy component are transitioned by arc surfaces, which eliminates stress concentration and extends the service life of the heat tracing device.

[0018] Third, the triangular heat-expanding wing plate of the high thermal conductivity alloy component of this utility model increases the heat transfer area. At the same time, the bottom arc surface of the heat-expanding wing plate is connected with the heat transfer bonding arc surface with the same curvature, so that the heat tracing device forms a wrap-around bonding structure.

[0019] Other advantages, objectives and features of this invention will be set forth in part in the description which follows, and in part will be apparent to those skilled in the art from the following examination or study, or may be taught from the practice of this invention. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the installation structure of the high thermal conductivity alloy component of this utility model;

[0021] Figure 2 This is a schematic diagram of the thermally conductive adhesive layer structure of this utility model;

[0022] Figure 3 This is a three-dimensional structural diagram of the present invention;

[0023] Figure 4 This is a front view structural diagram of the present utility model;

[0024] Figure 5 This is a schematic diagram of the high thermal conductivity alloy component structure of this utility model;

[0025] Figure 6 This is a schematic diagram of the high thermal conductivity alloy component structure of this utility model.

[0026] The main reference numerals are explained below:

[0027] 1. The pipe to be heated; 2. The flat heating pipe; 201. The heat transfer mating arc surface;

[0028] 202. Thermally conductive adhesive layer; 3. High thermal conductivity alloy component; 301. Heat transfer substrate;

[0029] 302. Heat-expanding wing plate; 303. Transition arc angle. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0031] like Figure 1-6As shown, this utility model provides a technical solution: a flat tube heat tracing device for increasing heat transfer area, comprising a heat-traced pipe 1, a flat heat tracing pipe 2, and a high thermal conductivity alloy component 3, characterized in that:

[0032] The flat heat tracing pipe 2 is arranged to cover the outer wall of the heat-traced pipe 1 in a circumferential manner. The inner side of the flat heat tracing pipe 2 is provided with a heat transfer and bonding arc surface 201, which makes the flat heat tracing pipe 2 fit tightly against the heat-traced pipe 1.

[0033] The high thermal conductivity alloy components 3 are symmetrically distributed on both sides of the flat heat tracing pipe 2, including a heat transfer substrate 301 and a heat expansion wing 302. The heat transfer substrate 301 is attached to the outer wall of the flat heat tracing pipe 2, and the heat expansion wing 302 extends outward from the bottom of the heat transfer substrate 301. The bottom arc surface of the heat expansion wing 302 is connected with the bottom arc surface of the heat transfer bonding arc surface 201 with the same curvature, so that the heat expansion wing 302 is tightly attached to the heat-traced pipe 1.

[0034] A transition arc angle 303 is also provided between the heat transfer substrate 301 and the heat expansion wing plate 302. The transition arc angle 303 is located on the inner side of the heat expansion wing plate 302 and between the heat expansion wing plate 302 and the flat heat tracing pipe 2. The transition arc angle 303 includes an outer arc surface and a bottom arc surface. The outer arc surface of the transition arc angle 303 is closely fitted with the arc surface of the bottom corner of the flat heat tracing pipe 2, so that the transition arc angle 303 can be embedded in the lower side of the bottom corner of the flat heat tracing pipe 2. The bottom arc surface of the transition arc angle 303 is continuously connected with the heat transfer fitting arc surface 201. The bottom arc structure of the heat expansion wing plate 302 and the bottom arc surface of the transition arc angle 303 are together fitted to the outer wall of the heat-traced pipe 1.

[0035] Between two adjacent high thermal conductivity alloy components 3, a thermally conductive adhesive layer 202 is also provided. The thermally conductive adhesive layer 202 attaches the high thermal conductivity alloy component 3 to the outer wall of the heat-traced pipe 1. At the same time, the thermally conductive adhesive layer 202 is used to absorb the differential expansion of the flat heat-tracing pipe 2 and the high thermal conductivity alloy component 3 at high temperatures.

[0036] The curvature of the heat transfer bonding arc surface 201 is consistent with the curvature of the outer wall of the heat-traced pipe 1.

[0037] The heat transfer substrate 301, heat expansion wing plate 302, and transition arc angle 303 of the high thermal conductivity alloy component 3 are integrally formed structures.

[0038] The heat transfer substrate 301 and the flat heat tracing pipe 2 are fixedly connected by a heat-conducting medium layer.

[0039] The heat-expanding wing plate 302 has a triangular cross-section, with its top edge connected to the heat transfer substrate 301 and its bottom edge being an arc-shaped edge that matches the arc surface of the flat heat tracing pipe 2.

[0040] All connections and edges of the high thermal conductivity alloy component 3 are transitioned by arc-shaped surfaces.

[0041] Working principle:

[0042] Based on the overall structure of the device, the flat heat tracing pipe 2 is wrapped circumferentially around the outer wall of the heat-traced pipe 1, ensuring that the curvature of its inner heat transfer bonding arc surface 201 is in contact with the outer wall of the heat-traced pipe 1. Then, the high thermal conductivity alloy assembly 3 is symmetrically placed on both sides of the flat heat tracing pipe 2. The high thermal conductivity alloy assembly 3 is attached to the outer wall of the heat-traced pipe 1 with thermally conductive putty. The heat-expanding wing plate 302 extends outward from the bottom of the heat transfer substrate 301. At the same time, the bottom arc curvature of the heat-expanding wing plate 302 is connected with the bottom arc surface of the heat transfer bonding arc surface 201 with the same curvature. The bottom arc surface of the transition arc angle 303 is continuously connected with the heat transfer bonding arc surface 201. A wrap-around, fitted structure is formed, and heat is transferred to the high thermal conductivity alloy component 3 through the flat heat tracing pipe 2. The heat transfer substrate 301 and the heat expansion wing plate 302 serve as the main heat conduction channels, rapidly diffusing heat to the entire alloy component. During processing, the heat transfer substrate 301, the heat expansion wing plate 302, and the transition arc angle 303 are manufactured through an integral molding process, which improves the overall compressive strength. All connections and edges of the high thermal conductivity alloy component 3 are transitioned through arc surfaces to eliminate stress concentration. The coating of thermally conductive putty allows the flat heat tracing pipe 2 and the high thermal conductivity alloy component 3 to undergo differential expansion at high temperatures, preventing structural deformation or detachment.

[0043] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, the curvature of the heat transfer bonding arc surface 201 is consistent with the curvature of the outer wall of the heat-traced pipe 1.

[0044] like Figure 1 , Figure 5 and Figure 6 As shown, the heat transfer substrate 301, heat expansion wing plate 302 and transition arc angle 303 of the high thermal conductivity alloy component 3 are integrally formed structures. The heat transfer substrate 301 and the flat heat tracing pipe 2 are fixedly connected through a heat-conducting medium layer. The heat expansion wing plate 302 has a triangular cross-section, with its top edge connected to the heat transfer substrate 301 and its bottom edge being an arc-shaped edge that matches the arc surface of the heat-traced pipe 1.

[0045] The triangular cross-section design of the heat-expanding wing plate 302 increases the contact area with the heat-traced pipe 1, and the transition arc angle 303 is located on the side near the bottom of the flat heat-traced pipe 2.

[0046] When the device is in use, by introducing a high thermal conductivity alloy component 3 between the flat heat tracing pipe 2 and the heat-traced pipe 1, the heat transfer contact area can be expanded without changing the width of the flat heat tracing pipe 2 itself.

[0047] This invention is applicable to different heat tracing applications, including different types of heat-traced pipes such as straight pipes and bent pipes, and is also applicable to tank heat tracing.

[0048] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flat tube heat tracing device for increasing heat transfer area, comprising a heat-traced pipe (1), a flat heat tracing pipe (2), and a high thermal conductivity alloy assembly (3), characterized in that: The flat heat tracing pipe (2) is circumferentially wrapped around the outer wall of the heat-traced pipe (1). The inner side of the flat heat tracing pipe (2) is provided with a heat transfer and bonding arc surface (201). The heat transfer and bonding arc surface (201) makes the flat heat tracing pipe (2) tightly bonded to the heat-traced pipe (1). The high thermal conductivity alloy component (3) is symmetrically distributed on both sides of the flat heat tracing pipe (2), including a heat transfer substrate (301) and a heat expansion wing plate (302). The heat transfer substrate (301) is attached to the outer wall of the flat heat tracing pipe (2). The heat expansion wing plate (302) extends outward from the bottom of the heat transfer substrate (301). The bottom arc surface of the heat expansion wing plate (302) is connected with the bottom arc surface of the heat transfer bonding arc surface (201) with the same curvature, so that the heat wing plate (302) is tightly attached to the heat-traced pipe (1). A transition arc angle (303) is also provided between the heat transfer substrate (301) and the heat expansion wing plate (302). The transition arc angle (303) is located inside the heat expansion wing plate (302) and between the heat expansion wing plate (302) and the flat heat tracing pipe (2). The transition arc angle (303) includes an outer arc surface and a bottom arc surface. The outer arc surface of the transition arc angle (303) is closely fitted with the arc surface of the bottom corner of the flat heat tracing pipe (2), so that the transition arc angle (303) can be embedded in the lower side of the bottom corner of the flat heat tracing pipe (2). The bottom arc surface of the transition arc angle (303) is continuously connected with the heat transfer fitting arc surface (201). The bottom arc structure of the heat expansion wing plate (302) and the bottom arc surface of the transition arc angle (303) are together fitted to the outer wall of the heat-traced pipe (1). A thermally conductive adhesive layer (202) is also provided between two adjacent high thermal conductivity alloy components (3). The thermally conductive adhesive layer (202) attaches the high thermal conductivity alloy components (3) to the outer wall of the heat-traced pipe (1). At the same time, the thermally conductive adhesive layer (202) is used to absorb the differential expansion of the flat heat-traced pipe (2) and the high thermal conductivity alloy components (3) at high temperatures.

2. The flat tube heat tracing device for increasing heat transfer area according to claim 1, characterized in that: The curvature of the heat transfer bonding arc surface (201) is consistent with the curvature of the outer wall of the heat-traced pipe (1).

3. The flat tube heat tracing device for increasing heat transfer area according to claim 1, characterized in that: The heat transfer substrate (301), heat expansion wing plate (302), and transition arc angle (303) of the high thermal conductivity alloy component (3) are integrally formed structures.

4. The flat tube heat tracing device for increasing heat transfer area according to claim 1, characterized in that: The heat transfer substrate (301) and the flat heat tracing pipe (2) are fixedly connected by a heat-conducting medium layer.

5. A flat tube heat tracing device for increasing heat transfer area according to claim 1, characterized in that: The heat-expanding wing plate (302) has a triangular cross-section, with its top edge connected to the heat transfer substrate (301) and its bottom edge being an arc-shaped edge that matches the arc surface of the flat heat tracing pipe (2).

6. A flat tube heat tracing device for increasing heat transfer area according to claim 1, characterized in that: All connections and edges of the high thermal conductivity alloy component (3) are transitioned by arc-shaped surfaces.

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