Diamond VC composite vapor chamber

Abstract

The utility model provides a diamond VC composite vapor chamber, which comprises an upper cover, a lower cover, a capillary structure unit and a fluid, the upper cover and the lower cover form a vacuum cavity, the capillary structure unit is arranged in the vacuum cavity, and the fluid is arranged in the vacuum cavity; and a diamond layer is at least arranged in the heat dissipation area at the joint of the lower cover and the heat dissipation source. According to the temperature equalizing plate, the lower cover connected with the heat dissipation source is compounded by adopting diamond, so that heat can be quickly and vertically transferred to the internal capillary structure unit, the temperature of each area is quickly balanced, the damage of a device caused by local high temperature is avoided, the performance of equipment is improved, and the temperature equalizing plate can be applied to heat dissipation parts of products such as mobile phones.

Description

Technical Field

[0001] This utility model belongs to the field of temperature equalization plate technology, and particularly relates to a diamond VC composite temperature equalization plate. Background Technology

[0002] A vapor chamber is a vacuum cavity with a finely structured inner wall, typically made of copper. When heat is conducted from the heat source to the evaporation zone, the coolant inside the cavity, heated in a low-vacuum environment, begins to vaporize. It absorbs heat and expands rapidly, quickly filling the cavity with the gaseous cooling medium. When the gaseous working fluid comes into contact with a cooler area, condensation occurs. This condensation releases the heat accumulated during evaporation, and the condensed coolant returns to the evaporation heat source through capillary channels in the microstructure. This process repeats continuously within the cavity. Visually, the vapor chamber is a flat plate with two tightly fitted caps at the top and bottom, supported by copper pillars. The two copper plates are made of oxygen-free copper, and pure water is typically used as the working fluid. The capillary structure is created using copper powder sintering or copper mesh techniques.

[0003] However, because copper structures cannot quickly transfer heat from the heat source to the heat spreader, they cannot achieve rapid cooling of the heat source. This is especially problematic for high-power or high-performance electrical components, affecting the equipment's performance and even causing damage. Utility Model Content

[0004] This invention provides a diamond VC composite heat spreader, which can effectively solve the above problems.

[0005] This utility model is implemented as follows:

[0006] A diamond VC composite heat exchanger includes an upper cover, a lower cover, a capillary unit, and a fluid. The upper cover and the lower cover form a vacuum cavity. The capillary unit is disposed within the vacuum cavity, and the fluid is disposed within the vacuum cavity. At least the heat dissipation area where the lower cover connects to the heat dissipation source is provided with a diamond layer.

[0007] As a further improvement, the diamond layer is a diamond sheet or a mixture of diamond and metal.

[0008] As a further improvement, at least the lower cover is a diamond sheet or a diamond and metal mixture layer, and a solder layer is provided between the upper cover and the lower cover to form a vacuum cavity. The capillary unit is sandwiched in the vacuum cavity between the upper cover and the lower cover. The upper cover and the lower cover are oxygen-free copper plates.

[0009] As a further improvement, the lower cover has a first mounting groove or a first mounting hole on the inner or outer side of the heat dissipation area, and the diamond layer is disposed in the first mounting groove or the first mounting hole.

[0010] As a further improvement, a solder layer is provided at the connection between the diamond layer and the lower cover.

[0011] As a further improvement, the upper cover has a second mounting groove or a second mounting hole on the inner or outer side of the vacuum cavity area, and the diamond layer is disposed in the first mounting groove or the second mounting hole.

[0012] As a further improvement, heat-conducting pillars are distributed on the side of the first or second mounting groove of the diamond layer, embedded in or penetrating the lower or upper cover.

[0013] As a further improvement, the heat-conducting pillars are configured to correspond one-to-one with the capillary pores of the capillary structure unit.

[0014] As a further improvement, a first mounting groove is provided on the outer side of the heat dissipation area of ​​the lower cover, and a second mounting groove is provided on the inner side of the vacuum cavity area of ​​the upper cover. Diamond sheets are welded into the first mounting groove and the second mounting groove.

[0015] As a further improvement, a heat-conducting column is provided on the upper cover side of the diamond sheet, and the heat-conducting column penetrates the copper plates of the upper and lower covers.

[0016] As a further improvement, a first mounting hole is provided on the inner or outer side of the heat dissipation area of ​​the lower cover, and a second mounting hole is provided on the inner side of the vacuum cavity area of ​​the upper cover. Diamond sheets are welded into the first and second mounting holes.

[0017] The beneficial effects of this utility model are: by using diamond composite for the lower cover connected to the heat dissipation source, the heat vapor chamber can quickly and vertically transfer heat to the internal capillary structure unit, so that the temperature of each area can be quickly balanced, avoiding damage to the device caused by local high temperature, and improving the performance of the device. It can be used for heat dissipation components of products not limited to mobile phones. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained from these drawings without creative effort.

[0019] Figure 1 This is an exploded view of the structure of an embodiment of a diamond VC composite heat spreader according to this utility model;

[0020] Figure 2 This is an exploded view of an embodiment of a diamond VC composite heat spreader according to this utility model;

[0021] Figure 3 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 1 of this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 2 of this utility model;

[0023] Figure 5 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 3 of this utility model;

[0024] Figure 6 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 4 of this utility model;

[0025] Figure 7 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 5 of this utility model;

[0026] Figure 8 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 6 of this utility model;

[0027] Figure 9 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 7 of this utility model;

[0028] Figure 10 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 8 of this utility model;

[0029] Figure 11 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 9 of this utility model;

[0030] Figure 12 This is a schematic diagram of the structure of a diamond VC composite heat spreader provided in Embodiment 10 of this utility model.

[0031] Figure label:

[0032] Top cover 1; second mounting groove 11; second mounting hole 12; bottom cover 2; first mounting groove 21; first mounting hole 22; capillary structure unit 3; vacuum cavity 4; diamond layer 5; heat-conducting column 51; solder layer 6. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Therefore, the following detailed description of the embodiments of this utility model provided in the accompanying drawings is not intended to limit the scope of the claimed utility model, but merely to represent selected embodiments of this utility model.

[0034] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0035] In the description of this utility model, the terms "upper", "middle", "side", "side", "upper side", "end", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] Reference Figure 1-12 As shown, a diamond VC composite heat exchanger includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed in the vacuum cavity 4, and the fluid is disposed in the vacuum cavity 4. At least the heat dissipation area where the lower cover 2 is connected to the heat dissipation source is provided with a diamond layer 5.

[0037] The heat spreader has a diamond layer 5 on the contact surface between the lower cover 2 and the heat source, such as the contact area of ​​the battery or chip, so that the heat from the heat source can be quickly and vertically transferred to the internal capillary unit 3, thereby balancing the temperature in various places and quickly dispersing and cooling the high temperature.

[0038] The capillary unit 3 consists of a top plate, copper pillars, and a bottom plate, forming a copper mesh structure with capillary structure.

[0039] Furthermore, the diamond layer 5 is a diamond sheet or a diamond-metal hybrid layer.

[0040] Diamond sheets are bonded to the upper cover 1 or the lower cover 2, and the diamond and metal mixed layer is bonded to the upper cover 1 or the lower cover 2 by sintering.

[0041] Furthermore, at least the lower cover 2 is a diamond sheet or a diamond and metal mixture layer, and a solder layer 6 is provided between the upper cover 1 and the lower cover 2 to form a vacuum cavity 4. The capillary unit 3 is sandwiched in the vacuum cavity 4 between the upper cover 1 and the lower cover 2. The upper cover 1 and the lower cover 2 are oxygen-free copper plates.

[0042] The upper cover 1 and the lower cover 2 are sealed together by a solder layer 6 to form a vacuum cavity 4. Solder is placed at the joint of the upper and lower covers 2, and then the welding is completed by high temperature and high pressure treatment.

[0043] Furthermore, the lower cover 2 has a first mounting groove 21 or a first mounting hole 22 on the inner or outer side of the heat dissipation area, and the diamond layer 5 is disposed in the first mounting groove 21 or the first mounting hole 22.

[0044] The mounting slot facilitates the setting of the diamond layer 5, while the mounting hole maximizes the heat transfer effect.

[0045] Furthermore, a solder layer 6 is provided at the connection between the diamond layer 5 and the lower cover 2.

[0046] The diamond layer 5 is bonded to the copper plate of the upper cover 1 or the lower cover 2 via the solder layer 6. The solder is placed at the junction of the diamond layer 5 and the upper and lower covers 2, and then the welding is completed through high temperature and high pressure treatment.

[0047] Furthermore, the upper cover 1 has a second mounting groove 11 or a second mounting hole 12 on the inner or outer side of the vacuum cavity 4 area, and the diamond layer 5 is disposed in the first mounting groove 21 or the second mounting hole 12.

[0048] Furthermore, heat-conducting pillars 51 are distributed on the first mounting groove 21 or the second mounting groove 11 side of the diamond layer 5, embedded in or penetrating the lower cover 2 or the upper cover 1.

[0049] The heat-conducting column 51 enhances the vertical heat transfer effect.

[0050] Furthermore, the heat-conducting pillars 51 are arranged in a one-to-one correspondence with the capillary pores of the capillary structure unit 3.

[0051] The heat-conducting column 51 is set to correspond to the capillary pores. Heat is quickly transferred inward through the heat-conducting column 51, and the fluid is quickly evaporated. This allows the pure water fluid to be quickly dispersed through the capillary pores after evaporation, dispersing the heat and exchanging heat with the cold fluid to achieve a uniform heat effect.

[0052] Furthermore, a first mounting groove 21 is provided on the outer side of the heat dissipation area of ​​the lower cover 2, and a second mounting groove 11 is provided on the inner side of the vacuum cavity 4 area of ​​the upper cover 1. Diamond sheets are welded into the first mounting groove 21 and the second mounting groove 11.

[0053] Furthermore, a heat-conducting column 51 is provided on the upper cover 1 side of the diamond sheet, and the heat-conducting column 51 penetrates the copper plates of the upper cover 1 and the lower cover 2.

[0054] Furthermore, the lower cover 2 has a first mounting hole 22 on the inner or outer side of the heat dissipation area, and the upper cover 1 has a second mounting hole 12 on the inner side of the vacuum cavity 4 area. Diamond sheets are welded into the first mounting hole 22 and the second mounting hole 12.

[0055] Example

[0056] The following describes embodiments of this application. The embodiments described below are exemplary and are only used to explain this application, and should not be construed as limiting this application. Where specific techniques or conditions are not specified in the embodiments, they shall be performed in accordance with the techniques or conditions described in the literature in the art or in accordance with the product manual.

[0057] Example 1

[0058] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed in the vacuum cavity 4, and the fluid is disposed in the vacuum cavity 4. The lower cover 2 is provided with a first mounting hole 22, and a diamond layer 5 is disposed in the first mounting hole 22. The diamond layer 5 is connected to the lower cover 2 through a solder layer 6.

[0059] Example 2

[0060] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. The upper cover 1 has a second mounting hole 12, and a diamond layer 5 is disposed within the second mounting hole 12. The diamond layer 5 is connected to the upper cover 1 through a solder layer 6. The lower cover 2 has a first mounting groove 21, and a diamond layer 5 is disposed within the first mounting groove 21. The diamond layer 5 is connected to the lower cover 2 through a solder layer 6.

[0061] Example 3

[0062] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed in the vacuum cavity 4, and the fluid is disposed in the vacuum cavity 4. A first mounting groove 21 is provided on the outer side of the lower cover 2. A diamond layer 5 is disposed in the first mounting groove 21, and the diamond layer 5 is connected to the lower cover 2 through a solder layer 6.

[0063] Example 4

[0064] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. The upper cover 1 has a second mounting groove 11 on its inner side, and a diamond layer 5 is disposed within the second mounting groove 11. The diamond layer 5 is connected to the upper cover 1 through a solder layer 6. The lower cover 2 has a first mounting groove 21 on its outer side, and a diamond layer 5 is disposed within the first mounting groove 21. The diamond layer 5 is connected to the lower cover 2 through a solder layer 6.

[0065] Example 5

[0066] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. A first mounting groove 21 is provided on the outer side of the lower cover 2. A diamond layer 5 is disposed within the first mounting groove 21. Heat-conducting pillars 51 are distributed on the side of the first mounting groove 21 of the diamond layer 5, embedded in or penetrating the lower cover 2. The diamond layer 5 is connected to the lower cover 2 through a solder layer 6.

[0067] Example 6

[0068] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. The upper cover 1 has a second mounting groove 11 on its inner side, and a diamond layer 5 is disposed within the second mounting groove 11. The diamond layer 5 is connected to the upper cover 1 through a solder layer 6. The lower cover 2 has a first mounting groove 21 on its outer side, and a diamond layer 5 is disposed within the first mounting groove 21. Heat-conducting pillars 51 are distributed on the side of the first mounting groove 21 of the diamond layer 5, embedded in or penetrating the lower cover 2. The diamond layer 5 is connected to the lower cover 2 through the solder layer 6.

[0069] Example 7

[0070] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. A first mounting groove 21 is provided on the inner side of the lower cover 2. A diamond layer 5 is disposed within the first mounting groove 21. Heat-conducting pillars 51 are distributed on the side of the first mounting groove 21 of the diamond layer 5, embedded in or penetrating the lower cover 2. The diamond layer 5 is connected to the lower cover 2 through a solder layer 6.

[0071] Example 8

[0072] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. The upper cover 1 has a second mounting groove 11 on its inner side, and a diamond layer 5 is disposed within the second mounting groove 11. The diamond layer 5 is connected to the upper cover 1 through a solder layer 6. The lower cover 2 has a first mounting groove 21 on its inner side, and a diamond layer 5 is disposed within the first mounting groove 21. Heat-conducting pillars 51 are distributed on the side of the first mounting groove 21 of the diamond layer 5, embedded in or penetrating the lower cover 2. The diamond layer 5 is connected to the lower cover 2 through the solder layer 6.

[0073] Example 9

[0074] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. The upper cover 1 is a diamond layer 5, the lower cover 2 is a diamond layer 5, and the diamond layers 5 of the upper cover 1 and the lower cover 2 are connected by a solder layer 6.

[0075] Example 10

[0076] A diamond VC composite heat spreader includes an upper cover 1, a lower cover 2, a capillary unit 3, and a fluid. The upper cover 1 and the lower cover 2 form a vacuum cavity 4. The capillary unit 3 is disposed within the vacuum cavity 4, and the fluid is disposed within the vacuum cavity 4. The upper cover 1 is an oxygen-free copper plate, and the lower cover 2 is a diamond layer 5. The diamond layers 5 of the upper cover 1 and the lower cover 2 are connected by a solder layer 6.

[0077] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A diamond VC composite heat spreader, characterized in that, It includes an upper cover, a lower cover, a capillary structure unit, and a fluid. The upper cover and the lower cover form a vacuum cavity. The capillary structure unit is disposed within the vacuum cavity, and the fluid is disposed within the vacuum cavity. At least the heat dissipation area where the lower cover connects to the heat dissipation source is provided with a diamond layer.

2. The diamond VC composite heat spreader according to claim 1, characterized in that, The diamond layer is a diamond sheet or a mixture of diamond and metal.

3. The diamond VC composite heat spreader according to claim 1, characterized in that, At least the lower cover is a diamond sheet or a diamond and metal mixture layer, and a solder layer is provided between the upper cover and the lower cover to form a vacuum cavity. The capillary unit is sandwiched in the vacuum cavity between the upper cover and the lower cover. The upper cover and the lower cover are oxygen-free copper plates.

4. The diamond VC composite heat spreader according to claim 1, characterized in that, The lower cover has a first mounting groove or a first mounting hole on the inner or outer side of the heat dissipation area, and the diamond layer is disposed in the first mounting groove or the first mounting hole.

5. The diamond VC composite heat spreader according to claim 1, characterized in that, The upper cover has a second mounting groove or a second mounting hole on the inner or outer side of the vacuum cavity area, and the diamond layer is disposed in the first mounting groove or the second mounting hole.

6. A diamond VC composite heat spreader according to claim 1 or 4, characterized in that, A solder layer is provided at the connection between the diamond layer and the lower or upper cover.

7. A diamond VC composite heat spreader according to claim 4 or 5, characterized in that, The diamond layer has heat-conducting pillars embedded in or penetrating the lower or upper cover, distributed on the side of the first or second mounting groove.

8. A diamond VC composite heat spreader according to claim 7, characterized in that, The heat-conducting pillars are arranged in a one-to-one correspondence with the capillary pores of the capillary structure unit.

9. A diamond VC composite heat spreader according to claim 1 or 4, characterized in that, The lower cover has a first mounting groove on the outside of the heat dissipation area, and the upper cover has a second mounting groove on the inside of the vacuum cavity area. Diamond sheets are welded into the first and second mounting grooves.

10. A diamond VC composite temperature distribution plate according to claim 1, characterized in that, The lower cover has a first mounting hole on the inner or outer side of the heat dissipation area, and the upper cover has a second mounting hole on the inner side of the vacuum cavity area. Diamond sheets are welded into the first and second mounting holes.

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