Ceramic tile adhesive bonding force testing device
By introducing temperature control and multi-directional force testing functions into the tile adhesive bonding force testing device, the shortcomings of existing devices in testing under extreme temperature and mechanical conditions are solved, and a more accurate and comprehensive bonding force assessment is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANDONG JIANGYU NEW MATERIALS CO LTD
- Filing Date
- 2025-04-28
- Publication Date
- 2026-05-19
AI Technical Summary
Existing tile adhesive bonding strength testing devices cannot simulate extreme environmental temperatures, have limited testing methods, and cannot assess the shear force between the tile and the substrate, resulting in inaccurate test results.
A tile adhesive bonding force testing device was designed, which includes a temperature control system and multi-directional force testing function. The temperature is regulated by a semiconductor cooling chip, and vertical and horizontal force testing is achieved by a hydraulic cylinder and a push plate, thereby enhancing the testing accuracy and functionality.
It achieves precise control of the test environment temperature, enabling the simulation of adhesion force tests under different mechanical conditions, thus improving the accuracy and comprehensiveness of the test results.
Smart Images
Figure CN224263058U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of tile adhesive technology, specifically a tile adhesive bonding force testing device. Background Technology
[0002] A tile adhesive bonding strength tester is a specialized device used to determine the bond strength between tile adhesive and a substrate (such as a wall or floor) or tile. Its core function is to quantitatively evaluate the bonding performance of the tile adhesive after curing by simulating stress conditions in actual use, ensuring that it meets construction standards or industry specifications.
[0003] The existing technology has the following shortcomings: Application number 202222693774.X proposes a tile adhesive bonding force testing device. It includes: a base frame; a tile adhesive bonding base plate disposed above the base frame for applying the tile adhesive to be tested and bonding the tile to be tested thereon; a testing assembly including a tensile measuring mechanism, a connector connecting the tensile measuring mechanism and the tile to be tested, and a tensile force application mechanism; a guide wheel disposed below the tensile measuring mechanism to adjust the direction of force application; and a traction rope, one end of which is connected to the tensile force application mechanism, and the other end of which is connected to the tensile measuring mechanism via the guide wheel. The tile adhesive bonding force testing device provided by this utility model is simple to manufacture, provides accurate testing, and effectively protects the measuring equipment while achieving efficient testing.
[0004] The aforementioned equipment is not suitable for controlling the ambient temperature of the tile adhesive during use. Fluctuations in ambient temperature can easily affect the tile adhesive, leading to data deviations. It cannot simulate the bonding strength of tile adhesive under extreme environments. Furthermore, the testing of tile adhesive is relatively simple, using only vertical tensile force for testing. The bonding area between the tile and the substrate can directly affect the test results. It cannot test shear force after the tile is fixed with tile adhesive. The functionality can be further improved. Utility Model Content
[0005] To address the shortcomings of existing technologies, this utility model provides a tile adhesive bonding force testing device to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a tile adhesive bonding force testing device, comprising a base plate, a column on the base plate, a test box on the column, a flip door on the test box, openings on both sides of the test box, a first hydraulic cylinder on the base plate, a fixed seat on the base plate, a second hydraulic cylinder on the fixed seat, a push plate at the output end of the second hydraulic cylinder, a mounting plate inside the test box, a mounting cavity inside the mounting plate, a connecting port inside the mounting cavity, side plates on the inner wall of the test box, a first semiconductor cooling chip and a second semiconductor cooling chip on the side plates, a temperature sensor inside the test box, and an adhesive plate at the output end of the first hydraulic cylinder;
[0007] The side panel includes a through hole and a square opening. The square opening is located in the middle of the side panel, and the through hole is located on one side of the side panel.
[0008] As a preferred technical solution of this utility model: the flip door is hinged to the test box, the flip door is made of tempered glass, the mounting plate is fixedly installed inside the test box, the connection port is connected to the mounting cavity, and the size of the connection port is smaller than the size of the ceramic tile.
[0009] As a preferred technical solution of this utility model: the output end of the first hydraulic cylinder extends into the test box and is fixedly connected to the bottom of the adhesive plate. A tension sensor is provided between the adhesive plate and the output end of the first hydraulic cylinder. The joints of the adhesive plates are compatible and their positions correspond.
[0010] As a preferred technical solution of this utility model: the second hydraulic cylinder is fixedly installed on the fixed base, the push plate is fixedly installed on the output end of the second hydraulic cylinder, and a pressure sensor is provided between the push plate and the output end of the second hydraulic cylinder.
[0011] As a preferred technical solution of this utility model: the push plate extends into the test box and is inserted into the placement cavity, and the push plate and the placement cavity are at the same level.
[0012] As a preferred technical solution of this utility model: there are two sets of side plates, which are fixedly installed on the inner wall of the test chamber. Each set of side plates has two sets of first semiconductor refrigeration chips and two sets of second semiconductor refrigeration chips embedded in its inner side. The heating surface of the first semiconductor refrigeration chip corresponds to the inside of the test chamber, and the heat absorption surface of the second semiconductor refrigeration chip corresponds to the inside of the test chamber.
[0013] As a preferred technical solution of this utility model: four sets of through holes are provided on each set of side plates, the through holes correspond to the positions of the first semiconductor refrigeration chip and the second semiconductor refrigeration chip, and the through holes correspond to the positions of the openings and are interconnected.
[0014] Compared with the prior art, this utility model provides a tile adhesive bonding force testing device, which has the following beneficial effects:
[0015] 1. This tile adhesive bonding force testing device includes an opening, a side plate, a through hole, a first thermoelectric cooler, a second thermoelectric cooler, and a temperature sensor. When the temperature inside the test chamber needs to be raised, the first thermoelectric cooler on the side plate is activated, and its heating surface faces the inside of the test chamber, generating heat that acts on the test chamber, raising its temperature. When the temperature inside the test chamber needs to be lowered, the first thermoelectric cooler is turned off, and the second thermoelectric cooler is turned on. The heat-absorbing surface of the second thermoelectric cooler faces the inside of the test chamber, absorbing the temperature inside the test chamber and achieving a cooling effect. The temperature inside the test chamber can be controlled according to actual needs.
[0016] 2. This tile adhesive bonding force testing device comprises a first hydraulic cylinder, a second hydraulic cylinder, a push plate, a mounting plate, a mounting cavity, a connecting port, and an adhesive plate. After the tile is bonded to the adhesive plate in the mounting cavity using tile adhesive, controlling the contraction of the first hydraulic cylinder can cause the adhesive plate to descend, generating tension between the tile and the adhesive plate, thus testing the vertical bonding force of the tile adhesive. By controlling the adhesive plate to be in the connecting port and at the same level as the connecting port, activating the second hydraulic cylinder pushes the push plate into the mounting cavity, applying a horizontal force to the tile in the mounting cavity until the tile separates from the adhesive plate, thus testing the bonding force of the tile adhesive under horizontal shear force. Furthermore, after the tile is fixed with tile adhesive, vertical tension and horizontal shear force can be applied to the tile to test the bonding force of the tile adhesive under different forces, thus enhancing the functionality of the testing device. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall external structure of this utility model;
[0018] Figure 2 This is a schematic diagram of the internal structure of the test chamber of this utility model;
[0019] Figure 3 This is a schematic diagram showing the connection between the push plate and the mounting plate of this utility model;
[0020] Figure 4 This is a schematic diagram of the side plate structure of this utility model.
[0021] In the diagram: 1. Base plate; 2. Column; 3. Test box; 4. Flip door; 5. Opening; 6. First hydraulic cylinder; 7. Fixing base; 8. Second hydraulic cylinder; 9. Push plate; 10. Mounting plate; 11. Mounting cavity; 12. Connection port; 13. Side plate; 1301. Through hole; 1302. Square opening; 14. First semiconductor refrigeration chip; 15. Second semiconductor refrigeration chip; 16. Temperature sensor; 17. Adhesive plate. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0023] Please see Figure 1-4 In this embodiment: a tile adhesive bonding force testing device includes a base plate 1, a column 2 on the base plate 1, a test box 3 on the column 2, a flip door 4 on the test box 3, openings 5 on both sides of the test box 3, a first hydraulic cylinder 6 on the base plate 1, a fixed seat 7 on the base plate 1, a second hydraulic cylinder 8 on the fixed seat 7, a push plate 9 at the output end of the second hydraulic cylinder 8, a mounting plate 10 inside the test box 3, a mounting cavity 11 inside the mounting plate 10, a connecting port 12 inside the mounting cavity 11, a side plate 13 on the inner wall of the test box 3, a first semiconductor cooling chip 14 and a second semiconductor cooling chip 15 on the side plate 13, a temperature sensor 16 inside the test box 3, and an adhesive plate 17 at the output end of the first hydraulic cylinder 6.
[0024] The column 2 can easily support the test chamber 3, the flip door 4 can open the test chamber 3 for testing, the fixed seat 7 can provide the installation conditions for the second hydraulic cylinder 8, and the temperature sensor 16 can monitor the temperature inside the test chamber 3.
[0025] The side panel 13 includes a through hole 1301 and a square opening 1302. The square opening 1302 is provided in the middle of the side panel 13, and the through hole 1301 is provided on one side of the side panel 13.
[0026] The square opening 1302 facilitates the installation of the mounting plate 10.
[0027] In this embodiment, the flip door 4 is hinged to the test box 3. The flip door 4 is made of tempered glass. The mounting plate 10 is fixedly installed inside the test box 3. The connecting port 12 is connected to the mounting cavity 11. The size of the connecting port 12 is smaller than that of the ceramic tile. The output end of the first hydraulic cylinder 6 extends into the test box 3 and is fixedly connected to the bottom of the adhesive plate 17. A tension sensor is provided between the adhesive plate 17 and the output end of the first hydraulic cylinder 6. The connecting port 12 of the adhesive plate 17 is compatible and the positions correspond.
[0028] Specifically, the first hydraulic cylinder 6 can drive the adhesive plate 17 to descend when the output end is retracted, which can test the vertical adhesion of the tile adhesive. The adhesive plate 17 facilitates the application of the tile adhesive to be tested.
[0029] In this embodiment, the second hydraulic cylinder 8 is fixedly installed on the fixed base 7, the push plate 9 is fixedly installed on the output end of the second hydraulic cylinder 8, a pressure sensor is provided between the push plate 9 and the output end of the second hydraulic cylinder 8, the push plate 9 extends into the test box 3 and is inserted into the placement cavity 11, and the push plate 9 and the placement cavity 11 are at the same level.
[0030] Specifically, the second hydraulic cylinder 8 can provide sufficient power for the movement of the push plate 9. The push plate 9 can apply a horizontal shear force to the tile in the placement cavity 11 under the action of the second hydraulic cylinder 8, which can test the bonding force of the tile adhesive when subjected to horizontal shear force.
[0031] In this embodiment, there are two sets of side plates 13. The side plates 13 are fixedly installed on the inner wall of the test chamber 3. Two sets of first semiconductor refrigeration chips 14 and two sets of second semiconductor refrigeration chips 15 are embedded in the inner side of each set of side plates 13. The heating surface of the first semiconductor refrigeration chip 14 corresponds to the inside of the test chamber 3, and the heat absorption surface of the second semiconductor refrigeration chip 15 corresponds to the inside of the test chamber 3. Four sets of through holes 1301 are opened on each set of side plates 13. The through holes 1301 correspond to the positions of the first semiconductor refrigeration chip 14 and the second semiconductor refrigeration chip 15. The through holes 1301 correspond to the positions of the opening 5 and are interconnected.
[0032] Specifically, the heating surface of the first semiconductor cooling chip 14 can raise the temperature inside the test chamber 3, and the heat absorption surface of the second semiconductor cooling chip 15 can lower the temperature inside the test chamber 3. The heat absorption surface of the first semiconductor cooling chip 14 can be connected to the outside air through the opening 5 and the through hole 1301 to avoid affecting the test device. The heating surface of the second semiconductor cooling chip 15 can also be connected to the outside air to avoid affecting the test device.
[0033] The working principle and usage process of this utility model are as follows: In actual use, the device is placed in a suitable position and connected to an external power supply. When it is necessary to raise the temperature inside the test chamber 3, the first semiconductor cooling chip 14 on the side plate 13 can be activated. Since the heating surface of the first semiconductor cooling chip 14 corresponds to the inside of the test chamber 3, the heat generated will act on the test chamber 3, raising the temperature of the test chamber 3. When it is necessary to cool down the test chamber 3, the first semiconductor cooling chip 14 can be turned off and the second semiconductor cooling chip 15 can be turned on. Since the heat absorbing surface of the second semiconductor cooling chip 15 corresponds to the inside of the test chamber 3, it will absorb the temperature inside the test chamber 3, achieving a cooling effect. The temperature inside the test chamber 3 can be controlled according to actual needs.
[0034] Open the hinged door 4 and place the test tile in the mounting cavity 11. Apply tile adhesive evenly to the adhesive plate 17. Control the first hydraulic cylinder 6 to extend and press against the bottom of the tile in the mounting cavity 11, so that the tile and the adhesive plate 17 are bonded together by the tile adhesive. Control the first hydraulic cylinder 6 to retract, which can drive the adhesive plate 17 to descend. The mounting plate 10 restricts the position of the tile, thereby generating a tensile force between the tile and the adhesive plate 17. Continue to lower the first hydraulic cylinder 6 until the adhesive plate 17 separates from the tile. The tension sensor connected between the adhesive plate 17 and the first hydraulic cylinder 6 can record the corresponding tensile force data, thereby testing the vertical bonding force of the tile adhesive.
[0035] When it is necessary to test the shear force of tile adhesive, tile adhesive is first evenly applied to the adhesive plate 17. The first hydraulic cylinder 6 is then raised to fix the tile in the placement cavity 11 to the adhesive plate 17 with tile adhesive. The first hydraulic cylinder 6 controls the adhesive plate 17 until it is in the joint 12 and at the same level as the joint 12. At this time, the second hydraulic cylinder 8 is activated to push the push plate 9 into the placement cavity 11. The push plate 9 can apply a horizontal force to the tile in the placement cavity 11 until the tile separates from the adhesive plate 17. The corresponding pressure data can be recorded by the pressure sensor between the output end of the second hydraulic cylinder 8 and the push plate 9. Vertical tension and horizontal shear force can be applied to the tile after it is fixed with tile adhesive. The adhesive force of tile adhesive under different forces can be tested, which improves the functionality of the testing device.
[0036] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A tile adhesive bonding force testing device, comprising a base plate (1), a column (2) disposed on the base plate (1), a test box (3) disposed on the column (2), and a flip door (4) disposed on the test box (3), characterized in that: The test chamber (3) has openings (5) on both sides. A first hydraulic cylinder (6) is provided on the base plate (1). A fixed seat (7) is provided on the base plate (1). A second hydraulic cylinder (8) is provided on the fixed seat (7). A push plate (9) is provided at the output end of the second hydraulic cylinder (8). A mounting plate (10) is provided inside the test chamber (3). A mounting cavity (11) is provided inside the mounting plate (10). A connecting port (12) is provided inside the mounting cavity (11). A side plate (13) is provided on the inner wall of the test chamber (3). A first semiconductor refrigeration chip (14) and a second semiconductor refrigeration chip (15) are provided on the side plate (13). A temperature sensor (16) is provided inside the test chamber (3). An adhesive plate (17) is provided at the output end of the first hydraulic cylinder (6). The side panel (13) includes a through hole (1301) and a square opening (1302). The square opening (1302) is provided in the middle of the side panel (13), and the through hole (1301) is provided on one side of the side panel (13).
2. The tile adhesive bonding force testing device according to claim 1, characterized in that: The hinged door (4) is hinged to the test box (3). The hinged door (4) is made of tempered glass. The mounting plate (10) is fixedly installed inside the test box (3). The connecting port (12) is connected to the mounting cavity (11). The size of the connecting port (12) is smaller than that of the ceramic tile.
3. The tile adhesive bonding force testing device according to claim 1, characterized in that: The output end of the first hydraulic cylinder (6) extends into the test box (3) and is fixedly connected to the bottom of the adhesive plate (17). A tension sensor is provided between the adhesive plate (17) and the output end of the first hydraulic cylinder (6). The connection port (12) of the adhesive plate (17) is compatible and the position is corresponding.
4. The tile adhesive bonding force testing device according to claim 1, characterized in that: The second hydraulic cylinder (8) is fixedly mounted on the fixed base (7), and the push plate (9) is fixedly mounted on the output end of the second hydraulic cylinder (8). A pressure sensor is provided between the push plate (9) and the output end of the second hydraulic cylinder (8).
5. The tile adhesive bonding force testing device according to claim 1, characterized in that: The push plate (9) extends into the test box (3) and is inserted into the placement cavity (11), with the push plate (9) and the placement cavity (11) at the same level.
6. The tile adhesive bonding force testing device according to claim 1, characterized in that: There are two sets of side plates (13). The side plates (13) are fixedly installed on the inner wall of the test chamber (3). Each set of side plates (13) has two sets of first semiconductor refrigeration chips (14) and two sets of second semiconductor refrigeration chips (15) embedded in its inner side. The heating surface of the first semiconductor refrigeration chip (14) corresponds to the inside of the test chamber (3), and the heat absorption surface of the second semiconductor refrigeration chip (15) corresponds to the inside of the test chamber (3).
7. The tile adhesive bonding force testing device according to claim 1, characterized in that: Each set of side plates (13) has four sets of through holes (1301). The through holes (1301) correspond to the positions of the first semiconductor refrigeration chip (14) and the second semiconductor refrigeration chip (15). The through holes (1301) correspond to the positions of the opening (5) and are interconnected.