Heat dissipation device for semiconductor laser

Abstract

The utility model belongs to the field of heat dissipation, and particularly relates to a heat dissipation device for a semiconductor laser, which comprises a semiconductor laser shell and a cover plate arranged on the semiconductor laser shell, and the semiconductor laser shell and the cover plate enclose to form a cooling working medium flowing space. A micro-channel groove is formed in one side, close to the cover plate, of the semiconductor laser shell; a first cooling working medium drainage hole and a second cooling working medium drainage hole are formed in one side, close to the semiconductor laser shell, of the cover plate; and the first cooling working medium drainage hole and the second cooling working medium drainage hole are respectively communicated with a first interface and a second interface which are arranged on the cover plate. Compared with the prior art, the micro-channel groove structure is designed on the back surface of the semiconductor laser shell, so that a cooling working medium flow path is matched with a heat source which is distributed in a stepped manner, the semiconductor laser is ensured to maintain relatively low temperature in a working process, and the heat dissipation efficiency is remarkably improved; therefore, the stability and service life of equipment are improved.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation, and specifically relates to a heat dissipation device for semiconductor lasers. Technical Background

[0002] Semiconductor lasers, due to their small size, high efficiency, and fast response speed, have been widely used in optical communication, industrial processing, biomedicine, and defense. With the continuous increase in laser output power, the heat generated during operation has increased significantly, and heat dissipation has gradually become a key factor restricting performance improvement and device reliability. Currently, the electro-optical conversion efficiency of semiconductor lasers is still limited, and a considerable portion of the input energy accumulates inside the device as heat. If this heat cannot be dissipated effectively and in a timely manner, it will not only lead to increased device temperature but may also cause laser wavelength drift, decreased output power, reduced quantum efficiency, and even thermal runaway and accelerated aging, seriously affecting its operational stability and lifespan.

[0003] To address this issue, various heat dissipation solutions have been proposed in existing technologies. For example, low-power lasers typically employ natural convection or air cooling, using heat sinks or fans to expel heat into the environment. However, these solutions have limited heat dissipation capabilities and are insufficient to meet the thermal management requirements of medium- and high-power lasers. For medium- and high-power lasers, water cooling technology, especially microchannel liquid cooling, has been widely adopted. This technology integrates microstructured channels at the bottom of the laser, allowing the coolant to flow through at a high velocity, achieving high-intensity convective heat transfer and improving heat dissipation efficiency.

[0004] However, existing microchannel liquid cooling structures still face the following shortcomings: On the one hand, microchannel structures are complex and costly to manufacture, and are prone to flow channel blockage or uneven heat flow due to manufacturing defects; on the other hand, in high heat flux regions, the cooling capacity of traditional microchannel heat dissipation structures is still insufficient to meet the heat dissipation needs of local hot spots, affecting overall temperature uniformity and cooling effect. In addition, existing liquid cooling systems are generally large in size and consume a lot of energy, which is not conducive to the miniaturization and integration of devices.

[0005] Therefore, there is an urgent need to develop a heat dissipation device with a more efficient structure, better cooling performance, and more reliable manufacturing process to further improve the thermal management capability of semiconductor lasers and ensure their long-term stable operation in high-power and high-reliability application scenarios. Utility Model Content

[0006] The purpose of this invention is to overcome at least one of the defects of the prior art and provide a heat dissipation device for semiconductor lasers.

[0007] This utility model is achieved using the following technical solution:

[0008] A heat dissipation device for a semiconductor laser includes a semiconductor laser housing and a cover plate disposed on the semiconductor laser housing, which together form a cooling working fluid flow space.

[0009] The semiconductor laser housing has a microchannel groove on the side near the cover plate; the cover plate has a first cooling medium drainage hole and a second cooling medium drainage hole on the side near the semiconductor laser housing to ensure that the cooling medium can flow smoothly into or out of the heat dissipation device; the first cooling medium drainage hole and the second cooling medium drainage hole are respectively connected to the first interface and the second interface provided on the cover plate.

[0010] Furthermore, the semiconductor laser housing has several chip placement platforms on the side opposite to the cover plate, an optical path area is provided next to the chip placement platforms, and the side of the semiconductor laser housing has connectors, fiber optic through holes and fiber optic fixing holes.

[0011] Furthermore, both the first and second interfaces are connected to connectors, and both can serve as inlets or outlets for the cooling medium. The cooling medium can flow in through either interface, exchange heat fully with the heat source area of ​​the semiconductor laser housing within the microchannel groove, and then flow out through the other interface, thereby achieving a highly efficient heat dissipation effect.

[0012] Furthermore, the cover plate and the semiconductor laser housing can be made of one or more of the following materials: copper, aluminum, aluminum alloy, copper-aluminum alloy, titanium alloy, magnesium alloy, stainless steel, alumina, aluminum nitride, silicon nitride, silicon carbide, silicon, plastic, resin, or glass, to balance thermal conductivity, corrosion resistance, and structural strength.

[0013] Furthermore, the semiconductor laser housing and the cover plate are connected by threaded connection, snap-fit ​​connection, riveting connection or welding;

[0014] When the cover plate and the semiconductor laser housing are connected by a threaded connection, snap-fit ​​connection, or riveting connection, a sealing gasket is provided between the cover plate and the semiconductor laser housing. The sealing gasket has a cutout corresponding to the shape and contour of the microchannel groove, and a gasket placement groove is provided on the cover plate or the semiconductor laser housing. When the cover plate and the semiconductor laser housing are connected by welding, the sealing gasket and gasket placement groove are usually not required. However, this invention does not exclude the possibility of using a sealing gasket under welding conditions to achieve higher sealing reliability.

[0015] Furthermore, when the connection between the cover plate and the semiconductor laser housing is threaded, the cover plate is provided with a second through hole, and the semiconductor laser housing is provided with a housing threaded hole. The number, distribution, and size parameters of the second through hole and the housing threaded hole correspond to each other. Screws pass through the second through hole in sequence and are screwed into the housing threaded hole to achieve a firm assembly.

[0016] When the connection between the cover plate and the semiconductor laser housing is a snap-fit, the relative positions of the cover plate and the semiconductor laser housing are provided with complementary snap-fit ​​structures, including hooks and slots.

[0017] When the cover plate is connected to the semiconductor laser housing by riveting, the cover plate and the semiconductor laser housing are provided with through holes at corresponding positions for placing rivets to achieve riveting fixation;

[0018] When the cover plate is connected to the semiconductor laser housing by welding, a weldable contact surface is provided between the cover plate and the semiconductor laser housing, and a fixed connection is achieved by welding.

[0019] Furthermore, the microchannel groove is provided with flow-blocking ribs, which divide the microchannel groove into multiple interconnected sub-grooves to form a continuous cooling channel, thereby extending the flow path of the cooling working fluid and enhancing the heat exchange effect.

[0020] Furthermore, the microchannel groove is provided with one or more groove stepped planes distributed in a stepped manner, and the height difference between two adjacent groove stepped planes is denoted as H, where H≥0; the projection area of ​​each groove stepped plane in the vertical direction covers one or more chip placement platforms.

[0021] Preferably, the number of chip placement platforms corresponding to each of the groove stepped planes is equal and parallel to it. The line connecting the corner points of two adjacent groove stepped planes in the plurality of groove stepped planes is denoted as L1, and the line connecting the corner points of two adjacent chip placement platforms in the plurality of chip placement platforms is denoted as L2. The straight line L1 is parallel to the straight line L2.

[0022] Furthermore, the groove stepped plane is provided with a number of spaced micro ribs, which divide each groove stepped plane into multiple microchannels, ensuring that the cooling medium can undergo more sufficient heat exchange when flowing through the microchannels, thereby further improving heat dissipation efficiency.

[0023] Furthermore, the projection shape of the microrib in the vertical direction is at least one of rounded rectangle, parallelogram, circle, triangle, S-shape, ellipse, teardrop shape or polygon, wherein the S-shape is a shape with a sine curve or cosine curve.

[0024] Furthermore, the microribs are arranged in a linear or interlocking manner.

[0025] Compared with the prior art, the present invention has the following advantages:

[0026] 1. This utility model, by designing a microchannel groove structure on the back of the semiconductor laser housing, matches the flow path of the cooling medium with the stepped distribution of heat sources, ensuring that the semiconductor laser maintains a low temperature during operation, significantly improving heat dissipation efficiency, thereby enhancing the stability and service life of the equipment.

[0027] 2. This utility model innovatively designs a sealing gasket and sets a matching sealing gasket placement groove on the cover plate or semiconductor laser housing, forming a specific sealing structure. This structure effectively prevents coolant leakage, significantly improves the sealing stability of the heat dissipation device, and thus further optimizes the overall heat dissipation performance.

[0028] 3. This utility model, through careful design of the flow path of the cooling medium in the microchannel groove, enables the cooling medium to flow evenly through the microchannel, ensuring efficient heat transfer. Furthermore, when combined with external equipment, it can achieve the circulation of the cooling medium, effectively improving heat dissipation efficiency and maximizing heat dissipation performance.

[0029] 4. The hole positions and connection methods of the cover plate and semiconductor laser housing of this utility model can be flexibly selected according to the actual situation, which meets diverse design and installation requirements.

[0030] 5. Compared with traditional air cooling or ordinary water cooling methods, the heat dissipation device of this utility model has the advantages of compact structure, high heat dissipation efficiency and strong adaptability. It can effectively support the heat dissipation requirements of high-power semiconductor lasers, while meeting the design goals of miniaturization, lightweighting and efficient heat dissipation. Attached Figure Description

[0031] Figure 1 This is an overall structural diagram of the present invention;

[0032] Figure 2 This is an exploded view of the overall structure of this utility model;

[0033] Figure 3 This is a front structural view of the cover plate of this utility model;

[0034] Figure 4 This is a structural diagram of the back of the cover plate of this utility model;

[0035] Figure 5 This is a cross-sectional view of the cover plate of this utility model at the first interface;

[0036] Figure 6This is a cross-sectional view of the cover plate of this utility model at the second interface;

[0037] Figure 7 This is a structural diagram of the sealing gasket of this utility model;

[0038] Figure 8 This is a structural diagram showing the fit between the sealing gasket of this utility model and the sealing gasket on the cover plate when placed in a groove.

[0039] Figure 9 This is an exploded view of the sealing gasket of this utility model when it is fitted with the sealing gasket in the groove on the cover plate.

[0040] Figure 10 This is a cross-sectional view of the sealing gasket of this utility model when it is placed in the groove on the cover plate.

[0041] Figure 11 This is a rear structural view of the semiconductor laser housing of this utility model;

[0042] Figure 12 This is a front structural view of the semiconductor laser housing of this utility model;

[0043] Figure 13 This is a side view of the semiconductor laser housing of this utility model;

[0044] Figure 14 This is a cross-sectional view of the semiconductor laser housing of this utility model;

[0045] Figure 15 This is a schematic diagram showing the possible projection shape of the microribbed column of this utility model in the vertical direction;

[0046] Figure 16 This is a schematic diagram of the sequential arrangement of the microribs of this utility model;

[0047] Figure 17 This is a schematic diagram of the micro-ribbed post insertion method of this utility model.

[0048] Explanation of the labels in the diagram: 1-Cover plate; 2-Screw; 3-Connector; 4-Sealing gasket; 5-Semiconductor laser housing; 11-First through hole; 12-Second through hole; 13-First interface; 14-First cooling medium drainage hole; 15-Second interface; 16-Sealing gasket placement groove; 17-Second cooling medium drainage hole; 41-Perforation; 51-Housing threaded hole; 52-Housing through hole; 53-Microchannel groove; 531-Micro rib; 532- Microchannel; 533-Groove stepped plane; 5331-Corner point of groove stepped plane; 54-Blocking rib; 55-Chip placement platform; 551-Corner point of chip placement platform; 56-Optical path area; 57-Connector; 58-Fiber optic through-hole; 59-Fiber optic fixing hole; L1-Line connecting the corner points of two adjacent groove stepped planes in multiple groove stepped planes; L2-Line connecting the corner points of two adjacent chip placement platforms in multiple chip placement platforms; Detailed Implementation

[0049] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. These embodiments are implemented based on the technical solution of the present invention, providing detailed implementation methods and specific operating procedures. However, the scope of protection of the present invention is not limited to the following embodiments.

[0050] In the description of this utility model, it should be understood that the terms "upper," "lower," "left," "right," "front," "back," "side," "left side," and "right side," etc., are based on the positions shown in the accompanying drawings and are used only for ease of explanation and simplification. They do not limit the device or component to having a specific orientation, structure, or operating method. For example, the side of the cover plate closest to the semiconductor laser housing is the front, and the side away is the back; conversely, the side of the semiconductor laser housing closest to the cover plate is the back, and the side away is the front. The dimensional terms such as "length," "width," "thickness," and "depth" used in this utility model are for descriptive convenience only. Their actual meaning should be understood in conjunction with the specific structure and installation state, and are not limitations on geometric directions, nor do they affect the scope of protection of this utility model. Therefore, the descriptions of positional relationships in the accompanying drawings are only illustrative and should not be considered as limitations on this utility model.

[0051] Furthermore, the terms "first" and "second" are used only to distinguish different features and do not indicate their relative importance or imply a specific number of the technical features. Therefore, a feature containing "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" generally refers to two or more, and "several" generally refers to one or more, unless otherwise explicitly defined. Additionally, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium, or a connection within two components, etc. Those skilled in the art can reasonably understand the applicable meaning of the above terms in this utility model according to the specific circumstances.

[0052] The following is in conjunction with the appendix Figure 1-17 The present invention will be further described through embodiments. These embodiments are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention. The described embodiments are only some embodiments of the present invention, and not all embodiments.

[0053] In some embodiments, the first interface 13, the second interface 15, the first cooling medium drainage hole 14, and the second cooling medium drainage hole 17 can be processed by drilling, laser cutting, milling, or wire cutting techniques, depending on the material, hole size, and structural requirements of the cover plate 1.

[0054] In some embodiments, the first interface 13 and the second interface 15 can be connected to the connector 3 by means of threaded connection, welding connection, clamp connection or sealant bonding, etc. The connector 3 can be a straight connector, elbow connector, flange connector or quick connector, etc.

[0055] Preferably, the connector 3 is a right-angle pagoda connector, which is specifically designed for hose connection and has strong fixation. Its connector direction can rotate 360° around the thread axis, saving horizontal and vertical space and meeting different needs for connection with external pipes.

[0056] When the right-angle pagoda connector is connected to the first interface 13 and the second interface 15 by threads, the threads can be sealed by wrapping with PTFE sealing tape, or by using thread sealant (such as anaerobic sealant) to enhance the sealing effect. Corrosion-resistant O-rings or sealing gaskets can also be used at the threaded connection to further improve the sealing performance and prevent leakage of the cooling medium.

[0057] In some embodiments, the materials of the cover plate 1 and the semiconductor laser housing 5 can be selected according to the usage environment and specific requirements. They can be one or more of copper, aluminum, aluminum alloy, copper-aluminum alloy, titanium alloy, magnesium alloy, stainless steel, alumina, aluminum nitride, silicon nitride, silicon carbide, silicon, plastic, glass or resin, in order to balance thermal conductivity, corrosion resistance and structural strength.

[0058] In some embodiments, the thickness and structural shape of the cover plate 1 can be adjusted according to the power level of the laser to ensure that the heat dissipation effect is not affected while taking into account mechanical strength.

[0059] In some embodiments, the cover plate 1 and the semiconductor laser housing 5 can be connected by various methods, including threaded connection, snap-fit ​​connection, riveting connection or welding connection, etc., which can be flexibly selected according to the usage environment, assembly requirements and sealing performance requirements.

[0060] Furthermore, when the cover plate 1 and the semiconductor laser housing 5 are connected by threads, snap-fit, or riveting, a sealing gasket 4 is provided between the cover plate 1 and the semiconductor laser housing 5 to ensure airtightness at the connection. The sealing gasket 4 has a perforation 41 corresponding to the shape and contour of the microchannel groove 53. Under pressure, the sealing gasket 4 can completely fill the gap between the semiconductor laser housing 5 and the cover plate 1, thereby improving the sealing performance and effectively preventing leakage of the cooling medium. A sealing gasket placement groove 16 is provided on the cover plate 1 or the semiconductor laser housing 5 to embed and position the sealing gasket 4, preventing relative displacement of the sealing gasket 4 when pressed between the cover plate 1 and the semiconductor laser housing 5, thus preventing interference with the flow of the cooling medium. When the cover plate 1 and the semiconductor laser housing 5 are connected by welding, since the mating surfaces of the cover plate 1 and the semiconductor laser housing 5 can form a reliable sealing structure, the sealing gasket 4 and the sealing gasket placement groove 16 are usually not required.

[0061] Preferably, the sealing gasket 4 is made of a high-temperature resistant and corrosion-resistant material, such as silicone rubber, fluororubber, EPDM rubber, nitrile rubber, polyurethane rubber, polyimide, flexible graphite, or polytetrafluoroethylene.

[0062] Preferably, the depth of the gasket placement groove 16 is less than the thickness of the gasket 4. The gasket 4 is partially embedded in the gasket placement groove 16 and protrudes slightly above the surface of the gasket placement groove 16 when not under pressure, thereby ensuring an effective seal after installation.

[0063] Furthermore, when the connection between the cover plate 1 and the semiconductor laser housing 5 is threaded, the cover plate 1 is provided with a second through hole 12, and the semiconductor laser housing 5 is provided with a housing threaded hole 51. The number, distribution and size parameters of the second through hole 12 and the housing threaded hole 51 correspond to each other. The screw 2 passes through the second through hole 12 and is screwed into the housing threaded hole 51 to achieve a stable connection.

[0064] The second through hole 12 can be configured as a threadless through hole or a threaded through hole, and the shell threaded hole 51 can be configured as a threaded through hole or a threaded blind hole. The number, distribution and size parameters of the second through hole 12 and the shell threaded hole 51 can be selected according to actual needs to meet different design and installation requirements.

[0065] Preferably, the threaded hole 51 of the housing is provided as a threaded through hole at the edge of the semiconductor laser housing 5 to ensure that the cover plate 1 and the semiconductor laser housing 5 are fully connected by screws 2; a threaded blind hole is provided at the wall of the semiconductor laser housing 5, and the unprocessed wall thickness between its bottom and the front of the semiconductor laser housing 5 is not less than 0.1mm, so as to prevent the threading process from damaging or interfering with the front structure of the semiconductor laser housing 5.

[0066] Preferably, the second through hole 12 is a countersunk through hole, and the nut of the screw 2 will be embedded in the countersunk through hole. The first interface 13 and the second interface 15 are set on the side of the cover plate 1, so that the back of the cover plate 1 is kept flat and easy to place on other workbenches. They are reasonably distributed according to functional requirements to ensure structural stability and installation reliability.

[0067] Furthermore, when the connection between the cover plate 1 and the semiconductor laser housing 5 is a snap-fit, the cover plate 1 is provided with a snap-fit ​​structure, and the semiconductor laser housing is provided with a matching slot structure. The snap-fit ​​structure can be inserted into and locked in the slot during assembly to form a quick assembly structure.

[0068] When the cover plate 1 and the semiconductor laser housing 5 are connected by riveting, the cover plate 1 and the semiconductor laser housing 5 are provided with through holes at corresponding positions, for inserting rivets and deforming and locking them through riveting equipment to form a non-removable connection, which is suitable for long-term use or application environments with high vibration resistance requirements.

[0069] When the cover plate 1 is connected to the semiconductor laser housing 5 by welding, a weldable contact surface is provided between the cover plate 1 and the semiconductor laser housing 5, and the connection is made by laser welding, spot welding, tin soldering or brazing; among them, brazing is preferred, which can achieve a permanent connection between the two components at a lower temperature and avoid damage to the internal components due to excessive heat input.

[0070] In some embodiments, the semiconductor laser housing 5 is provided with housing through holes 52, which are used to install specific connectors to achieve connection with external parts or structures of the heat dissipation device. When auxiliary installation is required through the cover plate 1, a first through hole 11 can be provided thereon. The number, distribution and size parameters of the first through hole 11 correspond to those of the housing through holes 52, so that the connectors can pass through the cover plate 1 and be fixed to the semiconductor laser housing 5.

[0071] The first through hole 11 and the housing through hole 52 can be configured as unthreaded through holes or threaded through holes. The number, distribution and size parameters of the first through hole 11 and the housing through hole 52 can be selected according to actual needs to meet different design and installation requirements.

[0072] In some embodiments, the front of the semiconductor laser housing 5 is provided with a plurality of chip placement platforms 55 arranged in a stepped manner, which allows multiple chips to be arranged in layers, which is beneficial for space utilization and multi-chip integration design; the upper surface of the chip placement platform 55 is parallel to the upper surface of the front of the semiconductor laser housing 5, which facilitates chip installation, bonding and thermal coupling, and improves the reliability and heat dissipation performance of multi-chip integration.

[0073] The semiconductor laser housing 5 has an optical path area 56 on the front side, which is used to install optical devices such as lenses, mirrors, and filters, so as to facilitate the shaping, collimation, guidance or coupling of the beam emitted by the laser, and meet the functional requirements of the optical path system in different application scenarios.

[0074] The semiconductor laser housing 5 has a connector 57, an optical fiber through-hole 58, and an optical fiber fixing hole 59 on its side. The connector 57 can stably supply power to the laser. The optical fiber through-hole 58 is used to extract the light beam emitted by the laser chip and transmit the optical signal to an external application device through the optical fiber. The optical fiber fixing hole 59 is provided around it to fix the position of the optical fiber and prevent the optical fiber from shaking, shifting, or falling off during operation, so as to ensure the stability of the light output direction and efficiency.

[0075] In some embodiments, the microchannel groove 53 is provided with flow-blocking ribs 54, which divide the microchannel groove 53 into multiple interconnected sub-grooves to increase the flow path of the cooling medium. Specifically, the flow-blocking ribs 54 extend along the centerline of the microchannel groove 53, with one end maintaining a distance from the inner wall of the end of the microchannel groove 53. This divides the microchannel groove 53 into two interconnected U-shaped flow channels, allowing the cooling medium to flow smoothly into one U-shaped flow channel and then into the other, finally flowing out of the heat dissipation device through the first interface 13 or the second interface 15, forming a continuous cooling series path and enhancing its heat exchange effect.

[0076] Preferably, the distances from both sides of the flow-blocking rib 54 to both sides of the inner wall of the microchannel groove 53 are equal.

[0077] In some embodiments, the microchannel groove 53 is provided with one or more groove step planes 533 distributed in a stepped manner, and the height difference between two adjacent groove step planes 533 is denoted as H, where H≥0; the projection area of ​​the groove step planes 533 in the vertical direction covers one or more chip placement platforms 55.

[0078] Furthermore, a plurality of micro ribs 531 are distributed on the groove stepped plane 533. The micro ribs 531 divide each groove stepped plane 533 into two or more micro channels 532, ensuring that the cooling working fluid can undergo more sufficient heat exchange when flowing through the micro channels 532, thereby further improving the heat dissipation efficiency.

[0079] Optionally, the stepped plane 533 of the groove is provided with a plurality of spaced microribs 531, and there is a gap between two adjacent microribs 531 and / or between the microribs 531 near the microchannel groove 53 and the inner wall of the microchannel groove 53 to form a microchannel 532.

[0080] Preferably, the number of chip placement platforms 55 corresponding to the groove stepped planes 533 are equal and parallel to them, and the width of the microchannels 532 is uniform. The line connecting the corner points 5331 of two adjacent groove stepped planes 533 is denoted as L1, and the line connecting the corner points 551 of two adjacent chip placement platforms 55 is denoted as L2. Lines L1 and L2 are parallel. This arrangement ensures that the groove stepped planes 533 correspond to the stepped layout of the chip placement platforms 55, allowing the groove stepped planes 533 to match the heat source area of ​​the semiconductor laser housing 5, thus optimizing the uniformity of the heat flow channel.

[0081] Preferably, the projection area of ​​the microchannel groove 53 in the vertical direction at least completely covers all the chip placement platforms 55. The interior of the microchannel groove 533 may be treated with microstructure surface treatment, such as nano-coating, laser etching or micro-hole spraying, to enhance fluid turbulence and further improve heat exchange efficiency.

[0082] Preferably, the distance between the groove stepped plane 533 and its corresponding chip placement platform 55 is minimized as much as possible while meeting the structural strength requirements, depending on the selected material, in order to improve the heat dissipation effect.

[0083] In some embodiments, the projected shape of the microribs 531 in the vertical direction can be at least one of rounded rectangles, parallelograms, circles, triangles, S-shapes, ellipses, teardrop-shaped shapes, or polygons, wherein the S-shape is a shape with a sine or cosine curve. The arrangement of the microribs 531 can be in a straight line or in a stacked arrangement, and their size, shape, spacing, and arrangement can be optimized according to actual cooling requirements to achieve the best heat conduction and hydrodynamic effects.

[0084] Furthermore, the in-line arrangement is easy to process and suitable for applications with low flow resistance requirements; the plug-in arrangement helps to enhance fluid turbulence and improve local heat transfer efficiency, making it suitable for high heat flux areas. Both arrangements can be flexibly selected according to actual heat dissipation needs to balance heat dissipation performance and flow pressure drop.

[0085] Furthermore, the cooling medium of the heat dissipation device can be selected according to specific needs. Common cooling media include water, ethylene glycol mixture, liquid nitrogen, molten salt solution, oil-based coolant or fluoride coolant, etc. Each cooling medium can provide different degrees of cooling effect under different temperature ranges and thermal management requirements.

[0086] Furthermore, the heat dissipation device can be connected to external equipment to ensure the circulation of the cooling medium, thereby forming a complete cooling system;

[0087] Furthermore, the heat dissipation device can be connected to an external temperature-controlled circulation pump to precisely control the coolant flow rate and temperature, thereby optimizing the heat dissipation effect;

[0088] Furthermore, the heat dissipation device can be connected to an external flow control valve to precisely adjust the flow rate of the cooling medium to meet the heat dissipation requirements of lasers with different power.

[0089] Furthermore, the cooling system can integrate micro sensors, including temperature sensors, flow sensors, and pressure sensors, to monitor in real time and adjust the flow rate through feedback control, thereby improving the overall heat dissipation efficiency.

[0090] Example

[0091] like Figures 1-2 As shown, this embodiment provides a heat dissipation device for a semiconductor laser, including a cover plate 1, screws 2, connectors 3, sealing gaskets 4, and a semiconductor laser housing 5. The cover plate 1 is fixed to the upper back of the semiconductor laser housing 5 by screws 2. The sealing gaskets 4 are pressed tightly between the cover plate 1 and the semiconductor laser housing 5 to ensure sealing. The connectors 3 are right-angle pagoda connectors, which are installed on the side of the cover plate 1 by threaded connection for the entry and exit of the cooling working fluid.

[0092] like Figure 3As shown, the cover plate 1 is provided with a first through hole 11, a second through hole 12, a first interface 13 and a second interface 15, and the front interior is provided with a gasket placement groove 16, a first cooling medium drainage hole 14 and a second cooling medium drainage hole 17; the first interface 13 and the second interface 15 are used to install the connector 3, and the gasket placement groove 16 is used to embed and position the gasket 4.

[0093] Specifically, such as Figure 4 As shown, the second through hole 12 has a countersunk structure so that the nut of the screw 2 can be inserted into it to maintain the flatness of the back of the cover plate 1.

[0094] like Figures 5-6 As shown, the first interface 13 is connected to the first cooling medium drainage hole 14, and the second interface 15 is connected to the second cooling medium drainage hole 17.

[0095] like Figures 7-10 As shown, the shape and size of the sealing gasket placement groove 16 inside the cover plate 1 match the sealing gasket 4 to ensure that the sealing gasket 4 can be correctly embedded in the sealing gasket placement groove 16. The depth of the sealing gasket placement groove 16 is slightly less than the thickness of the sealing gasket 4 so that the sealing gasket 4 can better fill the gap between the cover plate 1 and the semiconductor laser housing 5 under the pressure state.

[0096] Specifically, such as Figure 8 As shown, when the sealing gasket 4 is installed in the sealing gasket placement groove 16, due to the design of the internal structure of the cover plate 1, the sealing gasket 4 will block part of the first cooling medium drainage hole 14, but it will not affect the normal entry or exit of the cooling medium into the heat dissipation device.

[0097] like Figures 11-13 As shown, the semiconductor laser housing 5 is provided with a housing threaded hole 51 and a housing through hole 52. The front is provided with a number of stepped chip placement platforms 55 and an optical path area 56. The right side is provided with a connector 57. The left side is provided with an optical fiber through hole 58 and symmetrically distributed optical fiber fixing holes 59. The back is provided with a microchannel groove 53.

[0098] The threaded holes 51 in the housing are partially threaded through holes at the edge of the semiconductor laser housing 5, and threaded blind holes in other areas to avoid damaging the front structure. The number, distribution, and size parameters of the threaded holes 51 in the housing correspond to those of the second through holes 12, and the cover plate 1 and the semiconductor laser housing 5 are connected and fixed by screws 2. The number, distribution, and size parameters of the through holes 52 in the housing correspond to those of the first through holes 11, and they are used together to install parts or structures outside the heat dissipation device.

[0099] The upper surface of the chip placement platform 55 is parallel to the upper surface of the front of the semiconductor laser housing 5, and each platform can install one or more chips; the optical path area 56 can install optical devices or other auxiliary functional devices to adjust the beam and ensure the alignment accuracy of the beam output direction; the connector 57 is used to power the semiconductor laser; the fiber optic through hole 58 is used to guide the beam output by the semiconductor laser to external devices; the fiber optic fixing hole 59 has a threaded structure and is located on both sides of the fiber optic through hole 58 to securely fix the position of the fiber and prevent it from shifting during operation;

[0100] The microchannel groove 53 has stepped groove planes 533 arranged in a stepped manner. Microribs 531 are vertically arranged on the stepped groove planes 533. Microchannels 532 with uniform width are formed between the microribs 531 or between the microribs 531 and the inner wall of the microchannel groove 53. A flow-blocking rib 54 is provided in the middle of the microchannel groove 53. It is arranged along the extension direction of the microchannel groove 53. One end of the flow-blocking rib 54 is connected to the back of the semiconductor laser housing 5, and the other end terminates in front of the right inner wall of the microchannel groove 53. It is used to separate the inflow and outflow of cooling medium, forming two U-shaped flow channels in series. The cooling medium can flow through the two U-shaped flow channels in sequence and carry away the heat before flowing out from the first interface 13 or the second interface 15.

[0101] Specifically, such as Figure 14 As shown, the blue line indicates the location of the groove stepped plane 533, and the red line indicates the location of the chip placement platform 55. The corner points 5331 of the groove stepped plane are connected in sequence to form a straight line L1, and the corner points 551 of the chip placement platform are connected in sequence to form a straight line L2. Since the number of chip placement platforms 55 corresponding to each groove stepped plane 533 is the same and parallel to it, and the vertical height between adjacent groove stepped planes 533 is a uniform constant value, the straight lines L1 and L2 remain parallel, thereby ensuring that the stepped layout of the groove stepped plane 533 and the chip placement platform 55 matches, which is beneficial to optimizing the heat dissipation effect.

[0102] like Figure 15 As shown, the projection shape of the microrib 531 in the vertical direction can be a rounded rectangle, parallelogram, circle, triangle, S-shape, ellipse, teardrop shape or polygon, where the S-shape is a shape with a sine curve or cosine curve.

[0103] like Figures 16-17 As shown, the projection of the microribbed column 531 onto the stepped plane 533 of the groove is rectangular. Specifically, Figure 16 The arrangement of the microribs 531 in a sequential manner ensures that the flow velocity of the cooling medium is relatively uniform when it flows through the microchannels, reducing dead zones or turbulent zones in the flow and effectively improving the overall heat transfer efficiency. Figure 17The arrangement of the micro-ribs 531 can increase the flow disturbance, thereby improving the heat exchange efficiency between the coolant and the heat source; the arrow direction indicates the flow direction of the coolant in the microchannel groove 53, and the flow direction of the coolant can also be from left to right or perpendicular to the flow direction shown; the coolant is selected from one of the following: water, ethylene glycol mixture, liquid nitrogen, molten salt solution, oil coolant or fluoride coolant.

[0104] Working Principle: This embodiment provides a heat dissipation device for a semiconductor laser. In use, a right-angle pagoda connector serves as connector 3, which is threaded onto the first interface 13 and the second interface 15 on the side of the cover plate 1. The cover plate 1 is fixed to the back of the semiconductor laser housing 5 by screws 2. The cooling medium can flow in from the first interface 13 or the second interface 15. Specifically, the first interface 13 is connected to the first cooling medium drainage hole 14, and the second interface 15 is connected to the second cooling medium drainage hole 17. The cooling medium can flow sequentially through the first interface 13 (or the second interface 15) and the first cooling medium drainage hole 14 (or the second cooling medium drainage hole 17), and then enter the microchannel groove 53 inside the semiconductor laser housing 5. It flows along the microchannel 532, carrying away heat, and then flows sequentially through the second cooling medium drainage hole 17 (or the first cooling medium drainage hole 14) and the second interface 15 (or the first interface 13). Finally, it flows out from the heat dissipation device through connector 3, thereby achieving efficient heat dissipation.

[0105] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from its technical solution shall still fall within the protection scope of this utility model.

Claims

1. A heat dissipation device for a semiconductor laser, characterized in that, It includes a semiconductor laser housing (5) and a cover plate (1) disposed on the semiconductor laser housing (5), which together form a cooling working fluid flow space; The semiconductor laser housing (5) has a microchannel groove (53) on the side near the cover plate (1); The cover plate (1) is provided with a first cooling medium drainage hole (14) and a second cooling medium drainage hole (17) on the side near the semiconductor laser housing (5); the first cooling medium drainage hole (14) and the second cooling medium drainage hole (17) are respectively connected to the first interface (13) and the second interface (15) provided on the cover plate (1).

2. The heat dissipation device for a semiconductor laser according to claim 1, characterized in that, The semiconductor laser housing (5) has several chip placement platforms (55) and an optical path area (56) on the side away from the cover plate (1), and a connector (57), an optical fiber through hole (58) and an optical fiber fixing hole (59) on the side. Several chip placement platforms (55) are arranged in a stepped manner. The upper surface of each chip placement platform (55) is parallel to the upper surface of the semiconductor laser housing (5) on the side away from the cover plate (1). Each chip placement platform (55) installs and fixes one or more chips to achieve multi-chip integration. The optical path area (56) is used to install optical devices for adjusting and transmitting the beam. The connector (57) is used to guide the transmission current to power the semiconductor laser; The fiber optic through-hole (58) guides the beam output from the semiconductor laser to an external device through the optical fiber. The fiber optic fixing holes (59) are distributed around the fiber optic through-hole (58) to fix the position of the optical fiber and can effectively prevent the optical fiber from shifting during operation.

3. The heat dissipation device for a semiconductor laser according to claim 1, characterized in that, The first interface (13) and the second interface (15) are connected to a connector (3), both of which can serve as the inlet or outlet of the cooling medium. The cooling medium flows into the microchannel groove (53) through either interface for flow and heat exchange, and then flows out from the other interface.

4. A heat dissipation device for a semiconductor laser according to claim 1, characterized in that, The semiconductor laser housing (5) and the cover plate (1) are connected by threaded connection, snap-fit ​​connection, riveting connection or welding connection.

5. A heat dissipation device for a semiconductor laser according to claim 4, characterized in that, When the cover plate (1) and the semiconductor laser housing (5) are connected by threads, the cover plate (1) is provided with a second through hole (12), which is either a threadless through hole or a threaded through hole; the semiconductor laser housing (5) is provided with a housing threaded hole (51), which is either a threaded through hole or a threaded blind hole; the number, distribution and geometric parameters of the second through hole (12) and the housing threaded hole (51) correspond to each other, and the screw (2) passes through the second through hole (12) in sequence and is screwed into the housing threaded hole (51) to fix the cover plate (1) and the semiconductor laser housing (5); the number, distribution and size parameters of the housing threaded hole (51) and the second through hole (12) are adjusted according to actual needs; When the cover plate (1) is connected to the semiconductor laser housing (5) by a snap-fit, the relative positions of the cover plate (1) and the semiconductor laser housing (5) are provided with complementary snap-fit ​​structures; When the cover plate (1) and the semiconductor laser housing (5) are connected by riveting, the cover plate (1) and the semiconductor laser housing (5) are provided with through holes at corresponding positions for placing rivets to achieve riveting fixation; When the cover plate (1) is connected to the semiconductor laser housing (5) by welding, a weldable contact surface is provided between the cover plate (1) and the semiconductor laser housing (5), and a fixed connection is achieved by welding.

6. A heat dissipation device for a semiconductor laser according to claim 4, characterized in that, When the semiconductor laser housing (5) and the cover plate (1) are connected by thread, snap or riveting, a sealing gasket (4) is provided between the cover plate (1) and the semiconductor laser housing (5). The cover plate (1) or the semiconductor laser housing (5) is provided with a sealing gasket placement groove (16) for embedding and positioning the sealing gasket (4). The sealing gasket (4) has a cutout (41) corresponding to the shape and contour of the microchannel groove (53).

7. A heat dissipation device for a semiconductor laser according to claim 1, characterized in that, The microchannel groove (53) is provided with flow-blocking ribs (54), which divide the microchannel groove (53) into multiple interconnected sub-grooves to increase the flow path of the cooling working fluid.

8. A heat dissipation device for a semiconductor laser according to claim 1, characterized in that, The microchannel groove (53) has one or more stepped groove planes (533) arranged in a stepped manner. The height difference between two adjacent stepped groove planes (533) is denoted as H, where H≥0. The projection area of ​​each stepped groove plane (533) in the vertical direction covers one or more chip placement platforms (55).

9. A heat dissipation device for a semiconductor laser according to claim 8, characterized in that, The groove stepped plane (533) is provided with a plurality of spaced micro ribs (531), and the space between two adjacent micro ribs (531) and / or between the micro ribs (531) near the microchannel groove (53) and the inner wall of the microchannel groove (53) constitutes a microchannel (532).

10. A heat dissipation device for a semiconductor laser according to claim 9, characterized in that, The projection shape of the microrib (531) in the vertical direction is at least one of the following: rounded rectangle, parallelogram, circle, triangle, S-shape, ellipse, teardrop shape or polygon. The microribs (531) are arranged in a linear or interlocking manner.

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