Intelligent audio wireless transmitter

Abstract

The utility model relates to the field of audio transmission equipment, and discloses an intelligent audio wireless transmitter, which comprises an upper cover, a box body and a hinge piece air channel, the inside of the hinge piece air channel is divided into a plurality of small air channels by hinge pieces, a plurality of heat conduction hinge pieces are fixed on two sides of the hinge piece air channel, and the heat conduction hinge pieces and outer side module heat dissipation hinge pieces are provided with corresponding pin holes and are connected in series and fixed through threaded pin rods. And the transverse position of the module radiating fin can be adjusted along the pin hole. The height and the number of the transverse plates are adjusted through the plugs and the jacks of the longitudinal plates, and the connecting plates are rotatable, so that the heat dissipation and fixing structure is adaptive to mainboards and chips of different models and sizes, and resource waste caused by exclusive customization is avoided. The small air channels can increase the heat dissipation area, the fan and the air inlet and outlet grids form a convection air path, heat conduction fins, module heat dissipation fins and heat conduction pastes are matched, heat of a mainboard chip can be rapidly conducted out, and stable operation of equipment is guaranteed. In addition, the dustproof net can be drawn out from the bottom of the box body to be cleaned, the module heat dissipation fins are quickly disassembled and assembled through nuts, and later maintenance and component replacement are facilitated.

Description

Technical Field

[0001] This utility model belongs to the technical field of audio transmission equipment, specifically, it relates to an intelligent audio wireless transmitter. Background Technology

[0002] During the use of intelligent audio wireless transmitters, the internal motherboard and chips generate a significant amount of heat, requiring a cooling system to ensure stable operation. Currently, the cooling components of most intelligent audio wireless transmitters are custom-designed, meaning the position and size of the heatsink are perfectly matched to specific motherboard and chip models. However, the technology in today's electronic devices field is rapidly evolving. After motherboard models are upgraded or chip positions are adjusted, existing cooling components become unusable due to poor compatibility, necessitating replacement with entirely new components, resulting in significant resource waste. Furthermore, the current motherboard mounting structure lacks flexibility, only accommodating motherboards of a single shape and size. When replacing with motherboards of different specifications, the mounting structure must be modified accordingly, further increasing usage costs and operational complexity. Utility Model Content

[0003] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by this utility model is as follows:

[0004] The intelligent audio wireless transmitter includes a top cover, a housing, and a heat-conducting duct. The heat-conducting duct is divided into several smaller ducts by heat-conducting plates. Several heat-conducting plates are fixedly connected to both sides of the heat-conducting duct. Several pin holes are correspondingly opened on the heat-conducting plates. Threaded pins are movably sleeved inside the pin holes. Modular heat-dissipating plates are provided on the outer side of the heat-conducting plates. The side of the modular heat-dissipating plates opposite to the heat-conducting plates has a pin hole. The pin holes correspond to the pin holes on the heat-conducting plates and are fixed in series by threaded pins.

[0005] In a preferred embodiment of the present invention, connecting plates are movably installed at the four corners of the blade air duct. A through hole is opened at one end of the outer side of the connecting plate, and a tightening bolt is movably sleeved inside the through hole. A spring is sleeved on the upper end of the rod of the tightening bolt.

[0006] In a preferred embodiment of this utility model, a longitudinal plate is provided below the connecting plate, and threaded sleeves are fixedly connected to both ends of the longitudinal plate. The threaded sleeves correspond to the screws at the lower end of the tightening bolts and are threadedly connected to them. Several insertion holes are provided on the plate body of the longitudinal plate.

[0007] In a preferred embodiment of this utility model, a horizontal plate is provided at the upper end of the vertical plate, a buffer pad is fixedly installed on the upper surface of the horizontal plate, and a plurality of plugs are fixedly connected to the lower surface of the horizontal plate. The plugs correspond to the sockets and are plugged in.

[0008] In a preferred embodiment of this utility model, air inlet and outlet grilles are provided on both sides of the box body, and a fixed frame is fixedly connected to the inside of the box body near the air inlet and outlet grilles. A sliding groove is provided on the inner side of the fixed frame, and a dustproof net is slidably installed in the sliding groove. A fan is fixedly installed on the inner side of the fixed frame, with the outer side of the fan corresponding to the dustproof net and the inner side of the fan corresponding to the end of the blade air duct.

[0009] In a preferred embodiment of this utility model, a slot is provided at the bottom of the box body. The position and specifications of the slot correspond to the width and thickness of the dustproof mesh and are movably connected to it. Several antennas and connection slots are installed on the back side of the box body, and an indicator light is installed on the front of the box body.

[0010] In a preferred embodiment of this utility model, a motherboard is fixedly installed in the middle of the interior of the box by bolts. The motherboard is installed between the horizontal plate and the heat sink air duct. A thermal pad is fixedly connected to the lower surface of the heat sink air duct. The position of the main chip on the surface of the motherboard corresponds to the position of the heat sink air duct and the module heat sink.

[0011] In a preferred embodiment of this utility model, a display and control keys are installed on the top cover. The top cover corresponds to and is fastened to the opening at the top of the box. The display, control keys, antenna, connection slot and fan are all electrically connected to the motherboard.

[0012] Compared with the prior art, the present invention has the following advantages:

[0013] High adaptability: The module heat sink can be adjusted in lateral position via threaded pins, and the height and number of horizontal plates can be adjusted by the cooperation of plugs and vertical plate holes. The connecting plate can be rotated to adapt to the installation angle of the vertical plate, realizing the adaptation of heat dissipation structure and fixing structure to motherboards and chips of different models and sizes, avoiding the waste of resources caused by exclusive customization.

[0014] Highly efficient heat dissipation: The small air ducts inside the heat sink increase the heat dissipation area. The fan and the air intake and exhaust grilles form a convection airflow path. With the help of thermal pads, module heat sinks and thermal pads, the heat generated by the motherboard chip can be quickly dissipated, ensuring stable operation of the equipment.

[0015] Easy to install and disassemble: The dust filter can be pulled out from the bottom of the box for cleaning, the module heat sink can be quickly installed and removed with nuts, and the main board is double-fixed with a horizontal plate and bolts, which facilitates later maintenance and component replacement.

[0016] The specific embodiments of this utility model will be described in further detail below with reference to the accompanying drawings. Attached Figure Description

[0017] In the attached diagram:

[0018] Figure 1 A 3D schematic diagram of the overall appearance of the intelligent audio wireless transmitter;

[0019] Figure 2 A schematic diagram of the internal structure of an intelligent audio wireless transmitter;

[0020] Figure 3 This is a bottom-view diagram of the intelligent audio wireless transmitter.

[0021] Figure 4 This is a schematic diagram illustrating the module installation process for a smart audio wireless transmitter.

[0022] Figure 5 A bottom view of the fixed structure of an intelligent audio wireless transmitter;

[0023] Figure 6 This is an enlarged schematic diagram of the fixed crossbar of an intelligent audio wireless transmitter.

[0024] In the diagram: 1. Antenna; 2. Top cover; 3. Indicator light; 4. Control key; 5. Box body; 6. Display; 7. Air inlet / outlet grille; 8. Mounting bracket; 9. Heat sink duct; 10. Main board; 11. Module heat sink fins; 12. Dust filter; 13. Fan; 14. Vertical plate; 15. Connecting plate; 16. Thermal conductive fins; 17. Tightening bolt; 18. Spring; 19. Threaded pin; 20. Buffer pad; 21. Threaded sleeve; 22. Socket; 23. Horizontal plate; 24. Plug. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate this utility model.

[0026] like Figures 1 to 6 As shown, the intelligent audio wireless transmitter includes a top cover 2, a housing 5, and a heat-conducting duct 9. The heat-conducting duct 9 is divided into several smaller ducts by heat-conducting plates. Several heat-conducting plates 16 are fixedly connected to both sides of the heat-conducting duct 9. Several pin holes are opened on the heat-conducting plates 16, and threaded pins 19 are movably sleeved inside the pin holes. Modular heat-dissipating plates 11 are provided on the outside of the heat-conducting plates 16. A pin hole is opened on the side of the modular heat-dissipating plate 11 opposite to the heat-conducting plate 16. The pin hole corresponds to the pin hole on the heat-conducting plate 16 and is fixed in series by the threaded pins 19.

[0027] In this setup, the heat dissipation contact area can be expanded by separating small air channels with heat-conducting heat plates 16. Heat conduction is achieved by heat-conducting heat plates 16. The threaded pin 19 can not only fix the module heat dissipation heat plates 11 and the heat-conducting heat plates 16 in series, but also adjust the lateral position of the module heat dissipation heat plates 11 by loosening the nut, so that the module heat dissipation heat plates 11 can be accurately aligned with chips in different positions on the motherboard 10, improving the targeting of heat conduction, adapting to motherboards with different chip distributions, and avoiding the waste of resources of dedicated heat dissipation components.

[0028] like Figures 1 to 6 As shown, in a specific embodiment, a connecting plate 15 is movably installed at each of the four corners of the air duct 9. A through hole is opened at one end of the outer side of the connecting plate 15, and a tightening bolt 17 is movably sleeved inside the through hole. A spring 18 is sleeved on the upper end of the rod of the tightening bolt 17.

[0029] In this setup, the movable installation of the connecting plate 15 allows for flexible adjustment of the installation angle of the longitudinal plate 14, adapting to the fixing requirements of different sized mainboards 10; the tightening bolt 17 cooperates with the threaded sleeve 21 to achieve detachable fixing of the connecting plate 15 and the longitudinal plate 14; the spring 18 can provide buffer pressure during the tightening process to prevent excessive fixing force from squeezing and damaging the mainboard 10, while also offsetting the impact of equipment vibration on the connection structure and enhancing the fixing stability.

[0030] like Figures 1 to 6 As shown, in a specific embodiment, a longitudinal plate 14 is provided below the connecting plate 15. Threaded sleeves 21 are fixedly connected to both ends of the longitudinal plate 14. The threaded sleeves 21 correspond to the screws at the lower end of the tightening bolts 17 and are threadedly connected to them. Several insertion holes 22 are provided on the plate body of the longitudinal plate 14.

[0031] In this configuration, the threaded sleeve 21 provides a threaded connection point for the tightening bolt 17, thereby achieving a stable connection between the longitudinal plate 14 and the connecting plate 15. The multiple insertion holes 22 on the longitudinal plate 14 can provide different heights and spacings for the horizontal plate 23 according to the thickness and size of the main plate 10, so that the horizontal plate 23 can accurately support the main plate 10 and improve the adaptability of the fixing structure to main plates of different specifications.

[0032] like Figures 1 to 6 As shown, in a specific embodiment, a horizontal plate 23 is provided at the upper end of the vertical plate 14. A buffer pad 20 is fixedly installed on the upper surface of the horizontal plate 23, and a plurality of plugs 24 are fixedly connected to the lower surface of the horizontal plate 23. The plugs 24 correspond to the sockets 22 and are plugged into them.

[0033] In this setup, the plug 24 and socket 22 can be easily and quickly added or removed from the number of horizontal plates 23 and the position of the horizontal plates 23 can be adjusted to meet the support requirements of motherboards 10 of different sizes. The buffer pad 20 can form a flexible contact between the motherboard 10 and the horizontal plate 23, avoiding scratches caused by hard collisions during motherboard installation, while reducing the impact of vibration on the motherboard 10 during equipment operation and protecting the motherboard components.

[0034] like Figures 1 to 6 As shown, in a specific embodiment, air inlet and outlet grilles 7 are provided on both sides of the box body 5. A fixed frame 8 is fixedly connected to the inside of the box body 5 near the air inlet and outlet grilles 7. A sliding groove is provided on the inner side of the fixed frame 8. A dustproof net 12 is slidably installed in the sliding groove. A fan 13 is fixedly installed on the inner side of the fixed frame 8. The outer side of the fan 13 corresponds to the dustproof net 12, and the inner side of the fan 13 corresponds to the end of the blade air duct 9.

[0035] In this configuration, the air intake and exhaust grille 7 provides an intake and exhaust channel for airflow, forming a convection airflow path in conjunction with the fan 13; the sliding groove of the mounting bracket 8 facilitates the quick installation and removal of the dust filter 12, which can filter dust and impurities in the air and prevent dust from adhering to the motherboard 10 and heat dissipation components, thus affecting heat dissipation efficiency; the fan 13 accelerates airflow circulation, quickly carrying the heat from the heat sink air duct 9 and the heat sink fins out of the box, improving the overall heat dissipation speed.

[0036] like Figures 1 to 6 As shown, in a specific embodiment, a slot is provided at the bottom of the box body 5. The position and specifications of the slot correspond to the width and thickness of the dustproof mesh 12 and are movably connected to it. Several antennas 1 and connection slots are installed on the back side of the box body 5, and an indicator light 3 is installed on the front of the box body 5.

[0037] In this setup, the slot at the bottom of the housing provides support and a removal channel for the dust filter 12, making it easy to pull out the dust filter from the bottom for cleaning or replacement, reducing maintenance difficulty; the antenna 1 is used to enhance the reception and transmission capabilities of wireless audio signals and ensure transmission stability; the indicator light 3 can intuitively display the device's operating status (such as power on / off, signal strength, fault prompts, etc.), making it easy for users to quickly understand the device's status.

[0038] like Figures 1 to 6 As shown, in a specific embodiment, a motherboard 10 is fixedly installed in the middle of the interior of the box 5 by bolts. The motherboard 10 is installed between the horizontal plate 23 and the heat sink duct 9. A thermal pad is fixedly connected to the lower surface of the heat sink duct 9. The position of the main chip on the surface of the motherboard 10 corresponds to the position of the heat sink duct 9 and the module heat sink 11.

[0039] In this setup, the motherboard 10 is installed between the horizontal plate and the chip airflow channel, which provides stable support through the horizontal plate and allows the chip to be close to the heat dissipation structure. The thermal pad can fill the gap between the chip and the chip airflow channel, improve heat conduction efficiency, and ensure that the chip's heat is quickly transferred to the heat dissipation component. The chip and the heat dissipation component are positioned to avoid heat accumulation on the chip surface and ensure the stable operation of the motherboard 10.

[0040] like Figures 1 to 6 As shown, in a specific embodiment, a display 6 and control keys 4 are installed on the upper cover 2. The upper cover 2 corresponds to the opening at the upper end of the box 5 and is fastened to it. The display 6, control keys 4, antenna 1, connection slot and fan 13 are all electrically connected to the motherboard 10.

[0041] In this setup, the snap-fit ​​structure between the top cover and the housing facilitates quick and easy disassembly and assembly, making it convenient to inspect internal components; the display 6 can display device parameters in real time (such as operating frequency, audio signal strength, heat dissipation temperature, etc.), and the control keys 4 are used to adjust device functions (such as signal channel switching, volume adjustment, etc.), improving ease of operation; all components are electrically connected to the motherboard to ensure coordinated operation of device functions, realizing the integration of intelligent control and wireless audio transmission.

[0042] The implementation principle of the intelligent audio wireless transmitter in this embodiment is as follows:

[0043] The usage process of this utility model:

[0044] When the device is running, the heat generated by the motherboard 10 chip is transferred to the heat sink duct 9 and the module heat sink 11 through the thermal pad. The temperature of the module heat sink 11 is conducted to the heat sink duct 9 through the thermal pad 16. When the fan 13 starts, the outside air enters the box 5 after being filtered by the air inlet and outlet grille 7 and the dust filter 12. The airflow passes through the small air duct gap of the heat sink duct 9 and exhausts the heat from the air inlet and outlet grille 7 on the other side.

[0045] When the motherboard 10 needs to be replaced, loosen the top cover 2, remove the motherboard 10 fixing bolts, and adjust according to the size of the new motherboard: loosen the threaded pin 19 nut to move the position of the module heat sink 11, adjust the plug 24 of the horizontal plate 23 to insert into the socket 22 of the vertical plate 14, rotate the connecting plate 15 to adjust the angle of the vertical plate 14, and re-fix it after ensuring that the new motherboard chip and heat sink are aligned.

[0046] During regular maintenance, remove the dust filter 12 from the slot at the bottom of the housing 5, clean the surface dust, and reinsert it. If the module heat sink 11 is damaged, simply loosen the nut to replace it quickly.

Claims

1. An intelligent audio wireless transmitter, comprising a top cover (2), a housing (5), and a heat exchange duct (9), characterized in that: The air duct (9) is divided into several small air ducts by air ducts. Several heat-conducting air ducts (16) are fixedly connected to both sides of the air duct (9). Several pin holes are opened on the heat-conducting air ducts (16). Threaded pins (19) are movably sleeved inside the pin holes. Module heat dissipation air ducts (11) are provided on the outside of the heat-conducting air ducts (16). A pin hole is opened on the side of the module heat dissipation air duct (11) opposite to the heat-conducting air ducts (16). The pin hole corresponds to the pin hole on the heat-conducting air duct (16) and is fixed in series by the threaded pins (19).

2. The intelligent audio wireless transmitter according to claim 1, characterized in that, Connecting plates (15) are movably installed at the four corners of the air duct (9). A through hole is opened at one end of the outer side of the connecting plate (15). A tightening bolt (17) is movably sleeved inside the through hole. A spring (18) is sleeved on the upper end of the rod of the tightening bolt (17).

3. The intelligent audio wireless transmitter according to claim 2, characterized in that, A longitudinal plate (14) is provided below the connecting plate (15). Both ends of the longitudinal plate (14) are fixedly connected with threaded sleeves (21). The threaded sleeves (21) correspond to the screw at the lower end of the tightening bolt (17) and are threadedly connected to it. Several insertion holes (22) are provided on the plate body of the longitudinal plate (14).

4. The intelligent audio wireless transmitter according to claim 3, characterized in that, A horizontal plate (23) is provided at the upper end of the vertical plate (14). A buffer pad (20) is fixedly installed on the upper surface of the horizontal plate (23). Several plugs (24) are fixedly connected to the lower surface of the horizontal plate (23). The plugs (24) correspond to the sockets (22) and are plugged in.

5. The intelligent audio wireless transmitter according to claim 1, characterized in that, The box body (5) has air inlet and outlet grilles (7) on both sides. A fixed frame (8) is fixedly connected inside the box body (5) near the air inlet and outlet grilles (7). A sliding groove is provided on the inner side of the fixed frame (8). A dustproof net (12) is slidably installed in the sliding groove. A fan (13) is fixedly installed on the inner side of the fixed frame (8). The outer side of the fan (13) corresponds to the dustproof net (12), and the inner side of the fan (13) corresponds to the end of the blade air duct (9).

6. The intelligent audio wireless transmitter according to claim 5, characterized in that, The bottom of the box (5) is provided with a slot, the position and specifications of which correspond to the width and thickness of the dustproof net (12) and are movably connected to it. Several antennas (1) and connecting slots are installed on the back side of the box (5), and indicator lights (3) are installed on the front of the box (5).

7. The intelligent audio wireless transmitter according to claim 6, characterized in that, The motherboard (10) is fixedly installed in the middle of the box (5) by bolts. The motherboard (10) is installed between the horizontal plate (23) and the heat sink duct (9). A thermal pad is fixedly connected to the lower surface of the heat sink duct (9). The position of the main chip on the surface of the motherboard (10) corresponds to the position of the heat sink duct (9) and the module heat sink duct (11).

8. The intelligent audio wireless transmitter according to claim 1, characterized in that, The top cover (2) is equipped with a display (6) and control keys (4). The top cover (2) corresponds to the opening at the top of the box (5) and is fastened to it. The display (6), control keys (4), antenna (1), connection slot and fan (13) are all electrically connected to the motherboard (10).

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