Light source device

Abstract

The utility model relates to a light source device. The light source device comprises a substrate, a light-emitting chip and a lens. The substrate is provided with a front die bonding area and a side electrode area, and the side electrode area is electrically connected with the front die bonding area. The light-emitting chip is arranged in the front die bonding area. The lens is arranged on the front face of the substrate and covers the light-emitting chip, an exposed edge area is formed on the front face of the substrate, the edge area comprises two opposite side clamping areas, and the front face die bonding area and the side face electrode area are both located between the two side clamping areas. According to the light source device, the front die bonding area is arranged on the front face of the substrate, the light-emitting chip and the lens can be directly integrated on the substrate to form the light source device, and the two opposite side clamping areas are reserved on the front face of the substrate, so that the light source device can be laterally clamped and inserted into the clamping groove, and lateral installation of the light source device is achieved; in other words, the light source device with a large lens can be laterally installed only through the substrate of the light source device, an external substrate is not needed, and the requirement for lateral installation is met.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, and in particular to a light source device. Background Technology

[0002] In some side-illumination applications, the lenses of the light source devices are relatively large. The center of gravity of the side-mounted light source device is located on the lens, requiring a substrate for side mounting to prevent tipping. Specifically, the pins or pads at the bottom of the light source device are first fixed to the front of the substrate. The substrate has pads on its side. The substrate is then vertically inserted into a slot, with its front side facing upwards and the pads on its side facing upwards. For electrical connection of the light source device, a spring contact is provided on the circuit board. The spring contact elastically abuts against the pad, allowing the circuit board to control the light emission of the light source device, achieving side illumination. Although traditional technologies include side-mounted surface mount devices, whose side electrodes can be soldered to a horizontal circuit board for side mounting, when the lens of a side-mounted surface mount device is large and the center of gravity is located on the lens, the lens end is prone to tilting downwards under gravity, and may even loosen or detach. Clearly, light source devices with large lenses cannot meet the requirements for side mounting without an external substrate. Summary of the Invention

[0003] Therefore, it is necessary to provide a light source device that addresses the problem that light source devices with large lenses cannot meet the requirements for lateral mounting without the aid of an external substrate.

[0004] A light source device, comprising:

[0005] A substrate having a front die-bonding region and a side electrode region, wherein the side electrode region is electrically connected to the front die-bonding region;

[0006] A light-emitting chip, wherein the light-emitting chip is disposed on the front die-bonding region; and

[0007] A lens is disposed on the front side of the substrate, covering the light-emitting chip, and forming an exposed edge region on the front side of the substrate. The edge region includes two opposing side-mounted areas, and the front die-bonding area and the side electrode area are both located between the two side-mounted areas.

[0008] In one embodiment, the light source device further includes: an adhesive layer bonded between the front side of the substrate and the lens; the substrate also has an anti-overflow area surrounding the front die-bonding area and located between the two side-mounted areas, and the adhesive layer is disposed in the anti-overflow area.

[0009] In one embodiment, the spill prevention area is formed by a plurality of spill prevention rings and a groove between adjacent spill prevention rings.

[0010] In one embodiment, the plurality of anti-overflow rings include a first anti-overflow ring and a second anti-overflow ring from the inside out, with a first groove formed between the first anti-overflow ring and the second anti-overflow ring; the lens has a cavity, with the bottom edge of the cavity wall corresponding to the first groove; the adhesive layer includes a connected main body portion and an overflow portion, the main body portion filling the first groove and connecting to a portion of the bottom surface of the lens, the overflow portion extending into the cavity along the cavity wall and connecting to a portion of the cavity wall.

[0011] In one embodiment, the adhesive layer further includes an overflow portion that is connected to the main body portion and adhered between the top surface of the second anti-overflow ring and a portion of the bottom surface of the lens.

[0012] In one embodiment, the bottom edge of the cavity wall is rounded or chamfered.

[0013] In one embodiment, the substrate includes a plate body and a metal pattern, the metal pattern being disposed on the surface of the plate body and including the plurality of anti-overflow rings and the front die-bonding area, the plurality of anti-overflow rings and the front die-bonding area being formed by etching the same metal layer.

[0014] In one embodiment, the substrate further has a back electrode region connected to the side electrode region; the light source device further includes a conductor, at least a portion of which is inserted into the substrate and connects the back electrode region and the front die-bonding region, respectively.

[0015] In one embodiment, the edge region further includes two opposing avoidance zones, each of the avoidance zones connecting the two side card zones respectively.

[0016] In one embodiment, the substrate includes a plate body and a metal pattern, the metal pattern being disposed on the surface of the plate body and including the side electrode area, the side electrode area being formed by side electrode sheets; a limiting groove is formed on the side of the plate body, the side electrode sheets are located in the limiting groove, the limiting groove having two opposing limiting sides, the two limiting sides being used to limit the two sides of the side electrode sheets.

[0017] The aforementioned light source device, by setting a front die-bonding area on the front side of the substrate, which is electrically connected to the side electrode area, allows for the direct integration of a light-emitting chip and a lens onto the substrate, forming a light source device. Two opposing side-mounting areas are reserved on the front side of the substrate, enabling the light source device to be inserted into a slot, thus achieving lateral mounting. This means that a light source device with a large lens can be laterally mounted using only its own substrate, without the need for an external substrate, meeting the requirements for lateral mounting. Simultaneously, the lens does not interfere with the substrate's insertion, reducing the probability of lens damage or detachment due to interference between the lens and the slot. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a light source device in one embodiment of this application.

[0019] Figure 2 for Figure 1 Exploded view of the light source device.

[0020] Figure 3 for Figure 1 Top view of the light source device after it is assembled in the card slot.

[0021] Figure 4 for Figure 1 A top view of the light source device.

[0022] Figure 5 for Figure 1 A bottom view of the light source device.

[0023] Figure 6 for Figure 4 A cross-sectional view of the light source device along line II.

[0024] Figure 7 for Figure 2 A schematic diagram of the substrate structure of the light source device.

[0025] Explanation of reference numerals in the attached figures:

[0026] 100 - Light source device; 110 - Substrate; 111 - Connecting hole; 112 - Anti-overflow area; 113 - Anti-overflow ring; 114 - Groove; 115 - First anti-overflow ring; 116 - Second anti-overflow ring; 117 - First groove; 118 - Third anti-overflow ring; 119 - Limiting groove; 120 - Light-emitting chip; 122 - Anti-static chip; 130 - Lens; 132 - Cavity; 140 - Front die-bonding area; 142 - Front positive electrode; 144 - Front negative electrode; 150 - Side electrode area; 152 - Side positive electrode; 154 - Side negative electrode; 160 - Edge area; 162 - Side card area; 164 - Avoidance area; 170 - Card slot; 172 - Slot; 180 - Back electrode area; 182 - Back positive electrode; 184 - Back negative electrode; 186 - Conductor; 190 - Adhesive layer; 192 - Main body; 194 - Inner overflow part; 196 - Outer overflow part; 200 - Plate body; 202 - Metal pattern; 204 - Limiting side. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0029] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0030] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0031] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0033] Please see Figures 1 to 3 , Figure 1 A schematic diagram of the structure of a light source device in one embodiment of this application is shown. Figure 2 It shows Figure 1 Exploded view of the light source device. Figure 3 It shows Figure 1 A top view of the light source device after it is assembled in the slot. One embodiment of this application provides a light source device 100, including a substrate 110, a light-emitting chip 120, and a lens 130. The substrate 110 has a front die-bonding region 140 and a side electrode region 150, which are electrically connected to the front die-bonding region 140. The light-emitting chip 120 is disposed on the front die-bonding region 140. The lens 130 is disposed on the front side of the substrate 110, covering the light-emitting chip 120, and forming an exposed edge region 160 on the front side of the substrate 110. The edge region 160 includes two opposing side slot regions 162, with the front die-bonding region 140 and the side electrode region 150 both located between the two side slot regions 162.

[0034] By providing a front die-bonding region 140 on the front side of the substrate 110, which is electrically connected to the side electrode region 150, a light-emitting chip 120 and a lens 130 can be directly integrated on the substrate 110 to form a light source device 100. Two opposing side-mounting regions 162 are reserved on the front side of the substrate 110, allowing the light source device 100 to be side-mounted into the mounting slot 170, thus achieving lateral mounting of the light source device 100. This means that the light source device 100 with a large lens 130 can be laterally mounted using only its own substrate 110, without the need for an external substrate, meeting the requirements for lateral mounting. Simultaneously, the lens 130 will not interfere with the insertion of the substrate 110, reducing the probability of damage or detachment of the lens 130 due to interference between the lens 130 and the mounting slot 170. Furthermore, the light source device 100 of this application is equivalent to a combination of a traditional light source device and an external substrate, thus improving product integration, significantly reducing costs, simplifying the structure, and noticeably reducing the size.

[0035] It should be noted that when the light source device 100 is inserted into the card slot 170, the side card area 162 on one side and its corresponding back area can be inserted into the slot 172 on one side of the card slot 170, and the side card area 162 on the other side and its corresponding back area can be inserted into the slot 172 on the other side of the card slot 170. At this time, the side electrode area 150 of the substrate 110 faces upward, which facilitates elastic contact with the spring contacts on the external circuit board. The corresponding back area of ​​the side card area 162 is also a blank area without components to prevent assembly interference. Specifically, it can be the substrate surface of the substrate 110 or the surface of the metal electrode. In addition, the side electrode area 150 can be electrically connected to the front die-bonding area 140 through the conductive structure inside the substrate 110, or through the conductive layer on the surface of the substrate 110.

[0036] To further reduce assembly interference in the vertical direction, the edge region 160 on the front side of the substrate 110 also includes two opposing clearance areas 164. Each clearance area 164 connects to two side card areas 162, forming a closed area, i.e., the edge region 160 surrounds the lens 130. The edge region 160 is a reserved blank area after the lens 130 is placed on the substrate 110. The two clearance areas 164 can provide clearance space for the lens 130 in the vertical direction, thereby reducing the probability of interference between the lens 130 and the bottom of the card slot 170. At the same time, it can also prevent the lens 130 from colliding with the components of the circuit board above it, thus better protecting the lens 130. It can be understood that in the "vertical direction", the direction of insertion into the slot 172 is the "downward direction", and the direction opposite to the insertion direction is the "upward direction".

[0037] The substrate 110 of the light source device 100 specifically includes a plate 200 and a metal pattern 202, the metal pattern 202 being disposed on the surface of the plate 200. The material of the plate 200 may vary depending on the type of the substrate 110. The metal pattern 202 includes a front die-bonding region 140 and a side electrode region 150.

[0038] It should be noted that the type and specifications of substrate 110 are not specifically limited. Substrate 110 can be, but is not limited to, BT board (Bismaleimide Triazine), FR4 board (glass fiber cloth epoxy resin laminate), ceramic substrate, aluminum substrate, or other substrates, depending on the type of light-emitting chip 120. For example, when the light-emitting chip 120 is a high-power chip, substrate 110 can be a ceramic substrate or an aluminum substrate, which has good heat dissipation. When substrate 110 is an FR4 board, the material of board body 200 is epoxy resin filled with glass fiber cloth. As for the specifications of substrate 110, they depend on its application scenario. For example, in miniaturized applications, the smaller the size, the better.

[0039] The shape of the substrate 110 can be adjusted according to actual needs, and can be, but is not limited to, a polygon, a cylinder, an elliptical cylinder, or other shapes. In this embodiment, the substrate 110 is cuboid, but its shape is not limited to this. Furthermore, the plate 200 has four corners. To reduce assembly difficulty, notches (not labeled) are provided at each corner of the plate 200. These notches provide assembly redundancy, making it easier for the substrate 110 to fit with other structures during assembly without increasing structural precision, and also preventing the lens 130 from being scratched. In an alternative embodiment, notches can be provided at one or more of the four corners according to actual needs, instead of notching at all corners.

[0040] The front die-bonding region 140 is formed by a front electrode sheet, which includes a front positive electrode 142 and a front negative electrode 144 spaced apart, wherein the area of ​​the front negative electrode 144 is larger than that of the front positive electrode 142. The light-emitting chip 120 may be, but is not limited to, a vertical chip, whose negative electrode is soldered to the front negative electrode 144, and whose positive electrode is connected to the front positive electrode 142 through a bonding wire.

[0041] The light-emitting chip 120 can be, but is not limited to, an LED chip or a semiconductor laser chip. The semiconductor laser chip can be, but is not limited to, a VCSEL (Vertical Cavity Surface Emitting Laser) chip. The VCSEL chip can be a single-aperture chip or a multi-aperture chip. Furthermore, the number of light-emitting chips 120 is not limited to one. When the light-emitting chip 120 is a VCSEL chip and there is only one, the light-emitting aperture of the single-aperture VCSEL chip is centered and aligned with the lens 130. For multi-aperture VCSEL chips, the centers of the multiple apertures are centered and aligned with the lens 130. When the light-emitting chip 120 is a VCSEL chip and there are multiple chips, the center of the line connecting the multiple single-aperture VCSEL chips is centered and aligned with the lens 130. In other embodiments, the semiconductor laser chip can also be an EEL (Edge Emitting Laser) chip.

[0042] To protect the light-emitting chip 120, the light source device 100 also includes an anti-static chip 122. The anti-static chip 122 is also a vertical chip, with its positive electrode soldered to the front positive electrode 142 and its negative electrode connected to the front negative electrode 144 via a wire bond. The anti-static chip 122 prevents electrostatic discharge from damaging the light-emitting chip 120, thus improving the reliability of the light-emitting chip 120. It is understood that in other embodiments, the light-emitting chip 120 and the anti-static chip 122 can be flip-chips, directly bonded between the front negative electrode 144 and the front positive electrode 142, without the need for wire bonding. The light source device 100 can also use other anti-static measures instead of the anti-static chip 122, thus eliminating the need for the anti-static chip 122.

[0043] The anti-static chip 122 can be, but is not limited to, a Zener diode or a transient voltage suppressor diode (TVS diode).

[0044] Please see Figure 4 and Figure 5 , Figure 4 A top view of the light source device in this embodiment is shown. Figure 5 A bottom view of the light source device in this embodiment is shown. The substrate 110 also has a back electrode region 180, which is connected to the side electrode region 150. The light source device 100 also includes a conductor 186, at least a portion of which is inserted into the substrate 110 and connects the back electrode region 180 and the front die-bonding region 140, respectively.

[0045] The back electrode area 180, as part of the metal pattern 202, can be directly mounted on the light source device 100, thus combining side-mount and front-mount applications, increasing its application scenarios and expanding its applicability. Furthermore, the conductor 186 not only electrically connects the front die-bonding area 140 and the back electrode area 180, but also conducts the heat generated by the light-emitting chip 120 on the front die-bonding area 140 to the back electrode area 180, allowing the back electrode area 180 to radiate heat outwards, thereby improving heat dissipation.

[0046] The back electrode region 180 constitutes the majority of the back surface of the substrate 110, and consequently, the corresponding back surface of the side electrode region 162 is the corresponding surface of the back electrode region 180. The back electrode region 180 is formed by back electrode sheets, which include spaced-apart back positive electrodes 182 and back negative electrodes 184. The side electrode region 150 is formed by side electrode sheets, which include spaced-apart side positive electrodes 152 and side negative electrodes 154, wherein the side positive electrodes 152 are connected to the back positive electrodes 182, and the side negative electrodes 154 are connected to the back negative electrodes 184.

[0047] To achieve electrical connection between the back negative electrode 184 and the front negative electrode 144, the substrate 110 has at least two connection holes 111 corresponding to the front negative electrode 144. Each connection hole 111 penetrates the back negative electrode 184 and the plate 200, and allows the insertion of a conductor 186, thus electrically connecting the front negative electrode 144 and the back negative electrode 184. Since the connection hole 111 penetrates the back negative electrode 184, it facilitates the insertion of the conductor 186 from the back of the substrate 110. The presence of a conductor 186 within at least two connection holes 111 improves heat dissipation and enhances the reliability of the electrical connection. It should be noted that in other embodiments, the connection hole 111 may only penetrate the plate 200 without penetrating the back negative electrode 184, and the conductor 186 may connect between the front negative electrode 144 and the back negative electrode 184 without being exposed.

[0048] The substrate 110 also has at least one connection hole 111 corresponding to the front positive electrode 142. The connection hole 111 passes through the back positive electrode 182 and the plate 200, and the conductor 186 is inserted therein to electrically connect the back positive electrode 182 and the front positive electrode 142.

[0049] Please see Figure 6 and Figure 7 , Figure 6 A cross-sectional view of the light source device in this embodiment is shown. Figure 7A schematic diagram of the substrate of the light source device in this embodiment is shown. The light source device 100 also includes an adhesive layer 190, which is bonded between the front side of the substrate 110 and the lens 130, sealing the connection between the two and fixing the lens 130 to the substrate 110. In other embodiments, the lens 130 can be directly formed on the substrate 110 without the need for adhesive bonding. For example, when the light-emitting chip 120 is an LED chip, the lens 130 can be formed on the substrate 110 by dispensing or molding, and the lens 130 covers the light-emitting chip 120.

[0050] The substrate 110 also has an overflow prevention area 112, which surrounds the front die-bonding area 140 and is located between the two side-mounting areas 162, i.e., the overflow prevention area 112 is surrounded by the edge area 160. An adhesive layer 190 is disposed in the overflow prevention area 112, which prevents the adhesive forming the adhesive layer 190 from overflowing outside the lens 130. Because the edge area 160 surrounds the overflow prevention area 112, the overflow prevention area 112 can prevent the flow of adhesive, avoiding adhesive overflow into the side-mounting area 162 and affecting the side-mounting of the light source device 100.

[0051] The anti-overflow area 112 is formed by multiple anti-overflow rings 113 and grooves 114 between adjacent anti-overflow rings 113. When bonding the lens 130 to the substrate 110, glue can be filled into one of the grooves 114. When the lens 130 is attached to the substrate 110, the glue is squeezed and the glue flows under pressure. The anti-overflow rings 113 can block the flow of glue. If the glue is excessive and overflows, the overflowing glue can flow into another groove 114 and be blocked by the outer and inner anti-overflow rings 113, preventing the glue from flowing to the side clip area 162.

[0052] Combination Figure 6 The plurality of anti-overflow rings 113 include a first anti-overflow ring 115 and a second anti-overflow ring 116 from the inside out, with a first groove 117 formed between the first anti-overflow ring 115 and the second anti-overflow ring 116. The lens 130 has a cavity 132, and the bottom edge of the cavity wall of the cavity 132 is disposed corresponding to the first groove 117. The adhesive layer 190 includes a connected main body portion 192 and an overflow portion 194. The main body portion 192 fills the first groove 117 and connects to a portion of the bottom surface of the lens 130. The overflow portion 194 extends into the cavity 132 along the cavity wall and connects to a portion of the cavity wall of the cavity 132. The overflow portion 194 increases the connection area of ​​the lens 130, thereby significantly improving the airtightness and connection stability of the connection between the lens 130 and the substrate 110, preventing the lens 130 from falling off, and improving the airtightness and service life of the device.

[0053] Since the bottom edge of the cavity wall of cavity 132 corresponds to the first groove 117, and a notch (not labeled) is formed between the bottom edge of the cavity wall of cavity 132 and the outer edge of the top surface of the first anti-overflow ring 115, adhesive can enter the cavity 132 through this notch when bonding the lens 130. To reduce the resistance of adhesive passing through this notch, the bottom edge of the cavity wall of cavity 132 is rounded, making it easier for adhesive to flow into the cavity 132 and facilitating the demolding of the lens 130 during molding. In other embodiments, the bottom edge of the cavity wall of cavity 132 may be chamfered.

[0054] Furthermore, the outer edge of the top surface of the first anti-overflow ring 115 is also rounded, which can further reduce the resistance of the adhesive passing through the notch. In an alternative embodiment, the outer edge of the top surface of the first anti-overflow ring 115 can be chamfered.

[0055] When assembling the lens 130 and the substrate 110, the lens 130 is first inverted, adhesive is applied to the substrate 110, and then the substrate 110 is inverted and attached to the bottom surface of the lens 130. At this time, the adhesive can more easily pass through the rounded position and flow into the cavity 132 along the cavity wall. Overall, the overflow portion 194 is annular, forming an inverted snap-fit ​​structure that snaps onto the cavity wall of the cavity 132. That is, the outer surface (outer annular surface) of the overflow portion 194 is completely attached to the cavity wall of the cavity 132, resulting in a large connection area, good connection stability, and excellent connection sealing.

[0056] Furthermore, the overflow portion 194 extends onto the first anti-overflow ring 115 and covers at least a portion of the top surface of the first anti-overflow ring 115, thereby increasing the connection area on the substrate 110 and making the connection between the lens 130 and the substrate 110 more stable. In this embodiment, the overflow portion 194 completely covers the top surface of the first anti-overflow ring 115.

[0057] The adhesive layer 190 also includes an overflow portion 196, which is connected to the main body portion 192 and bonded between the top surface of the second anti-overflow ring 116 and part of the bottom surface of the lens 130, thereby further increasing the bonding area of ​​the adhesive and further optimizing the connection sealing and connection stability.

[0058] The multiple anti-overflow rings 113 also include a third anti-overflow ring 118, which surrounds the second anti-overflow ring 116. A second groove (not labeled) is formed between the third anti-overflow ring 118 and the second anti-overflow ring 116. The second groove can contain the overflowing glue, thereby further improving the anti-overflow effect.

[0059] Furthermore, the overflow portion 196 extends into the second groove and fills at least a portion of the second groove. When the adhesive fills the second groove, the third anti-overflow ring prevents the overflow adhesive from flowing outwards. Of course, the continuously extending overflow portion 196 contributes to improved connection sealing and connection stability.

[0060] Furthermore, at least a portion of the outer edge of the bottom of the lens 130 is rounded to accommodate any excess adhesive that overflows from the third anti-overflow ring 118, thus preventing overflow and reducing the difficulty of demolding the lens 130. In other embodiments, the outer edge of the bottom of the lens 130 may be chamfered.

[0061] Multiple overflow rings 113 are also part of the metal pattern 202. Furthermore, the multiple overflow rings 113 and the front die-bonding area 140 are formed by etching the same metal layer, eliminating the need for additional overflow rings 113. This simplifies the installation of overflow rings 113, improves production efficiency, and is significantly different from conventional designs where the metal layers on the substrate or support are all used as conductive polar metals (metal electrodes). In other embodiments, the overflow rings 113 can be dams directly formed on the substrate 110, or they can be protrusions of the substrate 110, protruding upwards from the front side of the substrate 110.

[0062] Combination Figure 2 Since the metal pattern 202 of the substrate 110 typically includes all electrodes, that is, the front die bond area 140, the side electrode area 150, and the back electrode area 180 of the metal pattern 202 are all etched from the same metal layer, in other words, the front die bond area 140, all anti-overflow rings 113, the side electrode area 150, and the back electrode area 180 are all etched from the same metal layer. Specifically, the metal pattern 202 of the substrate 110 can be formed by etching a copper clad laminate (CCL) in one step; however, the substrate of the substrate 110 is not limited to a copper clad laminate.

[0063] It should be noted that in other embodiments, the front die bond region 140 and all anti-overflow rings 113 may be formed by the same metal layer, while the side electrode region 150 and the back electrode region 180 may be formed by another metal layer; or, the front die bond region 140, all anti-overflow rings 113 and the side electrode region 150 may be etched by the same metal layer, while the back electrode region 180 may be formed by another metal layer.

[0064] A limiting groove 119 is formed on the side of the plate 200, and the side electrode is located in the limiting groove 119. The limiting groove 119 has two opposing limiting sides 204, which are used to limit the two sides of the side electrode and thus limit the side electrode. When the side electrode is cut along the limiting direction, the limiting groove 119 can prevent the side electrode from shifting or deforming due to the cutting force. When electrically connected to an external circuit board, the circuit board is provided with an elastically retractable spring piece, which elastically abuts against the side electrode to realize the electrical connection between the substrate 110 and the circuit board. The positive side electrode 152 and the negative side electrode 154 of the side electrode are each located in a limiting groove 119 and are respectively limited by the corresponding limiting groove 119.

[0065] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A light source device, characterized in that, include: A substrate (110) having a front die-bonding region (140) and a side electrode region (150) electrically connected to the front die-bonding region (140); A light-emitting chip (120) is disposed on the front die-bonding region (140); and Lens (130) is disposed on the front side of the substrate (110), covering the light-emitting chip (120), and forming an exposed edge region (160) on the front side of the substrate (110). The edge region (160) includes two opposing side card areas (162). The front die-bonding area (140) and the side electrode area (150) are both located between the two side card areas (162).

2. The light source device according to claim 1, characterized in that, Also includes: An adhesive layer (190) is bonded between the front side of the substrate (110) and the lens (130); The substrate (110) also has an anti-overflow area (112) which is disposed around the front die bonding area (140) and located between the two side card areas (162), and the adhesive layer (190) is disposed in the anti-overflow area (112).

3. The light source device according to claim 2, characterized in that, The overflow prevention area (112) is formed by a plurality of overflow prevention rings (113) and a groove (114) between adjacent overflow prevention rings (113).

4. The light source device according to claim 3, characterized in that, The plurality of anti-overflow rings (113) include a first anti-overflow ring (115) and a second anti-overflow ring (116) from the inside out, and a first groove (117) is formed between the first anti-overflow ring (115) and the second anti-overflow ring (116). The lens (130) has a cavity (132), and the bottom edge of the cavity wall of the cavity (132) is provided corresponding to the first groove (117); The adhesive layer (190) includes a connected main body portion (192) and an overflow portion (194), the main body portion (192) filling the first groove (117) and connecting to a portion of the bottom surface of the lens (130), the overflow portion (194) extending into the cavity (132) along the cavity wall and connecting to a portion of the cavity wall of the cavity (132).

5. The light source device according to claim 4, characterized in that, The adhesive layer (190) also includes an overflow portion (196) which is connected to the main body portion (192) and is bonded between the top surface of the second anti-overflow ring (116) and a portion of the bottom surface of the lens (130).

6. The light source device according to claim 4, characterized in that, The bottom edge of the cavity wall (132) is rounded or chamfered.

7. The light source device according to claim 3, characterized in that, The substrate (110) includes a plate body (200) and a metal pattern (202). The metal pattern (202) is disposed on the surface of the plate body (200) and includes the plurality of anti-overflow rings (113) and the front die bonding area (140). The plurality of anti-overflow rings (113) and the front die bonding area (140) are formed by etching the same metal layer.

8. The light source device according to any one of claims 1 to 7, characterized in that, The substrate (110) also has a back electrode region (180) connected to the side electrode region (150); The light source device (100) further includes a conductor (186), at least a portion of which is inserted into the substrate (110) and connects the back electrode region (180) and the front die-bonding region (140) respectively.

9. The light source device according to any one of claims 1 to 7, characterized in that, The edge region (160) also includes two opposing avoidance zones (164), each of the avoidance zones (164) connecting the two side card zones (162).

10. The light source device according to any one of claims 1 to 6, characterized in that, The substrate (110) includes a plate body (200) and a metal pattern (202), the metal pattern (202) is disposed on the surface of the plate body (200) and includes the side electrode region (150), the side electrode region (150) is formed by side electrode sheets; A limiting groove (119) is provided on the side of the plate, and the side electrode is located in the limiting groove (119). The limiting groove (119) has two opposing limiting sides (204), which are used to limit the two sides of the side electrode.

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