Bonding apparatus, bonding method, and storage medium

Abstract

The present invention provides a bonding apparatus, a bonding method, and a computer-readable storage medium. The bonding apparatus comprises a chip pickup assembly and a chip bonding assembly. The chip pickup assembly comprises a first body and a first rotating motor. A plurality of pickup heads are provided on the first body. First suction surfaces of the pickup heads for chips are all located on a same plane, and all face a same first direction. The first rotating motor is connected to the first body, and is used for rotationally switching the plurality of pickup heads to preset pickup stations one by one to pick up corresponding chips one by one. The chip bonding assembly is located in the first direction of the chip pickup assembly, and comprises a second body. A plurality of bonding heads are provided on the second body. Second suction surfaces of the bonding heads for the chips are all located on a same plane, and all face a second direction in which the chip pickup assembly is located, so as to simultaneously acquire the corresponding chips from the first suction surfaces of the pickup heads respectively.

Description

Bonding apparatus, bonding method and storage medium Technical Field

[0001] This invention relates to the field of semiconductor device fabrication, and more particularly to a bonding apparatus, a bonding method, and a computer-readable storage medium. Background Technology

[0002] The handover between the chip pick-up assembly and the chip bonding assembly in a bonding apparatus is a critical step in the bonding process, directly affecting the accuracy, efficiency, and reliability of the entire bonding process. Existing conventional bonding apparatuses typically only have one nozzle on the chip pick-up assembly. The chip pick-up assembly needs to perform a lateral alignment with the bonding head after each chip pick-up to complete one handover operation, resulting in low bonding efficiency.

[0003] To improve bonding efficiency, some improved chip pickup components have been proposed in the field. These components reduce the number of lateral movements of the chip pickup component by installing two nozzles facing different directions and configuring a rotary motor to switch between the nozzles. However, this anisotropic multi-nozzle design suffers from limitations in terms of space, making it difficult to achieve large-scale nozzle integration. Furthermore, it cannot guarantee the actual position and orientation of each nozzle after switching to the working position. Therefore, the pickup head needs to be readjusted after each nozzle switch, which still cannot meet the efficiency requirements of high-volume bonding.

[0004] In order to overcome the above-mentioned defects in the existing technology, there is an urgent need in the field for an improved bonding device that can not only effectively reduce the number of times the pick-up head and bonding head move and switch positions, but also ensure the consistency of the nozzle posture of each pick-up head and bonding head, thereby eliminating the need to correct the posture of each pick-up head and bonding head one by one, so as to balance the accuracy and efficiency of chip picking and bonding. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in the prior art, this invention provides a bonding apparatus, a bonding method, and a computer-readable storage medium. It not only reduces the number of times the pickup and bonding heads need to move and switch positions by designing multiple pickup and bonding heads, but also eliminates the need for individual orientation correction of each pickup head by designing the adsorption surfaces of the multiple pickup and bonding heads on the same plane. Furthermore, it supports the simultaneous transfer of multiple chips from multiple pickup heads to multiple bonding heads, thus effectively balancing the accuracy and efficiency of chip transfer and bonding.

[0007] Specifically, the bonding apparatus provided according to a first aspect of the present invention includes a chip pickup assembly and a chip bonding assembly. The chip pickup assembly includes a first body and a first rotary motor. The first body is provided with a plurality of pickup heads. The first adsorption surfaces of each pickup head for the chip are located on the same plane and all face the same first direction. The first rotary motor is connected to the first body and is used to rotate the plurality of pickup heads one by one to switch to a preset pickup station to pick up the corresponding chip one by one. The chip bonding assembly is located in the first direction of the chip pickup assembly and includes a second body. The second body is provided with a plurality of bonding heads. The second adsorption surfaces of each bonding head for the chip are located on the same plane and all face the second direction where the chip pickup assembly is located, so as to simultaneously pick up the corresponding chip from the first adsorption surface of each pickup head.

[0008] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a pick-up head traversing module. The pick-up head traversing module is used to first traverse the chip pick-up assembly to the pick-up station where the wafer disk is located, so that each of its pick-up heads picks up the corresponding chip one by one; then, it traverses the chip pick-up assembly to the handover station where the chip bonding assembly is located, so that each of the bonding heads of the chip bonding assembly simultaneously obtains the corresponding chip from the first adsorption surface of the corresponding pick-up head.

[0009] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a wafer disk and a wafer disk traversing module. The wafer disk carries a plurality of the chips. The wafer disk traversing module is used to traverse the wafer disk when one of the pick-up heads of the chip pick-up assembly completes the pick-up of a corresponding chip and rotates to switch to the next pick-up head, so as to traverse the next chip to be picked up to the pick-up station for alignment with the next pick-up head.

[0010] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a camera and a controller. The camera is used to acquire images of the chip pickup assembly and the chip bonding assembly after the chip pickup assembly arrives at the handover station. The controller is configured to: parse the images to determine the translational and rotational angle differences between the chip pickup assembly and the chip bonding assembly; and control the pickup head lateral movement module to lateralize according to the translational difference, and control the first rotary motor to rotate according to the rotational angle difference, so as to align each pickup head of the chip pickup assembly with the corresponding bonding head of the chip bonding assembly.

[0011] Furthermore, in some embodiments of the present invention, the first body and / or the second body are further provided with a leveling module. The controller is also configured to: parse the image to determine the parallelism between the chip pickup assembly and the chip bonding assembly; and control the leveling module to tilt according to the parallelism, so that the first adsorption surface of each pickup head of the chip pickup assembly is parallel to the second adsorption surface of the corresponding bonding head of the chip bonding assembly.

[0012] Furthermore, in some embodiments of the present invention, the chip bonding assembly further includes a bonding head lifting module. The bonding head lifting module is used to lift the chip bonding assembly in the second direction after the chip pickup assembly arrives at the handover station, so that each of its bonding heads simultaneously picks up the corresponding chip from the first adsorption surface of the corresponding pickup head. After picking up multiple chips, the chip bonding assembly is lifted in a third direction where the wafer chuck is located, so that each of the picked-up chips is bonded one by one or simultaneously to the corresponding target position on the wafer adsorbed by the wafer chuck.

[0013] Furthermore, in some embodiments of the present invention, the chip bonding assembly further includes a flipping module. The flipping module is used to flip the chip bonding assembly after acquiring multiple chips, so that the bonding head lifting module can lift and lower the chip bonding assembly in the first direction, and bond each of the acquired chips one by one or simultaneously to the corresponding target position on the wafer.

[0014] Furthermore, in some embodiments of the present invention, the chip bonding assembly further includes a second rotary motor. The second rotary motor is connected to the second body and is used to rotate the multiple bonding heads one by one to a preset bonding station after acquiring multiple chips, so as to bond each chip to the corresponding target position on the wafer one by one.

[0015] Furthermore, in some embodiments of the present invention, the bonding apparatus further includes a wafer chuck and a wafer chuck traversing module. The wafer chuck holds the wafer to be bonded. The wafer chuck traversing module is used to traverse the wafer chuck when one bonding head of the chip bonding assembly completes bonding of the corresponding chip and rotates to switch to the next bonding head, so as to traverse the next target position to be bonded to the bonding station for alignment with the next bonding head.

[0016] Furthermore, in some embodiments of the present invention, the chip bonding assembly further includes a plurality of lateral movement units and a plurality of rotation units. Each bonding head has one lateral movement unit and one rotation unit, which adjust the lateral movement and rotation amount of each bonding head according to the plurality of target positions on the wafer, so as to synchronously bond the plurality of chips adsorbed by the chip bonding assembly to the respective target positions on the wafer.

[0017] Furthermore, in some embodiments of the present invention, the first rotary motor and / or the second rotary motor employs a gas slip ring device, which includes a stator and a mover. The stator includes a cavity extending along the first direction, a plurality of air outlets communicating with the cavity, a plurality of annular venting grooves communicating one-to-one with each of the air inlets, and a sealing ring located between each of the annular venting grooves. The mover extends along the first direction and is mounted inside the cavity via a plurality of bearings to rotate around the first direction under the drive of the stator. The outer wall of the mover contacts the inner side of each of the sealing rings to cooperate with the inner wall of the cavity and the sealing rings to isolate each of the venting grooves. The interior of the mover is provided with a plurality of air passages, the first end of which is connected to each of the venting grooves to obtain negative pressure provided by the corresponding air inlet, and the second end of which is connected to the corresponding pickup head or bonding head via the corresponding air inlet to transmit the negative pressure to adsorb the chip.

[0018] Furthermore, in some embodiments of the present invention, the first body of the chip pickup assembly is provided with six pickup heads. Each pickup head is distributed at a 60° angle around the periphery of the first body. The second body of the chip bonding assembly is provided with six bonding heads. Each bonding head is correspondingly distributed at a 60° angle around the periphery of the second body, so as to simultaneously acquire the six chips adsorbed by each pickup head of the chip pickup assembly.

[0019] Furthermore, the bonding method provided by the second aspect of the present invention includes the following steps: laterally moving the chip pickup assembly of the bonding apparatus as provided by the first aspect of the present invention to a preset pickup station; sequentially rotating and switching multiple pickup heads of the chip pickup assembly via a first rotary motor of the chip pickup assembly to pick up corresponding chips from the wafer chuck one by one; laterally moving the chip pickup assembly to a preset handover station; simultaneously acquiring corresponding chips from the first adsorption surface of each pickup head via multiple bonding heads of the chip bonding assembly of the bonding apparatus; and sequentially or synchronously bonding each acquired chip to a corresponding target position on the wafer adsorbed by the wafer chuck via the multiple bonding heads.

[0020] Furthermore, the computer-readable storage medium provided according to the third aspect of the present invention stores computer instructions thereon. When the computer instructions are executed by a processor, the bonding method as provided in the second aspect of the present invention is implemented. Attached Figure Description

[0021] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0022] Figure 1 shows a schematic diagram of the chip pickup assembly provided in comparison.

[0023] Figure 2 shows a schematic diagram of the structure of a chip pickup assembly provided according to some embodiments of the present invention.

[0024] Figure 3 shows a schematic diagram of the structure of a chip bonding assembly provided according to some embodiments of the present invention.

[0025] Figure 4 shows a schematic diagram of the bonding device provided according to some embodiments of the present invention.

[0026] Figure 5 shows a schematic diagram of the structure of a first rotary motor and / or a second rotary motor provided according to some embodiments of the present invention.

[0027] Figure 6 shows a schematic flowchart of a bonding method provided according to some embodiments of the present invention. Detailed Implementation

[0028] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0029] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0030] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0031] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0032] As mentioned above, existing conventional bonding devices typically only have one nozzle installed in the chip pickup assembly. The chip pickup assembly needs to perform a lateral alignment of the bonding head after each chip pickup to complete a handover operation, resulting in low bonding efficiency. Improved anisotropic multi-nozzle designs suffer from space constraints, making large-scale nozzle integration difficult. Furthermore, they cannot guarantee the actual position and orientation of each nozzle after switching to the working position, requiring a readjustment of the pickup head after each nozzle switch, still failing to meet the efficiency requirements of high-volume bonding.

[0033] To overcome the aforementioned deficiencies in the prior art, this invention provides a bonding apparatus, a bonding method, and a computer-readable storage medium. It not only reduces the number of times the pickup and bonding heads need to move and switch positions by designing multiple pickup and bonding heads, but also eliminates the need for individual orientation correction of each pickup head by designing the adsorption surfaces of the multiple pickup and bonding heads on the same plane. Furthermore, it supports the simultaneous transfer of multiple chips from multiple pickup heads to multiple bonding heads, thus effectively balancing the accuracy and efficiency of chip transfer and bonding.

[0034] Please refer to Figures 1 through 4. Figure 1 shows a schematic diagram of a chip pickup assembly provided in a comparative example. Figure 2 shows a schematic diagram of a chip pickup assembly provided according to some embodiments of the present invention. Figure 3 shows a schematic diagram of a chip bonding assembly provided according to some embodiments of the present invention. Figure 4 shows a schematic diagram of a bonding device provided according to some embodiments of the present invention.

[0035] As shown in Figure 1, the existing chip picking assembly only includes one picking head. After the picking head picks up a chip, it is handed over to the bonding head. This method is inefficient.

[0036] In the embodiment shown in FIG2, the bonding apparatus provided by the first aspect of the present invention includes a chip pickup assembly and a chip bonding assembly. Here, the chip pickup assembly includes a first body 11 and a first rotary motor 12. The first body 11 is provided with a plurality of pickup heads 111 to 116, and the first adsorption surfaces of each pickup head 111 to 116 for picking up the chip are all located on the same plane and all face the same first direction (e.g., downward). The first rotary motor 12 is connected to the first body 11 and is used to rotate the plurality of pickup heads 111 to 116 one by one to switch to a preset pickup position to pick up the corresponding chip one by one.

[0037] In the embodiments shown in Figures 3 and 4, the chip bonding assembly is located in the first direction of the chip pickup assembly and includes a second body 21. Here, the second body 21 is provided with a plurality of bonding heads 211-216, all of which have their second adsorption surfaces for the chip located on the same plane and facing the second direction (e.g., upwards) of the chip pickup assembly, so as to simultaneously acquire the corresponding chip from the first adsorption surface of each of the pickup heads 111-116.

[0038] Furthermore, in the embodiment shown in FIG4, the bonding apparatus provided in the first aspect of the present invention preferably includes a pick-up head traversing module 13. The pick-up head traversing module 13 is used to first traverse the chip pick-up assembly to the pick-up station where the wafer disk 30 is located, so that each of its pick-up heads 111 to 116 picks up the corresponding chip one by one, and then traverse the chip pick-up assembly to the handover station where the chip bonding assembly is located, so that each of the bonding heads 211 to 216 of the chip bonding assembly simultaneously obtains the corresponding chip from the first adsorption surface of the corresponding pick-up head 111 to 116.

[0039] Furthermore, in the embodiment shown in FIG4, the bonding apparatus provided by the first aspect of the present invention further includes a wafer disk 30 and a wafer disk traversing module 31. Here, the wafer disk 30 carries a plurality of chips. The wafer disk traversing module 31 is used to traverse the wafer disk 30 when one pick-up head of the chip pick-up assembly completes the pick-up of a corresponding chip and rotates to switch to the next pick-up head, so as to traverse the next chip to be picked up to the pick-up station for alignment with the next pick-up head.

[0040] Furthermore, in some preferred embodiments, the bonding apparatus provided in the first aspect of the present invention further includes a camera for simultaneously aligning the plurality of pickup heads 111-116 with the plurality of bonding heads 211-216. Here, the camera is used to acquire images of the chip pickup assembly and the chip bonding assembly after the chip pickup assembly arrives at the handover station.

[0041] Furthermore, in some embodiments, the chip bonding assembly also includes a bonding head lifting module. This bonding head lifting module is used to lift the chip bonding assembly in a second direction after the chip pickup assembly arrives at the handover station, so that each of its bonding heads 211-216 can simultaneously pick up the corresponding chip from the first adsorption surface of the corresponding pickup head. After picking up multiple chips, the chip bonding assembly is lifted in a third direction where the wafer chuck is located, so that each picked-up chip is bonded one by one or simultaneously to the corresponding target position on the wafer adsorbed by the wafer chuck.

[0042] Furthermore, in some embodiments, the chip bonding assembly also includes a flipping module to reduce the lateral footprint, which is beneficial for large-scale integration in parallel pipelines. Here, the flipping module is used to flip the chip bonding assembly after acquiring multiple chips, allowing the bonding head lifting module to move the chip bonding assembly in a first direction, and bonding each acquired chip individually or simultaneously to the corresponding target position on the wafer. In this case, the third direction is equivalent to the first direction (e.g., downwards).

[0043] Those skilled in the art will understand that the embodiments of the bonding device shown in FIG4 are merely some non-limiting implementations provided by the present invention, intended to clearly illustrate the main concept of the present invention and provide some specific solutions that are easy for the public to implement, rather than being used to limit the scope of protection of the present invention.

[0044] Optionally, in other embodiments, those skilled in the art may also position the wafer chuck above the side of the chip bonding assembly. In this case, the bonding apparatus provided in the first aspect of the present invention first moves the chip bonding assembly laterally to the bonding position below it via the bonding head traversing module, and then the bonding head lifting module lifts the chip bonding assembly in a second direction (e.g., upward) to bond the acquired chips one by one or simultaneously to the target position of the wafer adsorbed by the wafer chuck.

[0045] Furthermore, in the embodiment shown in Figure 3, the chip bonding assembly further includes a second rotary motor 22. Here, the second rotary motor is connected to the second body and is used to rotate the multiple bonding heads one by one to a preset bonding station after acquiring multiple chips, so as to bond each chip to the corresponding target position on the wafer.

[0046] Furthermore, in some embodiments, the bonding apparatus provided in the first aspect of the present invention further includes a wafer chuck and a wafer chuck traversing module. Here, the wafer chuck holds a wafer to be bonded. The wafer chuck traversing module is used to traverse the wafer chuck when a bonding head of a chip bonding assembly completes bonding of a corresponding chip and rotates to switch to the next bonding head, so as to traverse the target position to be bonded to the bonding station for alignment with the next bonding head.

[0047] Furthermore, in some preferred embodiments, the chip bonding assembly further includes multiple lateral movement units and multiple rotation units. Here, each bonding head has a lateral movement unit and a rotation unit, which adjust the lateral movement and rotation amount of each bonding head according to multiple target positions on the wafer, so as to synchronously bond multiple chips adsorbed by the chip bonding assembly to each target position on the wafer.

[0048] Please refer further to Figure 5. Figure 5 shows a schematic diagram of the structure of a first rotary motor and / or a second rotary motor provided according to some embodiments of the present invention.

[0049] In the embodiment shown in Figure 5, the first rotary motor 12 and / or the second rotary motor 22 include a stator 51 and a mover 52. The stator 51 includes a cavity extending along a first direction, multiple air outlets 511 communicating with the cavity, multiple annular ventilation slots connecting each air inlet in a one-to-one manner, and sealing rings 512 located between each annular ventilation slot. The mover 52 extends along the first direction and is mounted inside the cavity via multiple bearings 521 to rotate around the first direction under the drive of the stator 51. The outer wall of the mover 52 contacts the inner side of each sealing ring 512 to cooperate with the inner wall of the cavity and the sealing rings 512 to isolate each ventilation slot. The mover 52 has multiple air passages inside, with its first end connected to each ventilation slot to obtain negative pressure provided by the corresponding air inlet 522, and its second end connected to the corresponding pickup head or bonding head via the corresponding air inlet 522 to transmit negative pressure to adsorb the chip.

[0050] Furthermore, in the embodiment shown in FIG2, the first body 11 of the chip pickup assembly is provided with six pickup heads 111-116. Each pickup head 111-116 is distributed at a 60° angle around the periphery of the first body 11. Similarly, in the embodiment shown in FIG3, the second body 21 of the chip bonding assembly is provided with six bonding heads 211-216, each bonding head 211-216 correspondingly distributed at a 60° angle around the periphery of the second body 21, so as to simultaneously acquire six chips adsorbed by each pickup head of the chip pickup assembly.

[0051] In some non-limiting embodiments, the bonding method provided in the second aspect of the present invention can be implemented based on the bonding apparatus provided in the first aspect of the present invention. Specifically, the bonding apparatus provided in the first aspect of the present invention further includes a memory and a controller. Here, the memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect of the present invention, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the bonding method provided in the first aspect of the present invention.

[0052] The working principle of the bonding device described above will be described below with reference to some embodiments of bonding methods. Those skilled in the art will understand that these embodiments of bonding methods are merely non-limiting implementations provided by the present invention, intended to clearly demonstrate the main concept of the invention and provide specific solutions convenient for public implementation, rather than limiting all functions or all operating methods of the bonding device. Similarly, the bonding device is also merely a non-limiting implementation provided by the present invention and does not constitute a limitation on the executing entity or execution order of the steps in these bonding methods.

[0053] Please refer to Figure 6. Figure 6 shows a schematic flowchart of a bonding method provided according to some embodiments of the present invention.

[0054] As shown in Figure 6, the controller can first move the chip pickup component of the bonding device provided in the first aspect of the present invention to a preset pickup station.

[0055] Subsequently, the controller can rotate and switch the multiple pickup heads 111 to 116 of the chip pickup component one by one via the first rotary motor 11 of the chip pickup component, so as to pick up the corresponding chip from the chip disk one by one.

[0056] Then, the controller can move the chip pickup component to a preset handover station, and simultaneously acquire the corresponding chip from the first adsorption surface of each pickup head 111-116 via multiple bonding heads 211-216 of the chip bonding component of the bonding device.

[0057] Subsequently, the controller can use multiple bonding heads 211-216 to bond each acquired chip individually or simultaneously to the corresponding target position on the wafer held by the wafer chuck.

[0058] Furthermore, in some preferred embodiments, the controller can also acquire images of the chip pickup assembly and the chip bonding assembly via a camera. The controller can then analyze the images to determine the differences in translation and rotation angles between the chip pickup assembly and the chip bonding assembly. Based on the translation difference, the controller controls the pickup head lateral movement module to move laterally, and based on the rotation angle difference, it controls the first rotary motor 11 to rotate, so as to align each pickup head 111-116 of the chip pickup assembly with its corresponding bonding heads 211-216 of the chip bonding assembly. Thus, the bonding apparatus provided in the first aspect of the present invention can simultaneously align multiple pickup heads with multiple bonding heads.

[0059] Furthermore, in some preferred embodiments, a leveling module is also provided on the first body 11 and / or the second body 21. Here, the controller can analyze the above image to determine the parallelism between the chip pickup assembly and the chip bonding assembly, and control the leveling module to tilt according to the parallelism, so that the first adsorption surface of each pickup head of the chip pickup assembly is parallel to the second adsorption surface of the corresponding bonding head of the chip bonding assembly. In this way, the bonding device provided by the first aspect of the present invention can simultaneously perform orientation correction of multiple pickup heads and multiple bonding heads.

[0060] In summary, the bonding apparatus, bonding method, and computer-readable storage medium provided by this invention can all improve the efficiency of picking and bonding by reducing the number of times the picking head or bonding head needs to switch positions, through the design of multiple picking heads and bonding heads. Furthermore, by designing the first adsorption surfaces of the multiple picking heads on the same plane, the need for individual orientation correction of each picking head is eliminated, further balancing picking accuracy and efficiency. In addition, by also designing the second adsorption surfaces of the multiple bonding heads on the same plane, the need for joint orientation correction of each picking head and bonding head can be eliminated, and simultaneous handover of multiple chips can be supported, further balancing chip handover accuracy and efficiency.

[0061] Although the methods described above are illustrated and depicted as a series of actions for the sake of simplicity, it should be understood and appreciated that these methods are not limited by the order of the actions, as some actions may occur in a different order and / or concurrently with other actions from the illustrations and descriptions herein or not illustrated and described herein but which may be understood by those skilled in the art, according to one or more embodiments.

[0062] Although the controller described in the above embodiments can be implemented through a combination of software and hardware, it is understood that the controller can also be implemented in software or hardware. For hardware implementation, the controller can be implemented using one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, other electronic devices for performing the above functions, or a selection of combinations of the above devices. For software implementation, the controller can be implemented using independent software modules such as procedures and functions running on a general-purpose chip, each module performing one or more functions and operations described herein.

[0063] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein may be embodied directly in hardware, in a software module executed by a processor, or in a combination of both. The software module may reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to a processor such that the processor can read and write information to / from the storage medium. In an alternative, the storage medium may be integrated into the processor. The processor and storage medium may reside in an ASIC. The ASIC may reside in a user terminal. In an alternative, the processor and storage medium may reside as discrete components in the user terminal.

[0064] In one or more exemplary embodiments, the described functionality may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functionality may be stored or transmitted as one or more instructions or code on or through a computer-readable medium. A computer-readable medium includes both computer storage media and communication media, encompassing any medium that facilitates the transfer of a computer program from one location to another. A storage medium may be any available medium accessible to a computer. By way of example and not limitation, such a computer-readable medium may include RAM, ROM, EEPROM, CD-ROM or other optical disc storage, disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and is accessible to a computer. Any connection is also legitimately referred to as a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of a medium. As used in this article, disk and disc include compact discs (CDs), laser discs, optical discs, digital multi-purpose discs (DVDs), floppy disks, and Blu-ray discs. Disks typically reproduce data magnetically, while discs reproduce data optically using lasers. Combinations of these should also be included within the scope of computer-readable media.

[0065] The prior description of this disclosure is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not intended to be limited to the examples and designs described herein, but should be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A bonding device, characterized in that, include: A chip picking assembly includes a first body and a first rotary motor. The first body is provided with a plurality of picking heads, and the first adsorption surfaces of each picking head for picking up chips are located on the same plane and all face the same first direction. The first rotary motor is connected to the first body and is used to rotate the plurality of picking heads one by one to switch to a preset picking station to pick up the corresponding chips one by one. A chip bonding assembly is located in a first direction of the chip pickup assembly and includes a second body. The second body is provided with a plurality of bonding heads, and the second adsorption surfaces of each bonding head for the chip are located on the same plane and are all facing the second direction of the chip pickup assembly, so as to simultaneously acquire the corresponding chip from the first adsorption surface of each of the pickup heads.

2. The bonding apparatus as claimed in claim 1, characterized in that, Also includes: The pick-up head lateral movement module is used to first laterally move the chip pick-up assembly to the pick-up station where the wafer disk is located, so that each of its pick-up heads can pick up the corresponding chip one by one, and then laterally move the chip pick-up assembly to the handover station where the chip bonding assembly is located, so that each of the bonding heads of the chip bonding assembly can simultaneously pick up the corresponding chip from the first adsorption surface of the corresponding pick-up head.

3. The bonding apparatus as described in claim 2, characterized in that, Also includes: The wafer disk carries a plurality of the chips; as well as The wafer disk traversing module is used to traverse the wafer disk when one of the pick-up heads of the chip pick-up assembly completes the pick-up of the corresponding chip and rotates to switch to the next pick-up head, so as to move the next chip to be picked up to the pick-up station and align it with the next pick-up head.

4. The bonding apparatus as described in claim 2, characterized in that, Also includes: A camera is used to capture images of the chip pickup component and the chip bonding component after the chip pickup component arrives at the handover station; as well as The controller is configured to: parse the image to determine the translational and rotational differences between the chip pickup assembly and the chip bonding assembly; and control the pickup head lateral movement module to lateralize according to the translational difference, and control the first rotary motor to rotate according to the rotational difference, so as to align each pickup head of the chip pickup assembly with the corresponding bonding head of the chip bonding assembly.

5. The bonding apparatus as described in claim 4, characterized in that, The first body and / or the second body are further provided with a leveling module, and the controller is further configured to: The image is analyzed to determine the parallelism between the chip pickup component and the chip bonding component; as well as The leveling module is tilted according to the parallelism control, so that the first adsorption surface of each pickup head of the chip pickup assembly is parallel to the second adsorption surface of the corresponding bonding head of the chip bonding assembly.

6. The bonding apparatus as claimed in claim 2, characterized in that, The chip bonding assembly also includes: The bonding head lifting module is used to lift the chip bonding assembly in the second direction after the chip picking assembly arrives at the handover station, so that each of its bonding heads can simultaneously pick up the corresponding chip from the first adsorption surface of the corresponding picking head. After picking up multiple chips, the chip bonding assembly is lifted in the third direction where the wafer chuck is located, so as to bond each of the picked chips one by one or synchronously to the corresponding target position on the wafer adsorbed by the wafer chuck.

7. The bonding apparatus as claimed in claim 6, characterized in that, The chip bonding assembly also includes: The flipping module is used to flip the chip bonding assembly after acquiring multiple chips, so that the bonding head lifting module can lift the chip bonding assembly in the first direction and bond each of the acquired chips to the corresponding target position on the wafer one by one or simultaneously.

8. The bonding apparatus as claimed in claim 6, characterized in that, The chip bonding assembly also includes: The second rotary motor, connected to the second body, is used to rotate the multiple bonding heads one by one to a preset bonding station after acquiring multiple chips, so as to bond each chip to the corresponding target position on the wafer.

9. The bonding apparatus as claimed in claim 8, characterized in that, Also includes: The wafer chuck has the wafer to be bonded adsorbed on it; as well as The wafer chuck traversing module is used to traverse the wafer chuck when the bonding head of the chip bonding assembly completes the bonding of the corresponding chip and rotates to switch to the next bonding head, so as to traverse the next target position to be bonded to the bonding station and align it with the next bonding head.

10. The bonding apparatus as claimed in claim 6, characterized in that, The chip bonding assembly further includes multiple lateral movement units and multiple rotation units. Each bonding head has one lateral movement unit and one rotation unit. Based on the multiple target positions on the wafer, the lateral movement and rotation of each bonding head are adjusted to simultaneously bond the multiple chips adsorbed by the chip bonding assembly to the target positions on the wafer.

11. The bonding apparatus as claimed in claim 8, characterized in that, The first rotary motor and / or the second rotary motor employs a gas slip ring device, which includes: The stator includes a cavity extending along the first direction, a plurality of air outlets communicating with the cavity, a plurality of annular vent grooves communicating one-to-one with each of the air inlets, and sealing rings located between each of the annular vent grooves; and A mover extends along the first direction and is mounted inside the cavity via multiple bearings to rotate around the first direction under the drive of the stator. The outer wall of the mover contacts the inner side of each of the sealing rings to cooperate with the inner wall of the cavity and the sealing rings to isolate each of the ventilation slots. The mover has multiple air passages inside, the first end of which is connected to each of the ventilation slots to obtain negative pressure provided by the corresponding air inlet, and the second end of which is connected to the corresponding pickup head or bonding head via the corresponding air inlet to transmit the negative pressure to adsorb the chip.

12. The bonding apparatus as claimed in claim 1, characterized in that, The first body of the chip pickup assembly is provided with six pickup heads, and each pickup head is distributed at a 60° angle around the periphery of the first body. The second body of the chip bonding assembly is provided with six bonding heads, each of which is distributed at a 60° angle around the periphery of the second body, so as to simultaneously acquire the six chips adsorbed by each of the pick-up heads of the chip pickup assembly.

13. A bonding method, characterized in that, Includes the following steps: The chip pickup component of the bonding apparatus as described in any one of claims 1 to 12 is moved laterally to a preset pickup station; The chip picking assembly uses a first rotary motor to rotate and switch multiple picking heads one by one to pick up the corresponding chips from the chip disk. The chip pickup assembly is moved laterally to a preset handover station; The chip is simultaneously picked up from the first adsorption surface of each pick-up head via multiple bonding heads of the chip bonding assembly of the bonding device. as well as Each of the acquired chips is bonded one by one or simultaneously to the corresponding target position on the wafer held by the wafer chuck via the multiple bonding heads.

14. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the bonding method as described in claim 13 is implemented.

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