Solder paste dispensing module and solder paste dispensing equipment

Abstract

The utility model discloses a solder paste dispensing module and solder paste dispensing equipment. The solder paste dispensing module comprises a base, a camera assembly, a height measuring assembly and a tin outlet assembly. The camera assembly is arranged on the base; the height measuring assembly is arranged on the base, can move in the vertical direction of the base relative to the camera assembly and is used for measuring the height of the position to be subjected to tin dispensing. The tin outlet assembly is connected with the height measuring assembly and can move along with the height measuring assembly, the tin outlet assembly comprises a tin outlet head, the tin outlet head is provided with a tin dispensing needle head which is arranged in a suspended mode, the tin dispensing needle head is arranged in a bent mode, and the tin dispensing needle head is provided with a tin dispensing opening. And the tin outlet head has a moving stroke of rotating around a rotating shaft extending along the vertical direction of the base. According to the arrangement mode of the solder paste dispensing module, the solder paste dispensing device is wider in solder paste dispensing range, more flexible in solder paste dispensing mode, higher in solder paste dispensing precision and more stable.

Description

Technical Field

[0001] This utility model relates to the technical field of soldering equipment, specifically to a solder paste application module and solder paste application equipment. Background Technology

[0002] Solder paste dispensing equipment is used in the electronics manufacturing industry to precisely apply solder paste to printed circuit boards (PCBs). For example, solder paste spray valve dispensing machines work by using compressed air or piezoelectric elements to propel solder paste from a nozzle, achieving non-contact dispensing. This allows for easy and precise application of solder paste to uneven surfaces or components with varying tolerances. However, traditional spray nozzles face downwards, limiting soldering operations to horizontally placed products. This makes soldering operations on small or inclined surfaces difficult. Utility Model Content

[0003] In order to solve the above-mentioned technical problems, the main purpose of this utility model is to provide a solder paste dispensing module and solder paste dispensing equipment, which aims to solve the problem that traditional solder paste dispensing equipment is difficult to operate on small or inclined surfaces.

[0004] To achieve the above objectives, this utility model proposes a solder paste application module, comprising:

[0005] Base;

[0006] The camera assembly is mounted on the base;

[0007] A height measuring component is mounted on the base and can move relative to the camera component along the vertical direction of the base, used to measure the height of the distance from the point to be soldered;

[0008] A solder dispensing assembly is connected to the height measuring assembly and can move together with the height measuring assembly. The solder dispensing assembly includes a solder dispensing head, which has a suspended soldering needle. The soldering needle is bent, and the solder dispensing head has a travel stroke that rotates about a rotation axis extending in the vertical direction along the base.

[0009] Optionally, the camera assembly, the height measuring assembly, and the solder tap are arranged at intervals along the transverse direction of the base.

[0010] Optionally, the solder tapping assembly includes:

[0011] The mounting base is slidably disposed on one side of the camera assembly along the vertical direction of the base;

[0012] The rotating sleeve is rotatably mounted on the mounting base;

[0013] A tin storage tube is fitted inside the rotating sleeve and can rotate together with the rotating sleeve;

[0014] The solder dispensing head can extend through the bottom of the solder storage cylinder so that the solder dispensing needle can be exposed.

[0015] Optionally, the rotating sleeve includes a first outer cylinder and a second outer cylinder that are detachably connected radially to the solder storage cylinder, and a clamp sleeved inside the first outer cylinder and the second outer cylinder. The first outer cylinder is rotatably connected to the mounting base, and the second outer cylinder is connected to the first outer cylinder such that at least a portion of the upper end of the solder storage cylinder is exposed. The clamp is engaged with the outer periphery of the solder storage cylinder.

[0016] Optionally, the first outer cylinder has a first connecting section arranged in an annular shape, a second connecting section snapped onto the outside of the clamp, and a connecting wall connecting the first connecting section and the second connecting section. The first connecting section is rotatably connected to the mounting base, and the second connecting section and the second outer cylinder surround each other to cover the outer periphery of the clamp. At least a portion of the connecting wall is hollowed out.

[0017] Optionally, the solder tapping assembly further includes a position limiting assembly, which includes a first position detector and a second position detector disposed on the outer periphery of the rotating sleeve, and a detection head disposed on the rotating sleeve;

[0018] When the rotating sleeve rotates along a first direction, such that the detection head is located within the detection area of ​​the first position detector, the rotating sleeve stops rotating along the first direction; when the rotating sleeve rotates along a second direction, such that the detection head is located within the detection area of ​​the second position detector, the rotating sleeve stops rotating along the second direction, wherein the first direction and the second direction are opposite.

[0019] Optionally, the solder paste application module further includes a drive assembly that is driven and connected to the rotating sleeve. The drive assembly is disposed on the mounting base and is used to drive the rotating sleeve to rotate.

[0020] Optionally, the height measuring component includes:

[0021] A height measuring mounting plate is detachably connected to the mounting base. The height measuring mounting plate is provided with a mounting part, and the mounting base is provided with a mating part that cooperates with the mounting part. The mounting part and the mating part cooperate to adjust the relative position of the height measuring mounting plate and the mounting base in the vertical direction.

[0022] A height sensor is installed on one side of the height measuring mounting plate.

[0023] Optionally, the solder paste application module further includes a height adjustment component, the height adjustment component comprising:

[0024] A height adjustment actuator is provided on the base;

[0025] A vertical straight module is connected to the height adjustment driver;

[0026] The transmission block is connected to the vertical linear module and the mounting base. The height adjustment driver drives the vertical linear module to move and drives the transmission block to move up and down along the base.

[0027] A solder paste application device includes the aforementioned solder paste application module.

[0028] The technical solution provided by this utility model has the following beneficial effects:

[0029] This utility model provides a solder paste dispensing module, including a base, a camera assembly, a height measuring assembly, and a solder dispensing assembly. The camera assembly can be used to acquire image information at the solder dispensing point to determine whether the solder dispensing is correct. The height measuring assembly can be used to measure the height from the solder dispensing point, thereby adjusting the height of the solder dispensing head of the solder dispensing assembly to better control the solder spraying height and ensure accurate and reliable solder dispensing range. Moreover, the solder dispensing needle of the solder dispensing assembly is bent, enabling lateral solder spraying for solder dispensing operations on the side of the product. Furthermore, the solder dispensing head can rotate, allowing for arbitrary adjustment of the orientation of the solder dispensing needle, making solder dispensing more flexible and diverse. Therefore, the configuration of this solder paste dispensing module results in a wider solder dispensing range, more flexible solder dispensing methods, higher solder dispensing accuracy, and greater stability. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of a structure of an embodiment of a solder paste application module provided by this utility model;

[0032] Figure 2 for Figure 1 Another structural diagram of the solder paste application module described above;

[0033] Figure 3 for Figure 1 A schematic diagram of the solder paste module from another perspective;

[0034] Figure 4 for Figure 1An exploded structural diagram of the solder paste module described herein.

[0035] Explanation of icon numbers:

[0036] 100 - Solder paste application module; 1 - Base; 2 - Camera assembly; 3 - Height measurement assembly; 31 - Height measurement mounting plate; 32 - Height sensor; 4 - Solder dispensing assembly; 41 - Mounting base; 42 - Rotating sleeve; 421 - First outer cylinder; 4211 - First connecting section; 4212 - Second connecting section; 4213 - Connecting wall; 422 - Second outer cylinder; 423 - Clamp; 43 - Solder storage cylinder; 431 - Solder application needle; 5 - Position limiting assembly; 51 - First position detector; 52 - Second position detector; 53 - Detection head; 6 - Drive assembly; 7 - Height adjustment assembly; 71 - Height adjustment driver; 72 - Vertical linear module; 73 - Transmission block.

[0037] The realization of the purpose, functional characteristics and excellent effects of this utility model will be further explained below in conjunction with specific embodiments and accompanying drawings. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0039] It should be noted that if the embodiments of this utility model involve directional indication, the directional indication is only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0040] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0041] This utility model provides a solder paste application module 100, suitable for solder paste application equipment. For details, please refer to... Figures 1 to 2 In this embodiment, the solder paste application module 100 includes a base 1, a camera assembly 2, a height measuring assembly 3, and a solder dispensing assembly 4. The camera assembly 2 is mounted on the base 1. The height measuring assembly 3 is mounted on the base 1 and can move relative to the camera assembly 2 along the vertical direction of the base 1 to measure the height of the point to be soldered. The solder dispensing assembly 4 is connected to the height measuring assembly 3 and can move together with the height measuring assembly 3. The solder dispensing assembly 4 includes a solder dispensing head with a suspended solder dispensing needle 431. The solder dispensing needle 431 is bent and has a travel radius that rotates about a rotation axis extending along the vertical direction of the base 1.

[0042] In this embodiment, the camera component 2 can be used to acquire image information at the soldering point, and the image information is used to determine whether the soldering is correct; the height measuring component 3 can be used to measure the height from the soldering point, thereby adjusting the height of the soldering head of the soldering component 4 to better control the solder spraying height and ensure accurate and reliable soldering range; moreover, the soldering needle 431 of the soldering component 4 is bent, thereby enabling lateral solder spraying to achieve soldering operation on the side of the product; and the soldering head can also rotate, and the orientation of the soldering needle 431 can be arbitrarily adjusted by rotating the soldering head, making soldering more flexible and diverse. Therefore, the arrangement of the solder paste module 100 makes the soldering method of the solder paste dispensing equipment more flexible, the soldering range wider, the soldering accuracy higher, and more stable.

[0043] The base 1 can be flat, box-shaped, or a frame assembled from a steel frame structure. Preferably, the base 1 supports the camera assembly 2 to fix it at a preset height, facilitating clear acquisition of image information at the solder joint. In one embodiment, the camera assembly 2 can also be movably mounted on the base 1, having a horizontal travel distance. For example, the camera assembly 2 has a travel distance along the left-right and / or front-back directions of the base 1, allowing the camera assembly 2 to move flexibly.

[0044] In one embodiment, such as Figure 3As shown, the camera assembly 2, the height measuring assembly 3, and the solder dispensing head are arranged at intervals along the transverse direction of the base 1. Furthermore, the camera assembly 2, the height measuring assembly 3, and the solder dispensing head can move together along the horizontal direction of the base 1 to ensure their relative positions in the horizontal direction. However, the height measuring assembly 3 and the solder dispensing head can move relative to the camera assembly 2 along the vertical direction of the base 1, allowing the height measuring assembly 3 to better determine the height of the solder dispensing head, thereby enabling adjustment of the solder dispensing head's soldering height.

[0045] Preferably, combined with Figure 1 and Figure 2 As shown, the solder dispensing assembly 4 includes a mounting base 41, a rotating sleeve 42, and a solder reservoir 43. The mounting base 41 is slidably disposed on one side of the camera assembly 2 along the vertical direction of the base 1. The rotating sleeve 42 is rotatably mounted on the mounting base 41. The solder reservoir 43 is fitted inside the rotating sleeve 42 and can rotate together with the rotating sleeve 42. The solder dispensing head can protrude through the bottom of the solder reservoir 43, so that the soldering needle 431 can be exposed. The rotation of the rotating sleeve 42 drives the rotation of the solder reservoir 43 to adjust the orientation of the soldering needle 431, thereby better realizing multi-directional soldering operations.

[0046] Preferably, the angle between the soldering needle 431 and the central axis of the solder storage cylinder 43 is 45º, wherein the product to be soldered is tilted and rotated on the carrier at a 45º angle to facilitate tilted soldering.

[0047] Furthermore, combined Figure 2 and Figure 4 As shown, the rotating sleeve 42 includes a first outer cylinder 421 and a second outer cylinder 422 detachably connected radially to the solder storage cylinder 43, and a clamp 423 sleeved inside the first outer cylinder 421 and the second outer cylinder 422. The first outer cylinder 421 is rotatably connected to the mounting base 41, and the second outer cylinder 422 is connected to the first outer cylinder 421, such that at least a portion of the upper end of the solder storage cylinder 43 is exposed. The clamp 423 is engaged with the outer periphery of the solder storage cylinder 43. The first outer cylinder 421 and the second outer cylinder 422 are connected by screws or bolts. During assembly, the clamp 423 can be engaged with the outside of the solder storage cylinder 43 first, then the solder storage cylinder 43 can be placed inside the first outer cylinder 421, and then the second outer cylinder 422 can be connected to the first outer cylinder 421 to fix the solder storage cylinder 43, making the assembly of the solder storage cylinder 43 more convenient.

[0048] Among them, such as Figure 4As shown, the first outer cylinder 421 has a first connecting section 4211 arranged in a ring, a second connecting section 4212 that is engaged with the outside of the clamp 423, and a connecting wall 4213 connecting the first connecting section 4211 and the second connecting section 4212. The first connecting section 4211 is rotatably connected to the mounting base 41. The second connecting section 4212 and the second outer cylinder 422 surround each other to cover the outer periphery of the clamp 423. At least a portion of the connecting wall 4213 is hollowed out, so that the upper end of the internal solder storage cylinder 43 can be exposed. This facilitates observation of the amount of solder in the solder storage cylinder 43 and also facilitates the soldering operation.

[0049] Moreover, combined Figure 1 and Figure 3 As shown, the solder dispensing assembly 4 further includes a position limiting assembly 5. The position limiting assembly 5 includes a first position detector 51 and a second position detector 52 disposed on the outer periphery of the rotating sleeve 42, and a detection head 53 disposed on the rotating sleeve 42. When the rotating sleeve 42 rotates in a first direction such that the detection head 53 is within the detection area of ​​the first position detector 51, the rotating sleeve 42 stops rotating in the first direction. When the rotating sleeve 42 rotates in a second direction such that the detection head 53 is within the detection area of ​​the second position detector 52, the rotating sleeve 42 stops rotating in the second direction. The first and second directions are opposite; for example, if the first direction is clockwise, the second direction is counterclockwise. The position limiting assembly 5 allows for better control of the rotation range of the solder dispensing needle 431.

[0050] The solder paste application module 100 further includes a drive component 6 that is driven and connected to the rotating sleeve 42. The drive component 6 is disposed on the mounting base 41 and is used to drive the rotating sleeve 42 to rotate. By driving the rotating sleeve 42 to rotate through the drive component 6, the solder paste application needle 431 is driven to rotate, so as to more intelligently adjust the solder paste application position of the solder paste application needle 431.

[0051] It is understood that the solder paste application module 100 may also include a controller. The controller is electrically connected to the camera component 2, the height measuring component 3, and the drive component 6. The controller can obtain the horizontal position of the solder application point based on the image information detected by the camera component 2, and obtain the vertical position of the solder application point based on the height measuring component 3, thereby controlling the movement of the solder application needle 431. The controller can also control the rotation of the solder application needle 431 to adjust the solder application direction, making the solder application of the entire solder paste application module 100 more flexible and precise.

[0052] The height measuring component 3 includes a height measuring mounting plate 31 and a height measuring sensor 32. The height measuring mounting plate 31 is detachably connected to the mounting base 41. The height measuring mounting plate 31 is provided with a mounting part, and the mounting base 41 is provided with a mating part that cooperates with the mounting part. The mounting part and the mating part cooperate to adjust the relative position of the height measuring mounting plate 31 and the mounting base 41 in the vertical direction. The height measuring sensor 32 is located on one side of the height measuring mounting plate 31, making the installation method more flexible.

[0053] Specifically, the mounting part includes an elongated hole on the height measuring mounting plate 31, which extends along the vertical direction of the base 1. The mating part includes a mating hole on the mounting base 41. By aligning the mating hole with different positions of the elongated hole, the height measuring mounting plate 31 can be fixed at different heights on the mounting base 41, thereby allowing for better adjustment of the position of the height measuring mounting plate 31.

[0054] Moreover, combined Figure 2 and Figure 4 As shown, the solder paste application module 100 further includes a height adjustment component 7. The height adjustment component 7 includes a height adjustment driver 71, a vertical linear module 72, and a transmission block 73. The height adjustment driver 71 is mounted on the base 1 and can be configured as a drive motor. The vertical linear module 72 is connected to the height adjustment driver 71 and includes a transmission screw and a sliding block screwed onto the transmission screw. The transmission screw extends along the vertical direction of the base 1. The height adjustment driver 71 drives the transmission screw to rotate, thereby causing the sliding block to move along the vertical direction of the base 1. The transmission block 73 is connected to the vertical linear module 72 and to the mounting base 41. The height adjustment driver 71 drives the vertical linear module 72 to move and causes the transmission block 73 to move up and down along the base 1. The transmission block 73 is connected to the sliding block. The up-and-down movement of the sliding block drives the transmission block 73 to move up and down, thereby driving the height sensor 32 and the solder dispensing assembly 4 to move together along the up-and-down direction of the base 1.

[0055] This utility model also provides a solder paste application device, which includes the aforementioned solder paste application module 100. The solder paste application module 100 makes the solder paste application more flexible and more precise.

[0056] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structure made using the contents of the present utility model specification and drawings, or directly or indirectly applied to other related technical fields, are similarly included within the patent protection scope of the present utility model.

Claims

1. A solder paste application module, characterized in that, include: Base; The camera assembly is mounted on the base; A height measuring component is mounted on the base and can move relative to the camera component along the vertical direction of the base, used to measure the height of the distance from the point to be soldered; A solder dispensing assembly is connected to the height measuring assembly and can move together with the height measuring assembly. The solder dispensing assembly includes a solder dispensing head, which has a suspended soldering needle. The soldering needle is bent, and the solder dispensing head has a travel stroke that rotates about a rotation axis extending in the vertical direction along the base.

2. The solder paste application module as described in claim 1, characterized in that, The camera assembly, the height measuring assembly, and the solder tap are arranged at intervals along the transverse direction of the base.

3. The solder paste application module as described in claim 1, characterized in that, The solder tapping assembly includes: The mounting base is slidably disposed on one side of the camera assembly along the vertical direction of the base; The rotating sleeve is rotatably mounted on the mounting base; A tin storage tube is fitted inside the rotating sleeve and can rotate together with the rotating sleeve; The solder dispensing head can extend through the bottom of the solder storage cylinder so that the solder dispensing needle can be exposed.

4. The solder paste application module as described in claim 3, characterized in that, The rotating sleeve includes a first outer cylinder and a second outer cylinder that are detachably connected radially along the solder storage cylinder, and a clamp sleeved on the inner side of the first outer cylinder and the second outer cylinder. The first outer cylinder is rotatably connected to the mounting base, and the second outer cylinder is connected to the first outer cylinder such that at least a portion of the upper end of the solder storage cylinder is exposed. The clamp is engaged with the outer periphery of the solder storage cylinder.

5. The solder paste application module as described in claim 4, characterized in that, The first outer cylinder has a first connecting section arranged in a ring shape, a second connecting section that is engaged with the outside of the clamp, and a connecting wall connecting the first connecting section and the second connecting section. The first connecting section is rotatably connected to the mounting base, and the second connecting section and the second outer cylinder surround each other to cover the outer periphery of the clamp. At least a portion of the connecting wall is hollowed out.

6. The solder paste application module as described in claim 3, characterized in that, The solder dispensing assembly further includes a position limiting assembly, which includes a first position detector and a second position detector disposed on the outer periphery of the rotating sleeve, and a detection head disposed on the rotating sleeve; When the rotating sleeve rotates along a first direction, such that the detection head is located within the detection area of ​​the first position detector, the rotating sleeve stops rotating along the first direction; when the rotating sleeve rotates along a second direction, such that the detection head is located within the detection area of ​​the second position detector, the rotating sleeve stops rotating along the second direction, wherein the first direction and the second direction are opposite.

7. The solder paste application module as described in claim 3, characterized in that, The solder paste application module also includes a drive assembly that is driven and connected to the rotating sleeve. The drive assembly is located on the mounting base and is used to drive the rotating sleeve to rotate.

8. The solder paste application module as described in claim 3, characterized in that, The height measuring component includes: A height measuring mounting plate is detachably connected to the mounting base. The height measuring mounting plate is provided with a mounting part, and the mounting base is provided with a mating part that cooperates with the mounting part. The mounting part and the mating part cooperate to adjust the relative position of the height measuring mounting plate and the mounting base in the vertical direction. A height sensor is installed on one side of the height measuring mounting plate.

9. The solder paste application module as described in claim 3, characterized in that, The solder paste application module also includes a height adjustment component, which includes: A height adjustment actuator is provided on the base; A vertical straight module is connected to the height adjustment driver; The transmission block is connected to the vertical linear module and the mounting base. The height adjustment driver drives the vertical linear module to move and drives the transmission block to move up and down along the base.

10. A solder paste application device, characterized in that, Includes the solder paste application module as described in any one of claims 1 to 9.

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