Optical wafer cutting and splitting jig
By designing fixing grooves and support points on the optical wafer dicing fixture, the problem of dust accumulation was solved, eliminating the need for additional cleaning operations, reducing costs, and protecting the imaging structure of the AR diffractive waveguide.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG ZHIGE TECH CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-05-26
Smart Images
Figure CN224273669U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of laser cutting and dicing technology for AR diffractive waveguides, specifically relating to an optical wafer cutting and dicing fixture. Background Technology
[0002] To obtain AR diffractive waveguides of the desired shape, it is currently necessary to perform laser cutting and dicing operations on optical wafers with AR diffractive waveguides.
[0003] The current method typically involves placing the optical wafer to be processed on an optical wafer dicing fixture, and then using a laser dicing device to perform laser dicing on the optical wafer to be processed placed on the optical wafer dicing fixture, thereby obtaining an AR diffraction waveguide of the desired shape.
[0004] Existing optical wafer dicing fixtures include a support base, a support stage on the support base, a fixing groove at a predetermined position on the upper surface of the support stage, and support points within the fixing groove. The height of the support points within the fixing groove is the same as the height of the upper surface of the support stage. In the process of laser dicing the optical wafer to be processed on the fixture using laser dicing equipment, the upper surface of the support stage and the support points within the fixing groove are used to position and support the optical wafer. Dust generated during dicing easily accumulates in the imaging structure area of the AR diffraction waveguide under gravity and electrostatic forces, requiring additional cleaning of the AR diffraction waveguide after dicing, increasing processing costs, and potentially damaging the imaging structure of the AR diffraction waveguide. Utility Model Content
[0005] In order to overcome the shortcomings of the prior art, this utility model provides an optical wafer cutting and dicing fixture.
[0006] This utility model is achieved through the following technical solution:
[0007] This utility model provides an optical wafer dicing fixture, including a support base and a support stage;
[0008] The lower surface of the support platform is disposed on the upper surface of the support base;
[0009] The upper surface of the support platform is provided with a fixing groove at a set position, and a support point is provided in the fixing groove. The height of the support point in the fixing groove is lower than the height of the upper surface of the support platform.
[0010] During the laser cutting and dicing process of the optical wafer to be processed, the upper surface of the support stage positions and supports the non-AR diffraction waveguide region of the optical wafer to be processed. After the laser cutting and dicing operation of the optical wafer to be processed is completed, the support points position and support the non-imaging structure region in the AR diffraction waveguide.
[0011] Furthermore, the shape and size of the fixing groove correspond to the shape and size of the AR diffraction waveguide in the optical wafer to be processed.
[0012] Furthermore, the fixed groove is positioned on the upper surface of the support stage and corresponds to the position of the AR diffraction waveguide within the optical wafer to be processed.
[0013] Furthermore, the upper surface of the support platform is provided with fixing grooves at multiple predetermined positions.
[0014] Furthermore, multiple support points are spaced apart within the fixing groove.
[0015] Furthermore, the side of the optical wafer to be processed that has the AR diffraction waveguide region contacts the upper surface of the support stage.
[0016] Furthermore, a covering layer is provided at the top of the support point.
[0017] Furthermore, the vertical distance between the top of the support point and the upper surface of the support platform is less than 0.2 mm.
[0018] Furthermore, the vertical distance between the top of the support point and the upper surface of the support platform is 0.15mm.
[0019] Compared with the prior art, the technical solution of this utility model has the following beneficial effects:
[0020] This invention provides an optical wafer dicing fixture, including a support base and a support stage. The lower surface of the support stage is disposed on the upper surface of the support base. A fixing groove is provided at a predetermined position on the upper surface of the support stage, and support points are provided within the fixing groove. The height of the support points within the fixing groove is lower than the height of the upper surface of the support stage. During the laser dicing of the optical wafer to be processed, the upper surface of the support stage provides positioning support for the non-AR diffraction waveguide region of the optical wafer to be processed. After the laser dicing operation of the optical wafer to be processed is completed, the support points provide positioning support for the non-imaging structure region in the AR diffraction waveguide. When the optical wafer to be processed is placed on the optical wafer dicing fixture of this invention for laser dicing, because the height of the support point in the fixed groove is lower than the height of the upper surface of the carrier stage, the dust generated by dicing will pass through the imaging structure area of the AR diffraction waveguide of the optical wafer under the action of the dicing airflow and migrate and accumulate on the upper surface of the carrier stage in the area where the non-AR diffraction waveguide area of the optical wafer to be processed is positioned and supported. This ensures that the dust generated by dicing will not contaminate the imaging structure area of the AR diffraction waveguide, eliminating the need for additional cleaning operations on the AR diffraction waveguide obtained after optical wafer dicing, reducing processing costs, and without damaging the imaging structure of the AR diffraction waveguide. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1 This is a schematic diagram of the overall structure of the optical wafer dicing fixture of this utility model.
[0023] Figure 2 This is a top view of the support platform;
[0024] Figure 3 for Figure 2 A partial sectional view of the support points of a single fixed groove;
[0025] Figure 4 This is a top view of the support base;
[0026] Figure 5 for Figure 2 Enlarged view of the fixing groove in the middle;
[0027] Figure 6 This is a bottom view of the support platform.
[0028] Among them, 1-optical wafer dicing jig, 2-support base, 2-1-first groove, 2-2-first vacuum inlet hole, 2-3-second groove, 2-4-second vacuum inlet hole, 2-5-fourth vacuum inlet hole, 3-support platform, 3-1-fixed groove, 3-2-support point, 3-3-first vacuum through hole, 3-4-second vacuum through hole, 3-5-third groove, 3-6-third ventilation pipe, 3-7-third vacuum inlet hole, 3-8-fourth groove, 3-9-fifth groove. Detailed Implementation
[0029] The technical solution of this utility model will be clearly and completely described below with reference to its embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0030] In this document, the terms "first," "second," and other similar words are not intended to imply any order, quantity, or importance, but are merely used to distinguish different elements. The terms "one," "a," and other similar words are not intended to indicate the existence of only one of the stated things, but rather that the description refers only to one of the stated things, which may have one or more. The terms "comprising," "including," and other similar words are intended to indicate a logical relationship, not a spatial relationship. For example, "A includes B" means that logically B belongs to A, not that spatially B is located inside A. Furthermore, the meanings of the terms "comprising," "including," and other similar words should be considered open-ended, not closed. For example, "A includes B" means that B belongs to A, but B does not necessarily constitute all of A; A may also include other elements such as C, D, and E.
[0031] In this document, the terms "embodiment," "this embodiment," "preferred embodiment," and "one embodiment" do not imply that the description applies only to one specific embodiment, but rather that such description may also be applicable to one or more other embodiments. Those skilled in the art will understand that any description made herein relating to one embodiment can be substituted, combined, or otherwise incorporated with the descriptions in one or more other embodiments. Such substitutions, combinations, or other incorporations resulting in new embodiments are readily conceived by those skilled in the art and fall within the protection scope of this utility model.
[0032] In this description, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0033] Optical wafer dicing fixtures are used for laser dicing of optical wafers.
[0034] An AR diffraction waveguide with the required profile is set inside the optical wafer to be processed. The optical wafer to be processed is then laser-cut and cleaved to obtain the AR diffraction waveguide with the required profile.
[0035] like Figure 1 As shown, the optical wafer dicing fixture 1 of this invention includes a support base 2 and a support stage 3. The upper surface of the support stage is in contact with the optical wafer to be processed.
[0036] In the laser cutting and dicing operation of an optical wafer placed on an optical wafer cutting and dicing fixture, in order to prevent laser damage to the imaging structure area of the AR diffraction waveguide in the optical wafer, the side of the optical wafer with the AR diffraction waveguide area is in contact with the upper surface of the support stage.
[0037] To prevent the upper surface of the stage from contacting the AR diffraction waveguide region inside the optical wafer to be processed and causing damage to the AR diffraction waveguide region, a fixing groove is set at a set position on the upper surface of the stage.
[0038] The position of the fixing slot on the upper surface of the support stage corresponds to the position of the AR diffraction waveguide in the optical wafer to be processed, and the shape and size of the fixing slot correspond to the shape and size of the AR diffraction waveguide in the optical wafer to be processed.
[0039] The number of fixing slots on the upper surface of the support stage corresponds to the number of AR diffraction waveguides within the optical wafer to be processed. For example, if one AR diffraction waveguide is placed within an optical wafer to be processed, the number of fixing slots can be one; multiple AR diffraction waveguides can also be placed within the optical wafer to be processed, in which case the number of fixing slots can be multiple, and the number of fixing slots can be equal to the number of AR diffraction waveguides.
[0040] For example, consider a wafer containing six AR diffractive waveguides with identical external contours. Figure 2 As shown, the upper surface of the support stage 3 has 6 fixing slots 3-1 in the inner region. The positions of the 6 fixing slots 3-1 on the upper surface of the support stage correspond to the positions of the 6 AR diffraction waveguides in the optical wafer to be processed. The outline and size of the 6 fixing slots 3-1 correspond to the outline and size of the 6 AR diffraction waveguides in the optical wafer to be processed.
[0041] After the laser cutting and dicing operation of the optical wafer to be processed is completed, in order to prevent the AR diffraction waveguide from falling into the fixing groove and causing damage to the imaging structure area of the AR diffraction waveguide, support points are set in the fixing groove. The support points position and support the non-imaging structure area in the AR diffraction waveguide.
[0042] The support points are positioned at a height lower than the upper surface of the support platform (e.g., ...). Figure 3 (As shown).
[0043] During the laser cutting and dicing process of the optical wafer to be processed, the upper surface of the support stage positions and supports the non-AR diffraction waveguide region of the optical wafer to be processed. After the laser cutting and dicing operation of the optical wafer to be processed is completed, the support points position and support the non-imaging structure region in the AR diffraction waveguide.
[0044] When the optical wafer to be processed is placed on the optical wafer dicing fixture of this invention for laser dicing, since the height of the support point in the fixed groove is lower than the height of the upper surface of the carrier stage, the dicing dust will pass through the imaging structure area of the AR diffraction waveguide of the optical wafer under the action of the dicing airflow and migrate and accumulate on the upper surface of the carrier stage in the area where the non-AR diffraction waveguide area of the optical wafer to be processed is positioned and supported. This prevents the dicing dust from contaminating the imaging structure area of the AR diffraction waveguide, eliminating the need for additional cleaning operations on the AR diffraction waveguide obtained after dicing the optical wafer, reducing processing costs, and preventing damage to the imaging structure of the AR diffraction waveguide.
[0045] There is no specific limitation on the number of support points within the fixing groove. Those skilled in the art can design the corresponding support points based on the outer contour of the optical wafer to be processed and the outer contour of the AR diffraction waveguide installed within the optical wafer. Preferably, multiple support points can be spaced out within the fixing groove.
[0046] The location of the support points within the fixed slot must correspond to the non-imaging structure region in the AR diffraction waveguide within the optical wafer to be processed.
[0047] To prevent the height difference between the top of the support point and the upper surface of the carrier from being too large and affecting the cutting accuracy of the optical wafer, preferably, the vertical distance between the top of the support point and the upper surface of the carrier is less than 0.2 mm, and more preferably, the vertical distance between the top of the support point and the upper surface of the carrier is 0.15 mm.
[0048] In a preferred embodiment, a coating layer (not shown in the figure) is provided at the top of the support point. For example, the coating layer can be a Teflon coating at the top of the support point. Providing a coating layer at the top of the support point can reduce the coefficient of friction and also reduce dust adhesion at the top of the support point.
[0049] The lower surface of the support platform is located on the upper surface of the support base. Specifically, the upper surface of the support base is placed horizontally, and the edge area of the lower surface of the support platform contacts the edge area of the upper surface of the support base.
[0050] like Figure 4 As shown, a first groove 2-1 is formed on the upper surface of the support base 2 near the edge area.
[0051] When the edge area of the lower surface of the support platform 3 is in contact with the edge area of the upper surface of the support base 2, the first groove 2-1 is in a sealed state.
[0052] A first vacuum inlet 2-2 is formed in the first groove 2-1, and the first vacuum inlet 2-2 is connected to the vacuum generator through the first ventilation pipe.
[0053] Vacuum gas in the vacuum generator enters the first groove 2-1 through the first ventilation pipe and the first vacuum inlet 2-2. The first groove 2-1 is under negative pressure, thereby achieving adsorption and fixation between the lower surface of the support platform 3 and the upper surface of the support base 2. Compared with the existing fixation method, this improves the yield of laser cutting and dicing of the optical wafer to be processed.
[0054] As a preferred example, in order to facilitate the control of the vacuum gas in the vacuum generator entering the first groove 2-1 through the first ventilation pipe and the first vacuum inlet 2-2, a valve can be installed on the first ventilation pipe. By controlling the opening and closing of the valve, the vacuum gas in the vacuum generator can be controlled to enter the first groove 2-1 through the first ventilation pipe and the first vacuum inlet 2-2.
[0055] As a preferred example, the upper surface of the aforementioned support platform is provided with multiple first vacuum through holes in the area where no fixing groove is opened.
[0056] A second groove is formed on the upper surface of the support base in the area in contact with the first vacuum through hole. A second vacuum air inlet is formed in the second groove, and the second vacuum air inlet is connected to the vacuum generator through a second ventilation pipe.
[0057] For example, such as Figure 2 As shown, the upper surface of the support platform 3 has six fixing grooves 3-1 in the inner region, a first vacuum through hole 3-3 in the region between the fixing grooves 3-1, and a first vacuum through hole 3-3 in the outer region surrounding the fixing grooves 3-1. Figure 4 As shown, a second groove 2-3 is formed on the upper surface of the support base 2 in the area in contact with the first vacuum through hole 3-3. A second vacuum inlet hole 2-4 is formed in the second groove 2-3. The second vacuum inlet hole 2-4 is connected to the vacuum generator through a second ventilation pipe.
[0058] Vacuum gas in the vacuum generator enters the second groove 2-3 through the second ventilation pipe and the second vacuum inlet 2-4, and then enters each of the first vacuum through holes 3-3 through the second groove 2-3, thereby achieving the adsorption and fixation of the optical wafer to be processed by the optical wafer cutting and dicing fixture during the laser cutting and dicing process of the optical wafer to be processed.
[0059] To facilitate the control of vacuum gas in the vacuum generator entering the second groove through the second ventilation pipe and the second vacuum inlet, a valve can be installed on the second ventilation pipe. By controlling the opening and closing of the valve, the vacuum gas in the vacuum generator can be controlled to enter the second groove through the second ventilation pipe and the second vacuum inlet.
[0060] In the process of laser cutting and dicing optical wafers, the aforementioned method of using vacuum gas from a vacuum generator to enter the second groove through the second ventilation pipe and the second vacuum inlet to enter each of the first vacuum through holes to achieve the adsorption and fixation of the optical wafer by the optical wafer cutting and dicing fixture is problematic because the adsorption force of the first vacuum through holes is relatively large, which will hinder the laser dicing operation after the optical wafers are laser-cut.
[0061] Therefore, as a preferred implementation method, such as Figure 5 As shown, a second vacuum through hole 3-4 is opened at the aforementioned support point 3-2.
[0062] like Figure 6 As shown, a third groove 3-5 is formed in the inner area of the lower surface of the support platform 3. A third ventilation pipe 3-6 is provided in the third groove 3-5. A third vacuum air inlet 3-7 is provided on the third ventilation pipe 3-6. The third ventilation pipe 3-6 is connected to the second vacuum through hole 3-4.
[0063] The third vacuum inlet 3-7 is connected to the vacuum generator. For example, as shown... Figure 4 As shown, a fourth vacuum inlet 2-5 is provided on the upper surface of the support base 2. The fourth vacuum inlet 2-5 is correspondingly provided with the third vacuum inlet 3-7. The fourth vacuum inlet 2-5 is connected to the vacuum generator through a fourth ventilation pipe.
[0064] Vacuum gas from the vacuum generator enters the second vacuum throughlet sequentially through the fourth ventilation pipe, the fourth vacuum inlet, the third vacuum inlet, and the third ventilation pipe. Similarly, to facilitate control of the vacuum gas's sequential flow through these pipes, a valve can be installed on the fourth ventilation pipe. Controlling the valve's opening and closing controls the flow of vacuum gas from the vacuum generator into the second vacuum throughlet.
[0065] Therefore, during laser cutting of the optical wafer, vacuum gas from the vacuum generator can enter the second groove through the second ventilation pipe and the second vacuum inlet to enter each of the first vacuum through holes, thereby achieving the adsorption and fixation of the optical wafer by the optical wafer cutting jig. During the laser dicing operation after laser cutting of the optical wafer, the vacuum gas from the vacuum generator sequentially enters the second vacuum through holes through the fourth ventilation pipe, the fourth vacuum inlet, the third vacuum inlet, and the third ventilation pipe to achieve the adsorption and fixation of the optical wafer at the support points. This improves the yield of the laser dicing process for the optical wafer.
[0066] In a preferred embodiment, a fourth groove 3-8 is formed on the upper surface of the support platform 3 in the edge region (e.g., Figure 1 (As shown). After the optical wafer to be processed is laser-cut and diced, the adsorption and fixing operation on the lower surface of the support stage and the upper surface of the support base can be eliminated, thereby facilitating the waste disposal operation by gripping the support stage 3 through the fourth groove 3-8. For example, a robotic arm can be used to grip the support stage through the fourth groove for waste disposal.
[0067] To prevent waste from splashing during the waste dumping operation, a fifth groove is formed on the upper surface of the support platform 3 around the area where the fixing groove 3-1 is set. This fifth groove can block waste from splashing during the waste dumping operation. For example, as shown... Figure 2 As shown, the fifth groove 3-9 can be an annular groove.
[0068] The above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although the utility model has been described in detail with reference to the above embodiments, those skilled in the art can still make modifications or equivalent substitutions to the specific implementation of this utility model. Any modifications or equivalent substitutions that do not depart from the spirit and scope of this utility model are within the protection scope of the claims of this utility model pending approval.
Claims
1. An optical wafer dicing fixture, characterized in that, Includes a support base and a support platform; The lower surface of the support platform is disposed on the upper surface of the support base; The upper surface of the support stage contacts the side of the optical wafer to be processed where the AR diffraction waveguide region is set; a fixing groove is set at a set position on the upper surface of the support stage, and a support point is set in the fixing groove, the setting height of the support point in the fixing groove is lower than the height of the upper surface of the support stage; The vertical distance between the top of the support point and the upper surface of the support platform is less than 0.2 mm; A covering layer is provided at the top of the support point; During the laser cutting and dicing process of the optical wafer to be processed, the upper surface of the support stage positions and supports the non-AR diffraction waveguide region of the optical wafer to be processed. After the laser cutting and dicing operation of the optical wafer to be processed is completed, the support points position and support the non-imaging structure region in the AR diffraction waveguide.
2. The optical wafer dicing fixture according to claim 1, characterized in that, The shape and size of the fixing groove correspond to the shape and size of the AR diffraction waveguide in the optical wafer to be processed.
3. The optical wafer dicing fixture according to claim 1, characterized in that, The fixed slot is positioned on the upper surface of the support stage and corresponds to the position of the AR diffraction waveguide inside the optical wafer to be processed.
4. The optical wafer dicing fixture according to any one of claims 1-3, characterized in that, The upper surface of the support platform is provided with fixing grooves at multiple predetermined positions.
5. The optical wafer dicing fixture according to any one of claims 1-3, characterized in that, Multiple support points are spaced apart within the fixed groove.
6. The optical wafer dicing fixture according to claim 1, characterized in that, The vertical distance between the top of the support point and the upper surface of the support platform is 0.15 mm.