A fixing assembly of a wafer cutting device

Abstract

This utility model discloses a fixing component of a wafer dicing device, relating to the field of wafer processing technology. Its key technical features include: a base having a horizontal working surface for supporting wafers; a clamping mechanism disposed around the periphery of the base, comprising clamping components with adjustable spacing, a gap between the lower surface of the clamping components and the working surface; and a cleaning component disposed on the lower surface of the clamping components and in contact with the working surface. This utility model can add an automatic cleaning function, avoiding the cleaning work required when re-fixing the wafers.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to a fixing component of a wafer dicing device. Background Technology

[0002] In a wafer positioning and dicing device described in existing application number CN202411666696.1, the fixing component of the wafer dicing device typically lacks an automatic debris removal function. During wafer processing, when a new wafer needs to be fixed, the operator must first manually clean the debris remaining on the worktable. This step not only increases the operator's workload but may also lead to contamination or damage to the wafer during fixing due to incomplete cleaning or improper operation, thereby affecting the wafer processing quality and efficiency. Summary of the Invention

[0003] In order to solve the above-mentioned technical problems, the purpose of this utility model is to provide a fixing component of a wafer dicing device, which adds an automatic cleaning function to avoid the cleaning work when re-fixing the wafer.

[0004] To achieve the above objectives, the present invention provides the following technical solution:

[0005] A fixing component of a wafer dicing apparatus includes:

[0006] The base has a horizontal working surface for supporting the wafer;

[0007] A clamping mechanism is provided on the periphery of the base and includes an adjustable-spacing clamping assembly, with a gap between the lower surface of the clamping assembly and the working surface;

[0008] The cleaning component, located on the lower surface of the clamping component and in contact with the working surface, enables automatic cleaning.

[0009] Preferably, the cleaning component is a roller brush or a scraper, which is the specific component that realizes the cleaning function.

[0010] Preferably, a collection hole is provided on the working surface, and a collection box connected to the collection hole is provided below the working surface. A negative pressure generating device is provided on one side of the collection box, and a filter screen is provided at the air intake of the negative pressure generating device, which has the function of automatically collecting debris.

[0011] Preferably, the collection box is provided with a cleaning door, which is made of explosion-proof glass for easy observation and cleaning.

[0012] Preferably, the surface of the cleaning component is provided with an antistatic coating to prevent the static adhesion of debris.

[0013] Preferably, the clamping assembly includes a clamping electric cylinder, the output shaft of which faces the working surface and is provided with a clamping plate, and the cleaning assembly is located below the clamping plate to realize the automatic clamping function.

[0014] This utility model has the following beneficial effects:

[0015] High versatility: The clamping mechanism includes adjustable-pitch clamping components, which can adapt to wafers of different sizes, improving the versatility of the device, meeting various production needs, and reducing the trouble and cost of changing equipment due to different wafer sizes.

[0016] To prevent scratching the wafer: A gap is left between the lower surface of the clamping component and the working surface. When clamping the wafer, this prevents the clamping component from directly contacting the back of the wafer, effectively avoiding scratching the wafer and ensuring the quality and performance of the wafer.

[0017] Easy cleaning of the working surface: The cleaning component is located on the lower surface of the clamping component and in contact with the working surface. It can promptly remove debris and other impurities from the working surface during or after cutting, keeping the working surface clean and ensuring cutting accuracy and wafer quality. The cleaning component uses a roller brush or scraper, allowing for flexible selection of the appropriate cleaning method to improve cleaning effectiveness.

[0018] Highly efficient debris collection: Collection holes are provided on the working surface, and a collection box connected to the collection holes is installed below. Under the action of the negative pressure generating device, debris and other impurities on the working surface can be sucked into the collection box, achieving efficient debris collection and preventing debris from accumulating on the working surface and affecting cutting operations. A filter screen is installed at the air intake of the negative pressure generating device to prevent debris from entering the negative pressure generating device and protect the normal operation of the equipment.

[0019] Easy cleaning operation: The collection box has a cleaning door. When the debris in the collection box accumulates to a certain level, the staff can easily clean the debris through the cleaning door. The operation is simple and quick, improving work efficiency.

[0020] High safety performance: The cleaning door is made of explosion-proof glass, which not only allows staff to easily observe the debris inside the collection box, but also ensures safety during operation and prevents debris from flying and injuring people in case of accidents.

[0021] Preventing electrostatic interference: The surface of the cleaning components is coated with an anti-static coating, which can effectively prevent the generation of static electricity during the cleaning process, avoid damage to the wafer by static electricity, and ensure the quality and performance of the wafer. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a front view of an embodiment of the present utility model.

[0024] Figure 2 This is a partial structural schematic diagram of an embodiment of the present utility model.

[0025] In the diagram: 1. Base; 101. Working surface; 2. Cleaning assembly; 301. Collection hole; 302. Collection box; 303. Negative pressure generating device; 304. Filter screen; 305. Cleaning door; 401. Clamping electric cylinder; 402. Clamping plate. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] like Figure 1 As shown, a fixing component of a wafer dicing apparatus includes: a base 1 having a horizontal working surface 101 for carrying wafers; a clamping mechanism disposed around the periphery of the base 1, including a clamping component with adjustable spacing, wherein a gap is left between the lower surface of the clamping component and the working surface 101; and a cleaning component 2 disposed on the lower surface of the clamping component and in contact with the working surface 101.

[0028] like Figure 1As shown, the base 1 provides a stable support foundation for the entire fixing assembly. Its horizontal working surface 101 is used to support the wafer, ensuring that the wafer remains stable during the cutting process and preventing the wafer from tilting or shaking due to unevenness of the base 1, thus affecting the cutting accuracy. The clamping assembly is located around the periphery of the base 1, and by adjusting the spacing, it can accommodate wafers of different sizes. When a wafer needs to be clamped, the spacing of the clamping assembly is adjusted according to the size of the wafer to ensure that it fits tightly against the edge of the wafer, firmly fixing the wafer to the working surface 101 and preventing the wafer from moving or shifting during the cutting process, thus ensuring the accuracy and stability of the cutting. A gap is left between the lower surface of the clamping assembly and the working surface 101. This design avoids the clamping assembly from directly contacting the back of the wafer, thereby preventing scratches or damage to the back of the wafer during clamping and protecting the integrity of the wafer. The cleaning component 2 is disposed on the lower surface of the clamping component and in contact with the working surface 101. During the wafer dicing process, the debris and impurities generated during dicing fall onto the working surface 101. The cleaning component 2 can clean the debris and impurities on the working surface 101 in real time, keeping the working surface 101 clean and preventing debris and impurities from affecting the running trajectory of the cutting tool, thereby ensuring dicing accuracy and wafer quality.

[0029] like Figure 1 As shown, the cleaning component 2 uses a roller brush or scraper. The cleaning component 2, using a roller brush or scraper, is positioned on the lower surface of the clamping component (clamping plate 402) and in contact with the working surface 101. During the wafer dicing process, the chips and impurities generated during dicing fall onto the working surface 101. The cleaning component 2 can clean the working surface 101 in real time, sweeping or scraping away the chips and impurities to keep the working surface 101 clean.

[0030] like Figure 1 As shown, a collection hole 301 is provided on the working surface. A collection box 302 connected to the collection hole 301 is provided below the working surface 101. A negative pressure generating device 303 is provided on one side of the collection box 302, and a filter screen 304 is provided at the air intake of the negative pressure generating device 303. The collection hole 301 on the working surface 101 allows cutting debris and impurities, after being cleaned by the cleaning component 2, to fall into the collection box 302 below through the collection hole 301. The negative pressure generating device 303 generates negative pressure when it is working, accelerating the entry of debris and impurities into the collection box 302 through the collection hole 301, thus improving collection efficiency. The filter screen 304 at the air intake of the negative pressure generating device 303 prevents debris and impurities from entering the inside of the negative pressure generating device 303, protecting the normal operation of the equipment.

[0031] like Figure 1As shown, the collection box 302 has a cleaning door 305 made of explosion-proof glass. The explosion-proof glass cleaning door 305 allows workers to easily observe the collection of debris and impurities inside the collection box 302, and also allows for safe opening of the cleaning door 305 for cleaning operations when needed. Furthermore, the explosion-proof glass provides sufficient strength and safety to prevent accidents during the cleaning process.

[0032] like Figure 1 As shown, the surface of the cleaning component 2 is coated with an anti-static coating. This anti-static coating effectively prevents the adsorption of debris and impurities by static electricity during the cleaning process, avoiding the re-adhesion of debris and impurities onto the working surface 101. It also reduces the impact of static electricity on the wafer, ensuring cutting accuracy and wafer quality.

[0033] like Figure 1 As shown, the clamping assembly includes a clamping electric cylinder 401. The output shaft of the clamping electric cylinder 401 faces the working surface 101 and is equipped with a clamping plate 402. The cleaning assembly 2 is located below the clamping plate 402. When it is necessary to clamp the wafer, the spacing of the clamping assembly is adjusted according to the size of the wafer so that the clamping plate 402 fits tightly against the edge of the wafer. Using the power provided by the clamping electric cylinder 401, the wafer is firmly fixed on the working surface 101, preventing the wafer from moving or shifting during the cutting process, and ensuring the accuracy and stability of the cutting.

[0034] The above are merely specific embodiments of this utility model, but the technical features of this utility model are not limited thereto. Any simple changes, equivalent substitutions, or modifications made based on this utility model to solve essentially the same technical problems and achieve essentially the same technical effects are all covered within the protection scope of this utility model.

Claims

1. A fixing component of a wafer dicing apparatus, characterized in that, include: The base (1) has a horizontal working surface (101) for supporting the wafer. A clamping mechanism is provided on the periphery of the base (1) and includes a clamping assembly with adjustable spacing, wherein a gap is left between the lower surface of the clamping assembly and the working surface (101); Cleaning component (2) is disposed on the lower surface of clamping component and in contact with working surface (101); The cleaning component (2) is a roller brush or a scraper; A collection hole (301) is provided on the working surface. A collection box (302) connected to the collection hole (301) is provided below the working surface (101). A negative pressure generating device (303) is provided on one side of the collection box (302). A filter screen (304) is provided at the air intake of the negative pressure generating device (303).

2. The fixing assembly of a wafer cutting device according to claim 1, wherein: The collection box (302) is provided with a cleaning door (305), and the cleaning door (305) is made of explosion-proof glass.

3. The wafer cutting apparatus fixing assembly of claim 2, wherein: The cleaning component (2) has an antistatic coating on its surface.

4. The fixing component of a wafer dicing apparatus according to claim 3, characterized in that: The clamping assembly includes a clamping electric cylinder (401), the output shaft of which faces the working surface (101) and is provided with a clamping plate (402), and the cleaning assembly (2) is provided below the clamping plate (402).

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