A kind of semiconductor diffusion furnace thermocouple production welding point reinforcing device

Abstract

This utility model relates to the field of thermocouple welding technology and discloses a device for reinforcing weld joints in thermocouple production using a semiconductor diffusion furnace. The device includes a welding table and two fixing rings. A fixing frame is fixedly connected to the top outer surface of the welding table. A first electric push rod and a second electric push rod are fixedly mounted on the top, downward-facing outer surface of the fixing frame. A welding gun is mounted on the output end of the first electric push rod, and a horizontal plate is fixedly connected to the output end of the second electric push rod. A first rotating seat is fixedly connected to the bottom outer surface of the horizontal plate. A rotating block is rotatably connected to the outer surface of the first rotating seat, and a spray gun is mounted on the outer surface of the rotating block. The first electric push rod drives the welding gun to contact the welding joint of the thermocouple wire for welding. The second electric push rod drives the spray gun to spray out a coating liquid to form a protective layer, reinforcing the weld joint and reducing the possibility of subsequent weld joint breakage.

Description

Technical Field

[0001] This utility model relates to the field of thermocouple welding technology, specifically a device for reinforcing weld joints in the production of thermocouples in a semiconductor diffusion furnace. Background Technology

[0002] Diffusion furnaces are widely used in semiconductor chip manufacturing processes, involving steps such as oxidation, diffusion, drive-through, annealing, reflow, alloying, and low-pressure deposition. These processes are often temperature-dependent, making precise temperature control of the diffusion furnace crucial. A common temperature control method involves designing five temperature zones within the furnace and employing a closed-loop control mode. This means using internal and external temperature sensors to detect the temperature, working in conjunction with a temperature controller to control the silicon wafer temperature. Thermocouples, typically thin cylindrical rods, are commonly used as temperature sensors. They are inserted into test holes in the furnace body to measure the temperature and adjust the temperature control accordingly. Thermocouple manufacturing requires welding two dissimilar materials of wire together to form a circuit.

[0003] In existing technologies, when welding thermocouple wires, the two wires to be welded are usually fixed and moved closer to each other to make them contact before welding. However, since thermocouple wires are relatively thin, the weld joints are prone to breakage during use. Therefore, a device for reinforcing weld joints in the production of thermocouples in a semiconductor diffusion furnace has been proposed. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a device for reinforcing solder joints in the production of thermocouples in semiconductor diffusion furnaces, thereby solving the problems mentioned in the background section.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a device for reinforcing solder joints in the production of thermocouples in a semiconductor diffusion furnace, comprising a welding table and two fixing rings. A fixing frame is fixedly connected to the top outer surface of the welding table. A first electric push rod and a second electric push rod are fixedly installed on the top downward-facing outer surface of the fixing frame. A welding gun is installed at the output end of the first electric push rod. A horizontal plate is fixedly connected to the output end of the second electric push rod. A first rotating seat is fixedly connected to the bottom outer surface of the horizontal plate. A rotating block is rotatably connected to the outer surface of the first rotating seat. A spray gun is installed on the outer surface of the rotating block.

[0006] Furthermore, a spring is fixedly connected to the bottom inner surface of the fixing ring, a lower arc-shaped plate is fixedly connected to one end of the spring, a screw is threaded through the top outer surface of the fixing ring, and an upper arc-shaped plate is rotatably connected to the bottom outer surface of the screw.

[0007] Furthermore, two side plates are fixedly connected to the top outer surface of the welding station, and positive and negative lead screws are rotatably connected between the two side plates. A motor is fixedly installed on the outer surface of one of the side plates, and the output end of the motor is fixedly connected to the positive and negative lead screws. A threaded block is threadedly connected to the outer surface of the positive and negative lead screws, and the fixing ring is fixed above the threaded block.

[0008] Furthermore, a second rotating seat is fixedly connected to the bottom outer surface of the horizontal plate and one side of the rotating block, and a third electric push rod is rotatably connected between the two second rotating seats.

[0009] Furthermore, two limiting rods are movably inserted into the top outer surface of the fixing ring, and the other end of the limiting rods is fixedly connected to the upper arc-shaped plate.

[0010] Furthermore, a sliding rod is fixedly connected between the two side plates, and the threaded block is movably sleeved on the outer surface of the sliding rod.

[0011] Furthermore, a rectangular groove is provided on one side of the fixing ring.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] 1. The semiconductor diffusion furnace thermocouple production solder joint reinforcement device uses a first electric push rod to drive the welding gun, which contacts the welding joint of the thermocouple wire for welding. The second electric push rod drives the spray gun, which sprays out a coating liquid to form a protective layer, reinforcing the solder joint and reducing the possibility of subsequent solder joint breakage.

[0014] 2. In this semiconductor diffusion furnace thermocouple production solder joint reinforcement device, when fixing the thermocouple wire, it is placed in a fixing ring. By rotating the screw, the screw drives the upper arc plate to move, so that the upper arc plate and the lower arc plate fix the thermocouple wire, thereby stably conveying the thermocouple wire. Attached Figure Description

[0015] Figure 1 This is a front view structural diagram of the present invention;

[0016] Figure 2 This is a schematic diagram of the structure of this utility model from below;

[0017] Figure 3 This is a schematic diagram of the fixing ring and related structures of this utility model;

[0018] Figure 4 This utility model Figure 2 Enlarged structural diagram at point A in the middle.

[0019] In the diagram: 1. Welding table; 2. Fixing frame; 3. First electric push rod; 4. Welding gun; 5. Second electric push rod; 6. Horizontal plate; 7. First rotating seat; 8. Spray gun; 9. Second rotating seat; 10. Third electric push rod; 11. Fixing ring; 12. Spring; 13. Lower arc plate; 14. Screw; 15. Upper arc plate; 16. Positive and negative lead screws; 17. Motor; 18. Threaded block. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0021] Please refer to the following: Figures 1-4 This utility model provides a technical solution: a device for reinforcing solder joints in the production of thermocouples in a semiconductor diffusion furnace, comprising a welding table 1 and two fixing rings 11. A fixing frame 2 is fixedly connected to the top outer surface of the welding table 1. A first electric push rod 3 and a second electric push rod 5 are fixedly installed on the top lower outer surface of the fixing frame 2. A welding gun 4 is installed at the output end of the first electric push rod 3. A horizontal plate 6 is fixedly connected to the output end of the second electric push rod 5. A first rotating seat 7 is fixedly connected to the bottom outer surface of the horizontal plate 6. A rotating block is rotatably connected to the outer surface of the first rotating seat 7. A spray gun 8 is installed on the outer surface of the rotating block. Specifically, the welding gun 4 is moved by the first electric push rod 3 to a suitable position to weld the connection between the two thermocouple wires. After welding, the second electric push rod 5 is activated, moving the spray gun 8 to a position corresponding to the solder joint. The spray gun 8 sprays a coating liquid onto the solder joint to form a protective layer, reinforcing the solder joint and reducing the possibility of subsequent solder joint breakage.

[0022] In this embodiment, a spring 12 is fixedly connected to the bottom inner surface of the fixing ring 11, and a lower arc plate 13 is fixedly connected to one end of the spring 12. A screw 14 is threaded through the top outer surface of the fixing ring 11, and an upper arc plate 15 is rotatably connected to the bottom outer surface of the screw 14. Specifically, by rotating the screw 14, the screw 14 drives the upper arc plate 15 to move, so that the upper arc plate 15 and the lower arc plate 13 fix the thermocouple wire.

[0023] In this embodiment, two side plates are fixedly connected to the top outer surface of the welding station 1. A positive and negative lead screw 16 is rotatably connected between the two side plates. A motor 17 is fixedly installed on the outer surface of one of the side plates. The output end of the motor 17 is fixedly connected to the positive and negative lead screw 16. A threaded block 18 is threadedly connected to the outer surface of the positive and negative lead screw 16. A fixing ring 11 is fixed above the threaded block 18. Specifically, the positive and negative lead screw 16 is driven to rotate by the motor 17. The positive and negative lead screw 16 drives the threaded block 18 to move. The two threaded blocks 18 respectively drive the two thermocouple wires to move in a direction closer to each other, so that the two thermocouple wires correspond to each other.

[0024] In this embodiment, a second rotating seat 9 is fixedly connected to the bottom outer surface of the horizontal plate 6 and one side of the rotating block. A third electric push rod 10 is rotatably connected between the two second rotating seats 9. Specifically, the direction of the spray gun 8 is adjusted by the operation of the third electric push rod 10 so that it corresponds precisely to the welding point.

[0025] In this embodiment, two limiting rods are movably inserted on the top outer surface of the fixing ring 11. The other end of the limiting rods is fixedly connected to the upper arc plate 15. Specifically, rotating the screw 14 drives the upper arc plate 15 to move, so that the limiting rods move accordingly, preventing the upper arc plate 15 from rotating with the rotation of the screw 14.

[0026] In this embodiment, a slide rod is fixedly connected between the two side plates, and a threaded block 18 is movably sleeved on the outer surface of the slide rod. Specifically, when the forward and reverse screws 16 rotate, the threaded block 18 slides on the outer surface of the slide rod, preventing the threaded block 18 from rotating with the forward and reverse screws 16.

[0027] In this embodiment, a rectangular groove is provided on one side of the fixing ring 11. Specifically, the rectangular groove provides space for the removal of the thermocouple wire.

[0028] Working principle: In use, the two thermocouple wires to be welded are fixed, and the positive and negative lead screws 16 are driven to rotate by the motor 17. The positive and negative lead screws 16 drive the threaded blocks 18 to move. The two threaded blocks 18 drive the two thermocouple wires to move closer to each other. The welding gun 4 is moved by the first electric push rod 3 to a suitable position to weld the connection between the two thermocouple wires. After welding, the second electric push rod 5 is activated, which drives the spray gun 8 to move to a position corresponding to the weld point. The spray gun 8 sprays the coating liquid onto the weld point to form a protective layer, which reinforces the weld point and reduces the possibility of subsequent weld breakage.

[0029] When fixing the thermocouple wire, it is placed inside the fixing ring 11. By rotating the screw 14, the screw 14 drives the upper arc plate 15 to move, so that the upper arc plate 15 and the lower arc plate 13 fix the thermocouple wire, thereby stably transporting the thermocouple wire.

[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A kind of semiconductor diffusion furnace thermocouple production weld reinforcement device, including welding table (1) and two fixed rings (11), it is characterized by: A fixed frame (2) is fixedly connected to the top outer surface of the welding table (1). A first electric push rod (3) and a second electric push rod (5) are fixedly installed on the top lower outer surface of the fixed frame (2). A welding gun (4) is installed at the output end of the first electric push rod (3). A horizontal plate (6) is fixedly connected to the output end of the second electric push rod (5). A first rotating seat (7) is fixedly connected to the bottom outer surface of the horizontal plate (6). A rotating block is rotatably connected to the outer surface of the first rotating seat (7). A spray gun (8) is installed on the outer surface of the rotating block.

2. The apparatus for reinforcing the welding spot of thermocouple for semiconductor diffusion furnace according to claim 1, wherein: A spring (12) is fixedly connected to the bottom inner surface of the fixed ring (11), and a lower arc plate (13) is fixedly connected to one end of the spring (12). A screw (14) is threaded through the top outer surface of the fixed ring (11), and an upper arc plate (15) is rotatably connected to the bottom outer surface of the screw (14).

3. The apparatus for reinforcing the welding spot of thermocouple for semiconductor diffusion furnace according to claim 1, wherein: The welding station (1) has two side plates fixedly connected to its top outer surface. A positive and negative screw rod (16) is rotatably connected between the two side plates. A motor (17) is fixedly installed on the outer surface of one of the side plates. The output end of the motor (17) is fixedly connected to the positive and negative screw rod (16). A threaded block (18) is threadedly connected to the outer surface of the positive and negative screw rod (16). The fixing ring (11) is fixed above the threaded block (18).

4. The apparatus for reinforcing the welding spot of thermocouple for semiconductor diffusion furnace according to claim 1, wherein: The bottom outer surface of the horizontal plate (6) and one side of the rotating block are fixedly connected to a second rotating seat (9), and a third electric push rod (10) is rotatably connected between the two second rotating seats (9).

5. The apparatus for reinforcing the welding spot of thermocouple for semiconductor diffusion furnace according to claim 2, wherein: Two limiting rods are movably inserted on the top outer surface of the fixed ring (11), and the other end of the limiting rods is fixedly connected to the upper arc plate (15).

6. The apparatus for reinforcing the welding spot of thermocouple for semiconductor diffusion furnace according to claim 3, wherein: A sliding rod is fixedly connected between the two side plates, and the threaded block (18) is movably sleeved on the outer surface of the sliding rod.

7. The apparatus for producing a solder joint of a thermocouple of a semiconductor diffusion furnace according to claim 1, characterized in that: A rectangular groove is provided on one side of the fixing ring (11).

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