A ceramic substrate grinding and polishing device

Abstract

This utility model relates to the field of plate grinding and processing technology, specifically to a ceramic substrate grinding and polishing device, including a polishing device body, which is an existing polishing equipment; a grinding disc, rotatably mounted on the top of the polishing device body; and further including: a cooling pipe, with an opening at the center of the top of the grinding disc, the cooling pipe being built inside the grinding disc, and the pipe opening protruding from the opening at the center of the grinding disc; and a connecting pipe, the opening of which is an "L"-shaped pipe rotatably contacts and seals the opening of the cooling pipe. This utility model, by setting a cooling pipe inside the grinding disc and using a water pump and circulation pipeline to achieve the circulation of cooling water, can effectively reduce the high temperature generated during the grinding process, protecting the ceramic substrate from heat damage. Furthermore, the cooling pipes are evenly distributed in a radial, annular pattern inside the grinding disc, making cooling more uniform and rapid.

Description

Technical Field

[0001] This utility model relates to the field of plate grinding and processing technology, specifically to a ceramic substrate grinding and polishing device. Background Technology

[0002] In modern high-tech fields such as electronics, optoelectronics, and semiconductors, ceramic substrates are crucial materials, playing an indispensable role in the manufacturing of products such as integrated circuit packaging, LED light sources, and sensors due to their excellent electrical, thermal, and mechanical properties. Typically, ceramic substrates are made of materials such as alumina, aluminum nitride, and silicon nitride. These materials are known for their high hardness and brittleness, which places high demands on the equipment used in the processing, especially during the grinding and polishing stages.

[0003] However, heat is inevitably generated during the grinding process. If this heat cannot be dissipated in time, it can easily cause the substrate surface temperature to rise, leading to problems such as thermal deformation or surface cracks. Considering the relatively low thermal conductivity of ceramic substrates, prolonged accumulation of localized high temperatures can not only damage their performance but may also lead to the final scrapping of the product. Therefore, we provide a ceramic substrate grinding and polishing device that effectively controls the heat generated during the grinding and polishing process, thereby ensuring the quality of the ceramic substrate. Utility Model Content

[0004] To overcome the shortcomings of the prior art, a ceramic substrate grinding and polishing apparatus is provided.

[0005] The technical solution of this utility model is as follows: a ceramic substrate grinding and polishing device, comprising a polishing device body, wherein the polishing device body is an existing polishing equipment and serves as the carrier of this polishing device; a grinding disc, rotatably mounted on the top of the polishing device body; further comprising: a cooling pipe, wherein an opening is provided at the center of the top of the grinding disc, the cooling pipe is built into the inside of the grinding disc, and the pipe opening protrudes from the opening at the center of the grinding disc; a connecting pipe, the pipe opening of which is in the shape of an "L" and the pipe opening of the cooling pipe are rotatably in contact and sealed; and an isolation plate, which is embedded and fixedly connected to the inner wall of the connecting pipe, the isolation plate separating the connecting pipe. The polishing device is symmetrically divided into two water flow chambers; a water pump is fixedly installed on one side of the top of the housing of the polishing device body; a circulation pipe 1 connects the water inlet of the water pump and one side chamber of the isolation plate inside the connecting pipe; a return pipe connects to the water outlet of the water pump; a cooling component for cooling water is provided on the top of the housing of the polishing device body, and a coiled circulation pipe 2 is provided inside the cooling component, one end of the circulation pipe 2 connects to the return pipe, and the other end of the circulation pipe 2 connects to the other side chamber of the isolation plate inside the connecting pipe; a material loading assembly is provided on the top of the housing of the polishing device body, and the material loading assembly is used to load the ceramic substrate to be polished.

[0006] As a preferred technical solution of this utility model, the cooling pipe extends outward from the pipe opening on the grinding disc as the center, and the cooling pipe is arranged in a radial pattern with the annular pipes evenly distributed inside the grinding disc.

[0007] As a preferred embodiment of this utility model, the cooling component includes: a mounting frame, fixedly mounted on the top of the housing of the polishing device body, with the second circulation pipe curved and fully laid inside the mounting frame; a fan, with the top of the mounting frame having an opening, the fan being assembled at the opening at the top of the mounting frame, the fan being used to accelerate the replacement of coolant in the second circulation pipe; and a filter screen, disposed on the outside of the fan, the filter screen being used to prevent dust from falling into the fan.

[0008] As a preferred technical solution of this utility model, a limiting frame is fixedly installed on the top of the polishing device body shell near the grinding disc, and the limiting frame is provided with an arc rod for limiting the loading disc.

[0009] As a preferred embodiment of this utility model, the material loading assembly includes: an electric push rod, fixedly installed on the top of the polishing device body housing; a connecting frame, fixedly connected to the telescopic rod of the electric push rod; a sliding block, fixedly connected to the end of the connecting frame; a guide rod, fixedly connected to the bottom surface of the sliding block; and an assembly frame, slidably connected to the bottom of the sliding block via the guide rod, with a spring provided between the assembly frame and the sliding block.

[0010] As a preferred embodiment of this utility model, it also includes a pressure sensor, which is mounted on the sliding block. The pressure sensor is used to monitor the grinding pressure applied by the assembly frame to the loading disc, and the pressure sensor has a built-in controller for controlling the electric push rod.

[0011] The beneficial effects are:

[0012] 1. This utility model effectively reduces the high temperature generated during the grinding process by setting cooling pipes inside the grinding disc and using a water pump and circulation pipeline to achieve the circulation of cooling water, thus protecting the ceramic substrate from heat damage. Furthermore, the cooling pipes are evenly distributed in a radial layout with annular pipes inside the grinding disc, making the cooling more uniform and rapid.

[0013] 2. This utility model uses an isolation plate to symmetrically divide the connecting pipe into two water flow chambers, enabling rapid replacement of old and new cooling water and improving cooling efficiency. At the same time, the fan in the cooling component accelerates the cooling process of the coolant, ensuring the efficient operation of the cooling system.

[0014] 3. This utility model can also ensure the precise positioning of the ceramic substrate during the grinding process through the design of the limiting frame and the arc rod, thereby improving the grinding accuracy. Through the electric push rod, spring and other structures, it can achieve adaptive adjustment for ceramic substrates of different thicknesses and ensure the stability of the grinding pressure. Attached Figure Description

[0015] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0016] Figure 2 This diagram shows the connection relationship between the cooling pipe, connecting pipe, isolation plate, and circulation pipe of this utility model.

[0017] Figure 3 This is a schematic diagram showing the relationship between the circulation pipe 1, the water pump, the circulation pipe 2, and the water pump of this utility model.

[0018] Figure 4 This is an exploded view of the components of this utility model, including the loading disc, assembly frame, guide rod, and sliding block.

[0019] Component names and serial numbers in the diagram: 1_Polishing device body, 101_Limiting frame, 2_Grinding disc, 3_Loading disc, 4_Cooling pipe, 5_Connecting pipe, 6_Isolation plate, 7_Circulation pipe one, 8_Water pump, 81_Return pipe, 9_Circulation pipe two, 10_Mounting frame, 11_Fan, 12_Filter screen, 13_Assembly frame, 14_Guide rod, 15_Sliding block, 16_Spring, 17_Electric push rod, 171_Connecting frame, 18_Pressure sensor. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this utility model clearer, the following will describe this utility model in further detail with reference to the accompanying drawings. It is hereby declared that the terms "up," "down," "left," "right," "front," "back," "inner," and "outer," etc., appearing or about to appear in this document, are based solely on the accompanying drawings and are not intended to specifically limit this utility model.

[0021] A ceramic substrate grinding and polishing device, such as Figures 1-4As shown, the device includes a polishing device body 1, which is an existing polishing device and serves as the carrier of this polishing device; a grinding disc 2, which is rotatably mounted on the top of the polishing device body 1; and also includes: a cooling pipe 4, with an opening at the center of the top of the grinding disc 2, the cooling pipe 4 being built inside the grinding disc 2, and the pipe opening protruding from the opening at the center of the grinding disc 2; a connecting pipe 5, which is an "L"-shaped pipe with its opening rotatably contacting and sealingly connected to the opening of the cooling pipe 4; an isolation plate 6, which is embedded and fixedly connected to the inner wall of the connecting pipe 5, symmetrically dividing the connecting pipe 5 into two water flow chambers; a water pump 8, which is fixedly mounted on one side of the top of the polishing device body 1; a circulation pipe 7, which connects the inlet of the water pump 8 to one side chamber of the isolation plate 6 inside the connecting pipe 5; and a return pipe 81, which connects to the outlet of the water pump 8; and the polishing device body 1 shell. The top of the body is equipped with a cooling component for cooling water. Inside the cooling component is a coiled circulation pipe 2 9. One end of the circulation pipe 2 9 is connected to the return pipe 81, and the other end of the circulation pipe 2 9 is connected to the other side chamber of the isolation plate 6 inside the connecting pipe 5. The material loading component is set on the top of the housing of the polishing device body 1. The material loading component is used to load the ceramic substrate to be polished. When the polishing disc 2 on the polishing device body 1 overheats due to grinding the ceramic substrate, the polishing device body 1 is shut down first, and the water pump 8 is activated to inject cooling water into the cooling pipe 4 through the circulation pipe 1 7 and the connecting pipe 5. At the same time, the water pump 8 extracts the originally heated cooling water in the cooling pipe 4 through the circulation pipe 2 9 and the connecting pipe 5. Under the separation effect of the isolation plate 6, the old and new cooling water can be quickly replaced. The replaced water can be cooled again by the cooling component. Thus, the cooling water in the cooling pipe 4 rapidly cools the polishing disc 2 through heat transfer.

[0022] like Figure 2 As shown, the cooling pipe 4 extends outward from the pipe opening on the grinding disc 2 as the center, with multiple concentric annular pipes. The cooling pipe 4 is arranged in a radial pattern, with the annular pipes evenly distributed inside the grinding disc 2.

[0023] like Figure 1 and Figure 3 As shown, the cooling components include: a mounting frame 10, which is fixedly mounted on the top of the housing of the polishing device body 1, and a circulation pipe 9 that is bent and fully laid inside the mounting frame 10; a fan 11, which is installed at the top of the mounting frame 10 with an opening, and is used to accelerate the replacement of coolant in the circulation pipe 9; and a filter screen 12, which is disposed on the outside of the fan 11 and is used to prevent dust from falling into the fan 11.

[0024] like Figure 1 and Figure 4As shown, a limiting frame 101 is fixedly installed on the top of the housing of the polishing device body 1 near the grinding disc 2. The limiting frame 101 is provided with an arc rod for limiting the loading disc 3. The grinding position of the ceramic substrate loaded on the loading disc 3 is precisely limited by the limiting frame 101.

[0025] like Figure 1 and Figure 4 As shown, the material loading assembly includes: an electric push rod 17, fixedly installed on the top of the housing of the polishing device body 1; a connecting frame 171, fixedly connected to the telescopic rod of the electric push rod 17; a sliding block 15, fixedly connected to the end of the connecting frame 171; a guide rod 14, fixedly connected to the bottom surface of the sliding block 15; and an assembly frame 13, slidably connected to the bottom of the sliding block 15 via the guide rod 14. A spring 16 is provided between the assembly frame 13 and the sliding block 15. The assembly frame 13 is used to press down the loading disc 3. The electric push rod 17 drives the sliding block 15 to move down through the connecting frame 171. The moving sliding block 15 elastically presses down on the loading disc 3 through the spring 16, so that the ceramic substrate on the bottom surface of the loading disc 3 can contact the grinding disc 2 for grinding.

[0026] like Figure 4 As shown, it also includes a pressure sensor 18, which is mounted on the sliding block 15. The pressure sensor 18 is used to monitor the grinding pressure applied by the assembly frame 13 to the loading disk 3. The pressure sensor 18 has a built-in controller for controlling the electric push rod 17. By presetting a suitable grinding pressure on the pressure sensor 18, the electric push rod 17 can better adapt to the grinding operation of ceramic substrates of different thicknesses.

[0027] When using this device to grind and polish ceramic substrates, the operator first fixes the ceramic substrate to the bottom of the loading disc 3, then places the ceramic substrate on the grinding disc 2. The arc rod of the limiting frame 101 precisely constrains the grinding position of the loading disc 3 on the grinding disc 2. Then, the electric push rod 17 is activated to drive the connecting frame 171 and the sliding plate to move down, so that the mounting frame 13 at the bottom of the sliding plate can press down onto the loading disc 3. The mounting frame 13, buffered by the spring 16, applies elastic pressure to the loading disc 3, making the substrate tightly adhere to the grinding disc 2. Subsequently, the polishing device body 1 drives the grinding disc 2 to rotate at high speed and grinds the ceramic substrate on the bottom surface of the loading disc 3. At this time, the pressure sensor 18 monitors the grinding pressure in real time and automatically adjusts the stroke of the electric push rod 17 to ensure the pressure adaptability of substrates of different thicknesses. When continuous operation causes the grinding disc 2 to become abnormally hot, the polishing device body 1 activates the automatic adjustment mechanism. The preset program stops the grinding disc 2 and then restarts the water pump 8. The water pump 8 injects cooling water into one side of the water flow chamber of the connecting pipe 5 through the circulation pipe 7. The water flow in the connecting pipe 5 quickly absorbs the heat generated on the grinding disc 2 through the radial concentric network of cooling pipes 4. At the same time, under the action of the water pump 8, the other side of the water flow chamber replaces the heated coolant in the cooling pipe 4 through the circulation pipe 9 and transfers it to the cooling component. In the cooling component, the coiled circulation pipe 9 achieves efficient cooling through forced convection heat dissipation by the fan 11 and dust prevention by the filter screen 12. The isolation plate 6 strictly separates the hot and cold dual circulation paths in the connecting pipe 5 to form a closed-loop cooling system. After the temperature of the grinding disc 2 returns to normal, the polishing device body 1 restarts and adjusts the grinding parameters according to the pressure feedback, ultimately achieving efficient and precise polishing of the ceramic substrate, effectively avoiding substrate damage or equipment wear caused by overheating in traditional grinding.

[0028] Those skilled in the art should understand that the above embodiments do not limit the present invention in any way, and all technical solutions obtained by equivalent substitution or equivalent transformation fall within the protection scope of the present invention.

Claims

1. A ceramic substrate grinding and polishing apparatus, comprising a polishing apparatus body (1), wherein the polishing apparatus body (1) is an existing polishing device; The polishing disc (2) is rotatably mounted on the top of the polishing device body (1); characterized in that Also includes: Cooling pipe (4): The grinding disc (2) has an opening at the center of the top of the disc body, and the cooling pipe (4) is built inside the disc body of the grinding disc (2); The openings of the connecting pipe (5) and the cooling pipe (4) rotate into contact and are sealed and connected. The isolation plate (6) is fixed to the inner wall of the connecting pipe (5), and the isolation plate (6) symmetrically divides the connecting pipe (5) into two water flow chambers; A water pump (8) is fixedly installed on one side of the top of the housing of the polishing device body (1); The circulation pipe (7) is connected to the inlet of the water pump (8) and one side chamber of the isolation plate (6) inside the connecting pipe (5); A return pipe (81) is connected to the outlet of the water pump (8); The polishing device body (1) has a cooling component for cooling water on the top of the housing. The cooling component has a second circulation pipe (9). One end of the second circulation pipe (9) is connected to the return pipe (81), and the other end of the second circulation pipe (9) is connected to the other side chamber of the isolation plate (6) inside the connecting pipe (5). A material loading assembly is disposed on the top of the housing of the polishing device body (1), and the material loading assembly is used to load the ceramic substrate to be polished.

2. The ceramic substrate grinding and polishing apparatus as described in claim 1, characterized in that, The cooling pipe (4) extends outward from the opening on the grinding disc (2) as the center, and the cooling pipe (4) is arranged in a radial pattern with the annular pipes evenly distributed inside the grinding disc (2).

3. The ceramic substrate grinding and polishing apparatus as described in claim 2, characterized in that, The cooling component includes: The mounting frame (10) is fixedly installed on the top of the housing of the polishing device body (1), and the second circulation pipe (9) is bent and filled inside the mounting frame (10); The fan (11) is mounted on the top of the mounting frame (10), which has an opening. A filter (12) is disposed on the outside of the fan (11).

4. The ceramic substrate grinding and polishing apparatus as described in claim 3, characterized in that, The top of the polishing device body (1) is fixedly installed with a limiting frame (101) near the grinding disc (2), and the limiting frame (101) is provided with an arc rod for limiting the loading disc (3).

5. The ceramic substrate grinding and polishing apparatus as described in claim 4, characterized in that, The material loading assembly includes: An electric push rod (17) is fixedly installed on the top of the housing of the polishing device body (1); A connecting frame (171) is fixedly connected to the telescopic rod of the electric push rod (17); a sliding block (15) is fixedly connected to the end of the connecting frame (171); The guide rod (14) is fixedly connected to the bottom surface of the sliding block (15); The assembly frame (13) is slidably connected to the bottom of the sliding block (15) via the guide rod (14), and a spring (16) is provided between the assembly frame (13) and the sliding block (15).

6. The ceramic substrate grinding and polishing apparatus as described in claim 5, characterized in that, It also includes a pressure sensor (18) mounted on a sliding block (15), the pressure sensor (18) being used to monitor the grinding pressure applied by the assembly frame (13) to the loading disc (3), and the pressure sensor (18) having a built-in controller for controlling the electric push rod (17).

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