Semiconductor product polishing centralized liquid supply device with cooling function

CN224274663UActive Publication Date: 2026-05-26YANGFAN SEMICON (JIANGSU) CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YANGFAN SEMICON (JIANGSU) CO LTD
Filing Date
2025-03-21
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing technologies, the chemical mechanical polishing process becomes unbalanced due to the temperature rise when the polishing slurry is recycled, which affects the surface finish. In addition, each polishing device needs to be equipped with an independent cooling device, which is costly and takes up space.

Method used

Design a centralized liquid supply device for polishing semiconductor products with cooling function, including a mixing tank, a cooling component and a temporary storage tank. The device achieves centralized mixing and cooling of the polishing liquid through a first liquid supply pump and a second liquid supply pump, and uses a temperature sensor and a solenoid valve to control the cooling water pipe for temperature regulation.

Benefits of technology

This technology enables centralized cooling and mixing of the polishing slurry, reducing the operating costs of cooling equipment and improving the efficiency of polishing slurry use and surface finish.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a semiconductor product polishing centralized liquid supply device with a cooling function, which comprises a liquid supply assembly, a liquid supply assembly and a liquid supply assembly, the liquid supply assembly comprises a box body, a first liquid supply pump and a plurality of liquid storage tanks, the box body is internally provided with a plurality of liquid storage tanks, and each liquid storage tank is connected with a liquid inlet of the first liquid supply pump through a first pipeline; the mixing tank is connected with a liquid outlet of the first liquid supply pump through a second pipeline; the cooling assembly comprises a cooling water pipe and a temperature sensor which are arranged in the mixing tank, an electromagnetic valve is arranged on the cooling water pipe, and the electromagnetic valve is connected with the temperature sensor; the temporary storage tank is connected with the mixing tank through a third pipeline, and the temporary storage tank is connected with a second liquid supply pump through a fourth pipeline. Compared with the prior art, the polishing solution can be mixed and cooled in a centralized manner, so that the use of cooling equipment is reduced, and the cost of purchasing the equipment is reduced.
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