Assembly jig

By designing an assembly fixture, positioning slots and receiving slots are used to position the electromagnetic membrane and the glue iron. Combined with a vacuum adsorption system, the assembly problem of the electromagnetic membrane and the glue iron is solved, improving assembly efficiency and yield, and meeting the requirements for high-precision drawing and handwriting functions.

CN224274831UActive Publication Date: 2026-05-26SHENZHEN SANBUM OPTOELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
SHENZHEN SANBUM OPTOELECTRONICS CO LTD
Filing Date
2025-04-22
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

In existing technologies, it is difficult to achieve accurate positioning when assembling the electromagnetic film and the glue iron, resulting in low assembly efficiency and low yield of semi-finished products.

Method used

Design an assembly fixture including a substrate and positioning slots. The positioning slots and receiving slots are used to position the glue iron and electromagnetic film, and to accommodate a flexible conductive structure. Combined with a vacuum adsorption system and support components, the fixture ensures assembly accuracy and efficiency.

Benefits of technology

It improves the assembly efficiency of electromagnetic film and glue iron and the yield of semi-finished products, meeting the requirements of high-precision drawing and handwriting functions.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses an assembly fixture for assembling a glue-on piece and an electromagnetic film. The assembly fixture includes a base plate with a positioning groove for accommodating and positioning the glue-on piece. The glue-on piece has a clearance opening, and a flexible conductive structure is integrated on the backlight side of the electromagnetic film. A receiving groove is formed on the bottom wall of the positioning groove, completely covering the clearance opening and the flexible conductive structure in a direction perpendicular to the bottom wall of the positioning groove. The receiving groove is used to accommodate the flexible conductive structure passing through the clearance opening during the assembly of the electromagnetic film and the glue-on piece. The assembly fixture of this utility model can accommodate the flexible conductive structure protruding from the backlight side of the electromagnetic film through the receiving groove on the base plate; and can position the glue-on piece and the electromagnetic film through the positioning groove, thereby improving assembly efficiency and increasing the yield of semi-finished products.
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Description

Technical Field

[0001] This utility model relates to the field of display device processing technology, and in particular to an assembly fixture. Background Technology

[0002] To achieve high-precision drawing and handwriting functions on mobile phones, an electromagnetic film is typically integrated into the screen assembly. Because the electromagnetic film is only 0.2mm thick and easily deformed, it needs to be attached to a mounting plate to form a semi-finished product before being assembled with other components of the screen assembly. In related technologies, the backlight side of the electromagnetic film is not a flat plane, and the assembly of the electromagnetic film and the mounting plate may involve threading. Manual assembly makes it difficult to achieve accurate positioning of the electromagnetic film and the mounting plate, resulting in low assembly efficiency and low yield of semi-finished products. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes an assembly fixture that can adapt to threading operations and position the glue iron and electromagnetic membrane, thereby improving the assembly efficiency of the glue iron and electromagnetic membrane and the yield of semi-finished products.

[0004] In a first aspect, embodiments of this application provide an assembly fixture, including a substrate, the substrate having a positioning groove for accommodating and positioning a glue piece, wherein the glue piece has a clearance opening, and the backlight side of the electromagnetic film has a flexible conductive structure integrated thereon.

[0005] The bottom wall of the positioning groove is provided with a receiving groove, which completely covers the clearance opening and the flexible conductive structure in a direction perpendicular to the bottom wall of the positioning groove. The receiving groove is used to receive the flexible conductive structure passing through the clearance opening when assembling the electromagnetic film and the glue iron.

[0006] The assembly fixture according to the embodiments of the present invention has at least the following beneficial effects: the flexible conductive structure protruding from the backlight side of the electromagnetic film is accommodated by the receiving groove on the substrate, and the positioning groove is used to position the glue and the electromagnetic film, thereby improving the assembly efficiency and the yield of semi-finished products.

[0007] According to the first aspect, in one possible implementation, the depth of the receiving groove relative to the bottom wall of the positioning groove is D, and the maximum thickness of the flexible conductive structure along the direction perpendicular to the electromagnetic membrane is Tmax, where D≥Tmax+3mm.

[0008] According to the first aspect, in one possible implementation, the receiving groove includes a first region and a second region that are connected to each other. The first region completely covers the clearance opening and the connection portion between the flexible conductive structure and the electromagnetic membrane in a direction perpendicular to the bottom wall of the positioning groove. The second region extends linearly and is used to provide a movement channel for the flexible conductive structure and to receive a portion of the flexible conductive structure.

[0009] According to the first aspect, in one possible implementation, the assembly fixture includes a vacuum adsorption system, the vacuum adsorption system including a vacuum communication structure and a plurality of adsorption holes, each of the adsorption holes being connected to the vacuum communication structure and forming an opening in the bottom wall of the positioning groove, the vacuum communication structure being connected to an external vacuum generator to form a negative pressure at the opening to adsorb the glue iron.

[0010] According to the first aspect, in one possible implementation, the plurality of adsorption holes include a first group of adsorption holes, the first group of adsorption holes being spaced apart along the edge of the positioning groove; and / or,

[0011] The plurality of adsorption holes include a second set of adsorption holes, which are spaced apart along the periphery of the receiving groove.

[0012] According to the first aspect, in one possible implementation, the vacuum communication structure is an air chamber or a mesh air channel disposed within the substrate.

[0013] According to the first aspect, in one possible implementation, the substrate is further provided with a material picking groove, a portion of which is recessed into the sidewall of the positioning groove, and the depth of the material picking groove is greater than the depth of the positioning groove or penetrates the substrate.

[0014] According to the first aspect, in one possible implementation, the material receiving groove is provided on both opposite sides of the positioning groove; or,

[0015] The material receiving groove is provided on both sides of the positioning groove.

[0016] According to the first aspect, in one possible implementation, the assembly fixture includes two sets of supports, which are spaced apart on the side of the substrate opposite to the positioning groove.

[0017] According to the first aspect, in one possible implementation, two sets of the support members are spaced apart along the direction from one end of the flexible conductive structure connected to the electromagnetic membrane to the other end, and the height of the support member at the front end is less than or equal to the height of the support member at the rear end.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0020] Figure 1 This is a schematic diagram of the assembly fixture in an embodiment of the present utility model;

[0021] Figure 2 This is a cross-sectional structural diagram of the assembly fixture in an embodiment of this utility model;

[0022] Figure 3 This is a schematic diagram of the structure of the adhesive iron, electromagnetic film and shielding layer in the embodiment of this utility model.

[0023] Figure label:

[0024] 100. Assembly fixture; 110. Substrate; 111. Positioning groove; 112. Receiving groove; 1121. First zone; 1122. Second zone; 120. Vacuum adsorption system; 121. Vacuum communication structure; 122. Adsorption hole; 130. Material picking groove; 140. Support component; 201. Adhesive iron; 202. Clearance opening; 203. Electromagnetic membrane; 204. Flexible conductive structure; 205. Shielding layer. Detailed Implementation

[0025] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0026] In the description of this utility model, it should be understood that the directional descriptions, such as up, down, front, back, left, right, etc., indicate the directional or positional relationships based on the directional or positional relationships shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] In the description of this utility model, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0028] In the description of this utility model, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this utility model in conjunction with the specific content of the technical solution.

[0029] In the description of this utility model, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0030] To achieve high-precision drawing and handwriting functions on mobile phones, an electromagnetic film is typically integrated into the screen assembly. Because the electromagnetic film is only 0.2mm thick and easily deformed, it needs to be attached to a mounting plate to form a semi-finished product before being assembled with other components of the screen assembly. In related technologies, the backlight side of the electromagnetic film is not a flat plane, and the assembly of the electromagnetic film and the mounting plate may involve threading. Manual assembly makes it difficult to achieve accurate positioning of the electromagnetic film and the mounting plate, resulting in low assembly efficiency and low yield of semi-finished products.

[0031] This application provides an assembly fixture, such as Figure 1 and Figure 2 As shown, the assembly jig 100 is used to assemble, for example... Figure 3The illustrated adhesive plate 201 and electromagnetic film 203 have a clearance opening 202. The backlight side of the electromagnetic film 203 integrates a flexible conductive structure 204. One end of the flexible conductive structure 204 is electrically connected to the electromagnetic film 203, and the other end has a connector for electrical connection to the mobile phone motherboard. When the electromagnetic film 203 is attached to the adhesive plate 201, the portion of the flexible conductive structure 204 electrically connected to the electromagnetic film 203 is located at the clearance opening 202. The flexible conductive structure 204 needs to extend a certain length, extending through the clearance opening 202. The flexible conductive structure 204 can be bent to electrically connect the connector to the mobile phone motherboard. The flexible conductive structure 204 can be an FPC (Flexible Printed Circuit).

[0032] In some embodiments, such as Figure 1 and Figure 2 As shown, the assembly fixture 100 includes a base plate 110, which has a positioning groove 111. A receiving groove 112 is formed in the bottom wall of the positioning groove 111. The shape and size of the positioning groove 111 match the shape and size of the plastic piece 201. During assembly, the plastic piece 201 is first placed in the positioning groove 111. Then, the insertion terminal of the flexible conductive structure 204 passes through the clearance opening 202 on the plastic piece 201 and moves backward along the receiving groove 112 until the electromagnetic membrane 203 is placed on the surface of the plastic piece 201. At this time, the portion where the flexible conductive structure 204 connects to the electromagnetic membrane 203 is located at the clearance opening 202 on the plastic piece 201, and the flexible conductive structure 204 is received within the receiving groove 112. The receiving groove 112 must completely cover the clearance opening 202 and the flexible conductive structure 204 in the direction perpendicular to the bottom wall of the positioning groove 111 to provide sufficient space and prevent the flexible conductive structure 204 from bending and exerting an upward force on the electromagnetic film 203 or pressing against the adhesive iron 201. In this embodiment, by providing an assembly jig 100, the receiving groove 112 on the substrate 110 is used to accommodate the flexible conductive structure 204 protruding from the backlight side of the electromagnetic film 203, and the positioning groove 111 is used to position the adhesive iron 201 and the electromagnetic film 203, thereby improving assembly efficiency and increasing the yield of semi-finished products.

[0033] Based on the conventional mobile phone screen structure, the outer contour of the adhesive plate 201 is typically rectangular or rectangular with rounded corners. Correspondingly, the positioning groove 111 is also designed as a rectangle or a rectangle with rounded corners. The rounded corner size of the positioning groove 111 is less than or equal to the rounded corner size of the adhesive plate 201 to prevent the rounded corners of the adhesive plate 201 from being suspended and causing tilting. The gap between the edge of the positioning groove 111 and the edge of the adhesive plate 201 can be designed at 0.07mm on each side, meaning the width of the positioning groove 111 is greater than the width of the adhesive plate 201 by 0.14mm, and the length of the positioning groove 111 is greater than the length of the adhesive plate 201 by 0.14mm. This balances positioning accuracy and assembly tolerance while meeting micron-level manufacturing requirements. Understandably, a certain amount of machining error is permissible in the positioning groove 111, but the width and length dimensions of the positioning groove 111 must be greater than the width and length dimensions of the adhesive plate 201, respectively.

[0034] The depth of the positioning groove 111 can be designed to be within the range of 0.15±0.05mm. This ensures that the positioning groove 111 effectively positions the glue piece 201, preventing it from shifting during assembly. At the same time, the depth of the positioning groove 111 will not exceed the thickness of the glue piece 201, preventing the glue piece 201 from completely sinking into the positioning groove 111. This improves the assembly quality of the electromagnetic film 203 and facilitates the smooth removal of the semi-finished product.

[0035] like Figure 1 As shown, X represents the length direction, Y represents the width direction, and Z represents the thickness or depth direction. The depth of the receiving groove 112 is D, which refers to the height difference between the bottom wall of the receiving groove 112 and the bottom wall of the positioning groove 111 along the Z direction. The maximum thickness of the flexible conductive structure 204 is Tmax, and the thickness of the flexible circuit board is also the dimension along the Z direction, where D≥Tmax+3mm; that is, the receiving groove 112 has at least 3mm of redundant space. When the flexible conductive structure 204 extends into the receiving groove 112, the redundant space can provide a certain gap for the movement of the flexible conductive structure 204, so that during the assembly of the electromagnetic membrane 203, the flexible conductive structure 204 can slide easily in the receiving groove 112, avoiding assembly difficulties or structural damage due to insufficient space.

[0036] In some embodiments, the receiving groove 112 can be divided into a first region 1121 and a second region 1122. The second region 1122 is connected to the first region 1121 along the X-direction to form a continuous whole. The first region 1121 completely covers the clearance opening 202 and the connection portion between the flexible conductive structure 204 and the electromagnetic membrane 203 in a direction perpendicular to the bottom wall of the positioning groove 111. The second region 1122 extends linearly and is used to provide a moving channel for the flexible conductive structure 204 and to receive a portion of the flexible conductive structure 204. Typically, the connection portion between the flexible conductive structure 204 and the electromagnetic membrane 203 is relatively wide. In this embodiment, dividing the receiving groove 112 into two parts can better adapt to the shape of the flexible conductive structure 204, reduce the proportion of the receiving groove 112 on the bottom wall of the positioning groove 111, and optimize the overall structural layout.

[0037] The second region 1122 extends linearly. When the flexible conductive structure 204 is bent, the width of the second region 1122 is greater than the distance between the outermost parts of the flexible conductive structure 204 along the Y direction, ensuring that there are no obstacles on the moving path of the flexible conductive structure 204 and further improving the ease of assembly.

[0038] Furthermore, the assembly fixture 100 is also used to attach a shielding layer 205 at the clearance opening 202 of the adhesive stick 201; the substrate 110 has an assembly opening communicating with the first region 1121 on the side opposite to the positioning groove 111, and the assembly fixture 100 also includes a cover plate movably connected to the substrate 110, the cover plate being movable relative to the substrate 110 to open or close the assembly opening. After the adhesive stick 201 and the electromagnetic film 203 are assembled, the assembly fixture 100 can be flipped over, and the cover plate can be operated to open the assembly opening, allowing the operator to perform the attachment operation through the assembly opening. The shielding layer 205 can be an insulating adhesive.

[0039] The cover plate and the substrate 110 can be rotatably connected by a pivot. The rotation axis of the cover plate is located on one side of the opening along the Y direction. The assembly port can be opened or closed by flipping the cover. The surface of the cover corresponding to the receiving cavity has a protruding part and can smoothly transition to the part of the bottom wall of the receiving cavity corresponding to the second region 1122, which plays a guiding role for the flexible conductive structure 204 when assembling the electromagnetic membrane 203.

[0040] It is worth noting that during the application of the shielding layer 205, since it is necessary to press the adhesive iron 201, in order to prevent the adhesive iron 201 from falling off the positioning groove 111, a pressure plate can be set. The pressure plate can press against the side of the electromagnetic film 203 away from the adhesive iron 201. While preventing the adhesive iron 201 from falling off, it provides additional clamping force for the bonding of the electromagnetic film 203 and the adhesive iron 201, making the bonding between the two more secure.

[0041] In some embodiments, the assembly fixture 100 includes a vacuum adsorption system 120, which includes a vacuum communication structure 121 and a plurality of adsorption holes 122. Each adsorption hole 122 is connected to the vacuum communication structure 121 and forms an opening on the bottom wall of the positioning groove 111. The vacuum communication structure 121 is connected to an external vacuum generator to form a negative pressure at the opening to adsorb the glue iron 201, so that the glue iron 201 is kept in contact with the bottom wall of the positioning groove 111, preventing the glue iron 201 from shifting and shaking during the assembly process, thereby improving the assembly accuracy and product quality.

[0042] Multiple adsorption holes 122 are arranged in an array. The pore diameter of the adsorption holes 122 can be designed to be 2mm to ensure uniform distribution of the adsorption holes 122 and provide a stable adsorption force to the adhesive iron 201. The layout of the adsorption holes 122 should avoid the area of ​​the receiving groove 112 to prevent the negative pressure generated by the adsorption holes 122 from affecting the movement of the flexible conductive structure 204.

[0043] When designing the arrangement of the adsorption holes 122, multiple adsorption holes 122 can be designed along the edge of the positioning groove 111 to form a first set of adsorption holes 122, providing sufficient adsorption force for the glue iron 201 at the edge of the positioning groove 111, preventing the glue iron 201 from lifting or shifting during assembly. Multiple adsorption holes 122 are arranged along the periphery of the receiving groove 112 to form a second set of adsorption holes 122, further enhancing the adsorption effect of the glue iron 201 in the area near the receiving groove 112, and ensuring the positional stability of the clearance opening 202 on the glue iron 201.

[0044] Furthermore, multiple adsorption holes 122 can be filled between the first set of adsorption holes 122 and the second set of adsorption holes 122 to form the above-mentioned array arrangement.

[0045] It should be noted that when the receiving groove 112 is located near the edge of the positioning groove 111, the suction hole 122 may not be provided between the edge and the receiving groove 112.

[0046] The vacuum communication structure 121 can be designed as a gas chamber or a mesh-like gas channel within the substrate 110. Both gas chambers and mesh-like gas channels can provide a uniform negative pressure distribution for the multiple adsorption holes 122.

[0047] In some embodiments, the substrate 110 is further provided with a material picking groove 130, a portion of which is recessed into the sidewall of the positioning groove 111, and the depth of the material picking groove 130 is greater than the depth of the positioning groove 111 or penetrates the substrate 110. The material picking groove 130 provides operating space, and after the electromagnetic film 203 and the adhesive iron 201 are assembled, the operator can pick up materials by reaching into the edge of the material picking groove 130 and contacting it.

[0048] The material taking groove 130 can be recessed 1mm to 2mm into the side wall of the positioning groove 111 to avoid applying excessive pressure to the glue iron 201 during the material taking process, thereby improving the flatness and structural integrity of the semi-finished product formed by assembling the glue iron 201 and the electromagnetic film 203.

[0049] Material picking slots 130 can be set on opposite sides of the positioning slot 111 to conform to actual operating habits; or material picking slots 130 can be set on both adjacent sides of the positioning slot 111 to provide more selection of material picking angles; this application does not limit this.

[0050] Of course, in other embodiments, a pushing mechanism can also be provided to push the glue iron 201 and the electromagnetic film 203 to assemble into a semi-finished product and make it detach from the positioning groove 111. This application does not limit this.

[0051] In some embodiments, the assembly fixture 100 includes two sets of support members 140, which are spaced apart on the side of the substrate 110 opposite to the positioning groove 111. During assembly, the support members 140 contact the table or operating platform, creating a certain gap between the substrate 110 and the table or operating platform. This serves to avoid other components, such as a cover plate or a pipe communicating with the vacuum communication structure 121, if designed on the back of the substrate 110.

[0052] Two sets of support members 140 are spaced apart along the Y direction, and the height of the support member 140 at the front end is less than or equal to the height of the support member 140 at the rear end. This keeps the substrate 110 in a horizontal or forward-tilted state, facilitating the assembly of the electromagnetic film 203.

[0053] The support member 140 can be a support foot, a support plate, or a telescopic rod with adjustable length; this application does not limit this. When the contact area between the support member 140 and the desktop or operating platform is small, each set of support members 140 must include more than two support members 140.

[0054] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. An assembly jig for assembling a glued iron and an electromagnetic membrane, characterized in that, The device includes a substrate, which has a positioning groove for accommodating and positioning the adhesive iron. The adhesive iron has a clearance opening, and the backlight side of the electromagnetic film has a flexible conductive structure integrated therein. The bottom wall of the positioning groove is provided with a receiving groove, which completely covers the clearance opening and the flexible conductive structure in a direction perpendicular to the bottom wall of the positioning groove. The receiving groove is used to receive the flexible conductive structure passing through the clearance opening when assembling the electromagnetic film and the glue iron.

2. The assembly fixture according to claim 1, characterized in that, The depth of the receiving groove relative to the bottom wall of the positioning groove is D, and the maximum thickness of the flexible conductive structure along the direction perpendicular to the electromagnetic film is Tmax, where D≥Tmax+3mm.

3. The assembly fixture according to claim 1, characterized in that, The receiving groove includes a first area and a second area that are connected to each other. The first area completely covers the clearance opening and the connection portion between the flexible conductive structure and the electromagnetic membrane in a direction perpendicular to the bottom wall of the positioning groove. The second area extends linearly and is used to provide a moving channel for the flexible conductive structure and to receive a portion of the flexible conductive structure.

4. The assembly fixture according to claim 1, characterized in that, The assembly fixture includes a vacuum adsorption system, which includes a vacuum communication structure and multiple adsorption holes. Each adsorption hole is connected to the vacuum communication structure and forms an opening in the bottom wall of the positioning groove. The vacuum communication structure is connected to an external vacuum generator to form a negative pressure at the opening to adsorb the glue iron.

5. The assembly fixture according to claim 4, characterized in that, The plurality of adsorption holes include a first group of adsorption holes, the first group of adsorption holes being spaced apart along the edge of the positioning groove; and / or, The plurality of adsorption holes include a second set of adsorption holes, which are spaced apart along the periphery of the receiving groove.

6. The assembly fixture according to claim 4, characterized in that, The vacuum communication structure is an air chamber or a mesh air channel located within the substrate.

7. The assembly fixture according to claim 1, characterized in that, The substrate is also provided with a material picking groove, part of which is recessed into the side wall of the positioning groove, and the depth of the material picking groove is greater than the depth of the positioning groove or penetrates the substrate.

8. The assembly fixture according to claim 7, characterized in that, The positioning groove is provided with the material picking groove on both sides of the opposite side; or, The material receiving groove is provided on both sides of the positioning groove.

9. The assembly fixture according to claim 1, characterized in that, The assembly fixture includes two sets of support members, which are spaced apart on the side of the substrate away from the positioning groove.

10. The assembly fixture according to claim 9, characterized in that, Along the direction from one end of the flexible conductive structure connected to the electromagnetic membrane to the other end, the two sets of support members are spaced apart, and the height of the support member at the front end is less than or equal to the height of the support member at the rear end.