Wafer feeding mechanism and conveying device having the wafer feeding mechanism

Abstract

This utility model relates to the technical field of workpiece conveying devices, and in particular to a feeding mechanism and a conveying device having the feeding mechanism. The feeding mechanism includes a first feeding module and a second feeding module arranged opposite to each other, and a third lifting device connected to the first feeding module. The first feeding module and the second feeding module each include a third clamping groove and a fourth clamping groove, which together form a receiving space for fixing the workpiece. The second feeding module includes a driving surface for driving the workpiece to move in the receiving space. The third lifting device is used to drive the first feeding module to move closer to or away from the second feeding module. After the workpiece enters the receiving space, it can be driven by the driving surface to move into the receiving space, thereby reducing the driving burden of workpiece feeding, improving the feeding efficiency of the feeding mechanism, realizing automatic feeding of workpieces, reducing production costs and accident risks, and improving the stability of product quality.

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