A surface-mount high-power RGB LED chip

Abstract

This utility model discloses a surface-mount high-power RGB LED chip, relating to the field of lighting technology. It includes: a bracket on which multiple LED chips are connected via wire bonding; and an IC control chip, where the multiple LED chips are connected in series to the electrodes of the IC control chip. The IC control chip outputs signals to control the color switching and gradation of all LED chips, making each LED chip an independent pixel. The multiple LED chips employ a 3-pin or 6-pin series structure, reducing current by increasing voltage to decrease heat and increase power. This surface-mount high-power RGB LED chip, through flexible series connection of LED chips and a highly efficient heat dissipation thermoelectric separation structure, significantly improves the power and brightness of the LED chip, meeting the needs of automotive lights, stage lights, and special lighting products for high-brightness illumination and rich lighting effects.

Description

Technical Field

[0001] This utility model relates to the field of lighting technology, specifically to a surface-mount high-power iridescent LED bead. Background Technology

[0002] In the current lighting field, iridescent LED beads are widely used in automotive lights, stage lights, and special lighting products because they can achieve rich color changes.

[0003] However, existing iridescent LED chips have many drawbacks:

[0004] Firstly, the colorful LED beads on the market generally suffer from low brightness, low voltage, and low power, which cannot meet the needs of applications such as long-distance lighting in car lights and high-brightness rendering in stage lights.

[0005] Secondly, the heat dissipation design is poor. Traditional RGB LEDs rely solely on pin heat dissipation and do not have thermoelectric separation pads, making it difficult to dissipate heat effectively. This limits the power increase, and most RGB LEDs can only achieve a power of less than 0.5W. Prolonged use can easily lead to severe light decay and shortened lifespan due to overheating.

[0006] Third, in terms of production efficiency, traditional packaging methods are not conducive to automatic surface mounting operations, and manual installation is inefficient and costly. Fourth, in terms of optical performance, existing LED chips lack effective processing of emitted light, resulting in insufficient brightness and uneven beam distribution, which affects the lighting effect and visual experience. Utility Model Content

[0007] The purpose of this invention is to provide a surface-mount high-power RGB LED chip to solve the problems mentioned in the background art.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a surface-mount high-power RGB LED chip, comprising:

[0009] A bracket on which multiple LED chips are connected by wire bonding;

[0010] An IC control chip is used, and the multiple LED chips are connected in series to the electrodes of the IC control chip. The IC control chip outputs signals to control the color switching and gradation of all LED chips, so that each LED chip constitutes an independent pixel.

[0011] The multiple LED chips adopt a 3-core series or 6-core series structure, which reduces heat and increases power by increasing voltage and reducing current.

[0012] The LED chip is packaged using an SMD surface mount substrate, which includes a thermoelectric separation structure, and the thermoelectric separation structure includes independent heat dissipation pads and electrical connection pads.

[0013] A transparent adhesive layer is applied to the LED chip and the surface of the bonding wire to protect the bonding wire and to perform secondary refraction of the light emitted from the LED chip.

[0014] Furthermore, the multiple LED chips include at least three different colors of light-emitting chips, and the IC control chip achieves the color mixing effect by controlling the light emission intensity of the different colored LED chips.

[0015] Furthermore, the heat dissipation pads of the thermoelectric separation structure are directly connected to the heat dissipation area at the bottom of the bracket, and the electrical connection pads form an electrical circuit with the IC control chip and the LED chip.

[0016] Furthermore, the transparent adhesive layer is made of epoxy resin or silicone material with a light transmittance of more than 95%.

[0017] Furthermore, the IC control chip integrates a PWM dimming circuit and a communication interface, supporting DMX512, SPI, or I2C communication protocols.

[0018] Furthermore, the support is made of copper-based or aluminum-based composite material, and the thickness of the silver plating layer on the surface is not less than 3μm.

[0019] This utility model provides a surface-mount high-power RGB LED chip, which has the following beneficial effects:

[0020] Through the flexible series connection of LED chips and the thermoelectric separation structure for efficient heat dissipation, the power and brightness of the LED chips are greatly improved, which can meet the needs of automotive lights, stage lights and special lighting products for high-brightness lighting and rich lighting effects.

[0021] A good heat dissipation design reduces light decay caused by overheating and extends the lifespan of the LED chips; precise IC control and a stable circuit structure ensure the stability of LED chip color switching and gradation.

[0022] The secondary refraction of light by the transparent adhesive layer improves the brightness and spectral uniformity of the LED beads, resulting in a more outstanding lighting effect. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the circuit principle structure of this utility model. Detailed Implementation

[0024] The embodiments of this utility model will be described in further detail below with reference to the examples. These examples are for illustrative purposes only and should not be construed as limiting the scope of this utility model.

[0025] A surface-mount high-power RGB LED chip, comprising:

[0026] The bracket is made of copper-based or aluminum-based composite material, and the silver plating layer on the surface is not less than 3μm thick. Multiple LED chips are connected to the bracket by wire bonding.

[0027] An IC control chip is used, with multiple LED chips connected in series to the electrodes of the IC control chip. The IC control chip outputs signals to control the color switching and gradation of all LED chips, making each LED an independent pixel. Multiple LED chips adopt a 3-core or 6-core series structure. By increasing the voltage and reducing the current, heat is reduced and power is increased. A copper-based composite material is used to make the bracket, and the thickness of the silver plating layer on its surface is controlled at 3μm to ensure good conductivity and oxidation resistance. On the bracket, 6 LED chips of different colors (red, green, and blue) are connected in series through a high-precision wire bonding process. These 6 chips form a 6-core series structure, which increases the working voltage of the LED to 24V, effectively reducing heat generation while reducing current and increasing power to 1.5W.

[0028] The LED chips are packaged using SMD (Surface Mount Device) substrate. The SMD substrate includes a thermoelectric separation structure, which comprises independent heat dissipation pads and electrical connection pads. The heat dissipation pads of the thermoelectric separation structure are directly connected to the heat dissipation area at the bottom of the bracket. The electrical connection pads form an electrical circuit with the IC control chip and the LED chip. A transparent adhesive layer covers the LED chip and the wire bonding surface to protect the bonding wires and to provide secondary refraction of the light emitted from the LED chip. The heat dissipation pads are tightly connected to the heat dissipation area at the bottom of the bracket, ensuring that the heat generated during LED chip operation can be quickly conducted away. The electrical connection pads form an electrical circuit with the IC control chip and the LED chip. The circuit is stable and reliable. The IC control chip integrates a PWM dimming circuit and a communication interface, supporting DMX512, SPI, or I2C communication protocols. After packaging, a transparent adhesive layer made of epoxy resin is coated on the surface of the LED chip. The transparent adhesive layer uses epoxy resin or silicone material with a light transmittance of more than 95%, and its light transmittance reaches 96%. It can protect the internal LED chip and wire bonding, and also perform secondary refraction of the light emitted by the LED chip, improving brightness and light distribution uniformity. Multiple LED chips include at least three different colors of light-emitting chips. The IC control chip achieves the color mixing effect by controlling the light intensity of different colored LED chips.

[0029] Using an automated chip mounter, the prepared iridescent LED beads are precisely mounted onto the circuit board of the automotive headlights according to a pre-designed matrix arrangement. When the car is driving normally at night, the IC control chip controls the LED beads to emit high-brightness white light, providing a clear and wide field of vision. When the vehicle turns, the car's turn signal is transmitted to the lighting control system, which in turn causes the IC control chip to switch the corresponding LED beads to yellow light, providing a clear warning effect. Due to the LED beads' excellent heat dissipation design, the LED bead temperature remains within a reasonable range during long-term continuous use, without significant light decay, ensuring the stability and durability of the headlight's illumination effect.

[0030] The embodiments of this utility model are given for illustrative and descriptive purposes only, and are not intended to be exhaustive or to limit the utility model to the forms disclosed. Many modifications and variations will be apparent to those skilled in the art. The embodiments were chosen and described in order to better illustrate the principles and practical applications of this utility model, and to enable those skilled in the art to understand this utility model and design various embodiments with various modifications suitable for a particular purpose.

Claims

1. A surface-mount high-power RGB LED chip, characterized in that, include: A bracket on which multiple LED chips are connected by wire bonding; An IC control chip is used, and the multiple LED chips are connected in series to the electrodes of the IC control chip. The IC control chip outputs signals to control the color switching and gradation of all LED chips, so that each LED chip constitutes an independent pixel. The multiple LED chips adopt a 3-core series or 6-core series structure, which reduces heat and increases power by increasing voltage and reducing current. The LED chip is packaged using an SMD surface mount substrate, which includes a thermoelectric separation structure, and the thermoelectric separation structure includes independent heat dissipation pads and electrical connection pads. A transparent adhesive layer is applied to the LED chip and the surface of the bonding wire to protect the bonding wire and to perform secondary refraction of the light emitted from the LED chip.

2. The surface-mount high-power RGB LED bead according to claim 1, characterized in that, Multiple LED chips include at least three different colors of light-emitting chips, and the IC control chip achieves a color mixing effect by controlling the light emission intensity of the different colored LED chips.

3. A surface-mount high-power RGB LED bead according to claim 2, characterized in that, The heat dissipation pads of the thermoelectric separation structure are directly connected to the heat dissipation area at the bottom of the bracket, and the electrical connection pads form an electrical circuit with the IC control chip and the LED chip.

4. A surface-mount high-power RGB LED bead according to claim 3, characterized in that, The transparent adhesive layer is made of epoxy resin or silicone material with a light transmittance of more than 95%.

5. A surface-mount high-power RGB LED bead according to claim 4, characterized in that, The IC control chip integrates a PWM dimming circuit and a communication interface, supporting DMX512, SPI, or I2C communication protocols.

6. A surface-mount high-power RGB LED bead according to claim 5, characterized in that, The support is made of copper-based or aluminum-based composite material, and the thickness of the silver plating layer on the surface is not less than 3μm.

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