Test boards, test machines, and test systems for testing machines

Abstract

This application relates to the field of chip testing, and in particular to a test board, a test machine, and a test system for a tester. The test board includes a BE board, a PCB board, and a heat sink, stacked sequentially from bottom to top. The PCB board includes at least one test channel, which includes an analog area and a power area. A temperature sensor is provided in the analog area, and at least one heating element corresponding to the power area is provided on the heat sink. A control module is provided on the BE board, which is electrically connected to the temperature sensor and the heating element. The control module is used to acquire the temperature data of the analog area collected by the temperature sensor and to control the heating element according to the temperature data to keep the temperature of the analog area stable within a set range. This application uses air cooling coupled with active temperature control to control the temperature of the analog area, reducing the temperature drift of heat-sensitive devices in the test board during actual operation, thereby improving the output performance of the test board.

Description

Technical Field

[0001] This application relates to the field of chip testing, and in particular to a test board, a test machine, and a test system for a test machine. Background Technology

[0002] Chip testing refers to the process of using a test machine to control a test board with a test head to output test signals and detect various parameters of the chip under test, eliminating defective products to control the quality of the chips before they leave the factory. The test board includes an analog area and a power area. The analog area contains many heat-sensitive devices, while the power area contains some power devices. During actual operation, the heat dissipation of the test board constantly changes, affecting the performance parameters of the heat-sensitive devices in the analog area, and thus affecting the accuracy of the output test signals.

[0003] In existing technologies, a heat sink is placed in the power area, and the temperature of the analog area is adjusted by regulating the temperature of the power area, thereby improving the output accuracy of the test signal. However, this temperature control method cannot precisely adjust the temperature of the analog area, making it difficult to meet the high-precision output requirements of the test board. Utility Model Content

[0004] Therefore, it is necessary to provide a test board, a test machine, and a test system for the test machine to address the above-mentioned technical problems.

[0005] In a first aspect, this utility model embodiment proposes a test board for a test machine. The test board includes a BE board, a PCB board, and a heat sink, which are stacked sequentially from bottom to top. The PCB board includes at least one test channel, and the test channel includes an analog area and a power area. A temperature sensor is provided in the analog area, and at least one heating element corresponding to the power area is provided on the heat sink.

[0006] The BE board is equipped with a control module, which is electrically connected to the temperature sensor and the heating element. The control module is used to acquire the temperature data of the simulation area collected by the temperature sensor, and control the heating element according to the temperature data to keep the temperature of the simulation area stable within a set range.

[0007] In some embodiments, the heating element is disposed on a non-protruding area of ​​the lower surface of the heat sink.

[0008] In some embodiments, the PCB board is provided with a socket, and the heating element is plugged into the socket via a power connector.

[0009] In some embodiments, the heat sink is an air-cooled heat sink.

[0010] In some embodiments, the heat sink contacts the power region to dissipate heat from the power region.

[0011] In some embodiments, the control module uses PID control based on the temperature data to control the heating power of the heating element, thereby stabilizing the temperature of the simulation zone within a set range.

[0012] In some embodiments, the control module determines whether the temperature data is abnormal. If abnormal, it uses PID control to control the heating power of the heating element in order to keep the temperature of the simulation zone stable within a set range.

[0013] In some embodiments, the test board is a mixed-signal board.

[0014] Secondly, this utility model embodiment proposes a testing machine, including at least one testing board as described in the first aspect.

[0015] Thirdly, this utility model embodiment proposes a testing system, including a host computer and a testing machine as described in the second aspect, which is communicatively connected to the host computer.

[0016] Compared with existing technologies, this test board, test machine, and test system, through the test board comprising a BE board, a PCB board, and a heat sink stacked sequentially from bottom to top, the PCB board including at least one test channel, the test channel including an analog area and a power area, a temperature sensor being provided in the analog area, and at least one heating element corresponding to the power area being provided on the heat sink; a control module being provided on the BE board, the control module being electrically connected to the temperature sensor and the heating element, used to acquire the temperature data of the analog area collected by the temperature sensor, and control the heating element according to the temperature data to keep the temperature of the analog area stable within a set range. This application uses air cooling coupled with active temperature control to control the temperature of the analog area. Air cooling reduces the temperature of the power devices in the power area through the heat sink to adjust the temperature of the analog area, and active temperature control controls the temperature stability of multiple heat-sensitive devices in the analog area of ​​the test board through dynamic heat dissipation compensation of the heating element, reducing the temperature drift of the heat-sensitive devices in the test board in actual operation, thereby improving the output performance of the test board, and on the other hand, reducing the complexity of the overall temperature control system. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the test board for the test machine in the first embodiment of this utility model;

[0018] Figure 2 This is a connection diagram of the control module in the test board of the test machine in the first embodiment of this utility model;

[0019] Figure 3This is a three-dimensional structural diagram of the test board for the testing machine in the second embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the PCB board structure in the test board card of the test machine in the second embodiment of this utility model;

[0021] Figure 5 This is a schematic diagram of the heat sink in the test board of the test machine in the second embodiment of this utility model;

[0022] Figure 6 This is a schematic diagram of the connection of the control module in the test board of the test machine in the third embodiment of this utility model.

[0023] The components are: 1. BE board; 2. PCB board; 3. Heat sink; 4. Analog area; 5. Power area; 6. Temperature sensor; 7. Heating element; 8. Control module. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0025] Obviously, the accompanying drawings described below are merely some examples or embodiments of this application. Those skilled in the art can apply this application to other similar scenarios based on these drawings without any inventive effort. Furthermore, it is understood that although the efforts made in this development process may be complex and lengthy, for those skilled in the art related to the content disclosed in this application, any changes to design, manufacturing, or production based on the technical content disclosed in this application are merely conventional technical means and should not be construed as insufficient disclosure of the content of this application.

[0026] In this application, the reference to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in multiple embodiments of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0027] Unless otherwise defined, the technical or scientific terms used in this application shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms “a,” “an,” “an,” “the,” and similar words used in this application do not indicate quantity limitation and may indicate singular or plural. The terms “comprising,” “including,” “having,” and any variations thereof used in this application are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or device that includes a series of steps or modules (units) is not limited to the listed steps or units, but may also include steps or units not listed, or may include other steps or units inherent to these processes, methods, products, or devices. The terms “connected,” “linked,” “coupled,” and similar words used in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Multiple” used in this application refers to two or more. “And / or” describes the relationship between related objects, indicating that three relationships may exist; for example, “A and / or B” can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following objects are in an "or" relationship. The terms "first," "second," and "third" used in this application are merely to distinguish similar objects and do not represent a specific ordering of the objects.

[0028] The first embodiment of this application proposes a test board for a test machine, such as... Figure 1 The diagram shows the structure of the test board, which includes a BE board 1, a PCB board 2, and a heat sink 3 stacked from bottom to top. The PCB board includes at least one test channel. Figure 1 Only one test channel is shown in the diagram. The test channel includes an analog zone 4 and a power zone 5. A temperature sensor 6 is provided in the analog zone 4. At least one heating element 7 corresponding to the power zone is provided on the heat sink 3. The BE board 1 is provided with a control module 8.

[0029] like Figure 2 As shown, the control module 8 is electrically connected to the temperature sensor 6 and the heating element 7. The control module 8 is used to acquire the temperature data of the simulation zone 4 collected by the temperature sensor 6, and control the heating element 7 according to the temperature data, so as to control the temperature of the simulation zone 4 to be stable within a set range.

[0030] The simulation area 4 mainly includes some heat-sensitive devices. The temperature of the simulation area 4 has a significant impact on the parameters of the heat-sensitive devices, thereby affecting the output accuracy of the test board. A temperature sensor 6 is installed on the simulation area 4 to detect the temperature of the simulation area 4.

[0031] The power zone 5 mainly includes some power devices. During the actual operation of the test board, the heat dissipation of the power devices changes continuously. Above the power devices is the heat sink 3, which is used to reduce the temperature of some power devices in the power zone 5 to further regulate the temperature of the simulation zone 4.

[0032] The control module can use an existing control chip to acquire the temperature data of the simulation zone 4 collected by the temperature sensor 6 on the simulation zone 4, and control the power of the heating element 7 according to the temperature data, thereby controlling the temperature of the simulation zone 4 to be stable within a set range.

[0033] In this embodiment, a temperature sensor is provided in the simulation area, and at least one heating element corresponding to the power area is provided on the heat sink. The temperature sensor detects the temperature data of the simulation area, and the control module controls the power of the heating element according to the temperature data to stabilize the temperature of the simulation area within a set range. This application uses air cooling coupled with active temperature control to control the temperature of the simulation area. Air cooling reduces the temperature of the power devices in the power area through the heat sink to regulate the temperature of the simulation area. Active temperature control controls the temperature stability of multiple heat-sensitive devices in the simulation area of ​​the test board through dynamic heat loss compensation of the heating element, reducing the temperature drift of the heat-sensitive devices in the test board during actual operation, thereby improving the output performance of the test board. On the other hand, it can reduce the complexity of the overall temperature control system.

[0034] In some embodiments, the heating element is disposed on the non-protruding area of ​​the lower surface of the heat sink 3.

[0035] In some embodiments, a socket is provided on the PCB board, and the heating element is plugged into the socket via a power connector to provide power to the heating element.

[0036] In some embodiments, the heat sink 3 is an air-cooled heat sink.

[0037] In some embodiments, the heat sink 3 contacts the power region 5 to dissipate heat from the power region 5.

[0038] By bringing the heat sink into contact with the power region, the heat sink dissipates heat from the power devices in the power region, thereby regulating the temperature of the analog region and reducing the temperature drift of the thermistors in the analog region.

[0039] In some embodiments, the control module uses PID control based on the temperature data to control the heating power of the heating element, so as to keep the temperature of the simulation zone 4 stable within a set range.

[0040] Specifically, the control module includes a PID controller, which controls the heating power of the heating element based on the temperature data of the simulation zone 4, so as to keep the temperature of the simulation zone 4 stable within a set range.

[0041] In some embodiments, the control module determines whether the temperature data is abnormal. If abnormal, it uses PID control to control the heating power of the heating element in order to keep the temperature of the simulation zone 4 stable within a set range.

[0042] Specifically, the temperature sensor 6 collects the temperature data of the simulation zone 4, the control module acquires the temperature data in real time, and the control module compares the temperature data with the preset normal temperature range data. In the case of abnormal temperature data, the PID controller adjusts the power of the heating element on the heat sink 3. The heat sink 3 transfers heat to the simulation zone 4 through the boss, the heat-generating device itself and the PCB board, thereby controlling the temperature of the simulation zone 4 within a stable range.

[0043] In some embodiments, the test board is a mixed-signal board.

[0044] In some specific embodiments, the PCB board 2 is described as having two test channels (test channel 1 and test channel 2) as an example. Please refer to [link / reference] for details. Figure 3-5 . Figure 3 A three-dimensional structural diagram of a test board for a testing machine is shown. The test board includes a BE board 1, a PCB board 2, and a heat sink 3 stacked from bottom to top.

[0045] Figure 4 A schematic diagram of the PCB board 2 in the test board is shown. Test channel 1 includes a first power area A1 and a first analog area A2, while test channel 2 includes a second power area A3 and a second analog area A4. The first power area A1 and the second power area A3 house the heat-generating components of the test board, while the first analog area A2 and the second analog area A4 house the thermally sensitive components. The analog areas are significantly affected by the power consumption of the heat-generating components in the power amplifier area, the power consumption of other boards, and fluctuations in ambient temperature. A first temperature sensor A5 is installed in the first analog area A2 of test channel 1 to monitor the temperature of the first analog area A2 in real time. Similarly, a second temperature sensor A6 is installed in the second analog area A4 of test channel 2 to monitor the temperature of the second analog area A4 in real time.

[0046] Figure 5The diagram shows the specific structure of the heat sink 3 in the test board. A first heating element B2 corresponding to the first power zone A1 and a second heating element B4 corresponding to the second power zone A3 are attached to the heat sink. The first heating element B2 includes a first mounting hole B1 for a power connector. The power connector of the first heating element B2 is mounted to a corresponding socket on the PCB board 2 through the first mounting hole B1. The control module 8 can dynamically adjust the power of the first heating element B2 based on the temperature value collected by the first temperature sensor A5 in the first simulation zone A2 to keep the temperature of the first simulation zone A2 stable within a set range. The second heating element B4 includes a second mounting hole B3 for a power connector. The power connector of the second heating element B4 is mounted to a corresponding socket on the PCB board 2 through the second mounting hole B3. The control module 8 can dynamically adjust the power of the second heating element B4 based on the temperature value collected by the second temperature sensor A6 in the second simulation zone A4 to keep the temperature of the second simulation zone A4 stable within a set range.

[0047] In other embodiments, the test board includes multiple test channels, each including an analog zone 4 and a power zone 5. Each analog zone 4 is equipped with a temperature sensor 6, and at least one heating element 7 corresponding to each power zone is provided on the heat sink 3. Figure 6 As shown, the control module 8 is electrically connected to each of the temperature sensors 6 and each of the heating elements 7. The control module 8 is used to acquire the temperature data of the simulation zone 4 collected by each of the temperature sensors 6, and to control the corresponding heating element 7 according to the temperature data, so as to keep the temperature of each corresponding simulation zone 4 stable within a set range.

[0048] The control module controls the power of the corresponding heating element based on the temperature data of each simulation zone, thereby achieving independent active temperature control for each test channel.

[0049] Based on the same concept, this application also proposes a testing machine, including the testing board in the above embodiments.

[0050] Since the testing machine includes the testing board in the above embodiments, it can solve the same technical problems and achieve the same technical effects, which will not be repeated here.

[0051] Based on the same concept, this application also proposes a testing system, including a host computer and a testing machine as described in the above embodiments, which is communicatively connected to the host computer.

[0052] The host computer is used to send test commands to the test machine, and the test machine receives the test commands to detect various parameters of the chip under test.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above embodiments merely illustrate several implementation methods of this application, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A test board card for a test machine, characterized by, The test board includes a BE board, a PCB board and a heat sink, which are stacked from bottom to top. The PCB board includes at least one test channel, which includes an analog area and a power area. A temperature sensor is provided in the analog area, and at least one heating element corresponding to the power area is provided on the heat sink. The BE board is equipped with a control module, which is electrically connected to the temperature sensor and the heating element. The control module is used to acquire the temperature data of the simulation area collected by the temperature sensor, and to control the heating element according to the temperature data, so as to keep the temperature of the simulation area stable within a set range.

2. The test board card for a test machine according to claim 1, characterized by, The heating element is located in the non-protruding area on the lower surface of the heat sink.

3. The test board card for a test machine according to claim 2, wherein, The PCB board has a socket, and the heating element is plugged into the socket via a power connector.

4. The test board card for a test machine of claim 1, wherein, The heat sink is an air-cooled radiator.

5. The test board for a testing machine according to claim 1, characterized in that, The heat sink contacts the power zone to dissipate heat from the power zone.

6. The test board for a testing machine according to claim 1, characterized in that, The control module uses PID control based on the temperature data to control the heating power of the heating element, thereby keeping the temperature of the simulation zone stable within a set range.

7. The test board for a testing machine according to claim 6, characterized in that, The control module determines whether the temperature data is abnormal. If abnormal, it uses PID control to control the heating power of the heating element in order to keep the temperature of the simulation zone stable within the set range.

8. The test board for a testing machine according to claim 1, characterized in that, The test board is a mixed-signal board.

9. A testing machine, characterized in that, It includes at least one test board as described in any one of claims 1 to 8.

10. A testing system, characterized in that, It includes a host computer and a test machine as described in claim 9 that is communicatively connected to the host computer.

Images