A non-inductive resistor suitable for high-frequency circuits

Abstract

This utility model relates to the field of non-inductive resistor technology and discloses a non-inductive resistor suitable for high-frequency circuits. It includes a package housing, a flange at the bottom of the inner part of the package housing, a connection point at the top of the flange, a substrate at the upper end of the connection point, a resistive layer at the top of the substrate, and two leads at the top of the resistive layer. One end of the flange passes through the side wall of the package housing and extends outward. A through hole is formed on the flange. A heat sink is connected to the top of the package housing by fastening bolts. One end of each of the two leads passes through the side wall of the package housing and extends outward. This utility model increases the heat dissipation area by designing both sides of the package housing as heat sink fins. The heat sink and fastening bolts, through their interaction, improve the heat dissipation effect of the non-inductive resistor, thereby extending its service life.

Description

Technical Field

[0001] This utility model relates to the field of non-inductive resistor technology, specifically a non-inductive resistor suitable for high-frequency circuits. Background Technology

[0002] A non-inductive resistor is a type of radio component, also known as a passive resistor. Unlike ordinary resistors, it does not generate inductive reactance in high-frequency circuits, meaning it is unaffected by frequency, hence the name "non-inductive." Non-inductive resistors are passive resistors used in high-frequency circuits, possessing non-inductive characteristics and providing high resistance and impedance matching. They are widely used in electronic devices and are very helpful in improving circuit performance and energy saving.

[0003] Existing non-inductive resistors suitable for high-frequency circuits have a small heat dissipation area and poor heat dissipation effect, which shortens their service life. Therefore, there is an urgent need for a non-inductive resistor suitable for high-frequency circuits to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a non-inductive resistor suitable for high-frequency circuits, in order to solve the problem mentioned in the background art that existing non-inductive resistors suitable for high-frequency circuits have a small heat dissipation area and poor heat dissipation effect, which shortens their service life.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A non-inductive resistor suitable for high-frequency circuits includes a package housing. A flange is located at the bottom of the package housing, and a connection point is mounted on the top of the flange. A substrate is mounted on the upper end of the connection point, and a resistive layer is mounted on the top of the substrate. Two leads are mounted on the top of the resistive layer. One end of the flange passes through the side wall of the package housing and extends outward. A through hole is provided on the flange. A heat sink is connected to the top of the package housing via fastening bolts. One end of the two leads passes through the side wall of the package housing and extends outward. Both the left and right sides of the package housing are shaped like heat sink fins.

[0007] As a preferred embodiment of this utility model, the number of fastening bolts is set to four, and the four fastening bolts are arranged in pairs opposite each other about the encapsulation shell.

[0008] As a preferred embodiment of this invention, the material of the encapsulation shell is epoxy resin.

[0009] In a preferred embodiment of this invention, the resistive layer is made of resistive paste.

[0010] In a preferred embodiment of this invention, the substrate is made of aluminum oxide.

[0011] As a preferred embodiment of this invention, the through hole is located on the outside of the encapsulation housing.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] This invention increases the heat dissipation area by setting both sides of the encapsulation housing in the shape of heat dissipation fins, and by setting heat dissipation fins and fastening bolts, the heat dissipation effect of the non-inductive resistor can be improved by utilizing the interaction between them, thereby extending the service life of the non-inductive resistor. Attached Figure Description

[0014] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a cross-sectional view of the overall structure of this utility model;

[0017] Figure 3 This utility model Figure 1 A magnified structural diagram of point A in the middle.

[0018] In the diagram: 1. Encapsulation housing; 2. Flange; 3. Connection point; 4. Substrate; 5. Resistor layer; 6. Leads; 7. Through hole; 8. Heat sink; 9. Fastening bolt; 10. Shape of heat sink fins. Detailed Implementation

[0019] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the utility model. Furthermore, it should be noted that, for ease of description, only the parts relevant to the utility model are shown in the accompanying drawings. In the embodiments of the present utility model, the different types of cross-sectional lines are not labeled according to national standards, nor do they specify material requirements for the components; they are used to distinguish the cross-sectional views of the components in the drawings.

[0020] Please see Figure 1-3A non-inductive resistor suitable for high-frequency circuits includes a package housing 1. A flange 2 is provided at the bottom of the package housing 1. A connection point 3 is installed on the top of the flange 2. A substrate 4 is installed at the upper end of the connection point 3. A resistive layer 5 is installed on the top of the substrate 4. Two pins 6 are installed on the top of the resistive layer 5. One end of the flange 2 passes through the side wall of the package housing 1 and extends outward. A through hole 7 is provided on the flange 2. A heat sink 8 is connected to the top of the package housing 1 by fastening bolts 9. A layer of thermally conductive silicone grease is applied to the contact surface between the heat sink 8 and the package housing 1. One end of the two pins 6 passes through the side wall of the package housing 1 and extends outward. Both the left and right sides of the package housing 1 are configured as heat dissipation fins 10.

[0021] The number of fastening bolts 9 is set to four, and the four fastening bolts 9 are arranged in pairs opposite each other about the encapsulation housing 1.

[0022] The material of the encapsulation shell 1 is epoxy resin.

[0023] The material of the resistive layer 5 is a resistive paste.

[0024] The substrate 4 is made of aluminum oxide.

[0025] The through hole 7 is located on the outside of the encapsulation housing 1.

[0026] The working principle and usage process of this utility model are as follows: Firstly, during operation, the heat generated by the electronic components inside the encapsulation housing 1 is transferred to the encapsulation housing 1. By setting both sides of the encapsulation housing 1 into heat dissipation fins 10, the heat dissipation area of ​​the non-inductive resistor is increased. Furthermore, a heat sink 8 and a fastening bolt 9 are provided on the top of the encapsulation housing, and a layer of thermally conductive silicone grease is applied to the contact surface between the heat sink 8 and the encapsulation housing 1. The thermally conductive silicone grease allows the heat generated on the encapsulation housing 1 to be more effectively conducted to the heat sink 8. The heat sink 8 then dissipates the heat from the encapsulation housing 1 into the surrounding air, thereby improving the heat dissipation effect of the non-inductive resistor and extending its service life. Content not described in detail in this specification belongs to prior art known to those skilled in the art.

[0027] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the utility model involved in this application is not limited to the technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A non-inductive resistor suitable for high-frequency circuits, comprising a package housing (1), characterized in that: The inner bottom of the encapsulation housing (1) is provided with a flange (2), the top of the flange (2) is provided with a connecting point (3), the upper end of the connecting point (3) is provided with a substrate (4), the top of the substrate (4) is provided with a resistor layer (5), the top of the resistor layer (5) is provided with two pins (6), one end of the flange (2) passes through the side wall of the encapsulation housing (1) and extends outward, the flange (2) is provided with a through hole (7), the top of the encapsulation housing (1) is connected with a heat sink (8) by a fastening bolt (9), one end of the two pins (6) passes through the side wall of the encapsulation housing (1) and extends outward, the left and right sides of the encapsulation housing (1) are both provided with heat sink fins (10).

2. A non-inductive resistor suitable for high-frequency circuits according to claim 1, characterized in that: The number of fastening bolts (9) is set to four, and the four fastening bolts (9) are arranged in pairs opposite each other about the encapsulation housing (1).

3. A non-inductive resistor suitable for high-frequency circuits according to claim 1, characterized in that: The material of the encapsulation shell (1) is epoxy resin.

4. A non-inductive resistor suitable for high-frequency circuits according to claim 1, characterized in that: The material of the resistive layer (5) is a resistive paste.

5. A non-inductive resistor suitable for high-frequency circuits according to claim 1, characterized in that: The substrate (4) is made of aluminum oxide.

6. A non-inductive resistor suitable for high-frequency circuits according to claim 1, characterized in that: The through hole (7) is located on the outside of the encapsulation housing (1).

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