An RGB and TOF sensor module

Abstract

This utility model discloses an RGB and TOF sensor module, including an RGB module and hexagonal studs. The RGB module has four sets of equally spaced hexagonal studs on its exterior, and a TOF module is mounted on the exterior of each hexagonal stud. Four sets of equally spaced first bolts are provided on the sidewalls of both the RGB and TOF modules. These first bolts pass through the RGB and TOF modules and are threadedly connected to the hexagonal studs. The sidewall of the RGB module has symmetrically arranged grooves, with threaded holes on both sides of each groove. This utility model not only enables convenient and sealed installation of RGB and TOF cameras using the RGB and TOF sensor module, improving the ease of sealed installation, but also facilitates efficient heat dissipation of heat-prone chips, reducing chip temperature, preventing high-temperature damage, and improving chip heat dissipation efficiency.

Description

Technical Field

[0001] This utility model relates to the field of sensor module technology, specifically to an RGB and TOF sensor module. Background Technology

[0002] RGB sensor modules are mainly used to capture color images. Through RGB sensor modules, devices can obtain color information in a scene. RGB sensor modules are usually composed of three color filters: red, green, and blue. Each filter corresponds to a color of light. By combining these three colors, the true colors of the scene can be reproduced. TOF (Time-of-Flight) sensor modules are a type of 3D depth sensor. They calculate distance by measuring the time of flight of light pulses. TOF sensor modules emit light pulses towards a target and measure the time it takes for the light pulse to travel from emission to reflection. They calculate the distance using the principle that the speed of light is known. This technology is widely used in 3D modeling, distance measurement, and depth perception.

[0003] RGB and TOF sensor modules can provide high-precision depth information, which is crucial for 3D vision applications. The medium-to-long-range TOF module can achieve a detection distance of 20 meters with an accuracy of <1% and a field of view of over 120 degrees. Furthermore, its accuracy is less affected by outdoor ambient light conditions, making it suitable for various application scenarios. The RGB+TOF system-level product has a completely independent TOF calibration scheme, enabling dual-body calibration and fusion of RGB+TOF.

[0004] Existing sensor modules of this type generally do not facilitate convenient and sealed installation of RGB and TOF cameras, which affects the ease of sealed installation of RGB and TOF cameras. They also make it difficult to efficiently conduct heat dissipation for heat-prone chips, which are prone to high-temperature damage and affect chip lifespan. Utility Model Content

[0005] The purpose of this invention is to provide an RGB and TOF sensor module to solve the problems mentioned in the background art, such as the inconvenience of convenient and sealed installation of RGB and TOF cameras, which affects the convenience of sealed installation of RGB and TOF cameras, and the inconvenience of efficient heat conduction and heat dissipation for heat-prone chips, which easily leads to high-temperature damage to the chips and affects their lifespan.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an RGB and TOF sensor module, comprising an RGB module and hexagonal studs. The RGB module has four sets of equally spaced hexagonal studs on its exterior, and a TOF module is disposed on the exterior of the hexagonal studs. Four sets of equally spaced first bolts are disposed on the sidewalls of the RGB and TOF modules. Each first bolt passes through the RGB and TOF modules and is threadedly connected to the hexagonal studs. The sidewalls of the RGB module have symmetrically arranged grooves, with threaded holes on both sides of each groove extending into the interior of the RGB module. Sealing rings are disposed on the exterior of each groove. An RGB camera is disposed on the exterior of one set of sealing rings, and a TOF camera is disposed on the exterior of the other set of sealing rings. An annular groove is provided on one side of each of the RGB and TOF cameras on the side of each sealing ring. U-shaped brackets are installed on both sides of each of the RGB and TOF cameras on the side of the annular groove.

[0007] Preferably, a second bolt is provided on the top of each U-shaped bracket, and the second bolt passes through the U-shaped bracket.

[0008] Preferably, the second bolt extends to the outside of the U-shaped bracket and is threaded into the threaded hole.

[0009] Preferably, a chip body is mounted on the side wall of the TOF module, and a support plate is mounted on the side wall of the TOF module outside the chip body.

[0010] Preferably, a through hole is provided at the center of the support plate, and three sets of protrusions with equal spacing are installed on both sides of the support plate.

[0011] Preferably, a heat-dissipating aluminum plate body is provided on the outside of the support plate, and an elastic sheet is movably installed on the top of the heat-dissipating aluminum plate body.

[0012] Preferably, connecting plates are installed at both ends of the elastic sheet, and the connecting plates are in contact with the protrusions.

[0013] Preferably, a support frame is installed at the top of the heat dissipation aluminum plate body, and a fan is installed at the top of the support frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are: the sensor module not only realizes the convenient sealed installation of RGB and TOF sensor modules for RGB and TOF cameras, improving the convenience of sealed installation of RGB and TOF cameras, but also facilitates efficient heat conduction and heat dissipation of heat-prone chips, reducing chip temperature, avoiding high-temperature damage to chips, and improving chip heat dissipation efficiency.

[0015] (1) When using RGB and TOF sensor modules, the RGB module and TOF module are connected to hexagonal studs by multiple sets of first bolts. The sealing rings are placed into the annular grooves at the bottom of the RGB camera and TOF camera respectively, so that the sealing rings are in close contact with the annular grooves. The RGB camera, TOF camera and sealing ring are placed on the surface of the groove respectively. The two sets of second bolts are turned. Under the support of the U-shaped bracket, the second bolts are connected to the threaded holes, so that the second bolts drive the RGB camera, TOF camera and sealing ring to make close contact with the groove respectively. This facilitates the close contact of the RGB camera and TOF camera, and realizes the convenient sealing installation of the RGB and TOF sensor modules for the RGB camera and TOF camera, improving the convenience of sealing installation of the RGB camera and TOF camera.

[0016] (2) The support plate is fitted onto the surface of the chip body and connected to the TOF module. The chip body dissipates heat outward through the through hole. The heat sink aluminum plate body is placed on the surface of the support plate. The elastic sheet is fitted onto the surface of the heat sink aluminum plate body. The support frame and fan are placed above the heat sink aluminum plate body. The connecting plates on both sides of the elastic sheet are brought closer to the protrusion so that the connecting plates contact the protrusion. The heat sink aluminum plate body, support frame, and fan are fixed for heat dissipation. Under the connection of the elastic sheet, the heat sink aluminum plate body and the chip body are in close contact. When the heat sink aluminum plate body needs to be replaced, the connecting plates are pried open on both sides so that the connecting plates are separated from the protrusion. The elastic sheet, connecting plate, heat sink aluminum plate body, support frame, and fan can be taken out and replaced. This facilitates the convenient replacement of the heat sink aluminum plate and realizes the efficient heat conduction and heat dissipation of the heat-prone chip of the RGB and TOF sensor modules. It reduces the temperature of the chip, avoids high temperature damage to the chip, and improves the efficiency of chip heat dissipation. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a front view structural diagram of the present utility model;

[0019] Figure 3 This is a three-dimensional structural diagram of the U-shaped bracket of this utility model;

[0020] Figure 4 This is a three-dimensional structural diagram of the RGB module of this utility model;

[0021] Figure 5 This is a three-dimensional structural diagram of the TOF module of this utility model;

[0022] Figure 6 This is a three-dimensional structural diagram of the elastic sheet of this utility model.

[0023] In the diagram: 1. RGB module; 2. TOF module; 3. Hexagonal stud; 4. RGB camera; 5. TOF camera; 6. First bolt; 7. Annular groove; 8. Sealing ring; 9. Second bolt; 10. U-shaped bracket; 11. Groove; 12. Threaded hole; 13. Support plate; 14. Through hole; 15. Chip body; 16. Bump; 17. Elastic sheet; 18. Connecting plate; 19. Heat sink aluminum plate body; 20. Support frame; 21. Fan. Detailed Implementation

[0024] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended utility model purpose, the following detailed description of the specific implementation methods, structure, features and effects of this utility model is provided in conjunction with the accompanying drawings and preferred embodiments.

[0025] Please see Figure 1-6 This utility model provides an embodiment of an RGB and TOF sensor module, including an RGB module 1 and hexagonal studs 3. The RGB module 1 is provided with four sets of hexagonal studs 3 at equal intervals. The hexagonal studs 3 are provided with a TOF module 2. The sidewalls of the RGB module 1 and the TOF module 2 are provided with four sets of first bolts 6 at equal intervals. The first bolts 6 all pass through the RGB module 1 and the TOF module 2 and are threadedly connected to the hexagonal studs 3. The sidewalls of the RGB module 1 are symmetrically provided with grooves 11. The two sides of the grooves 11 are provided with threaded holes 12, and the threaded holes 12 extend into the interior of the RGB module 1. The grooves 11 are all provided with sealing rings 8. The RGB camera 4 is provided outside one set of sealing rings 8, and the TOF camera 5 is provided outside the other set of sealing rings 8. The RGB camera 4 and the TOF camera 5 on one side of the sealing ring 8 are provided with an annular groove 7. The RGB camera 4 and the TOF camera 5 on one side of the annular groove 7 are both equipped with U-shaped brackets 10.

[0026] When using RGB and TOF sensor modules, RGB module 1 and TOF module 2 are connected to hexagonal studs 3 via multiple sets of first bolts 6. Sealing rings 8 are placed into the annular grooves 7 at the bottom of RGB camera 4 and TOF camera 5, respectively, so that the sealing rings 8 are in close contact with the annular grooves 7. RGB camera 4, TOF camera 5, and sealing ring 8 are placed on the surface of groove 11. Two sets of second bolts 9 are tightened. With the support of U-shaped bracket 10, the second bolts 9 are threaded into the threaded holes 12, so that the second bolts 9 drive RGB camera 4, TOF camera 5, and sealing ring 8 to make close contact with groove 11. This facilitates the tight contact of RGB camera 4 and TOF camera 5, and enables convenient sealing installation of RGB and TOF sensor modules, improving the convenience of sealing installation of RGB camera 4 and TOF camera 5.

[0027] A second bolt 9 is provided above each U-shaped bracket 10. The second bolt 9 passes through the U-shaped bracket 10 and extends to the outside of the U-shaped bracket 10. The second bolt 9 is threadedly connected to the threaded hole 12. A chip body 15 is installed on the side wall of the TOF module 2. A support plate 13 is installed on the side wall of the TOF module 2 outside the chip body 15.

[0028] A through hole 14 is provided at the center of the support plate 13, and three sets of protrusions 16 with equal spacing are installed on both sides of the support plate 13. A heat dissipation aluminum plate body 19 is provided on the outside of the support plate 13, and an elastic sheet 17 is movably installed on the top of the heat dissipation aluminum plate body 19.

[0029] Both ends of the elastic sheet 17 are equipped with connecting plates 18, which are in contact with the protrusions 16. The top of the heat dissipation aluminum plate body 19 is equipped with a support frame 20, and the top of the support frame 20 is equipped with a fan 21.

[0030] When heat dissipation is required for the TOF module 2, the support plate 13 is fitted onto the surface of the chip body 15 and connected to the TOF module 2. The chip body 15 dissipates heat outward through the through-hole 14. The heat dissipation aluminum plate body 19 is placed on the surface of the support plate 13, and the elastic sheet 17 is fitted onto the surface of the heat dissipation aluminum plate body 19. The support frame 20 and the fan 21 are placed above the heat dissipation aluminum plate body 19. The connecting plates 18 on both sides of the elastic sheet 17 are brought closer to the protrusion 16 so that the connecting plates 18 contact the protrusion 16, thus fixing the heat dissipation aluminum plate body 19, the support frame 20, and the fan 21 in place for heat dissipation. The heat sink aluminum plate body 19 is in close contact with the chip body 15 under the connection of the elastic sheet 17. When the heat sink aluminum plate body 19 needs to be replaced, the connecting plate 18 is pried open to both sides, so that the connecting plate 18 is separated from the protrusion 16. The elastic sheet 17, connecting plate 18, heat sink aluminum plate body 19, support frame 20, and fan 21 can be taken out and replaced. This facilitates the convenient replacement of the heat sink aluminum plate and realizes efficient heat conduction and heat dissipation of the heat-prone chip of the RGB and TOF sensor modules. It reduces the temperature of the chip, avoids high temperature damage to the chip, and improves the efficiency of chip heat dissipation.

[0031] Working principle: When using RGB and TOF sensor modules, RGB module 1 and TOF module 2 are connected to hexagonal studs 3 via multiple sets of first bolts 6. Sealing rings 8 are placed inside the annular grooves 7 at the bottom of RGB camera 4 and TOF camera 5, ensuring tight contact between the sealing rings 8 and the annular grooves 7. RGB camera 4, TOF camera 5, and sealing ring 8 are placed on the surface of groove 11. Tightening the two sets of second bolts 9, supported by the U-shaped bracket 10, and with the threaded connection between the second bolts 9 and the threaded holes 12, causes the second bolts 9 to bring the RGB camera 4, TOF camera 5, and sealing ring 8 into tight contact with groove 11, facilitating convenient and tight contact between the RGB camera 4 and TOF camera 5. The support plate 13 is then fitted onto the surface of the chip body 15 and connected to the TOF module 2. The chip body 15 is connected via through holes. 14. Heat dissipation is achieved by placing the heat dissipation aluminum plate body 19 on the surface of the support plate 13, and fitting the elastic sheet 17 onto the surface of the heat dissipation aluminum plate body 19. The support frame 20 and fan 21 are placed above the heat dissipation aluminum plate body 19. The connecting plates 18 on both sides of the elastic sheet 17 are brought closer to the protrusion 16 so that the connecting plates 18 and the protrusion 16 are in contact, thus fixing the heat dissipation aluminum plate body 19, support frame 20, and fan 21 for heat dissipation. Under the connection of the elastic sheet 17, the heat dissipation aluminum plate body 19 is in close contact with the chip body 15. When it is necessary to replace the heat dissipation aluminum plate body 19, the connecting plates 18 are pried open to both sides to separate the connecting plates 18 from the protrusion 16. The elastic sheet 17, connecting plates 18, heat dissipation aluminum plate body 19, support frame 20, and fan 21 can then be removed and replaced, facilitating the convenient replacement of the heat dissipation aluminum plate to complete the use of the sensor module.

[0032] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present utility model. Any indirect modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. An RGB and TOF sensor module, characterized by: The system includes an RGB module (1) and hexagonal studs (3). The RGB module (1) has four equally spaced sets of hexagonal studs (3) on its exterior. A TOF module (2) is located on the exterior of each hexagonal stud (3). Four equally spaced sets of first bolts (6) are located on the sidewalls of the RGB module (1) and the TOF module (2). All first bolts (6) pass through the RGB module (1) and the TOF module (2) and are threadedly connected to the hexagonal studs (3). The sidewalls of the RGB module (1) are symmetrically provided with grooves (11), and both sides of the grooves (11) are provided with… There is a threaded hole (12) that extends into the interior of the RGB module (1). A sealing ring (8) is provided on the outside of the groove (11). An RGB camera (4) is provided on the outside of one set of sealing rings (8), and a TOF camera (5) is provided on the outside of another set of sealing rings (8). An annular groove (7) is provided on one side of the RGB camera (4) and the TOF camera (5) on one side of the sealing ring (8). U-shaped brackets (10) are installed on both sides of the RGB camera (4) and the TOF camera (5) on one side of the annular groove (7). 2.The RGB and TOF sensor module of claim 1, wherein: Each of the U-shaped brackets (10) is provided with a second bolt (9) on its upper part, and the second bolt (9) passes through the U-shaped bracket (10).

3. The RGB and TOF sensor module according to claim 2, characterized in that: The second bolt (9) extends to the outside of the U-shaped bracket (10) and is threaded into the threaded hole (12).

4. The RGB and TOF sensor module of claim 1, wherein: A chip body (15) is mounted on the side wall of the TOF module (2), and a support plate (13) is mounted on the side wall of the TOF module (2) outside the chip body (15).

5. The RGB and TOF sensor module according to claim 4, characterized in that: A through hole (14) is provided at the center of the support plate (13), and three sets of protrusions (16) with equal spacing are installed on both sides of the support plate (13).

6. The RGB and TOF sensor module according to claim 5, characterized in that: The support plate (13) is provided with a heat dissipation aluminum plate body (19) on the outside, and an elastic sheet (17) is movably installed on the top of the heat dissipation aluminum plate body (19).

7. The RGB and TOF sensor module according to claim 6, characterized in that: Both ends of the elastic sheet (17) are equipped with connecting plates (18), and the connecting plates (18) are in contact with the protrusions (16).

8. The RGB and TOF sensor module according to claim 7, characterized in that: A support frame (20) is installed at the top of the heat dissipation aluminum plate body (19), and a fan (21) is installed at the top of the support frame (20).

Images