Double-sided board copper block embedding equipment
By setting up a double-sided copper embedding device with a jig plate and a thin film assembly on the aligning machine, the problems of difficult alignment and PCB board scratches caused by the variety of copper block specifications are solved, and a highly efficient and accurate copper embedding process is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 广东喜珍电路科技有限公司
- Filing Date
- 2025-04-24
- Publication Date
- 2026-05-26
AI Technical Summary
In existing copper embedding processes, the variety of copper block specifications makes it impossible for the alignment machine to place them accurately, and manual operation is inefficient and easily scratches the PCB board surface.
Design a double-sided board copper block embedding device, which uses a jig plate and a thin film assembly. Through the guide groove and swimming lane structure, the vibration of the alignment machine and the cooperation of the thin film assembly are used to ensure that the copper blocks are aligned according to specifications and accurately fall into the copper groove of the PCB board, and are fixed with high temperature resistant red tape.
It improves the efficiency of the copper embedding process, avoids copper blocks scratching the PCB board, reduces the waiting time for loading, and achieves efficient arrangement and fixation of copper blocks of various specifications.
Smart Images
Figure CN224290174U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB production equipment technology, and more specifically, it relates to a double-sided board embedded copper block equipment. Background Technology
[0002] In the PCB manufacturing industry, to meet the heat dissipation requirements of high-frequency, high-speed PCBs, copper blocks are typically incorporated into the PCB. This manufacturing process is generally called embedded copper technology. Currently, the existing embedded copper process involves manually placing the copper block into the milled groove after milling and securing it with high-temperature resistant red tape to facilitate subsequent drilling and vacuum resin plugging. However, this method, due to its manual operation, has several drawbacks, such as small parts, inconvenient handling, and low efficiency.
[0003] In the electronics industry, there are aligning machines that place components on a tray and vibrate it along the X-axis by changing the tray's pitch angle, causing the components to fall into their corresponding slots. However, in PCB copper embedding processes, the required copper blocks come in one or more specifications, making it difficult for different specifications of copper blocks to enter the corresponding slots using aligning machines. Existing aligning machines place components directly on the tray, essentially placing the copper blocks directly on the PCB surface. The vibration of the copper blocks on the PCB surface can easily cause scratches. Therefore, how to apply aligning machines to the copper embedding process has become a pressing technical problem for those skilled in the art. Utility Model Content
[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a double-sided copper embedded block device to solve the above-mentioned technical problems.
[0005] The above-mentioned technical objective of this utility model is achieved through the following technical solution: a double-sided copper-embedded block device, comprising: a main body; a fixture plate is provided on the main body, and a plurality of guide grooves corresponding to the copper grooves on the PCB are formed on the fixture plate; a plurality of baffles for separating guide grooves of different sizes are provided on the fixture plate; a thin film assembly covering all guide grooves is provided on the main body, and a clearance groove adapted to the guide grooves is formed on the thin film assembly.
[0006] Specifically, two adjacent baffles form a lane. After the main body is installed on the alignment machine, a through hole of the corresponding size is placed into the lane containing the corresponding guide groove, ensuring that only copper blocks corresponding to the guide groove size exist in the lane. Then, the thin-film assembly is rotated to disconnect the clearance groove on the thin-film assembly from the guide groove. The alignment machine then changes the tilt angle of the main body and causes it to vibrate along the X-axis, moving the copper blocks within the lane and into the guide groove. Once copper blocks are present in all guide grooves, the vibration stops. The main body is tilted, and any excess copper blocks are returned to the hopper. The main body is then leveled, at which point the thin-film assembly can block the copper blocks. Next, the PCB board to be embedded with copper is placed under the fixture plate, ensuring that the copper grooves on the PCB board correspond one-to-one with the guide grooves on the fixture plate. The thin-film assembly is then rotated to connect the clearance groove with the guide groove. At this point, the copper blocks in the guide groove fall into the copper grooves on the PCB board and are fixed by the high-temperature resistant red adhesive tape on the back of the PCB board, thus completing the copper embedding process on the PCB board.
[0007] By installing a fixture plate on the main body, the copper blocks only move on the fixture plate when the alignment machine starts, thus preventing the copper blocks from scratching the PCB board. Several baffles are installed on the fixture plate to form several lanes. A copper block of the same size as the guide groove in each lane is placed there, allowing for the isolation of copper blocks of different sizes. This enables the simultaneous alignment of multiple copper blocks of different sizes, ensuring that the copper blocks entering the guide groove are compatible with the guide groove size. A thin-film assembly ensures that the copper blocks are in the guide groove when the alignment machine starts, thus pre-aligning the copper blocks and reducing waiting time for personnel to load materials. After the alignment machine stops, the PCB board is placed under the fixture plate, and the thin-film assembly is rotated to connect the clearance groove and the guide groove. The copper blocks fall into the copper grooves of the PCB board and are fixed by the high-temperature resistant red adhesive tape on the back of the PCB board, improving the efficiency of copper embedding.
[0008] Optionally, the film assembly includes: a film and two powered rollers; the two powered rollers are respectively disposed at the bottom ends of the main body, the film is disposed on the two powered rollers, and the film covers the receiving groove; a clearance groove adapted to the guide groove is formed on the film.
[0009] Specifically, before the alignment machine starts, two driven rollers rotate, causing the film to move horizontally, thus preventing the clearance grooves on the film from connecting with the guide grooves. The alignment machine then starts; at this point, the copper blocks entering the guide grooves are blocked by the film, completing the alignment of the copper blocks on the fixture plate. This pre-alignment of the copper blocks reduces waiting time for manual loading. After the alignment machine stops, the PCB board is placed below the fixture plate, with the copper grooves on the PCB board aligned with the guide grooves. The two driven rollers then move the film horizontally, connecting the clearance grooves on the film with the guide grooves. At this point, the copper blocks in the guide grooves are no longer blocked by the film and fall into the copper grooves, where they are fixed by the high-temperature resistant red adhesive tape on the back of the PCB board, improving the efficiency of copper embedding.
[0010] Optionally, a plurality of first negative pressure channels are provided on the main body; a plurality of first adsorption holes are formed on the first negative pressure channels; and a clearance groove adapted to the first adsorption holes is formed on the film.
[0011] Specifically, the first negative pressure channel is connected to an external negative pressure device. After the alignment machine stops, the PCB board is placed below the fixture board, with the copper groove of the PCB board aligned with the guide groove. Then, the negative pressure device is activated to create negative pressure in the first negative pressure channel. The first suction hole contacts the PCB board and adsorbs the PCB board to the bottom of the fixture board, preventing the PCB board from shifting position during film translation. Furthermore, the size of the empty groove is designed to ensure that the first suction hole is always exposed during film translation, guaranteeing that the first suction hole will not adsorb the film.
[0012] Optionally, a plurality of second negative pressure channels are also provided on the main body; a plurality of second adsorption holes are opened on the second negative pressure channels, and the second adsorption holes are facing the film.
[0013] Specifically, the second negative pressure channel is connected to an external negative pressure device. After the powered roller moves the film to a point where the clearance groove and guide groove are no longer connected, the negative pressure device creates negative pressure within the second negative pressure channel. The second adsorption hole adsorbs the film, fixing its position and ensuring its stability under the load of the copper block. After the alignment machine stops, the negative pressure device restores normal pressure to the second negative pressure channel, allowing the powered roller to move the film again.
[0014] Optionally, the fixture plate is provided with alignment holes corresponding to the PCB board; and the film is provided with alignment grooves adapted to the alignment holes.
[0015] Specifically, during film translation, the alignment groove ensures that the alignment holes are always exposed. After placing the PCB board under the fixture board, pins are passed sequentially through the positioning holes on the PCB board and the alignment holes on the fixture board to quickly position the copper channels on the PCB board and the guide grooves on the fixture board.
[0016] Optionally, the opening of the guide groove gradually decreases from top to bottom.
[0017] Specifically, the gradually decreasing opening of the guide groove facilitates the entry of copper blocks into the guide groove, and under the action of the side wall of the guide groove, they can quickly and accurately fall into the bottom of the guide groove, improving the alignment efficiency of the copper blocks.
[0018] Optionally, several debris blind holes are provided at both ends of the main body.
[0019] Specifically, by setting up blind holes for debris, it is possible to collect debris that falls from the copper block, thus preventing excessive debris from falling into the guide groove.
[0020] Optionally, main body fixing seats are provided on both sides of the main body.
[0021] Specifically, the main body is fixed to the train assembly equipment using the main body fixing bracket to ensure the connection stability between the main body and the train assembly equipment.
[0022] In summary, this utility model has the following beneficial effects:
[0023] By installing a fixture plate on the main body, the copper blocks only move on the fixture plate when the alignment machine starts, thus preventing the copper blocks from scratching the PCB board. Several baffles are installed on the fixture plate to form several lanes. A copper block of the same size as the guide groove in each lane is placed there, allowing for the isolation of copper blocks of different sizes. This enables the simultaneous alignment of multiple copper blocks of different sizes, ensuring that the copper blocks entering the guide groove are compatible with the guide groove size. A thin-film assembly ensures that the copper blocks are in the guide groove when the alignment machine starts, thus pre-aligning the copper blocks and reducing waiting time for personnel to load materials. After the alignment machine stops, the PCB board is placed under the fixture plate, and the thin-film assembly is rotated to connect the clearance groove and the guide groove. The copper blocks fall into the copper grooves of the PCB board and are fixed by the high-temperature resistant red adhesive tape on the back of the PCB board, improving the efficiency of copper embedding. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the overall structure of the double-sided copper-embedded block device according to an embodiment of the present invention;
[0025] Figure 2 This is a bottom schematic diagram of the double-sided copper-embedded block device according to an embodiment of the present invention;
[0026] Figure 3 This is a perspective view of the double-sided copper-embedded block device according to an embodiment of the present invention;
[0027] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure of AA;
[0028] Figure 5 yes Figure 3 Schematic diagram of the cross-sectional structure of BB;
[0029] Figure 6 yes Figure 3 A schematic diagram of the cross-sectional structure of the C-C section;
[0030] Figure 7 yes Figure 3 Schematic diagram of the cross-sectional structure of DD.
[0031] In the diagram: 1. Main body; 2. Fixture plate; 3. Guide groove; 4. Baffle; 5. Thin film assembly; 51. Thin film; 52. Power roller; 6. Clearing groove; 7. First negative pressure channel; 8. First adsorption hole; 9. Clearing groove; 10. Second negative pressure channel; 11. Second adsorption hole; 12. Alignment hole; 13. Alignment groove; 14. Debris blind hole; 15. Main body fixing seat; 16. PCB board; 17. High temperature resistant red tape; 18. Copper channel. Detailed Implementation
[0032] To make the objectives, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model are described in detail below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein.
[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances. The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.
[0034] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.
[0035] Example 1
[0036] This embodiment provides a double-sided panel copper embedded block device, such as... Figure 1-7 As shown, it includes: a main body 1; a fixture plate 2 is provided on the main body 1, and a plurality of guide grooves 3 corresponding to the copper grooves 18 on the PCB are provided on the fixture plate 2; a plurality of baffles 4 are provided on the fixture plate 2 to separate the guide grooves 3 of different sizes; a thin film assembly 5 is provided on the main body 1 to cover all the guide grooves 3, and a relief groove 6 adapted to the guide grooves 3 is provided on the thin film assembly 5.
[0037] Specifically, two adjacent baffles 4 form a lane. After the main body 1 is installed on the alignment machine, the corresponding through hole is placed into the lane where the corresponding guide groove 3 is located, so that only copper blocks corresponding to the size of the guide groove 3 exist in the lane. Then, the thin film assembly 5 is rotated so that the clearance groove 6 on the thin film assembly 5 is not connected to the guide groove 3. Then, the alignment machine changes the tilt angle of the main body 1 and drives the main body 1 to vibrate along the X-axis, so that the copper blocks move in the lane and enter the guide groove 3. After there are copper blocks in all guide grooves 3, the vibration stops. The main body 1 is tilted and the excess copper blocks are poured back into the hopper. Then the main body 1 is laid flat. At this time, the thin film assembly 5 can block the copper blocks. Next, place the PCB board 16, which needs to be embedded with copper, under the fixture plate 2, and make the copper groove 18 of the PCB board 16 correspond one-to-one with the guide groove 3 of the fixture plate 2. Then rotate the thin film assembly 5 to make the clearance groove 6 and the guide groove 3 connect. At this time, the copper block in the guide groove 3 falls into the copper groove 18 of the PCB board 16 and is fixed by the high temperature resistant red tape 17 on the back of the PCB board 16, thus completing the embedded copper process of the PCB board 16.
[0038] By setting a fixture plate 2 on the main body 1, the copper blocks will only move on the fixture plate 2 when the alignment machine is started, thus avoiding scratching the PCB board 16. Several baffles 4 are set on the fixture plate 2 to form several lanes. A copper block of the same size as the guide groove 3 in each lane is placed in each lane. The lanes can isolate copper blocks of different specifications, and multiple specifications of copper blocks can be aligned at the same time, ensuring that the copper blocks entering the guide groove 3 are compatible with the size of the guide groove 3. The thin film assembly 5 can ensure that the copper blocks are in the guide groove 3 when the alignment machine is started, thereby aligning the copper blocks in advance and reducing the waiting time for personnel to load materials. After the alignment machine stops, the PCB board 16 is placed under the fixture plate 2, and the thin film assembly 5 is rotated to make the clearance groove 6 connect with the guide groove 3. The copper blocks fall into the copper groove 18 of the PCB board 16 and are fixed by the high temperature resistant red adhesive tape 17 on the back of the PCB board 16, which can improve the efficiency of copper embedding.
[0039] Optionally, the film assembly 5 includes: a film 51 and two power rollers 52; the two power rollers 52 are respectively disposed at the bottom ends of the main body 1, the film 51 is disposed on the two power rollers 52, and the film 51 covers the receiving groove; a clearance groove 6 adapted to the guide groove 3 is provided on the film 51.
[0040] Specifically, before the alignment machine is started, the two driven rollers 52 rotate to move the diaphragm 51 horizontally, making the clearance groove 6 on the diaphragm 51 disconnected from the guide groove 3. Then, the alignment machine is started. At this time, the copper blocks entering the guide groove 3 are blocked by the diaphragm 51, thus completing the alignment of the copper blocks on the fixture plate 2, thereby aligning the copper blocks in advance and reducing waiting time for personnel to load materials. After the alignment machine stops, the PCB board 16 is placed below the fixture plate 2, with the copper groove 18 of the PCB board 16 facing the guide groove 3. Then, the two driven rollers 52 move the diaphragm 51 horizontally, making the clearance groove 6 on the diaphragm 51 connect with the guide groove 3. At this time, the copper blocks in the guide groove 3 are no longer blocked by the diaphragm 51 and fall into the copper groove 18, and are fixed by the high-temperature resistant red adhesive tape 17 on the back of the PCB board 16, which can improve the efficiency of copper embedding.
[0041] Generally, 0.18mm PET film is selected for film 51, which has good dimensional stability. The two drive rollers 52 are driven in groups and share a power source. In this embodiment, the power source is a motor. The two drive rollers 52 are connected by a belt. When the power source drives one drive roller 52 to rotate, the other drive roller 52 rotates accordingly.
[0042] Optionally, the opening of the guide groove 3 gradually decreases from top to bottom.
[0043] Specifically, the gradually decreasing opening of the guide groove 3 facilitates the entry of copper blocks into the guide groove 3, and under the action of the side wall of the guide groove 3, the copper blocks can fall quickly and accurately into the bottom of the guide groove 3, thereby improving the alignment efficiency of the copper blocks.
[0044] In this embodiment, the guide groove 3 is in the shape of an inverted boss, and the four side walls of the guide groove 3 have the same inclination angle.
[0045] Optionally, several debris blind holes 14 are provided at both ends of the main body 1.
[0046] Specifically, by setting the debris blind hole 14, it is possible to collect the debris that falls off the copper block, thus preventing too much debris from falling into the guide groove 3.
[0047] In this embodiment, after the embedded copper process of the PCB board 16 is completed, the debris in the debris blind hole 14 is removed by a vacuum cleaner.
[0048] Optionally, main body fixing seats 15 are provided on both sides of the main body 1.
[0049] Specifically, the main body 1 is fixed to the train-aligning equipment by the main body fixing seat 15 to ensure the connection stability between the main body 1 and the train-aligning equipment.
[0050] Example 2
[0051] This embodiment provides a double-sided panel copper embedded block device, such as... Figure 1-7 As shown, it includes: a main body 1; a fixture plate 2 is provided on the main body 1, and a plurality of guide grooves 3 corresponding to the copper grooves 18 on the PCB are provided on the fixture plate 2; a plurality of baffles 4 are provided on the fixture plate 2 to separate the guide grooves 3 of different sizes; a thin film assembly 5 is provided on the main body 1 to cover all the guide grooves 3, and a relief groove 6 adapted to the guide grooves 3 is provided on the thin film assembly 5.
[0052] Specifically, two adjacent baffles 4 form a lane. After the main body 1 is installed on the alignment machine, the corresponding through hole is placed into the lane where the corresponding guide groove 3 is located, so that only copper blocks corresponding to the size of the guide groove 3 exist in the lane. Then, the thin film assembly 5 is rotated so that the clearance groove 6 on the thin film assembly 5 is not connected to the guide groove 3. Then, the alignment machine changes the tilt angle of the main body 1 and drives the main body 1 to vibrate along the X-axis, so that the copper blocks move in the lane and enter the guide groove 3. After there are copper blocks in all guide grooves 3, the vibration stops. The main body 1 is tilted and the excess copper blocks are poured back into the hopper. Then the main body 1 is laid flat. At this time, the thin film assembly 5 can block the copper blocks. Next, place the PCB board 16, which needs to be embedded with copper, under the fixture plate 2, and make the copper groove 18 of the PCB board 16 correspond one-to-one with the guide groove 3 of the fixture plate 2. Then rotate the thin film assembly 5 to make the clearance groove 6 and the guide groove 3 connect. At this time, the copper block in the guide groove 3 falls into the copper groove 18 of the PCB board 16 and is fixed by the high temperature resistant red tape 17 on the back of the PCB board 16, thus completing the embedded copper process of the PCB board 16.
[0053] By setting a fixture plate 2 on the main body 1, the copper blocks will only move on the fixture plate 2 when the alignment machine is started, thus avoiding scratching the PCB board 16. Several baffles 4 are set on the fixture plate 2 to form several lanes. A copper block of the same size as the guide groove 3 in each lane is placed in each lane. The lanes can isolate copper blocks of different specifications, and multiple specifications of copper blocks can be aligned at the same time, ensuring that the copper blocks entering the guide groove 3 are compatible with the size of the guide groove 3. The thin film assembly 5 can ensure that the copper blocks are in the guide groove 3 when the alignment machine is started, thereby aligning the copper blocks in advance and reducing the waiting time for personnel to load materials. After the alignment machine stops, the PCB board 16 is placed under the fixture plate 2, and the thin film assembly 5 is rotated to make the clearance groove 6 connect with the guide groove 3. The copper blocks fall into the copper groove 18 of the PCB board 16 and are fixed by the high temperature resistant red adhesive tape 17 on the back of the PCB board 16, which can improve the efficiency of copper embedding.
[0054] Optionally, the film assembly 5 includes: a film 51 and two power rollers 52; the two power rollers 52 are respectively disposed at the bottom ends of the main body 1, the film 51 is disposed on the two power rollers 52, and the film 51 covers the receiving groove; a clearance groove 6 adapted to the guide groove 3 is provided on the film 51.
[0055] Specifically, before the alignment machine is started, the two driven rollers 52 rotate to move the diaphragm 51 horizontally, making the clearance groove 6 on the diaphragm 51 disconnected from the guide groove 3. Then, the alignment machine is started. At this time, the copper blocks entering the guide groove 3 are blocked by the diaphragm 51, thus completing the alignment of the copper blocks on the fixture plate 2, thereby aligning the copper blocks in advance and reducing waiting time for personnel to load materials. After the alignment machine stops, the PCB board 16 is placed below the fixture plate 2, with the copper groove 18 of the PCB board 16 facing the guide groove 3. Then, the two driven rollers 52 move the diaphragm 51 horizontally, making the clearance groove 6 on the diaphragm 51 connect with the guide groove 3. At this time, the copper blocks in the guide groove 3 are no longer blocked by the diaphragm 51 and fall into the copper groove 18, and are fixed by the high-temperature resistant red adhesive tape 17 on the back of the PCB board 16, which can improve the efficiency of copper embedding.
[0056] Generally, 0.18mm PET film is selected for film 51, which has good dimensional stability. The two drive rollers 52 are driven in groups and share a power source. In this embodiment, the power source is a motor. The two drive rollers 52 are connected by a belt. When the power source drives one drive roller 52 to rotate, the other drive roller 52 rotates accordingly.
[0057] Optionally, a plurality of first negative pressure channels 7 are provided on the main body 1; a plurality of first adsorption holes 8 are provided on the first negative pressure channels 7; and a venting groove 9 adapted to the first adsorption holes 8 is provided on the film 51.
[0058] Specifically, the first negative pressure channel 7 is connected to an external negative pressure device. After the alignment machine stops, the PCB board 16 is placed below the fixture plate 2, with the copper groove 18 of the PCB board 16 facing the guide groove 3. Then, the negative pressure device is activated to create negative pressure in the first negative pressure channel 7. The first adsorption hole 8 contacts the PCB board 16 and adsorbs the PCB board 16 to the bottom of the fixture plate 2, preventing the position of the PCB board 16 from shifting when the film 51 is translated. Furthermore, the size of the empty groove 9 is designed to ensure that the first adsorption hole 8 is always exposed when the film 51 is translated, ensuring that the first adsorption hole 8 does not adsorb the film 51.
[0059] Optionally, a plurality of second negative pressure channels 10 are also provided on the main body 1; a plurality of second adsorption holes 11 are provided on the second negative pressure channels 10, and the second adsorption holes 11 are directly opposite the film 51.
[0060] Specifically, the second negative pressure channel 10 is connected to a negative pressure device. After the power roller 52 moves the film 51 to a position where the clearance groove 6 and the guide groove 3 are no longer connected, the negative pressure device creates a negative pressure in the second negative pressure channel 10. The second adsorption hole 11 adsorbs the film 51 to fix its position and ensure the stability of the film 51 when the copper block is loaded. After the alignment machine stops, the negative pressure device restores the normal pressure in the second negative pressure channel 10. The negative pressure device also creates a negative pressure in the first negative pressure channel 7 to adsorb the PCB board 16 and prevent it from falling off the bottom surface of the fixture plate 2.
[0061] Optionally, the fixture plate 2 is provided with alignment holes 12 corresponding to the PCB board 16; and the thin film 51 is provided with alignment grooves 13 adapted to the alignment holes 12.
[0062] Specifically, during the translation of the thin film 51, the alignment groove 13 ensures that the alignment hole 12 is always exposed. After the PCB board 16 is placed under the fixture plate 2, the positioning of the copper groove 18 on the PCB board 16 and the guide groove 3 on the fixture plate 2 can be quickly completed by passing pins through the positioning holes on the PCB board 16 and the alignment holes 12 on the fixture plate 2 in sequence.
[0063] Optionally, the opening of the guide groove 3 gradually decreases from top to bottom.
[0064] Specifically, the gradually decreasing opening of the guide groove 3 facilitates the entry of copper blocks into the guide groove 3, and under the action of the side wall of the guide groove 3, the copper blocks can fall quickly and accurately into the bottom of the guide groove 3, thereby improving the alignment efficiency of the copper blocks.
[0065] In this embodiment, the guide groove 3 is in the shape of an inverted boss, and the four side walls of the guide groove 3 have the same inclination angle.
[0066] Optionally, several debris blind holes 14 are provided at both ends of the main body 1.
[0067] Specifically, by setting the debris blind hole 14, it is possible to collect the debris that falls off the copper block, thus preventing too much debris from falling into the guide groove 3.
[0068] In this embodiment, after the embedded copper process of the PCB board 16 is completed, the debris in the debris blind hole 14 is removed by a vacuum cleaner.
[0069] Optionally, main body fixing seats 15 are provided on both sides of the main body 1.
[0070] Specifically, the main body 1 is fixed to the train-aligning equipment by the main body fixing seat 15 to ensure the connection stability between the main body 1 and the train-aligning equipment.
[0071] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.
Claims
1. A double-sided panel copper embedded block device, characterized in that, include: main body; A fixture plate is provided on the main body, and a number of guide grooves corresponding to the copper grooves on the PCB are formed on the fixture plate; a number of baffles for separating guide grooves of different sizes are provided on the fixture plate; a thin film assembly covering all the guide grooves is provided on the main body, and a clearance groove adapted to the guide grooves is formed on the thin film assembly.
2. The double-sided copper-embedded block equipment according to claim 1, characterized in that, The film assembly includes: a film and two powered rollers; the two powered rollers are respectively disposed at the bottom ends of the main body, the film is disposed on the two powered rollers, and the film covers all guide grooves; a clearance groove adapted to the guide grooves is formed on the film.
3. The double-sided copper-embedded block equipment according to claim 2, characterized in that, The main body is provided with a plurality of first negative pressure channels; the first negative pressure channels are provided with a plurality of first adsorption holes; the film is provided with a clearance groove adapted to the first adsorption holes.
4. The double-sided copper-embedded block equipment according to claim 2, characterized in that, The main body is also provided with a number of second negative pressure channels; the second negative pressure channels are provided with a number of second adsorption holes, and the second adsorption holes are directly facing the film.
5. A double-sided copper-embedded block device according to claim 2 or 4, characterized in that, The fixture plate is provided with alignment holes corresponding to the PCB board; the film is provided with alignment grooves that are adapted to the alignment holes.
6. The double-sided copper-embedded block equipment according to claim 1, characterized in that, The opening of the guide groove gradually decreases from top to bottom.
7. A double-sided copper-embedded block device according to claim 1, characterized in that, Several debris blind holes are provided at both ends of the main body.
8. A double-sided copper-embedded block device according to claim 1, characterized in that, The main body is provided with main body fixing seats on both sides.