Power module heat dissipation module and automotive power supply

Abstract

This utility model discloses a power module heat dissipation module and an automotive power supply, relating to the field of automotive power supplies. The power module heat dissipation module includes a mounting assembly and multiple heat-generating devices. The mounting assembly includes a first circuit board and a second circuit board arranged opposite each other and spaced apart. The side of the first circuit board facing the second circuit board is a first mounting surface, and the side of the second circuit board facing away from the first mounting surface is a second mounting surface. The first end face of each heat-generating device is connected to either the first or second mounting surface, and the second end face of each heat-generating device is flush with the same plane. This utility model aims to simplify the water channel structure and reduce the risk of leakage.

Description

Technical Field

[0001] This utility model relates to the field of automotive power technology, and in particular to a power module heat dissipation module and an automotive power supply. Background Technology

[0002] Existing automotive power supply products often employ complex processes like brazing or friction stir welding to create irregularly shaped water channels for heat dissipation due to significant variations in the package sizes of their internal components and the strong need for rapid heat dissipation. However, this over-reliance on the complex water channels integrated into the vehicle's overall water cooling system limits flexibility and versatility. Furthermore, these heat dissipation structures typically require a pair of independent water-cooling interfaces, increasing production costs and raising the risk of leakage, ultimately impacting the vehicle's safety and reliability. Utility Model Content

[0003] The main purpose of this invention is to propose a power module heat dissipation module and an automotive power supply, which aims to simplify the water channel structure and reduce the risk of leakage.

[0004] To achieve the above objectives, this utility model proposes a power module heat dissipation module, comprising:

[0005] The mounting assembly includes a first circuit board and a second circuit board arranged opposite to and spaced apart from each other. The side of the first circuit board facing the second circuit board is a first mounting surface, and the side of the second circuit board facing away from the first mounting surface is a second mounting surface.

[0006] Multiple heating elements are provided, with the first end face of each heating element connected to the first mounting surface or the second mounting surface, and the second end face of each heating element being flush with the same plane.

[0007] In one embodiment, the power module heat dissipation module further includes a heat-conducting component located on the side of the second circuit board facing away from the first circuit board, and the heat-conducting component has a planar heat-conducting surface facing the second mounting surface;

[0008] The second end face of each of the heating devices is thermally connected to the planar thermally conductive surface.

[0009] In one embodiment, the heat-conducting element includes:

[0010] A base plate, which is parallel to and spaced apart from the second circuit board, wherein the side of the base plate facing the second circuit board is the planar heat-conducting surface; and

[0011] Side panels, together with the bottom plate, form a box with a receiving groove;

[0012] Both the mounting components and the heating element are located within the trough.

[0013] In one embodiment, the power module heat dissipation module further includes potting compound, which is wrapped around the outside of at least one of the heat-generating devices, or the potting compound fills the cavity; and / or

[0014] The heat-conducting component also includes a cover plate, which covers the box body and seals the trough.

[0015] In one embodiment, the power module heat dissipation module further includes a heat sink configured to accelerate heat dissipation from the heat-conducting element.

[0016] In one embodiment, the power module heat dissipation module further includes a heat sink located on the side of the second circuit board facing away from the first circuit board, and the heat sink has a planar heat dissipation surface facing the second mounting surface;

[0017] The second end face of each of the heat-generating devices is thermally connected to the planar heat dissipation surface.

[0018] In one embodiment, the mounting assembly further includes a connection structure configured to establish a mechanical connection between the first circuit board and the second circuit board and / or to establish an electrical connection between the first circuit board and the second circuit board.

[0019] In one embodiment, the connection structure includes a plurality of electrical connectors, which are one or more of copper terminals, connecting cables, flexible circuit boards, connectors, and plastic-coated copper busbars.

[0020] In one embodiment, the plurality of heating devices includes at least one first device and at least one second device, one end of the at least one first device is disposed on the first mounting surface, and one end of the at least one second device is disposed on the second mounting surface, wherein the height of the first device is A, the height of the second device is B, and A>B.

[0021] This utility model also provides an automotive power supply, including the power module heat dissipation module as described above.

[0022] The power module heat dissipation module provided by this utility model consists of a first circuit board, a second circuit board, and multiple heat-generating devices. One end of each heat-generating device is directly connected to the first or second mounting surface, and the second end face of each heat-generating device is flush with the same plane. This effectively conducts heat from multiple heat-generating devices through a single heat dissipation surface, significantly improving heat dissipation efficiency. When installing a radiator, thanks to the single heat dissipation surface formed by the flush second end faces of multiple heat-generating devices, there is no need to design complex irregular water channels for heat-generating devices in different locations, effectively avoiding cumbersome processes such as brazing and friction stir welding. This not only greatly simplifies the manufacturing process and significantly reduces production time and labor costs, but also directly reduces the complexity and cost of installation. Furthermore, the single main heat dissipation surface provides more active cooling options for the entire vehicle system to adapt to different types of radiators. In particular, this design eliminates the need for independent water-cooling interfaces, thereby eliminating the risk of leakage at the source and improving the safety and reliability of the entire vehicle. In summary, this utility model improves the heat dissipation efficiency of the power module, simplifies the manufacturing process, reduces production costs, and enhances system safety. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0024] Figure 1 A schematic diagram of a power module heat dissipation module according to an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of another embodiment of the power module heat dissipation module provided by this utility model;

[0026] Figure 3 This is a schematic diagram of another embodiment of the power module heat dissipation module provided by this utility model.

[0027] Explanation of icon numbers:

[0028] 100. Power module heat dissipation module; 1. Mounting assembly; 11. First circuit board; 111. First mounting surface; 12. Second circuit board; 121. Second mounting surface; 2. Heat-conducting component; 21. Heat-conducting plate; 211. Planar heat-conducting surface; 22. Side plate; 23. Cover plate; 24. Heat-conducting sheet; 3. Heat-generating device; 31. First device; 32. Second device; 4. Connection structure; 41. Electrical connector; 5. Electronic device.

[0029] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0031] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0032] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0033] This utility model proposes a power module heat dissipation module 100.

[0034] Please refer to 1. In one embodiment of this utility model, the power module heat dissipation module 100 includes a mounting assembly 1 and a plurality of heat-generating devices 3. The mounting assembly 1 includes a first circuit board 11 and a second circuit board 12 that are arranged opposite to each other and spaced apart. The side of the first circuit board 11 facing the second circuit board 12 is a first mounting surface 111, and the side of the second circuit board 12 facing away from the first mounting surface 111 is a second mounting surface 121. The first end face of each heat-generating device 3 is connected to the first mounting surface 111 or the second mounting surface 121, and the second end face of each heat-generating device 3 is flush with the same plane.

[0035] The power module heat dissipation module 100 provided by this utility model consists of a first circuit board 11, a second circuit board 12, and multiple heat-generating devices 3. One end of each heat-generating device 3 is directly connected to the first mounting surface 111 or the second mounting surface 121, and the second end face of each heat-generating device 3 is flush with the same plane. In this way, the heat from multiple heat-generating devices 3 can be effectively conducted away through a single heat dissipation surface, greatly improving heat dissipation efficiency. When installing a radiator, thanks to the flush second end faces of multiple heat-generating devices 3 forming a single heat dissipation surface, there is no need to design complex irregular water channels for heat-generating devices 3 in different locations, effectively avoiding cumbersome processes such as brazing and friction stir welding. This not only greatly simplifies the manufacturing process and significantly reduces production time and labor costs, but also directly reduces the complexity and cost of the installation process. In addition, the single main heat dissipation surface can also provide more active cooling options for the entire vehicle system to adapt to different types of radiators. In particular, this design can also eliminate the design of independent water cooling interfaces, thereby eliminating the risk of leakage at the source and improving the safety and reliability of the entire vehicle. In summary, this invention improves the heat dissipation efficiency of the power module, simplifies the manufacturing process, reduces production costs, and enhances system safety.

[0036] Since the second end face of the heating device 3 mounted on the first mounting surface 111 needs to be flush with the second end face of the heating device 3 mounted on the second mounting surface 121, it can be known that the orthographic projection of the first circuit board 11 on the planar heat-conducting surface 211 does not completely fall within the orthographic projection of the second circuit board 12 on the planar heat-conducting surface 211. That is to say, in the actual manufacturing of the first circuit board 11 and the second circuit board 12, the second circuit board 12 can be provided with at least one clearance hole or clearance groove according to the installation requirements, so that the heating device 3 mounted on the first mounting surface 111 can be inserted and arranged. The heating device 3 mounted on the first mounting surface 111 can usually include large high-heat-generating devices 3 such as power transformers and inductors, while the heating device 3 mounted on the second mounting surface 121 is mainly composed of power MOSFETs.

[0037] In the aforementioned structure, although it specifically refers to the first circuit board 11 having a first mounting surface 111 and the second circuit board 12 having a second mounting surface 121, this does not mean that only the first and second mounting surfaces 121 can be used to mount the heat-generating device 3. In fact, other surfaces of the first circuit board 11 and the second circuit board 12 can be used to mount heat-generating devices 3 of different specifications. Since the heat-generating devices 3 vary in size and specifications, their layout or shape can be adjusted to suit specific areas of the circuit board. This flexibility ensures the effective integration of different heat-generating devices 3. Furthermore, smaller heat-generating electronic devices 5 can also be mounted in other locations on the first circuit board 11 and the second circuit board 12. These electronic devices 5 can dissipate heat through the thermal conductivity of the circuit board itself. Therefore, by rationally adjusting the layout or shape of the devices and utilizing the overall thermal conductivity of the circuit board, the heat transfer path can be optimized, thereby improving the overall system's heat dissipation efficiency.

[0038] Please continue reading. Figure 1 In one embodiment, the power module heat dissipation module 100 further includes a heat-conducting element 2, located on the side of the second circuit board 12 facing away from the first circuit board 11. The heat-conducting element 2 has a planar heat-conducting surface 211 facing the second mounting surface 121; the second end face of each heat-generating device 3 is thermally connected to the planar heat-conducting surface 211. In this embodiment, the heat-conducting element 2 typically has high thermal conductivity, such as being made of metal, ceramic, or other high thermal conductivity materials, to establish an effective heat conduction path between the heat-generating device 3 and the heat sink or other heat dissipation medium, achieving rapid and uniform heat conduction. When the heat-generating device 3 is thermally connected to the planar heat-conducting surface 211 of the heat-conducting element 2, the heat generated by the heat-generating device 3 can be quickly transferred to the heat-conducting element 2, and then dissipated to the external environment through the heat sink or other heat dissipation methods. This helps maintain the stable operating temperature of the heat-generating device 3, prevents overheating damage, ensures the stable operation of the power module under high load, and also extends the service life of the device. In addition, in order to improve the heat conduction efficiency, the second end face of the heating device 3 and the planar heat conduction surface 211 can be processed by machining, grinding, sheet metal or other processes that can reduce the surface flatness, thereby reducing the thermal resistance of the contact surface.

[0039] It is understandable that a thermally conductive connection refers to a connection between the heating element 3 and the thermally conductive component 2 through direct contact or indirect connection using thermally conductive materials to achieve efficient heat transfer. The purpose of this connection is to ensure that heat can be smoothly conducted from the heat source to the heat dissipation part, thereby effectively reducing the temperature of the heating element 3, ensuring its stable operation, and extending its service life. For example, screws can be used to fix the heating element 3 and the thermally conductive component 2 together, achieving both mechanical fixation and thermal conduction simultaneously.

[0040] Furthermore, in one embodiment, the heat-conducting component 2 includes a base plate and side plates 22. The base plate is parallel to and spaced apart from the second circuit board 12, and the side of the base plate facing the second circuit board 12 is a planar heat-conducting surface 211. The side plates 22 and the base plate together form a box with a receiving groove. The mounting assembly 1 and the heat-generating device 3 are both disposed within the receiving groove. In this embodiment, the box can effectively isolate the potential damage to the inside of the receiving groove from the external environment, such as dust, moisture, and physical impact, thereby ensuring the stable operation and long-term reliability of the power module heat dissipation module 100. At the same time, the box design takes into account heat dissipation requirements, optimizes the ventilation path, and helps to efficiently dissipate heat, further improving the safety and service life of the overall system. In addition, the size and shape of the box can follow a unified standard, which is convenient for mass production and assembly.

[0041] For heat-generating devices 3 that require three-dimensional heat dissipation or are not tall enough, it is necessary to increase the heat dissipation area or the installation height of the heat-generating device 3. Therefore, in one embodiment, the power module heat dissipation module 100 also includes potting compound, which is wrapped around the outside of at least one heat-generating device 3. This can increase the heat dissipation area of ​​the heat-generating device 3 and improve the heat transfer speed of the heat conduction component 2. In actual operation, a baffle can be set around the heat-generating device 3 that needs potting to prevent the potting compound from flowing to unwanted areas and ensure that the glue can cover the entire outer surface of the heat-generating device 3 so as to form a continuous heat conduction path in contact with the planar heat conduction surface 211, thereby improving the heat dissipation efficiency.

[0042] Considering the low thermal conductivity of air, in another embodiment, potting compound is filled into the cavity. This not only helps to improve thermal conductivity by reducing the air gap in the cavity, but also increases the overall mechanical strength of the heat dissipation module, improves its resistance to vibration and impact, and enhances the durability of the equipment.

[0043] In one embodiment, the heat-conducting component 2 further includes a cover plate 23, which covers the box body and seals the cavities. In this way, the heat-conducting component 2 can form a complete heat-conducting and protective structure, which not only improves the heat transfer efficiency but also ensures the airtightness and stability of the internal environment.

[0044] To improve heat dissipation, in one embodiment, the power module heat dissipation module 100 further includes a heat sink, which is configured to accelerate the dissipation of heat from the heat-conducting component 2. In this embodiment, depending on the type of heat sink, the heat-conducting component 2 and the heat sink can have different installation methods. For example, when the heat sink is a water-cooled heat sink or a thermoelectric cooler, the heat-conducting component 2 and the heat sink need to be in direct contact to achieve efficient heat conduction. In particular, the contact surface between the heat-conducting component 2 and the heat sink can be precision-machined to ensure a smooth and tight contact surface, reducing thermal resistance. When the heat sink is an air-cooled heat sink, a certain gap needs to be maintained between the heat-conducting component 2 and the heat sink to achieve heat transfer through air convection. Thus, through the effective cooperation between the heat-conducting component 2 and the heat sink, heat can be quickly transferred from the heat-generating device 3 to the heat sink and then quickly dissipated into the environment through the heat sink, which helps maintain the stable operating temperature of the heat-generating device 3, prevents overheating, extends the service life of the device, and ensures the stable operation of the power module under high load.

[0045] Of course, the second end face of the heating element 3 can also be directly thermally connected to the heat sink. In other embodiments, the heat sink is located on the side of the second circuit board 12 facing away from the first circuit board 11. The heat sink has a planar heat dissipation surface facing the second mounting surface 121, and the second end face of each heating element 3 is thermally connected to the planar heat dissipation surface. In this embodiment, the heat sink can be a water-cooled heat sink or a semiconductor cooler. When the heating element 3 is thermally connected to the planar heat dissipation surface of the heat sink, the heat generated by the heating element 3 can be quickly transferred to the heat sink. This helps to maintain the stable operating temperature of the heating element 3, prevent overheating damage, ensure the stable operation of the power module under high load, and also extend the service life of the device. In addition, in order to improve the heat conduction efficiency, the contact between the second end face of the heating element 3 and the planar heat dissipation surface can be processed by machining, grinding, sheet metal, or other processes that reduce the surface flatness, thereby reducing the thermal resistance of the contact surface.

[0046] To further improve the heat dissipation performance and ease of installation of the power module heat dissipation module 100, the design of the heat sink and mounting component 1 has been supplemented. For example, a heat dissipation groove can be formed on the side of the heat sink near the mounting component 1, and the mounting component 1 and the heat-generating device 3 can be installed in the heat dissipation groove. This facilitates the potting process, ensures uniform distribution of the adhesive, and improves heat dissipation and structural stability. This not only improves heat dissipation performance but also simplifies the manufacturing process, reduces production costs, and further enhances the safety and reliability of the system.

[0047] Please see Figure 1 and Figure 2In one embodiment, the mounting assembly 1 further includes a connecting structure 4, which establishes a mechanical connection between the first circuit board 11 and the second circuit board 12. Specifically, in this embodiment, the connecting structure 4 can be designed as a metal bracket made of sturdy metal materials such as aluminum or steel, providing stable support through screws, bolts, or other fixing methods; or it can be a high-strength plastic frame, secured by clips, slots, or screws to ensure the stable position of the two circuit boards; alternatively, a welding bracket can be used, with specific welding points pre-set on the circuit boards to fix the two circuit boards while providing stable support. It is worth noting that the connecting structure 4, while providing mechanical connection and support, can also serve a certain purpose of heat dissipation.

[0048] Please see Figure 3 In another embodiment, the connection structure 4 can also be used to establish an electrical connection between the first circuit board 11 and the second circuit board 12. For example, the connection structure 4 may include a plurality of electrical connectors 41, which are one or more of copper terminals, connecting cables, flexible circuit boards, connectors, and plastic-coated copper busbars. It should be noted that copper terminals are generally crimped between the first circuit board 11 and the second circuit board 12 to achieve both mechanical and electrical connection functions; connecting cables are usually used to transmit power or signals between the first circuit board 11 and the second circuit board 12, and an interface needs to be provided on the circuit board; one end of the flexible circuit board is fixed to the first circuit board 11, and the other end is fixed to the second circuit board 12 to achieve electrical connection. Due to its bending characteristics, it can provide a more flexible electrical connection than copper terminals, and is suitable for scenarios that require bending or movement; connectors may include various types of plugs and sockets for quick connection and disconnection of electrical connections between circuit boards; plastic-coated copper busbars are copper busbars with an insulating outer layer, which are usually connected to the circuit board by screws, providing good insulation protection while providing high current transmission. Of course, in other embodiments, the electrical connector 41 can also be other types of devices or structures, but all should have good conductivity to ensure efficient transmission of signals and power, and should also be able to withstand environmental factors such as vibration and temperature changes to maintain a long-term stable connection. In practical use, through this diverse combination of electrical connectors 41, the connection structure 4 can not only achieve a stable electrical connection between circuit boards to separate devices of different heights while bringing them close to the planar heat-conducting surface 211, but also can be flexibly adjusted according to different application requirements, thereby improving the overall performance and reliability of the power module heat dissipation module 100.

[0049] Please continue reading. Figure 3 In one embodiment, the connection structure 4 can be provided with both a bracket and an electrical connector 41 to achieve the dual functions of mechanical connection and electrical connection.

[0050] Please see Figure 1 In one embodiment, the heat-conducting component 2 further includes a heat-conducting sheet 24, which is mounted on the planar heat-conducting surface 211 and extends toward the first mounting surface 111. The heat-conducting sheet 24 is disposed close to the heat-generating device 3. Thus, the heat generated by the heat-generating device 3 can be effectively conducted to the heat-conducting plate 21 via the heat-conducting sheet 24, achieving an auxiliary heat transfer effect. The heat-conducting sheet 24 is typically made of a high thermal conductivity material, such as aluminum, copper, or their alloys, and is designed to be inserted into the slots or gaps of each heat-generating device 3 to ensure the efficiency and stability of heat conduction. Of course, the heat-conducting sheet 24 can also integrate the function of a surrounding plate to facilitate potting of individual heat-generating devices 3.

[0051] In one embodiment, the plurality of heating devices 3 include at least one first device 31 and at least one second device 32. One end of the at least one first device 31 is disposed on a first mounting surface 111, and one end of the at least one second device 32 is disposed on a second mounting surface 121. The height of the first device 31 is A, and the height of the second device 32 is B, where A > B. In this embodiment, by stacking the first circuit board 11 and the second circuit board 12, the end faces of the first device 31 and the second device 32, which are of different heights, are located at the same horizontal level, effectively utilizing vertical space and improving space utilization. It should be noted that the height of the first device 31 can be adjusted by adding a shim or pad to achieve alignment with the end face of the second device 32 at the same horizontal level.

[0052] This utility model also provides an automotive power supply, including a power module heat dissipation module 100. The specific structure of the power module heat dissipation module 100 is as described in the above embodiments. Since the automotive power supply adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be described in detail here.

[0053] The above description is merely an exemplary embodiment of the present utility model and does not limit the patent scope of the present utility model. Any equivalent structural transformations made based on the technical concept of the present utility model and the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A power module heat sink module, characterized by, The power module heat dissipation module comprises: a mounting assembly comprising a first circuit board and a second circuit board arranged oppositely and spaced apart, a first mounting surface of the first circuit board facing a side of the second circuit board, and a second mounting surface of the second circuit board facing a side of the first circuit board; a plurality of heat generating devices, a first end surface of each of the heat generating devices being connected to the first mounting surface or the second mounting surface, and a second end surface of each of the heat generating devices being flush with a same plane. The power module heat dissipation module further comprises a heat conducting member, the heat conducting member being located on a side of the second circuit board facing away from the first circuit board, and the heat conducting member having a planar heat conducting surface facing the second mounting surface.

2. The power module heat sink module of claim 1, wherein, The second end surface of each of the heat generating devices is in heat conducting connection with the planar heat conducting surface. The heat conducting member comprises:

3. The power module heat sink module of claim 2, wherein, a bottom plate parallel to and spaced apart from the second circuit board, the planar heat conducting surface being located on a side of the bottom plate facing the second circuit board; and a side plate, the bottom plate and the side plate together enclosing a box body having a container groove. The mounting assembly and the heat generating devices are both arranged in the container groove. The power module heat dissipation module further comprises potting glue, the potting glue being wrapped on an outer side of at least one of the heat generating devices, or the potting glue being filled in the container groove; and / or 4. The power module heat sink assembly of claim 3, wherein, The heat conducting member further comprises a cover plate, the cover plate being arranged on the box body and sealing the container groove. The power module heat dissipation module further comprises a heat sink configured to accelerate heat dissipation of the heat conducting member.

5. The power module heat sink assembly of claim 2, wherein, The power module heat dissipation module further comprises a heat sink, the heat sink being located on a side of the second circuit board facing away from the first circuit board, and the heat sink having a planar heat dissipation surface facing the second mounting surface.

6. The power module heat sink assembly of claim 1, wherein, The second end surface of each of the heat generating devices is in heat conducting connection with the planar heat dissipation surface. The mounting assembly further comprises a connecting structure configured to establish mechanical connection between the first circuit board and the second circuit board and / or to establish electrical connection between the first circuit board and the second circuit board.

7. The power module heat sink module of any one of claims 1 to 6, wherein, The connecting structure comprises a plurality of electrical connectors, the plurality of electrical connectors being one or more of a copper stud, a connecting cable, a flexible circuit board, a connector, and a plastic-coated copper bar.

8. The power module heat sink module of claim 7, wherein, The plurality of heat generating devices comprises at least one first device and at least one second device, one end of the at least one first device being arranged on the first mounting surface, and one end of the at least one second device being arranged on the second mounting surface, wherein a height of the first device is A, and a height of the second device is B, and A > B.

9. The power module heat sink module of any one of claims 1 to 6, wherein, The power module heat dissipation module comprises any one of claims 1 to 9.

10. An automotive power supply characterized by comprising: ​

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