Heat dissipation devices and testing equipment

Abstract

A heat dissipation device and testing equipment are disclosed. The heat dissipation device includes: a heat sink; a thermally conductive adapter in thermal contact with the heat sink; a first connector having a first end and a second end, the first end being connected to the thermally conductive adapter, and the second end being configured to connect to a circuit board, the projection of the second end on the thermally conductive adapter being movable relative to the thermally conductive adapter; and a heat conduction element disposed on the thermally conductive adapter, the heat conduction element being movable along the thermally conductive adapter, and the heat conduction element being configured to thermally contact a heat source on the circuit board and the thermally conductive adapter. This improves the recyclability of the heat dissipation device.

Description

Technical Field

[0001] This disclosure relates to the field of chip testing technology, and in particular to a heat dissipation device and testing equipment. Background Technology

[0002] As the demands on chip computing power increase, so does the power consumption of chips. In practical applications, circuit boards (PCBs) are typically selected to match the performance of chips. Before mass production, these PCBs undergo testing and evaluation, requiring heat dissipation devices to cool the chips and critical electronic components. However, currently, different heat dissipation devices are used for testing different PCBs, resulting in low recycling rates for these devices. Utility Model Content

[0003] To address the aforementioned technical problems, this disclosure provides a heat dissipation device and testing equipment to solve the problem of low recycling rate of the heat dissipation device.

[0004] The first aspect of this disclosure provides a heat dissipation device, comprising:

[0005] heat sink;

[0006] Thermally conductive adapter, in thermal contact with the heat sink;

[0007] A first connector has a first end and a second end, the first end being connected to a heat-conducting adapter, the second end being configured to connect to a circuit board, and the projection of the second end on the heat-conducting adapter being movable relative to the heat-conducting adapter.

[0008] A heat conduction element is disposed on a heat conduction adapter, and the heat conduction element is movable along the heat conduction adapter. The heat conduction element is configured to thermally contact a heat source and a heat conduction adapter on a circuit board.

[0009] A second aspect of this disclosure provides a test apparatus including a heat dissipation device as provided in the first aspect of this disclosure.

[0010] In this embodiment, the heat generated by the heat source on the circuit board is transferred to the heat sink for heat dissipation through the heat-conducting adapter and the heat sink during testing of the heat source, facilitating heat dissipation. A first end of a first connector is connected to the heat-conducting adapter, and a second end of the first connector is configured to connect to the circuit board. The projection of the second end on the heat-conducting adapter is set to be movable relative to the adapter. Thus, when testing and verifying circuit boards of different sizes, the second end of the first connector can be moved, causing its projection relative to the adapter to move, allowing the second end to connect to circuit boards of different sizes. In other words, the first connector can adapt to connecting circuit boards of different sizes, improving the adaptability of the heat dissipation device to different sizes of circuit boards, thereby increasing the reusability of the heat dissipation device.

[0011] Furthermore, a heat conduction element is incorporated into the heat-conducting adapter, allowing the heat conduction element to move along the heat-conducting adapter. This element is configured to thermally contact the heat source and the heat-conducting adapter on the circuit board. Thus, for heat sources at different locations on circuit boards of different sizes, the movement of the heat conduction element along the heat-conducting adapter ensures that the heat conduction element remains in thermal contact with both the heat source and the adapter. This facilitates the transfer of heat from the heat source to the heat-conducting adapter, and then to the heat sink. This enhances the adaptability of the heat conduction element to heat sources at different locations on circuit boards of different sizes, thereby improving the recyclability of the heat dissipation device. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of a heat dissipation device provided in some embodiments of this disclosure;

[0013] Figure 2 This is an exploded structural diagram of a heat dissipation device provided in some embodiments of this disclosure;

[0014] Figure 3 This is a schematic diagram of a heat-conducting adapter in a heat dissipation device provided in some embodiments of this disclosure;

[0015] Figure 4 This is a schematic diagram of a first connecting member in a heat dissipation device provided in some embodiments of this disclosure;

[0016] Figure 5 This is a schematic diagram of a second connector in a heat dissipation device provided in some embodiments of this disclosure;

[0017] Figure 6 This is a schematic diagram of the structure of a heat sink in a heat dissipation device provided in some embodiments of this disclosure;

[0018] Figure 7This is another exploded structural diagram of the heat dissipation device provided in some embodiments of this disclosure;

[0019] Figure 8 This is another structural schematic diagram of the heat sink in the heat dissipation device provided in some embodiments of this disclosure;

[0020] Figure 9 This is a schematic diagram of the internal structure of a radiator in a heat dissipation device provided in some embodiments of this disclosure;

[0021] Figure 10 This is another exploded structural diagram of the heat dissipation device provided in some embodiments of this disclosure;

[0022] Figure 11 This is another structural schematic diagram of the heat sink in the heat dissipation device provided in some embodiments of this disclosure;

[0023] Figure 12 This is a schematic diagram of another internal structure of the heat sink in the heat dissipation device provided in some embodiments of this disclosure.

[0024] Explanation of reference numerals in the attached figures:

[0025] 10-Heat sink; 20-Thermal conductive adapter; 30-First connector; 40-Circuit board; 50-Thermal conductive component; 60-First thermal conductive interface layer; 70-Third thermal conductive interface layer; 80-Fourth thermal conductive interface layer; 90-Housing;

[0026] 101-Heat dissipation fins; 102-Fan; 210-First mounting position; 220-Second mounting position; 301-First end; 302-Second end; 310-First clamping element; 320-Second clamping element; 330-Flange; 410-Heat source; 510-Second connecting element; 520-Heat conductor;

[0027] 211-First mounting hole; 221-Second mounting hole; 511-Injection hole; 521-First groove; 522-Protrusion. Detailed Implementation

[0028] To explain this disclosure, exemplary embodiments of the disclosure will now be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the disclosure, and not all of them. It should be understood that the disclosure is not limited to exemplary embodiments.

[0029] To enable those skilled in the art to better understand the technical solutions in this disclosure, the technical solutions in the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments in this disclosure, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this disclosure.

[0030] It should be noted that many specific details are set forth in the following description in order to provide a full understanding of this disclosure. However, this disclosure may also be implemented in other ways different from those described herein. Therefore, the scope of protection of this disclosure is not limited to the specific embodiments disclosed below.

[0031] In the description of this disclosure, it should be understood that the terms "upper," "lower," "horizontal," "bottom," "inner," and "outer" (if any) indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are used only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this disclosure. In this disclosure, unless otherwise expressly specified and limited, the first feature being "upper" or "lower" than the second feature may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium.

[0032] In this disclosure, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral unit; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. However, specifying a direct connection indicates that the two entities connected are not linked by an intermediate structure, but are simply connected to form a whole. For those skilled in the art, the specific meaning of the above terms in this disclosure can be understood according to the specific circumstances.

[0033] In this disclosure, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features.

[0034] Figure 1 This is a schematic diagram of a heat dissipation device provided in some embodiments of this disclosure.

[0035] In some embodiments of this disclosure, the circuit board 40 can be tested using a testing device.

[0036] In some examples, circuit board 40 can be mounted on a test device for testing.

[0037] In some examples, refer to Figure 1 As shown, the test equipment may include a heat dissipation device. The circuit board 40 can be mounted on the heat dissipation device for testing. This facilitates the heat dissipation device in cooling the chips and key electronic components on the circuit board 40.

[0038] In some examples, refer to Figure 1 As shown, the heat dissipation device may include a heat sink 10. When testing the circuit board 40, the heat sink 10 can dissipate heat from the heat source 410 on the circuit board 40.

[0039] In some examples, refer to Figure 1 As shown, the heat dissipation device may include a heat-conducting adapter 20. The heat-conducting adapter 20 may be in thermal contact with the heat sink 10.

[0040] In some examples, the thermally conductive adapter 20 may be made of a thermally conductive material. For example, the thermally conductive adapter 20 may be made of metals such as aluminum, copper, platinum, or gold, or alloys such as aluminum alloys, copper alloys, or platinum.

[0041] In some examples, when testing the circuit board 40, the circuit board 40 can be connected to the side of the thermal adapter 20 away from the heat sink 10. The heat source 410 on the circuit board 40 can be in thermal contact with the thermal adapter 20. In this way, when testing the circuit board 40, the heat generated by the heat source 410 can be conducted to the heat sink 10 through the thermal adapter 20 and dissipated by the heat sink 10.

[0042] In some examples, the heat source 410 may include a chip on the circuit board 40.

[0043] In some examples, the heat source 410 may include electronic components on the circuit board 40.

[0044] In some examples, as the computing power requirements of the chips increase, the power consumption of the chips also increases. In practical applications, circuit boards 40 are typically selected to match the power consumption of the chips. That is, different types of chips require different types and sizes of circuit boards 40. To test different sizes of circuit boards 40, different heat dissipation devices are usually required, resulting in low recycling rates for the heat dissipation devices.

[0045] Figure 2 This is an exploded structural diagram of a heat dissipation device provided in some embodiments of this disclosure.

[0046] In some examples, to improve the recycling rate of the heat dissipation device, refer to Figure 2 As shown, the heat dissipation device may include a first connector 30. The first connector 30 may be connected to the heat-conducting adapter 20. The first connector 30 may be used to connect the circuit board 40. That is, the circuit board 40 can be connected to the heat-conducting adapter 20 through the first connector 30.

[0047] In some examples, refer to Figure 2 As shown, the first connector 30 may have a first end 301. The first end 301 may be connected to the heat-conducting adapter 20.

[0048] In some examples, the first end 301 can be fixedly connected to the thermally conductive adapter 20.

[0049] In some examples, the first end 301 can be movably connected to the thermally conductive adapter 20. That is, after the first end 301 is connected to the thermally conductive adapter 20, the first end 301 can move along the thermally conductive adapter 20.

[0050] In some examples, the first connector 30 may have a second end 302. The second end 302 may be configured to connect to the circuit board 40.

[0051] In some examples, to accommodate connections to circuit boards 40 of different sizes, the projection of the second end 302 onto the thermally conductive adapter 20 (e.g., reference) Figure 2 As shown, the second end 302 can be along Figure 2 The direction projection shown by the y-axis can be moved relative to the heat-conducting adapter 20.

[0052] In some examples, the second end 302 may be movable relative to the first end 301, so that the projection of the second end 302 on the thermally conductive adapter 20 may be moved relative to the thermally conductive adapter 20.

[0053] In some examples, the first end 301 can move relative to the heat-conducting adapter 20, thereby causing the second end 302 to move as well. This allows the projection of the second end 302 onto the heat-conducting adapter 20 to move relative to the adapter. In this way, the movement of the projection of the second end 302 onto the heat-conducting adapter 20 allows the second end 302 to adapt to connecting circuit boards 40 of different sizes, thus improving the adaptability of the heat dissipation device to circuit boards 40 of different sizes. When testing circuit boards 40 of different sizes, the circuit board 40 can be fixed by adjusting the position of the second end 302, improving the reusability of the heat dissipation device.

[0054] In some examples, the location of the heat source 410 on different types and sizes of circuit boards 40 may vary. To facilitate the transfer of heat emitted by the heat source 410 to the heat sink 10 via the thermally conductive adapter 20, refer to... Figure 2 As shown, the heat dissipation device may include a heat conduction element 50. The heat conduction element 50 may be disposed on the heat conduction adapter 20.

[0055] In some examples, the heat conduction element 50 may be located on the side of the heat conduction adapter 20 facing the circuit board 40.

[0056] In some examples, the heat transfer element 50 is movable along the heat transfer adapter 20. For example, see reference... Figure 2 As shown, the heat conduction element 50 can extend along the heat conduction adapter 20. Figure 2 The heat transfer element 50 moves in the direction shown by the x-axis. In this way, the position of the heat transfer element 50 on the heat transfer adapter 20 can be adjusted according to the position of the heat source 410 on the circuit board 40 of different types and sizes, so as to facilitate the adaptation to different types and sizes of circuit boards 40, and facilitate the reuse of the same heat dissipation device when testing different types and sizes of circuit boards 40, thereby improving the recycling rate of the heat dissipation device.

[0057] In some examples, the heat conductor 50 can be configured to thermally contact the heat source 410 and the heat-conducting adapter 20. That is, the heat emitted by the heat source 410 can be transferred through the heat conductor 50 to the heat-conducting adapter 20; then, it is transferred through the heat-conducting adapter 20 to the heat sink 10 for heat dissipation. In this way, the thermal resistance between the heat source 410 and the heat-conducting adapter 20 can be reduced, which is beneficial for heat dissipation of the heat source 410.

[0058] In some examples, the material of the heat conduction element 50 may be the same as, similar to or similar to that of the heat conduction adapter 20. For details, please refer to the detailed description of the heat conduction adapter 20 in the foregoing embodiments of this disclosure. This disclosure will not repeat the details in this embodiment.

[0059] In this embodiment of the disclosure, the heat source 410 on the circuit board 40 is tested by thermally contacting the heat-conducting adapter 20 with the heat sink 10. The heat emitted by the heat source 410 can be transferred to the heat sink 10 for heat dissipation through the thermally conductive adapter 20, which facilitates the heat dissipation of the heat source 410. The first end 301 of the first connector 30 is connected to the heat-conducting adapter 20, and the second end 302 of the first connector 30 is configured to be connected to the circuit board 40. The projection of the second end 302 on the heat-conducting adapter 20 is set to be movable relative to the heat-conducting adapter 20. In this way, when testing and verifying circuit boards 40 of different sizes, the second end 302 of the first connector 30 can be moved so that the projection of the second end 302 on the heat-conducting adapter 20 moves relative to the heat-conducting adapter 20, so that the second end 302 can be connected to circuit boards 40 of different sizes. That is to say, the first connector 30 can be adapted to connect circuit boards 40 of different sizes, improving the adaptability of the heat dissipation device to circuit boards 40 of different sizes, that is, improving the recycling rate of the heat dissipation device.

[0060] In addition, a heat conduction element 50 is provided on the heat conduction adapter 20, and the heat conduction element 50 can move along the heat conduction adapter 20. The heat conduction element 50 is configured to make thermal contact with the heat source 410 on the circuit board 40 and the heat conduction adapter 20. In this way, when dealing with heat sources 410 at different positions on circuit boards 40 of different sizes, the heat conduction element 50 can be moved on the heat conduction adapter 20 to ensure that the heat conduction element 50 maintains thermal contact with the heat source 410 and the heat conduction adapter 20. This facilitates the transfer of heat from the heat source 410 to the heat conduction adapter 20 and then to the heat sink 10. This improves the adaptability of the heat conduction element 50 to heat sources 410 at different positions on circuit boards 40 of different sizes, thereby improving the recycling rate of the heat dissipation device.

[0061] In some examples, the first end 301 of the first connector 30 is fixedly connected to the heat-conducting adapter 20.

[0062] In some examples, the first end 301 can be fixed to the heat-conducting adapter 20 by connecting components such as bolts, screws or threaded rods.

[0063] In some examples, the heat-conducting adapter 20 may have a threaded hole, and the first end 301 may have an external thread. The first end 301 may be fixed to the heat-conducting adapter 20 by threaded connection.

[0064] In some examples, the first end 301 can be welded to the thermally conductive adapter 20.

[0065] In some examples, the second end 302 of the first connector 30 can be positioned relative to the first end 301 in a first direction (e.g., Figure 2The second end 302 can move in the direction shown by the x-axis. This facilitates connection of the second end 302 to circuit boards 40 of different sizes.

[0066] In some examples, the first direction can be a direction that is not perpendicular to the heat-conducting adapter 20. Specifically, the direction perpendicular to the heat-conducting adapter 20 can be... Figure 2 The direction indicated by the y-axis. That is, the movement of the second end 302 relative to the first end 301 only requires... Figure 2 As long as there is a movement component in the direction shown by the x-axis, when testing circuit boards 40 of different sizes, the second end 302 can be moved relative to the first end 301 in the first direction to adapt to circuit boards 40 of different sizes, facilitating the fixed connection of circuit boards 40 of different sizes. This improves the recycling rate of the heat sink 10.

[0067] In some examples, the first connector 30 may include a multi-joint connection structure. For example, the first connector 30 may include a universal joint. The first end 301 of the multi-joint connection structure may be fixedly connected to the heat-conducting adapter 20. The second end 302 of the multi-joint connection structure may move relative to the first end 301 in a first direction via a movable joint, thereby adapting to connect circuit boards 40 of different sizes.

[0068] In some examples, the first connector 30 may include a flexible connection structure. For example, the first connector 30 may include a connecting rope or chain. The second end 302 of the flexible connection structure may be bent and deformed relative to the first end 301, thereby moving relative to the first end 301 in a first direction.

[0069] In some examples, the first connector 30 may include a hinge. That is, the first end 301 and the second end 302 may be hinged. After the first end 301 is fixed to the heat-conducting adapter 20, the second end 302 can move relative to the first end 301 in a first direction through the hinge.

[0070] In some examples, the first end 301 of the first connector 30 is movable along the heat-conducting adapter 20. As the first end 301 moves along the heat-conducting adapter 20, it can cause the projection of the second end 302 of the first connector 30 onto the heat-conducting adapter 20 to move relative to the heat-conducting adapter 20.

[0071] In some examples, the first connector 30 may be a rigid component. When the first end 301 of the first connector 30 moves along the heat-conducting adapter 20, it causes the second end 302 of the first connector 30 to move, thereby causing the second end 302 to move relative to the heat-conducting adapter 20.

[0072] In some examples, the first end 301 of the first connector 30 may slide along the heat-conducting adapter 20. For example, a guide rail or guide groove may be provided on the heat-conducting adapter 20, and the first end 301 may slide along the guide rail or guide groove on the heat-conducting adapter 20.

[0073] In some examples, the first end 301 of the first connector 30 may be provided with a magnetic attachment, allowing the first end 301 to be magnetically attached to the thermally conductive adapter 20. When fixing circuit boards 40 of different sizes, the first end 301 can be detached from the thermally conductive adapter 20 and magnetically attached to a suitable position on the thermally conductive adapter 20, thereby adjusting the position of the first connector 30 on the thermally conductive adapter 20 and facilitating the connection of circuit boards 40 of different sizes.

[0074] In some examples of embodiments of this disclosure, by setting the first end 301 of the first connector 30 to be movable on the heat-conducting adapter 20, the movement of the first end 301 can drive the second end 302 to move relative to the heat-conducting adapter 20, thereby facilitating the second end 302 to adapt to the connection of circuit boards 40 of different sizes and improving the recycling rate of the heat dissipation device.

[0075] Figure 3 This is a schematic diagram of a heat-conducting adapter in a heat dissipation device provided in some embodiments of this disclosure.

[0076] In some examples, refer to Figure 3 As shown, the heat-conducting adapter 20 may be provided with multiple first mounting positions 210. The first end 301 of the first connector 30 is movable among the multiple first mounting positions 210. That is, the first connector 30 can be installed at any one of the multiple first mounting positions 210, thereby causing the projection of the second end 302 of the first connector 30 on the heat-conducting adapter 20 to move relative to the heat-conducting adapter 20.

[0077] In some examples, the first mounting position 210 may be a slot or hook located on the side of the thermally conductive adapter 20 facing the circuit board 40. The first end 301 of the first connector 30 may engage with the slot or hook to connect to the thermally conductive adapter 20.

[0078] In some examples, when testing for circuit boards 40 of different sizes, the first end 301 of the first connector 30 can be removed from one of the first mounting positions 210 and installed on another first mounting position 210 to accommodate connection of circuit boards 40 of different sizes.

[0079] In some examples, the first mounting position 210 may be equipped with a magnetic attractor that magnetically attracts the first end 301, thereby connecting the first connector 30 to the heat-conducting adapter 20.

[0080] In this embodiment, by providing multiple first mounting positions 210 on the thermally conductive adapter 20, the first end 301 of the first connector 30 can move between the multiple first mounting positions 210. This facilitates connection between the first connector 30 and the thermally conductive adapter 20, and also facilitates movement of the first connector 30 within the thermally conductive adapter 20, thereby enabling testing of circuit boards 40 of different sizes and improving the recyclability of the heat dissipation device.

[0081] In some examples, continue to refer to Figure 3 As shown, the first mounting position 210 may include a first mounting hole 211.

[0082] In some examples, the first mounting hole 211 can be a through hole. The first mounting hole 211 can be along the thickness direction of the thermally conductive adapter 20 (e.g., Figure 3 The direction shown by the z-axis penetrates both surfaces of the heat-conducting adapter 20.

[0083] Figure 4 This is a schematic diagram of the structure of the first connecting member in a heat dissipation device provided in some embodiments of this disclosure.

[0084] In some examples, refer to Figure 4 As shown, the first connector 30 can be a rod-shaped structure. The first end 301 of the first connector 30 can pass through the first mounting hole 211.

[0085] In some examples, the second end 302 of the first connector 30 may be provided with a first clamping member 310, which may clamp onto the edge of the circuit board 40.

[0086] In some examples, the first connector 30 may have external threads (not shown in the figure). The inner wall of the first mounting hole 211 may have internal threads. After the first end 301 of the first connector 30 passes through the first mounting hole 211, the first connector 30 can be connected to the heat-conducting adapter 20 by the threads.

[0087] In some examples, the second end 302 of the first connector 30 may be provided with a first clamping member 310. The first clamping member 310 may be configured to clamp at the edge of the circuit board 40.

[0088] In some examples, the first clamp 310 may be fixedly connected to the second end 302.

[0089] In some examples, the first clamp 310 may include a nut, and the first clamp 310 may be threadedly connected to the second end 302.

[0090] In some examples, the first clamping member 310 can be a hand-tightening nut. The cylindrical surface of the first clamping member 310 can be set to a rough surface. This allows the operator to adjust the position of the first clamping member 310 by hand, making it easier for the first clamping member 310 to clamp and fix the circuit board 40.

[0091] In some examples of embodiments of this disclosure, the first mounting position 210 is configured as a first mounting hole 211, and the first end 301 of the first connector 30 passes through the first mounting hole 211. This facilitates the connection between the first connector 30 and the thermally conductive adapter 20, improves the installation efficiency of the first connector 30, and enhances testing efficiency when testing circuit boards 40 of different sizes.

[0092] Additionally, a first clamping member 310 is provided at the second end 302 of the first connector 30, and the first clamping member 310 is configured to clamp the edge of the circuit board 40. This facilitates the clamping member 310 in clamping and fixing the circuit board 40, improving the efficiency of fixing and installing the circuit board 40, and also improving the testing efficiency of testing the circuit board 40.

[0093] In some examples, the first mounting hole 211 can be a blind hole. That is, the first mounting hole 211 can be a hole recessed in the thermally conductive adapter 20 on the side facing the circuit board 40, and the first mounting hole 211 does not penetrate the thermally conductive adapter 20.

[0094] In some examples, during specific installation, the first end 301 of the first connector 30 can be inserted into the first mounting hole 211 and connected to the heat-conducting adapter 20 by threads. Then, the first clamping member 310 is installed on the side of the circuit board 40 away from the heat-conducting adapter 20 by hand-tightening the second end 302. After tightening the first clamping member 310, the first clamping member 310 can clamp the circuit board 40 between the first clamping member 310 and the heat-conducting adapter 20 through the first connector 30.

[0095] In some examples, refer to Figure 4 As shown, the second end 302 of the first connector 30 may be provided with a second clamping member 320. The second clamping member 320 may be opposite to the first clamping member 310, and the first clamping member 310 and the second clamping member 320 are clamped at the edges of opposite sides of the circuit board 40.

[0096] In some examples, the structure of the second clamping member 320 may be the same as, similar to or similar to that of the first clamping member 310. The specific structure of the second clamping member 320 can be referred to the detailed description of the first clamping member 310 in the foregoing embodiments of this disclosure, and will not be repeated in the embodiments of this disclosure.

[0097] In some examples, the second clamping member 320 may include a flange 330. The flange 330 may be located at the second end 302. The flange 330 may be fixedly connected to the second end 302.

[0098] In some examples, the flange 330 may be integral with the first connector 30.

[0099] In some examples, during installation, the second clamp 320 can be clamped on the side of the circuit board 40 facing away from the heat-conducting adapter 20. The first clamp 310 can be clamped by hand-tightening on the side of the circuit board 40 facing the heat-conducting adapter 20. In this way, the circuit board 40 can be securely fastened between the first clamp 310 and the second clamp 320, facilitating stable installation of the circuit board 40.

[0100] In some embodiments of this disclosure, a second clamping member 320 is provided at the second end 302 of the first connector 30, and the first clamping member 310 and the second clamping member 320 clamp the circuit board 40 at opposite edges. Thus, the circuit board 40 can be clamped by the first clamping member 310 and the second clamping member 320, allowing for stable clamping of the circuit board 40 from both sides, facilitating stable installation of the circuit board 40 and improving the stability of the circuit board 40 during testing.

[0101] In some examples, the first end 301 of the first connector 30 may be provided with a flange 330. The first mounting hole 211 may be a through hole. When installing the first connector 30, the second end 302 of the first connector 30 can be inserted into the first mounting hole 211 from the side of the heat-conducting adapter 20 facing away from the circuit board 40. At this time, the flange 330 can abut against the side of the heat-conducting adapter 20 facing away from the circuit board 40, thereby realizing the connection between the first connector 30 and the heat-conducting adapter 20. Then, a first clamping member 310 and a second clamping member 320 are provided at the second end 302 to fix the circuit board 40. This facilitates the connection, installation, and position adjustment of the first connector 30, and facilitates the fixation of the circuit board 40.

[0102] In some examples, the heat-conducting adapter 20 may have multiple second mounting positions 220. The heat-conducting element 50 may be mounted in any one of the multiple second mounting positions 220. That is, the heat-conducting element 50 is movable between the multiple second mounting positions 220.

[0103] In some examples, the structure and type of the second mounting position 220 may be the same as, similar to or similar to the structure and type of the first mounting position 210. The specific structure and type of the second mounting position 220 can be referred to the detailed description of the structure and type of the first mounting position 210 in the foregoing embodiments of this disclosure, and will not be repeated in this disclosure.

[0104] In some examples of embodiments of this disclosure, by providing multiple second mounting positions 220 on the thermally conductive adapter 20, the heat-conducting member 50 can move between the multiple second mounting positions 220, thereby facilitating thermal contact between the heat-conducting member 50 and heat sources 410 on circuit boards 40 of different types and sizes, and facilitating the heat-conducting member 50 to conduct the heat generated by the heat source 410 to the thermally conductive adapter 20. In other words, a single heat dissipation device can be adapted to test circuit boards 40 of different sizes, improving the versatility and recyclability of the heat dissipation device.

[0105] In some examples, the second mounting position 220 may include a second mounting hole 221. It is understood that the second mounting hole 221 may be configured in the same, similar, or analogous manner as the first mounting hole 211. For details, please refer to the detailed description of the first mounting hole 211 in the foregoing embodiments of this disclosure, which will not be repeated here.

[0106] In some examples, the thermally conductive adapter 20 can be a perforated plate. One part of the through hole in the thermally conductive adapter 20 can serve as a first mounting hole 211, and the other part of the through hole in the thermally conductive adapter 20 can serve as a second mounting hole 221.

[0107] Figure 5 This is a schematic diagram of a second connector in a heat dissipation device provided in some embodiments of this disclosure.

[0108] In some examples, refer to Figure 5 As shown, the heat-conducting component 50 may include a second connector 510. The second connector 510 may be a columnar structure.

[0109] In some examples, the second connector 510 may pass through the second mounting hole 221. The second connector 510 is movable between the second mounting holes 221 corresponding to the plurality of second mounting positions 220.

[0110] In some examples, refer to Figure 5 As shown, the heat conduction element 50 may include a heat conductor 520. The heat conductor 520 may be connected to the second connector 510.

[0111] In some examples, the heat conductor 520 can be detachably connected to the second connector 510.

[0112] In some examples, the heat conductor 520 may be fixedly connected to the second connector 510.

[0113] In some examples, the heat conductor 520 can have thermal contact with the heat source 410 and the heat transfer adapter 20. That is, the heat from the heat source 410 can be transferred to the heat conductor 520, and then from the heat conductor 520 to the heat transfer adapter 20, so that the heat emitted by the heat source 410 can be conducted to the heat sink 10 for heat dissipation through the heat transfer adapter 20.

[0114] In some examples, the material of the heat conductor 520 may be the same as, similar to or similar to that of the heat conductor adapter 20. For details, please refer to the detailed description of the material of the heat conductor adapter 20 in the foregoing embodiments of this disclosure. This disclosure will not repeat the details in this embodiment.

[0115] In some examples of embodiments of this disclosure, the second mounting hole 221 is used as the second mounting position 220. Thus, the second mounting hole 221 can be formed simultaneously with the first mounting hole 211 on the heat-conducting adapter 20; that is, the second mounting position 220 can be formed at the same time as the first mounting position 210, reducing the processing steps of the first mounting position 210 and the second mounting position 220, improving the processing efficiency of the heat-conducting adapter 20, and reducing the processing difficulty of the heat-conducting adapter 20.

[0116] Furthermore, the heat conductor 520 is connected between the heat source 410 and the heat-conducting adapter 20 via the second connector 510, allowing the heat conductor 520 to have thermal contact with both the heat source 410 and the heat-conducting adapter 20. This facilitates the transfer of heat generated by the heat source 410 to the heat-conducting adapter 20, and then to the heat sink 10 for heat dissipation. The connection between the heat conductor 520 and the second connector 510 allows for convenient adjustment of the position of the heat conductor 520 when testing circuit boards 40 of different sizes, improving the reusability of the heat dissipation device.

[0117] In some examples, refer to Figure 2 As shown, the heat dissipation device may include a first thermal interface layer 60 (not shown in the figure). The first thermal interface layer 60 may be disposed between the heat conductor 520 and the thermal adapter 20.

[0118] In some examples, the first thermal interface layer 60 may be thermal grease.

[0119] In some examples, the first thermally conductive interface layer 60 may be a thermally conductive gel.

[0120] In some examples, the first thermal interface layer 60 may be a thermal pad.

[0121] In some examples, the first thermally conductive interface layer 60 can fill the mating gap between the heat conductor 520 and the thermally conductive adapter 20. In this way, by using the first thermally conductive interface layer 60 to fill the mating gap between the heat conductor 520 and the thermally conductive adapter 20, the contact thermal resistance between the heat conductor 520 and the thermally conductive adapter 20 can be reduced, facilitating the transfer of heat emitted by the heat source 410 to the thermally conductive adapter 20 through the heat conductor 520.

[0122] In some examples, refer to Figure 5 As shown, the heat conductor 520 may have a first groove 521 on the side facing the heat conduction adapter 20.

[0123] In some examples, the first thermal interface layer 60 may be filled within the first groove 521.

[0124] In some examples, the first thermal interface layer 60 may overflow the opening of the first groove 521.

[0125] In some examples, the first thermally conductive interface layer 60 can be injected into the first groove 521 by injection molding, filling the opening protruding from the first groove 521. In this way, the first thermally conductive interface layer 60 can completely fill the first groove 521, effectively filling the gap between the heat conductor 520 and the heat-conducting adapter 20, thus facilitating the transfer of heat from the heat source 410 on the circuit board 40.

[0126] In addition, by providing a first groove 521 on the side of the heat conductor 520 facing the heat transfer adapter 20, the material used in the heat conductor 520 can be reduced, thus saving the cost of the heat conductor 520.

[0127] In some examples, refer to Figure 5 As shown, the opening edge of the first groove 521 may be provided with a protrusion 522. The protrusion 522 may be fitted into the second mounting hole 221.

[0128] In some examples, the protrusion 522 may face the heat-conducting adapter 20. After the heat-conducting member 50 is mounted on the heat-conducting adapter 20, the protrusion 522 may be fitted into the second mounting hole 221.

[0129] In some examples, the protrusion 522 and the heat conductor 520 can be a single piece.

[0130] In some embodiments of this disclosure, a protrusion 522 is provided at the opening edge of the first groove 521; thus, the amount of the first thermally conductive interface layer 60 injected into the first groove 521 can be controlled by the protrusion 522. For example, the amount of the first thermally conductive interface layer 60 can be controlled to overflow from the opening of the first groove 521 and be flush with the protrusion 522. In this way, after the heat conduction member 50 is installed on the thermally conductive adapter 20, the first thermally conductive interface layer 60 can be compressed by the heat conduction body 520 and the thermally conductive adapter 20, thereby making full contact between the first thermally conductive interface layer 60 and the heat conduction body 520 and the thermally conductive adapter 20, reducing the contact thermal resistance between the heat conduction body 520 and the thermally conductive adapter 20, and improving the heat dissipation efficiency of the heat source 410.

[0131] In some examples, the second mounting hole 221 may be filled with a second thermally conductive interface layer (not shown in the figure). This reduces the thermal resistance within the second mounting hole 221, thereby improving the heat dissipation efficiency of the heat source 410.

[0132] In some examples, the material of the second thermal interface layer may be the same as, similar to or similar to that of the first thermal interface layer 60. For details, please refer to the detailed description of the first thermal interface layer 60 in the foregoing embodiments of this disclosure. This disclosure will not repeat the details in the embodiments.

[0133] In some examples, the second connector 510 has a cavity (not shown) filled with a first thermally conductive interface layer 60, which completely fills the cavity.

[0134] In some examples, refer to Figure 5 As shown, the second connector 510 can have an injection hole 511 in the radial direction, and the injection hole 511 can communicate with the cavity.

[0135] In some examples, the first thermally conductive interface layer 60 can be injected into the cavity through the injection hole 511 and fill the cavity.

[0136] In some examples of embodiments of this disclosure, the second connector 510 is configured as a hollow structure, and the cavity is filled with a first thermally conductive interface layer 60. This reduces the material used in the second connector 510, saving on its cost.

[0137] In some examples, refer to Figure 2 As shown, the heat dissipation device may include a third thermal interface layer 70. The third thermal interface layer 70 may be disposed between the heat conductor 520 and the heat source 410.

[0138] In some examples, the third thermal interface layer 70 can be configured to fill the mating gap between the thermal conductor 520 and the heat source 410.

[0139] In some examples, the material of the third thermal interface layer 70 may be the same as, similar to or similar to that of the first thermal interface layer 60. For details, please refer to the detailed description of the first thermal interface layer 60 in the foregoing embodiments of this disclosure. This disclosure will not repeat the details in the embodiments.

[0140] In some examples of embodiments of this disclosure, by filling a third thermal interface layer 70 between the heat conductor 520 and the heat source 410, the contact thermal resistance between the heat source 410 and the heat conductor 520 can be reduced, facilitating the transfer of heat from the heat source 410 to the heat conductor 520 and improving the heat dissipation efficiency of the heat source 410.

[0141] In some examples, the heat conductor 520 may have a second groove (not shown in the figure) on the side facing the heat source 410.

[0142] In some examples, the second groove may be configured in the same, similar or identical manner as the first groove 521. For details, please refer to the detailed description of the first groove 521 in the foregoing embodiments of this disclosure.

[0143] In some examples, the third thermal interface layer 70 may fill the second groove, and the third thermal interface layer 70 may overflow the opening of the second groove. It is understood that the arrangement of the third thermal interface layer 70 in the second groove may be the same as, similar to or similar to the arrangement of the first thermal interface layer 60 in the first groove 521. For details, please refer to the detailed description of the first thermal interface layer 60 in the foregoing embodiments of this disclosure, which will not be repeated here.

[0144] In some examples of embodiments of this disclosure, a second groove is provided on the side of the heat conductor 520 facing the heat source 410, and the third thermal interface layer 70 is filled in the second groove, which facilitates the provision of the third thermal interface layer 70.

[0145] In some examples, refer to Figure 2 As shown, the heat dissipation device may include a fourth thermal interface layer 80. The fourth thermal interface layer 80 may be disposed between the thermally conductive adapter 20 and the heat sink 10.

[0146] In some examples, the fourth thermal interface layer 80 can be configured to fill the mating gap between the thermal adapter 20 and the heat sink 10.

[0147] In some examples, the material of the fourth thermal interface layer 80 may be the same as, similar to or similar to that of the first thermal interface layer 60. For details, please refer to the detailed description of the first thermal interface layer 60 in the foregoing embodiments of this disclosure.

[0148] In some examples of embodiments of this disclosure, a fourth thermally conductive interface layer 80 is filled in the mating gap between the thermally conductive adapter 20 and the heat sink 10. This reduces the contact thermal resistance between the thermally conductive adapter 20 and the heat sink 10, facilitating heat transfer from the thermally conductive adapter 20 to the heat sink 10, thereby improving the heat dissipation efficiency of the heat source 410.

[0149] In some examples, the heat output of the heat source 410 is different, and the type of heat sink 10 required may be different.

[0150] Figure 6 This is a schematic diagram of the structure of a heat sink in a heat dissipation device provided in some embodiments of this disclosure.

[0151] In some examples, refer to Figure 2 and Figure 6 As shown, when the heat source 410 is an L1-level autonomous driving domain controller, the heat generated by the heat source 410 is relatively small. Natural heat dissipation can be used to cool the heat source 410.

[0152] In some examples, refer to Figure 6 As shown, the radiator 10 may include a natural radiator. Multiple heat dissipation fins 101 may be provided on one side of the natural radiator opposite to the heat conduction adapter 20. The natural radiator can dissipate heat from the surrounding environment through natural heat conduction, convection, and radiation via the heat dissipation fins 101.

[0153] In some examples, the heat sink 10 and the thermally conductive adapter 20 can be detachably connected.

[0154] Figure 7 This is another exploded structural diagram of the heat dissipation device provided in some embodiments of this disclosure. Figure 8 This is a schematic diagram of another structure of the heat sink in the heat dissipation device provided in some embodiments of this disclosure. Figure 9 This is a schematic diagram of the internal structure of a heat sink in a heat dissipation device provided in some embodiments of this disclosure.

[0155] In some examples, when testing the circuit board 40 where the heat source 410 generates a large amount of heat, the natural heat sink 10 can be removed and replaced with a heat sink 10 with higher heat dissipation efficiency.

[0156] In some examples, refer to Figures 7-9As shown, the heat sink 10 may include an air-cooled heat sink. Heat sink fins 101 and a fan 102 may be disposed inside the heat sink 10. The fan 102 can deliver cool air from the external environment into the heat sink 10 and force it to convect heat with the heat sink fins 101, thereby quickly removing heat from the heat sink fins 101. For example, when testing the circuit board 40 of an L2 or L2+ level autonomous driving domain controller, the air-cooled heat sink can be mounted on the thermally conductive adapter 20, and the fan 102 can increase airflow within the heat sink 10, enhancing convective heat transfer and thus improving the heat dissipation effect of the heat sink 10.

[0157] Figure 10 This is another exploded structural diagram of a heat dissipation device provided in some embodiments of this disclosure.

[0158] Figure 11 This is another structural schematic diagram of the heat sink in the heat dissipation device provided in some embodiments of this disclosure.

[0159] Figure 12 This is a schematic diagram of another internal structure of the heat sink in the heat dissipation device provided in some embodiments of this disclosure.

[0160] In some examples, when testing on a heat source 410 that generates more heat, such as the circuit board 40 of an L3 or L4 level autonomous driving domain controller, reference is made. Figures 10-12 As shown, a liquid cooler with higher heat dissipation efficiency can be used for heat dissipation.

[0161] In some examples, refer to Figure 12 As shown, the liquid-cooled radiator can be equipped with heat dissipation fins 101. Coolant can enter the radiator 10 through the inlet, exchange heat with the heat dissipation fins 101, and then be discharged from the outlet of the radiator 10. In this way, the heating efficiency of the heat source 410 can be improved.

[0162] In other words, in some examples of embodiments of this disclosure, the heat sink 10 may include any one of a natural heat sink, an air-cooled heat sink, and a hot-cooled heat sink. The specific selection of the heat sink 10 can be selectively set according to the heat output of the heat source 410 on the circuit board 40 to be tested. In this way, a heat dissipation device can be adapted to test different types of circuit boards 40 by changing the type of heat sink 10, thereby improving the reusability of the heat dissipation device.

[0163] It is understood that in some examples of the embodiments of this disclosure, the type of heat sink 10 is only shown as a specific example. In other examples, the heat sink 10 may be of other types, which will not be listed one by one in the embodiments of this disclosure.

[0164] In some examples, refer to Figure 1 and Figure 2 As shown, the heat dissipation device may include a housing 90. The housing 90 may be connected to the thermally conductive adapter 20.

[0165] In some examples, the housing 90 may be located on the side of the heat conductor 50 away from the heat conductor adapter 20.

[0166] In some examples, when testing the circuit board 40, the circuit board 40 can be mounted between the housing 90 and the heat-conducting element 50.

[0167] In some examples, the housing 90 may be located on the side of the circuit board 40 facing away from the heat conductor 50. The housing 90 can protect the circuit board 40.

[0168] In some examples, the housing 90 can be detachably connected to the thermally conductive adapter 20. For example, the housing 90 can be detachably connected to the thermally conductive adapter 20 via connecting components such as bolts, screws, or threaded rods.

[0169] In some examples of embodiments of this disclosure, by connecting the housing 90 to the thermally conductive adapter 20, the circuit board 40 is placed between the housing 90 and the thermally conductive member 50 when testing the circuit board 40; thus, the circuit board 40 can be protected by the housing 90.

[0170] In some examples, the thermally conductive adapter 20 includes multiple thermally conductive adapters 20, each having an extension connection (not shown in the figure). Multiple thermally conductive adapters 20 are detachably connected via the extension connection to expand the size of the thermally conductive adapter 20.

[0171] In some examples, the extended connection may include a magnetic connection. Multiple thermally conductive adapters 20 can be extended magnetically.

[0172] In some examples, the extended connection may include a snap-fit ​​connection. Multiple thermally conductive adapters 20 can be extended by snap-fitting.

[0173] In some examples, the extended connection may include a plug-in connection. Multiple thermally conductive adapters 20 can be extended by plugging in.

[0174] In some examples, the extended connection may include a riveted connection.

[0175] In some examples, the extended connection may include a mortise and tenon joint.

[0176] It is understood that the specific types of extended connection parts in the embodiments of this disclosure are only shown as specific examples and are not intended to limit the specific types of extended connection parts.

[0177] In some examples of embodiments of this disclosure, by providing an extension connection portion on the thermally conductive adapter 20, multiple thermally conductive adapters 20 can be connected through the extension connection portion, thereby expanding the size of the thermally conductive adapter 20, making it easier to adapt to circuit boards 40 of different sizes, and improving the recycling rate of the heat dissipation device.

[0178] The basic principles of this disclosure have been described above with reference to specific embodiments. However, the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0179] Various modifications and variations can be made to this disclosure without departing from its spirit and scope. Therefore, this disclosure is also intended to include such modifications and variations if they fall within the scope of the claims of this disclosure and their equivalents.

Claims

1. A heat dissipation device, characterized in that, include: heat sink; A heat-conducting adapter makes thermal contact with the heat sink; A first connector has a first end and a second end, the first end being connected to the thermally conductive adapter, the second end being configured to connect to a circuit board, and the projection of the second end on the thermally conductive adapter being movable relative to the thermally conductive adapter. A heat-conducting element is disposed on the heat-conducting adapter, the heat-conducting element being movable along the heat-conducting adapter, the heat-conducting element being configured to thermally contact a heat source on the circuit board and the heat-conducting adapter.

2. The heat dissipation device according to claim 1, characterized in that, The first end of the first connector is fixedly connected to the heat-conducting adapter; The second end of the first connector is movable relative to the first end in a first direction to connect with circuit boards of different sizes, wherein the first direction is not perpendicular to the thermally conductive adapter.

3. The heat dissipation device according to claim 1, characterized in that, The first end of the first connector is movable on the heat-conducting adapter to cause the projection of the second end of the first connector on the heat-conducting adapter to move relative to the heat-conducting adapter.

4. The heat dissipation device according to claim 1, characterized in that, The heat-conducting adapter is provided with a plurality of first mounting positions, and the first end of the first connector can move between the plurality of first mounting positions to drive the projection of the second end of the first connector on the heat-conducting adapter to move relative to the heat-conducting adapter.

5. The heat dissipation device according to claim 4, characterized in that, The first mounting position includes a first mounting hole; The first end of the first connector passes through the first mounting hole; The second end of the first connector is provided with a first clamping member, which is configured to clamp onto the edge of the circuit board.

6. The heat dissipation device according to claim 5, characterized in that, The second end of the first connector is further provided with a second clamping member, and the first clamping member and the second clamping member are clamped at the edge positions of opposite sides of the circuit board.

7. The heat dissipation device according to any one of claims 1-6, characterized in that, The heat-conducting adapter is provided with multiple second mounting positions, and the heat-conducting component is movable between the multiple second mounting positions.

8. The heat dissipation device according to claim 7, characterized in that, The second mounting position includes a second mounting hole, and the heat conduction element includes: The second connector passes through the second mounting hole and is movable between the second mounting holes corresponding to a plurality of second mounting positions; A heat conductor is connected to the second connector, and the heat conductor is in thermal contact with the heat source and the heat-conducting adapter.

9. The heat dissipation device according to claim 8, characterized in that, The heat dissipation device also includes: A first thermally conductive interface layer is disposed between the thermally conductive body and the thermally conductive adapter, and the first thermally conductive interface layer is configured to fill the mating gap between the thermally conductive body and the thermally conductive adapter.

10. The heat dissipation device according to claim 9, characterized in that, The heat conductor has a first groove on the side facing the heat-conducting adapter, the first heat-conducting interface layer fills the first groove, and the first heat-conducting interface layer overflows the opening of the first groove.

11. The heat dissipation device according to claim 10, characterized in that, The opening edge of the first groove is provided with a protrusion, which is embedded in the second mounting hole.

12. The heat dissipation device according to claim 9, characterized in that, The second connector has a cavity, which is filled with the first thermally conductive interface layer, and the first thermally conductive interface layer fills the cavity.

13. The heat dissipation device according to claim 8, characterized in that, The heat dissipation device also includes: A third thermal interface layer is disposed between the heat conductor and the heat source, and the third thermal interface layer is configured to fill the mating gap between the heat conductor and the heat source.

14. The heat dissipation device according to claim 13, characterized in that, The heat conductor has a second groove on the side facing the heat source, the third heat-conducting interface layer fills the second groove, and the third heat-conducting interface layer overflows the opening of the second groove.

15. The heat dissipation device according to any one of claims 1-6 and 8-14, characterized in that, The heat dissipation device also includes: A fourth thermal interface layer is disposed between the thermally conductive adapter and the heat sink, and the fourth thermal interface layer is configured to fill the mating gap between the thermally conductive adapter and the heat sink.

16. The heat dissipation device according to any one of claims 1-6 and 8-14, characterized in that, The heat-conducting adapter includes multiple components, each with an extended connection portion. The multiple heat-conducting adapters are detachably connected through the extended connection portion to expand the size of the heat-conducting adapter.

17. A testing device, characterized in that, Includes the heat dissipation device as described in any one of claims 1-16.

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