A flip-chip packaging structure and LED beads

By employing a multi-layer structure and precision channel design in the LED packaging structure, the problem of poor contact caused by conductive adhesive bubbles is solved, improving the stability and thermal conductivity of LED chips, making them suitable for high-density integration and high-power applications.

CN224290522UActive Publication Date: 2026-05-26DIVINE VISION (SHENZHEN) CULTURE TECH CO LTD +2
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
DIVINE VISION (SHENZHEN) CULTURE TECH CO LTD
Filing Date
2025-04-29
Publication Date
2026-05-26

AI Technical Summary

Technical Problem

Existing single-layer boss designs are prone to conductive adhesive bubbles in small-sized and high-power LED packages, leading to poor chip contact and affecting performance and lifespan.

Method used

The design employs a multi-layer structure, including a base support layer, a conductive channel layer, and a positioning nesting layer. By setting oblique channels and venting plates on the recessed sidewalls of the substrate, it ensures uniform flow of conductive adhesive and effectively removes air bubbles. Combined with bolt connections and snap-fit ​​fixation, it ensures a stable connection between the chip and the substrate.

Benefits of technology

It effectively solves the problem of bubble formation, improves conductivity and heat conduction efficiency, enhances the stability and lifespan of LED beads, and reduces thermal resistance and poor electrical connection.

✦ Generated by Eureka AI based on patent content.

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    Figure CN224290522U_ABST
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Abstract

This utility model discloses a flip-chip packaging structure, including: a base with an inner cavity; a flip structure including a chip, a base carrier layer, a conductive channel layer, and a positioning nesting layer; the base carrier layer further includes a substrate, the substrate being fixed to the bottom of the inner cavity, and the substrate having a groove; the bottom wall of the groove having multiple spaced protrusions; the side wall of the groove having an oblique channel communicating with the groove, the top end of the oblique channel extending along the bottom wall of the groove away from the groove; one side of the conductive channel layer abutting against the side of the chip near the groove, the conductive channel layer having multiple through holes for the flow of adhesive; the positioning nesting layer abutting against the chip, the positioning nesting layer being snap-fitted to the base, and the positioning nesting layer being fixedly connected to the base carrier layer. By setting the oblique groove and cooperating with the conductive channel layer, gas in the conductive adhesive escapes, greatly improving the conductivity.
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