Silicon nitride COB LED
By using a combination of a one-piece molded silicon nitride substrate and thermal grease, the problem of poor heat dissipation in LED lamps has been solved, achieving smaller size and more efficient heat dissipation, and increasing the design freedom of LED chips.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGXI HONGLI TRONIC CO LTD
- Filing Date
- 2025-05-06
- Publication Date
- 2026-05-26
Smart Images
Figure CN224290525U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED lamp bead technology, and in particular to a silicon nitride COB LED. Background Technology
[0002] With the improvement of people's living standards and the development of science and technology, the photographic lighting industry has continued to innovate and evolve. From traditional tungsten filament lamps and gas discharge lamps to modern LED lighting, photographic lighting products have undergone tremendous changes. LED lighting technology, with its advantages of high efficiency, energy saving, and environmental friendliness, has gradually become the mainstream in the lighting industry.
[0003] Driven by technologies such as the Internet of Things, big data, and artificial intelligence, concepts like intelligent dimming and color rendering in photographic lighting are gradually gaining popularity. As an important component of photography studios, advertising, music video, and video production, intelligent dimming and color-correcting products for photographic lighting have received widespread attention and promotion in their development and application.
[0004] Existing LED lamps have complex structures. For example, the heat dissipation part of the lamp consists of three layers: an aluminum substrate, a thermal grease layer, and a heat sink. This requires multiple assembly steps, resulting in high thermal resistance and relatively poor overall thermal conductivity. Furthermore, the heat dissipation requirements are high, leading to a large heat sink volume. This invention provides a COB LED lamp, where multiple LED chips are directly mounted on a substrate and then encapsulated as a whole. This results in a more compact design, better heat dissipation, and more uniform light output, thus solving the aforementioned heat dissipation problems. Utility Model Content
[0005] In view of the shortcomings of the prior art, the purpose of this utility model is to provide a silicon nitride COB LED, which aims to solve the technical problems of complex heat dissipation structure and poor heat dissipation in the heat dissipation part of the existing LED lamps.
[0006] To achieve the above objectives, this utility model is implemented through the following technical solution:
[0007] A silicon nitride COB LED includes a plurality of LED light sources and a heat dissipation substrate for fixing and dissipating heat from the plurality of LED light sources. The heat dissipation substrate is a silicon nitride substrate. Each LED light source includes an LED chip and an adhesive layer. The LED chip is soldered to one side of the silicon nitride substrate. The side of the LED chip near the silicon nitride substrate has two spaced-apart conductive layers and a thermally conductive layer. The side of the silicon nitride substrate near the LED chip has a solder layer. The plurality of LED light sources are soldered to the silicon nitride substrate through the solder layer. The adhesive layer is disposed on the side of the LED chip away from the silicon nitride substrate and is at least partially bonded to the silicon nitride substrate.
[0008] According to one aspect of the above technical solution, the silicon nitride substrate is integrally formed.
[0009] According to one aspect of the above technical solution, the thermally conductive layer is disposed between the two conductive layers.
[0010] According to one aspect of the above technical solution, the thermally conductive layer is disposed on one side of the two conductive layers.
[0011] According to one aspect of the above technical solution, the welding layer includes two welding lines, and the two conductive layers are respectively welded to the two welding lines.
[0012] According to one aspect of the above technical solution, the side of the thermally conductive layer away from the LED chip is attached to the side of the silicon nitride substrate.
[0013] According to one aspect of the above technical solution, the thermally conductive layer is made of thermally conductive silicone grease.
[0014] According to one aspect of the above technical solution, the conductive layer is a silver layer.
[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: the heat sink part assembled from multiple layers of the lamp is replaced with an integral silicon nitride substrate, reducing the overall lamp structure and thermal resistance, allowing for a smaller overall lamp heat dissipation structure design. At the same time, based on the integral silicon nitride substrate as the pad base, the versatility of LED light source soldering is improved, giving LED chips more design space, reducing restrictions on LED chip placement schemes, allowing LED chips to be placed in multiple positions and directions, and further enhancing the design space of R&D solutions. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the silicon nitride COB LED structure in the first embodiment of this utility model;
[0017] Figure 2 This is a schematic diagram of the silicon nitride COB LED structure in the second embodiment of this utility model;
[0018] Explanation of key component symbols: 1-LED light source, 11-LED chip, 12-adhesive layer, 2-silicon nitride substrate, 3-welding layer, 4-conductive layer, 5-thermal grease;
[0019] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0020] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0021] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0023] See Figure 1The first embodiment of this utility model provides a silicon nitride COB LED, comprising a plurality of LED light sources 1 and a heat dissipation substrate soldered to one side of the LED light sources 1. Each LED light source 1 includes an LED chip 11 and an adhesive layer 12. The adhesive layer 12 is disposed on the outer side of the LED chip 11 to reflect the light emitted by the LED chip 11. A portion of the adhesive layer 12 is bonded to the heat dissipation substrate, enclosing the LED chip 11 between the adhesive layer 12 and the heat dissipation substrate. Two conductive layers 4 and a thermally conductive layer are disposed on the other side of the LED chip 11. In this embodiment, the conductive layer 4 is a silver layer. It is understood that since the conductive layer 4 is a conductive material, it can also be other conductive materials, such as gold, pure copper, or other materials with high conductivity. The two conductive layers 4 protrude from one side of the LED chip 11 to form two electrode connection terminals. A heat dissipation substrate for heat dissipation is disposed on one side of the LED chip 11 of the LED light source 1. Further, in this embodiment, the heat dissipation substrate is a silicon nitride substrate 2 integrally made of silicon nitride material. A welding layer 3 is provided on one side of the silicon nitride substrate 2. The LED light source 1 is welded to the welding layer 3 through the conductive layer 4 and fixed on the silicon nitride substrate 2. A heat-conducting layer is also provided on one side of the LED chip 11 to conduct the heat emitted by the LED chip 11 to the silicon nitride substrate 2 for heat dissipation. Multiple LED light sources 1 are welded to one side of the heat dissipation substrate to form a photographic lamp structure. This direct contact between the LED chip 11 and the heat dissipation substrate made of silicon nitride through the heat-conducting layer, taking advantage of the good thermal conductivity and low thermal resistance of silicon nitride, and the integrated photographic lamp structure, further improves the heat dissipation performance of the lamp. The integrated structure makes the overall structure of the lamp simpler, so that the size of the lamp can be made smaller, giving the LED chip 11 and LED light source 1 more design space, reducing the restrictions on the placement of the LED chip 11, and allowing the LED chip 11 to be placed in multiple positions and directions, which can greatly improve the design space of the research and development solution.
[0024] Furthermore, in this embodiment, the thermal conductive layer is composed of thermally conductive silicone grease 5. Utilizing the good thermal conductivity of the silicone grease, the LED chip 11 is directly transferred to the silicon nitride substrate 2 for heat dissipation, thereby improving the heat dissipation effect. It can be understood that the larger the contact area between the thermal conductive layer and the aluminum nitride bracket and the silicon nitride substrate, the better the heat dissipation effect.
[0025] See Figure 1 In this embodiment, the thermal grease 5 is disposed between the two conductive layers 4. Since the thermal grease 5 is not conductive, the entire thermal grease 5 can be coated between the two conductive layers 4 to increase the area of the thermal grease 5, which is beneficial to improving the heat dissipation effect of the LED light source 1. Of course, a separation gap can also be set between the conductive layer 4 and the thermal grease 5.
[0026] See Figure 2In other embodiments, the thermal grease 5 is disposed on one side of the two conductive layers 4. This arrangement makes the spacing between the two conductive layers 4 closer, which is suitable for some tight and narrow welding positions. However, it is worth noting that since the two conductive layers 4 are conductive materials, the two conductive layers 4 need to be spaced apart to avoid contact that could cause a short circuit.
[0027] Furthermore, the welding layer 3 includes two welding lines, and the two conductive layers 4 are respectively welded to the two welding lines. The welding layer 3 is used to connect and conduct electricity to the LED chips 11 of the LED light source 1.
[0028] In summary, the silicon nitride COB LED in the above embodiments of this utility model reduces thermal resistance by setting the heat dissipation part of the lamp to a heat dissipation substrate made of silicon nitride material. The LED chip is directly soldered to the silicon nitride substrate, and heat is conducted through thermal grease, which improves the heat dissipation performance of the lamp and achieves a higher heat conduction effect. Furthermore, the integrated silicon nitride substrate simplifies the structure of the entire lamp, thereby controlling the overall size of the lamp and giving the LED light source more design space. It also reduces the restrictions on the placement of LED chips, allowing the LED chips to be placed in multiple positions and directions, thus greatly expanding the design space for research and development solutions.
[0029] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0030] The above-described embodiments are merely illustrative of several implementations of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the appended claims.
Claims
1. A silicon nitride COB LED, characterized in that, The device includes a plurality of LED light sources and a heat dissipation substrate for fixing and dissipating heat from the plurality of LED light sources. The heat dissipation substrate is a silicon nitride substrate. Each LED light source includes an LED chip and an adhesive layer. The LED chip is soldered to one side of the silicon nitride substrate. The side of the LED chip near the silicon nitride substrate has two spaced-apart conductive layers and a thermally conductive layer. The side of the silicon nitride substrate near the LED chip has a welding layer. The plurality of LED light sources are soldered to the silicon nitride substrate through the welding layer. The adhesive layer is disposed on the side of the LED chip away from the silicon nitride substrate and is at least partially bonded to the silicon nitride substrate.
2. The silicon nitride COB LED according to claim 1, characterized in that, The silicon nitride substrate is integrally formed.
3. The silicon nitride COB LED according to claim 1, characterized in that, The thermally conductive layer is disposed between the two conductive layers.
4. The silicon nitride COB LED according to claim 1, characterized in that, The thermally conductive layer is disposed on one side of the two conductive layers.
5. The silicon nitride COB LED according to claim 1, characterized in that, The welding layer includes two welding lines, and the two conductive layers are respectively welded to the two welding lines.
6. The silicon nitride COB LED according to claim 1, characterized in that, The thermally conductive layer is attached to the side of the silicon nitride substrate away from the LED chip.
7. The silicon nitride COB LED according to claim 6, characterized in that, The thermally conductive layer is made of thermally conductive silicone grease.
8. The silicon nitride COB LED according to claim 1, characterized in that, The conductive layer is a silver layer.