Wafer transfer device

Abstract

The utility model provides a wafer transfer device, which comprises an equipment front-end module and at least one airflow equipment, and is characterized in that the side surface of the equipment front-end module is provided with at least one loading port, and the loading port is used for loading a front-opening transmission box; a fan filtering unit is arranged at the top of the equipment front-end module and is used for sucking air in the dust-free room environment and generating downward laminar airflow in the equipment front-end module; the airflow equipment is arranged on the inner side wall of the equipment front-end module, and is positioned above the loading port and below the fan filtering unit; the airflow equipment comprises at least one airflow channel, a heater and a supercharger are arranged between the air inlet end of the airflow channel and the fan filtering unit, and the supercharger and the heater are sequentially communicated to the air inlet end of the airflow channel through an airflow pipeline; part of laminar airflow exhausted by the fan filtering unit is guided into the heater through the supercharger, heated by the heater and then exhausted downwards through the airflow channel, so that a downward laminar airflow wall is formed at the loading opening.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor integrated circuit manufacturing technology, and in particular to a wafer transfer device. Background Technology

[0002] Semiconductor integrated circuits can be manufactured using a variety of processes, such as thermal oxidation, diffusion, ion implantation, RTP (rapid thermal processing), CVD (chemical vapor deposition), PVD (physical vapor deposition), etching, and photolithography. Semiconductor wafers are placed in a front-opening unified pod (FOUP) for storage between process steps and for transport between various process machines.

[0003] The Equipment Front-End Module (EFEM) is the area where wafers are transported in the atmospheric environment. The EFEM has at least one loading port on its side for loading FOUPs, and a Fan Filter Unit (FFU) on its top. The FFU draws air from the cleanroom environment into the EFEM to create a small, positive-pressure, downward laminar flow, dust-free environment, ensuring the wafers are not contaminated by microparticles.

[0004] Since the front door of the FOUP is open, the FOUP is connected to the interior of the EFEM through the loading port. Even if the FOUP is in a purging state, the laminar flow pressure provided by the FFU in the EFEM is still higher than the pressure in the FOUP. Ambient air from the EFEM will enter the FOUP. Then, gaseous molecular pollutants and water molecules in the ambient air will react with the wafers in the FOUP, which will cause defects in the wafers.

[0005] Therefore, how to prevent ambient air from entering the FOUP from the EFEM, and thus prevent gaseous molecular pollutants and water molecules in the ambient air from reacting with the wafers in the FOUP, has become a technical problem that urgently needs to be solved in this field. Utility Model Content

[0006] To solve the above-mentioned technical problems, this utility model provides a wafer transfer device, comprising:

[0007] The equipment front-end module has at least one loading port on its side for loading a front-opening conveyor box; the top of the equipment front-end module has a fan filter unit for drawing in air from the cleanroom environment and generating a downward laminar airflow within the equipment front-end module.

[0008] At least one airflow device is disposed on the inner wall of the front-end module of the device, and located above the loading port and below the fan filter unit; the airflow device includes at least one airflow channel, and a heater and a booster are provided between the air inlet end of the airflow channel and the fan filter unit, the booster and the heater being connected to the air inlet end of the airflow channel in sequence through an airflow pipeline; a portion of the laminar airflow discharged from the fan filter unit is introduced into the heater through the booster, and after being heated by the heater, it is discharged downward through the airflow channel to form a downward laminar air wall at the loading port.

[0009] Optionally, the airflow device further includes a temperature and humidity detection channel and a temperature and humidity sensor, wherein the temperature and humidity sensor is connected to the temperature and humidity detection channel and is used to detect the temperature and humidity of the laminar air wall at the loading port.

[0010] Optionally, the wafer transfer device may further include a controller connected to the temperature and humidity sensor and the heater.

[0011] Optionally, the airflow device further includes an acid-base detection channel for detecting the acidity or alkalinity of the laminar air wall at the loading port, the acid-base detection channel being connected to an acid-base analyzer outside the front-end module of the device via a connecting pipe.

[0012] Optionally, the airflow device further includes a device body, which includes a rear side that is in close contact with the inner wall of the device front end module and a front side that is opposite to the rear side. The front side includes an upper inclined surface and a lower vertical surface. The upper inclined surface gradually slopes away from the rear side from top to bottom, and the lower end of the upper inclined surface is integrally connected to the upper end of the lower vertical surface.

[0013] Optionally, the inclination angle of the upper inclined surface is 45°.

[0014] Optionally, the main body of the device further includes an upper end face and a lower end face, the upper end face connecting the upper inclined surface and the rear side surface, and the lower end face connecting the lower vertical surface and the rear side surface; the airflow channel passes through the upper end face and the lower vertical surface of the main body of the device.

[0015] Optionally, the distance between the lower end face and the upper edge of the loading port is 15-25 mm.

[0016] Optionally, a chemical filter may also be provided between the heater and the air inlet of the airflow channel.

[0017] Optionally, the air outlet end of the airflow channel is also provided with a nozzle.

[0018] Compared with the prior art, the technical solution of this utility model embodiment has the following beneficial effects:

[0019] The front-end module of the equipment has at least one loading port on its side for loading a front-opening conveyor box. A fan filter unit is located on the top of the front-end module. Air from the cleanroom environment is drawn into the front-end module through the fan filter unit to create a small, positive-pressure, downward laminar flow, and dust-free environment. The front-opening conveyor box is loaded onto the loading port of the front-end module, and the front door of the front-opening conveyor box is opened, thus connecting the front-opening conveyor box to the interior of the front-end module through the loading port. Since the pressure of the laminar airflow inside the front-end module is greater than the pressure inside the front-opening conveyor box, to prevent ambient air from entering the front-opening conveyor box and causing gaseous pollutants and water molecules in the ambient air to react with the wafer inside the front-opening conveyor box, thereby causing defects in the wafer, this invention provides at least one airflow device on the inner wall of the front-end module. The airflow device is located on the inner wall of the front-end module, above the loading port and below the fan filter unit. The airflow device includes at least one airflow channel. A heater and a booster are provided between the air inlet end of the airflow channel and the fan filter unit. The booster and the heater are connected to the air inlet end of the airflow channel in sequence through an airflow pipeline. Part of the laminar airflow discharged from the fan filter unit in the front module of the device is introduced into the heater through the booster and then discharged downward through the airflow channel to form a downward laminar air wall at the loading port. The laminar air wall can prevent the ambient air in the front module of the device from entering the front opening transfer box, preventing gaseous molecular pollutants and water molecules in the ambient air from reacting with the wafers in the front opening transfer box, thereby improving the wafer yield.

[0020] Meanwhile, this invention heats part of the laminar airflow discharged through the fan filter unit using a heater. As the air temperature rises, the saturated vapor pressure rises, so each kilogram of air can hold more water vapor. Therefore, the water vapor on the wafer surface will detach from the wafer surface and be adsorbed into the air, making the wafer surface dry and less prone to reaction, thereby improving the wafer yield. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a wafer transfer device provided in an embodiment of the present invention;

[0023] Figure 2This is a schematic diagram of the structure of the air inlet end of the front-end module of the device provided in an embodiment of the present invention;

[0024] Figure 3 This is a schematic diagram of the airflow device structure provided in an embodiment of the present invention;

[0025] Figure 4 This diagram illustrates the process by which water vapor on the wafer surface detaches from the wafer surface and is adsorbed into the air as the temperature rises, according to an embodiment of the present invention.

[0026] Explanation of reference numerals in the attached figures:

[0027] 1--Equipment front-end module;

[0028] 101 -- Loading port;

[0029] 2--Airflow equipment;

[0030] 201--Main body of the equipment;

[0031] 20101 -- Rear side;

[0032] 20102 -- Upper inclined surface;

[0033] 20103 -- Bottom vertical surface;

[0034] 20104 -- Top surface;

[0035] 202 -- Airflow channel;

[0036] 203 -- Temperature and humidity sensor;

[0037] 204 -- pH detection channel;

[0038] 3--Front-opening transfer box;

[0039] 4--Supercharger;

[0040] 5--Filter;

[0041] 6--Fan filter unit;

[0042] 601 -- Fan;

[0043] 602 -- Filter module;

[0044] 7--Heater;

[0045] 8--Controller

[0046] 9--Acid-base analyzer;

[0047] 10 -- Wafer. Detailed Implementation

[0048] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0049] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus. The terms "above" and "over," and any variations thereof, are intended to describe positional relationships and do not imply direct contact between the described objects.

[0050] Please refer to Figures 1 to 3 One embodiment of the present invention provides a wafer transfer device, which may include a device front-end module 1. The device front-end module 1 has at least one loading port 101 on its side, and the loading port 101 is used to load a front-opening transfer box 3.

[0051] Among them, the front-opening transfer box 3 is used to load wafers.

[0052] In this embodiment, the front-opening conveyor box 3 may include a housing with a front opening and a front door, the front door being used to open and close the front opening of the housing. The bottom of the housing is provided with a purge inlet and a purge outlet. Purge gas is introduced into the housing through the purge inlet, which can blow out contaminants inside the housing from the purge outlet.

[0053] In this embodiment, a fan filter unit 6 is provided on the top of the front-end module 1 of the equipment. The fan filter unit 6 is used to draw in air from the cleanroom environment and generate a downward laminar airflow within the front-end module 1 of the equipment.

[0054] Specifically, the top of the front-end module 1 of the equipment is provided with an air inlet. The fan filter unit 6 may include a fan 601 and a filter module 602. The fan 601 is located at the air inlet at the top of the front-end module 1 of the equipment, and the filter module 602 is located below the fan 601. When the fan 601 is working, it draws air from the cleanroom environment into the front-end module 1 of the equipment from the air inlet, and after being filtered by the filter module 602, it generates a downward laminar airflow into the front-end module 1 of the equipment.

[0055] In this embodiment, the wafer transfer apparatus may further include at least one airflow device 2, which is disposed on the inner sidewall of the front-end module 1 of the apparatus and located above the loading port 101 and below the fan filter unit 6.

[0056] In this embodiment, the front-opening transfer box 3 is mounted on the loading port 101, and the front door is opened, so the front-opening transfer box 3 communicates with the interior of the device front-end module 1 through the loading port 101. By installing at least one airflow device 2 on the inner wall of the device front-end module 1, above the loading port 101 and below the fan filter unit 6, the problem of ambient air entering the front-opening transfer box 3 due to the pressure of the laminar airflow in the device front-end module 1 being greater than the pressure in the front-opening transfer box 3 can be avoided. This would prevent gaseous pollutants and water molecules in the ambient air from reacting with the wafer in the front-opening transfer box 3, thus causing defects in the wafer.

[0057] In this embodiment, the airflow device 2 may include at least one airflow channel 202. A heater 7 and a booster 4 are provided between the air inlet end of the airflow channel 202 and the fan filter unit 6. The booster 4 and the heater 7 are connected to the air inlet end of the airflow channel 202 in sequence through an airflow pipeline.

[0058] In this embodiment, part of the laminar airflow discharged from the fan filter unit 6 is pressurized by the booster 4 and then introduced into the heater 7. The high-pressure gas pressurized by the booster 4 is heated by the heater 7 and discharged downward through the connected airflow channel 202 to form a downward high-pressure laminar air wall at the loading port 101. The laminar air wall can prevent the ambient air in the front module 1 of the equipment from entering the front opening conveyor box 3.

[0059] In the above embodiment, the heater 7 heats part of the laminar airflow discharged from the fan filter unit 6. Because the increased air temperature causes an increase in saturated vapor pressure, each kilogram of air can hold more water vapor. Therefore, please refer to... Figure 4 Water vapor on the surface of wafer 10 will detach from the surface of wafer 10 and be adsorbed into the air, making the surface of wafer 10 dry and less prone to reaction, thereby improving the yield of wafer 10.

[0060] As one embodiment, the airflow device 2 may further include a temperature and humidity sensor 203 for detecting the temperature and humidity of the laminar air wall at the loading port 101. The temperature and humidity sensor 203 is connected to the controller 8, and the controller 8 is also connected to the heater 7.

[0061] In this embodiment, the temperature and humidity of the laminar air wall at the loading port 101 are detected by the temperature and humidity sensor 203, and the temperature and humidity signal is transmitted to the controller 8. The controller 8 controls the operation of the heater 7 so that the temperature and humidity of the laminar air wall at the loading port 101 reach the set temperature and humidity.

[0062] Furthermore, to facilitate the installation of the temperature and humidity sensor 203, the airflow device 2 may also include a temperature and humidity detection channel, in which the temperature and humidity sensor 203 is disposed.

[0063] As one embodiment, the airflow device 2 may further include an acid-base detection channel 204 for detecting the acidity or alkalinity of the laminar air wall at the loading port 101. The acid-base detection channel 204 is connected to an acid-base analyzer 9 outside the device's front-end module 1 via a connecting pipe. The acid-base analyzer 9 has a negative pressure device. When it is necessary to detect the acidity or alkalinity of the laminar air wall at the loading port 101, a portion of the airflow from the laminar air wall at the loading port 101 is drawn into the acid-base analyzer 9 through the acid-base detection channel 204 via the negative pressure device. The acid-base analyzer 9 then measures the acidity or alkalinity of the laminar air wall at the loading port 101. If the acidity or alkalinity of the laminar air wall detected by the acid-base analyzer 9 exceeds a set value, a chemical filter needs to be installed at the air inlet of the device's front-end module 1 to ensure that the acidity or alkalinity of the laminar air wall does not exceed the set value. If the acidity or alkalinity of the laminar air wall detected by the acid-base analyzer 9 does not exceed the set value, a chemical filter is not required at the air inlet of the device's front-end module 1.

[0064] As one embodiment, the airflow device 2 may further include a device body 201. The device body 201 includes a rear side surface 20101 that is closely attached to the inner wall of the device front-end module 1 and a front side surface opposite to the rear side surface 20101. The front side surface includes an upper inclined surface 20102 and a lower vertical surface 20103. The upper inclined surface 20102 gradually slopes away from the rear side surface 20101 from top to bottom, and the lower end of the upper inclined surface 20102 is integrally connected to the upper end of the lower vertical surface 20103. This embodiment uses the inclined upper inclined surface 20102 to allow the downward laminar airflow to move away from the front opening transfer box 3, thus avoiding affecting the wafers inside the front opening transfer box 3.

[0065] In this embodiment, if the tilt angle of the upper inclined surface 20102 is too small, the volume of the main body 201 of the device will be too large, which will affect the operation of the robotic arm in the front module 1 of the device; if the tilt angle of the upper inclined surface 20102 is too large, the guiding effect of the upper inclined surface 20102 will be poor. Therefore, it is preferable that the tilt angle of the upper inclined surface 20102 is 45°.

[0066] Furthermore, the main body 201 may also include an upper end face 20104 and a lower end face. The upper end face 20104 is connected to the upper end of the rear side face 20101 and the upper end of the upper inclined surface 20102. The airflow channel 202 passes through the upper end face 20104 and the lower vertical surface 20103 of the main body 201.

[0067] The lower end face connects the lower end of the rear side 20101 and the lower end of the lower vertical face 20103. The distance between the lower end face and the upper edge of the loading port 101 is 15-25mm. The purpose is to ensure that the installation of the airflow device 2 does not affect the opening and closing of the front door of the front opening conveyor box 3, as well as the operation of the robotic arm in the front module 1 of the device.

[0068] The air outlet of the airflow channel 202 is also equipped with a nozzle, which is intended to expand the area of ​​the air wall sprayed from the air outlet so that the air wall can completely cover the loading port 101, thereby preventing the ambient air in the front module 1 of the equipment from entering the front opening conveyor box 3 through the loading port 101.

[0069] Furthermore, the temperature and humidity detection channel and the pH detection channel 204 also penetrate the upper end surface 20104 and the lower vertical surface 20103 of the main body of the device 201.

[0070] As one embodiment, a filter 5 is also provided in the airflow duct between the heater 7 and the airflow channel 202, so as to further filter the air heated by the heater 7.

[0071] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer transfer device, comprising: include: The device front-end module has at least one loading port on its side, which is used to load a front-opening conveyor box. The top of the front-end module of the equipment is equipped with a fan filter unit, which is used to draw in air from the cleanroom environment and generate a downward laminar airflow within the front-end module of the equipment. At least one airflow device is disposed on the inner wall of the front-end module of the device, and located above the loading port and below the fan filter unit; the airflow device includes at least one airflow channel, and a heater and a booster are provided between the air inlet end of the airflow channel and the fan filter unit, the booster and the heater being connected to the air inlet end of the airflow channel in sequence through an airflow pipeline; a portion of the laminar airflow discharged from the fan filter unit is introduced into the heater through the booster, and after being heated by the heater, it is discharged downward through the airflow channel to form a downward laminar air wall at the loading port.

2. The wafer transfer device of claim 1, wherein, The airflow device also includes a temperature and humidity detection channel and a temperature and humidity sensor. The temperature and humidity sensor is connected to the temperature and humidity detection channel and is used to detect the temperature and humidity of the laminar air wall at the loading port.

3. The wafer transfer device of claim 2, wherein, The wafer transfer apparatus also includes a controller connected to the temperature and humidity sensor and the heater.

4. The wafer transfer apparatus according to claim 1, characterized in that, The airflow device also includes an acid-base detection channel for detecting the acidity or alkalinity of the laminar air wall at the loading port. The acid-base detection channel is connected to an acid-base analyzer outside the front-end module of the device via a connecting pipe.

5. The wafer transfer apparatus according to claim 1, characterized in that, The airflow device also includes a device body, which includes a rear side that is close to the inner wall of the front end module of the device and a front side that is opposite to the rear side. The front side includes an upper inclined surface and a lower vertical surface. The upper inclined surface gradually slopes away from the rear side from top to bottom. The lower end of the upper inclined surface is integrally connected to the upper end of the lower vertical surface.

6. The wafer transfer apparatus according to claim 5, characterized in that, The inclination angle of the upper inclined surface is 45°.

7. The wafer transfer apparatus according to claim 5, characterized in that, The main body of the device also includes an upper end face and a lower end face. The upper end face connects the upper inclined surface and the rear side surface, and the lower end face connects the lower vertical surface and the rear side surface. The airflow channel passes through the upper end face and the lower vertical surface of the main body of the device.

8. The wafer transfer apparatus according to claim 7, characterized in that, The distance between the lower end face and the upper edge of the loading port is 15-25mm.

9. The wafer transfer apparatus according to claim 1, characterized in that, A chemical filter is also provided between the heater and the air inlet of the airflow channel.

10. The wafer transfer apparatus according to claim 1, characterized in that, The air outlet of the airflow channel is also equipped with a nozzle.

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