Submerged cooling device

Abstract

The immersion cooling device comprises a case, a liquid outlet hole arranged at the middle of the wall plate of the case, electronic elements arranged in the case, an overflow funnel in communication with the inner cavity and the liquid outlet hole, a radiator module comprising a radiator attached to the surface of the first electronic element, a fluid distribution pipe with multiple branches arranged in the case and in fluid connection with the liquid inlet hole, each branch being in fluid connection with a radiator module, the cooling liquid entering the radiator through the fluid distribution pipe, being heated in the radiator and being discharged to the side of the case away from the liquid outlet hole, the first electronic element being arranged in the case in an arrayed manner and vertically and close to the liquid outlet hole, the third electronic element being arranged directly or indirectly on the bottom plate of the case, the heated surface of the third electronic element being in the covered area of the flow track of the cooling liquid in the case, and the first electronic element being partially immersed in the cooling liquid. The immersion cooling device reduces the amount of cooling liquid and the cost, and ensures the heat dissipation effect through differential flow distribution.

Description

Technical Field

[0001] This utility model belongs to the technical field of liquid cooling devices for electronic equipment, specifically relating to an immersion cooling device for electronic equipment such as servers. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence and big data, data centers are facing an ever-increasing demand for high-density computing. In the past, the industry generally adopted air cooling or cold plate liquid cooling technology as the main heat dissipation solutions. However, these traditional heat dissipation methods have gradually shown limitations in high power density scenarios. For example, air cooling systems are limited by air convection efficiency and cannot cope with the heat dissipation needs of racks exceeding 30kW; although cold plate liquid cooling can improve local heat dissipation capacity, it still relies on air-assisted heat dissipation, and the overall energy efficiency improvement is limited.

[0003] Immersion liquid cooling is an emerging liquid cooling technology in recent years. Immersion liquid cooling features direct contact cooling, theoretically providing higher heat dissipation efficiency. However, existing full immersion liquid cooling solutions still have some shortcomings in practical applications: for example, the full immersion design requires a large amount of coolant, which not only increases the construction cost of data centers but also brings additional burdens for coolant maintenance and replacement. Furthermore, in a full immersion design, the natural flow of coolant within the sealed cavity is poor, resulting in lower heat exchange efficiency and an inability to effectively control the operating temperature of high-power chips such as GPUs. Due to poor flow, uneven temperature distribution is also prone to occur, with prominent localized hotspots affecting the reliability of equipment operation. These problems restrict the large-scale application of immersion liquid cooling technology in data centers. Utility Model Content

[0004] The purpose of this invention is to provide an immersion liquid cooling device that can reduce costs, has good heat dissipation effect, and high heat dissipation efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An immersion cooling device includes: a chassis with a liquid inlet and a liquid outlet, the liquid outlet being located in the middle of a wall panel of the chassis; a first electronic component and a third electronic component disposed within the chassis, the first electronic component generating more heat than the third electronic component; an overflow funnel disposed within the chassis and communicating with the liquid outlet, through which coolant flows into the liquid outlet; a heat sink module disposed within the chassis, the heat sink module including a heat sink attached to the surface of the first electronic component; and a fluid distribution pipe disposed within the chassis and fluidly connected to the liquid inlet. The fluid distribution pipe has multiple branches, each of which is fluidly connected to a heat sink module. After the coolant enters the heat sink through the fluid distribution pipe and completes heat exchange, it is discharged from the heat sink to the side of the chassis away from the outlet hole. The first electronic component is vertically arranged and arrayed in the chassis on the side near the outlet hole. The third electronic component is directly or indirectly disposed on the bottom plate of the chassis. The heated surface of the third electronic component is within the area covered by the flow path of the coolant in the chassis. The first electronic component is partially immersed in the coolant in the chassis.

[0007] In some embodiments, an overflow funnel with an inner cavity communicating with the liquid outlet is provided inside the chassis at the liquid outlet. The top of the overflow funnel is open to form an overflow port, which is located below the coolant level inside the chassis and above the lowest edge of the liquid outlet.

[0008] In some embodiments, the overflow funnel is disposed on the wall panel where the liquid outlet is located. The overflow funnel includes an inclined plate opposite to the liquid outlet and two side plates respectively disposed on both sides of the inclined plate. The bottom of the inclined plate and the side plates are connected to the wall panel where the liquid outlet is located.

[0009] In some embodiments, the liquid outlet and the liquid inlet are located on the same side of the chassis.

[0010] In some embodiments, a flow distribution chamber communicating with the liquid inlet is provided inside the chassis at the liquid inlet, and the fluid distribution pipe is connected to the flow distribution chamber, wherein the fluid distribution pipe is a manifold.

[0011] In some embodiments, a second electronic component is further included on the third electronic component. The heat generated by the second electronic component is less than that generated by the first electronic component. The second electronic component is located on the side of the chassis away from the liquid outlet and is covered in a cooling chamber. The cooling chamber is fluidly connected to the radiator module through a connecting pipe. After the coolant that has completed heat exchange in the radiator module enters the cooling chamber for heat exchange, it is discharged from the cooling chamber to the side of the chassis away from the liquid outlet.

[0012] In some embodiments, the outlet of the radiator at the end of the radiator module is connected to a liquid outlet pipe, the outlet of which is horizontally or downwardly positioned and located below the coolant level inside the chassis.

[0013] In some embodiments, the outlet of the cooling chamber is connected to a liquid outlet pipe, the outlet of which is horizontal or downward and located below the coolant level inside the chassis.

[0014] In some embodiments, the device further includes a mounting bracket and a cold plate mounting member disposed within the chassis. The heat sink is a cold plate. The mounting bracket includes a base plate and a back plate connected together. The base plate forms a receiving groove for accommodating the third electronic component. The cold plate mounting member is inserted into the mounting bracket and located above the receiving groove. The cold plate and the first electronic component are disposed on the cold plate mounting member.

[0015] In some embodiments, the first electronic component is a GPU, and the third electronic component includes a motherboard, a power supply component, and a network card. The motherboard is disposed on the bottom plate of the chassis and located on the side of the chassis away from the liquid outlet. The power supply component is disposed on the bottom plate of the chassis and housed in the receiving slot. The motherboard and the power supply component are in a fully submerged state, and the network card is inserted into the mounting bracket and is in a semi-submerged state.

[0016] As can be seen from the above technical solution, this utility model adopts a design scheme of direct connection of fluid distribution pipe to heat sink. The fluid distribution pipe realizes the distribution and delivery of coolant. Simultaneously, the first heat sink is arranged in an array and concentrated on the side of the chassis near the outlet. The coolant first passes through the heat sink to enhance the heat dissipation and cooling of electronic components with high heat generation, meeting the heat dissipation requirements of these components. The coolant flows from the fluid distribution pipe through each heat sink in the heat sink module to complete heat exchange before converging into the chassis, flowing from far to near towards the outlet, and then flowing out from the outlet. During this process, heat dissipation can be achieved for electronic components along the return path, including those that have already passed through the heat sink. The secondary cooling of electronic components after heat dissipation by the radiator enhances the heat dissipation effect. Furthermore, by changing the height of the outlet, the coolant in the chassis does not completely fill the chassis, which helps improve the flow of coolant within the chassis. Electronic components can be fully or partially submerged in the coolant for heat exchange, creating a differentiated flow rate distribution within the system. The returning liquid maintains a basic flow rate, while the liquid flowing through the radiator achieves an enhanced flow rate. This flow rate gradient design not only effectively avoids the accumulation of local hot spots and optimizes resource utilization efficiency while ensuring heat dissipation performance, but also reduces costs by decreasing the amount of coolant used.

[0017] In a further technical solution, this utility model not only controls the flow rate of coolant in the heat dissipation branch through the fluid distribution pipe to match the heat load inside the branch, but also sets the positions of different electronic components in the branch according to the different heat flux densities of the electronic components. For example, electronic components with low heat flux density, such as the CPU, are placed at the end of the branch, while electronic components with high heat flux density, such as the GPU, are placed at the beginning of the branch. This can ensure that the temperature rise of each component is within a reasonable range, and can also reduce the overall flow rate and reduce the power consumption of the system. Attached Figure Description

[0018] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the immersion cooling device after removing the top cover plate according to an embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the internal structure of the immersion cooling device according to an embodiment of the present invention;

[0021] Figure 3 This is a top view of the immersion cooling device according to an embodiment of the present invention after removing the top cover plate;

[0022] Figure 4 This is an exploded view of the immersion server according to an embodiment of the present invention;

[0023] Figure 5 This is a schematic diagram of the cold plate mounting bracket according to an embodiment of the present utility model;

[0024] Figure 6 This is a structural schematic diagram of the cold plate mounting bracket from another angle according to an embodiment of this utility model;

[0025] Figure 7 This is a schematic diagram of the overflow funnel according to an embodiment of the present invention;

[0026] Figure 8 This is a structural schematic diagram of the overflow funnel from another angle, according to an embodiment of the present invention.

[0027] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Detailed Implementation

[0028] The present invention will now be described in detail with reference to the accompanying drawings. In the detailed description of the embodiments of the present invention, for ease of explanation, the drawings illustrating the device structure will be partially enlarged without adhering to the general scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. It should be noted that the drawings are in a simplified form and use non-precise scales, solely for the purpose of conveniently and clearly illustrating the embodiments of the present invention. Additionally, in the description of this application, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Terms such as "positive," "negative," "bottom," "upper," "lower," "front," "rear," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0029] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0030] like Figure 1 As shown, the immersion cooling device in this embodiment includes a casing 1, a fluid distribution pipe 2, a cold plate mounting component 3, a mounting bracket 4, a cooling chamber 5, several connecting pipes 6, and a cold plate (not shown). The immersion cooling device is connected to an external coolant circulation system via pipes (not shown). The coolant is introduced into the immersion cooling device by a fluid drive unit such as a circulation pump, and returns to the coolant circulation system after heat exchange.

[0031] In this embodiment, the chassis 1 is a closed structure composed of a top plate, a bottom plate, side plates, a front plate, and a back plate, forming an internal space to accommodate electronic components. The chassis 1 can also be filled with coolant. The chassis 1 has a front end and a rear end. The front end of the chassis 1 is generally equipped with components such as switches or handles, while the rear end is the end opposite to the front end. The front end is usually facing the operator for ease of operation.

[0032] The chassis 1 has a coolant inlet (not shown) and a coolant outlet a. The coolant inlet is connected to a coolant circulation system via a pipe, allowing coolant to enter the chassis 1. The coolant outlet a is also connected to the coolant circulation system via a pipe, allowing the cooled coolant to exit the chassis 1 after heat exchange. The coolant inlet and outlet a can be located on a side panel, front panel, back panel, or other chassis wall panel. In this embodiment, both the coolant inlet and outlet a are located on the back panel of the chassis 1, at the rear end of the chassis 1. The outlet a is located in the middle of the back panel (wall panel), at half the height of the chassis 1. Furthermore, in this embodiment, the coolant inlet is located above the outlet a.

[0033] The fluid distribution pipe 2 is connected to the inlet port, through which coolant enters the chassis 1 and then into the fluid distribution pipe 2. In this embodiment, a flow divider 7 is provided at the inlet port, which is connected to the inlet port, and the fluid distribution pipe 2 is connected to the flow divider 7. The coolant enters the flow divider 7 through the inlet port and then enters the fluid distribution pipe 2, which is connected to the flow divider 7.

[0034] In this embodiment, the fluid distribution pipe 2 is a manifold, which is a fluid conduit commonly used to control the flow path and flow rate distribution of fluids such as liquids or gases. The fluid distribution pipe 2 in this embodiment has three branches, through which the coolant can dissipate heat from the electronic components located on each branch.

[0035] The chassis 1 houses various electronic components, such as the GPU, CPU, motherboard, network card, and power supply components (battery, power supply). These components generate varying amounts of heat and have different cooling requirements. In this embodiment, the electronic components are broadly categorized into three groups: the first group consists of high-heat-generating components (A), such as the GPU; the second group consists of high-heat-generating components (B), such as the CPU; and the third group consists of relatively low-heat-generating components (C), such as the motherboard, network card, and power supply components. The heat generation of the first electronic component A is greater than that of the second electronic component B, which in turn is greater than that of the third electronic component C. The cooling requirements of each component correspond to its heat generation, with the first electronic component A having the highest cooling requirement.

[0036] For electronic components with high heat dissipation requirements, this embodiment employs a combination of localized enhanced heat dissipation via a cold plate and immersion cooling. The first electronic component A is mounted on a cold plate mounting component 3, which also houses a cold plate with coolant channels for circulating coolant. The cold plate, mounted on the cold plate mounting component 3, is attached to the surface of the first electronic component A. As the coolant flows through the coolant channels within the cold plate, it carries away the heat generated by the first electronic component A, thus providing localized enhanced heat dissipation for the heat-generating first electronic component A.

[0037] like Figure 5 and Figure 6As shown, the cold plate mounting component 3 in this embodiment is equipped with a liquid inlet / outlet module 3-1. The cold plate is connected to the fluid distribution pipe 2 and / or the connecting pipe 6 through the liquid inlet / outlet module 3-1. The cold plate serves as a radiator, and multiple cold plates are connected in series through the connecting pipe 6 to form a cold plate module (radiator module). The fluid distribution pipe 2 is connected to one of the cold plates in the cold plate module. After the coolant flows into the fluid distribution pipe 2, it enters the coolant flow channel in the cold plate through the liquid inlet / outlet module 3-1, then flows out of the cold plate through the connecting pipe 6, and enters another cold plate connected in series with the cold plate. This process continues, with the coolant flowing through each cold plate in the cold plate module in sequence, and then flowing out from the connecting pipe 6 connected to the last cold plate (the end cold plate).

[0038] In this embodiment, a total of eight GPUs (first electronic component A), two CPUs (second electronic component B), and a third electronic component C, including a motherboard c1, a network card c2, and a power supply component c3, are installed inside the chassis 1. The fluid distribution pipe 2 in this embodiment has three heat dissipation branches for cooling the eight GPUs and two CPUs. Each heat dissipation branch is connected to a cold plate module. Two of the cold plate modules on each branch include three cold plates connected in series via a connecting pipe 6, each cooling one of the three GPUs. The cold plate module on the third branch includes two cold plates connected in series via a connecting pipe 6, each cooling one of the two GPUs, and a cooling cavity 5 for cooling the two CPUs. The cooling cavity 5 is located after the cold plates, meaning the coolant passes through the cold plates first and then through the cooling cavity 5. In other embodiments, the types and quantities of electronic components can vary depending on the actual situation, and the branches of the fluid distribution pipe can also be varied accordingly. This is not limited here.

[0039] To better guide the flow and prevent liquid from spraying randomly, the outlet of the end cold plate (the last cold plate in the coolant flow path of the cold plate module) or the outlet of the cooling cavity is connected to a liquid outlet pipe 6a. After the coolant flows in the heat dissipation branch and completes heat exchange, it flows out from the liquid outlet pipe 6a and into the chassis 1. When the outlet end of the liquid outlet pipe 6a is set upward, it will generate noise from liquid scouring. In order to reduce noise, the outlet of the liquid outlet pipe 6a is preferably set horizontally or downward, and the outlet of the liquid outlet pipe 6a is located below the coolant level in the chassis 1.

[0040] In this invention, the coolant outlet a of the chassis 1 is located in the middle of the chassis 1, such as at 1 / 3 to 2 / 3 of the chassis height. There is a certain distance between the coolant outlet a and the bottom plate, and the coolant will form a certain liquid level in the chassis 1, which can submerge the third electronic component C. That is, the heated surface of the third electronic component C is within the area covered by the coolant flow trajectory, so the third electronic component C can directly exchange heat with the coolant for heat dissipation. The coolant outlet pipe 6a is located at the last section of the heat dissipation branch. The coolant discharged from the coolant outlet pipe 6a will flow from far to near towards the coolant outlet a (the part far from the coolant outlet is the far end). When the liquid level in the chassis 1 reaches the height of the coolant outlet a, the coolant will naturally flow outward and enter the external coolant circulation pipeline. After being temperature controlled by the heat exchange equipment, it will circulate back to the inlet.

[0041] The coolant outlet a is located in the middle of the chassis wall panel (midpoint of the chassis height). The coolant level reaches the outlet and overflows, ensuring that electronic components within chassis 1 are at least partially submerged. These submerged components can directly exchange heat with the coolant for cooling. Furthermore, after exiting from the various cooling channels, the coolant naturally flows from the furthest point to outlet a within chassis 1, maintaining good flow within the chassis. This flow is better than a fully submerged system, preventing uneven temperature distribution due to poor flow. For the primary electronic components with high heat generation and cooling requirements, a cold plate is used to enhance heat dissipation, preventing localized hotspots. Simultaneously, thanks to the cold plate's cooling effect on high-heat components, the semi-submerged approach within the chassis is sufficient to cool other electronic components, reducing coolant consumption and lowering costs.

[0042] In practical applications, the inventors discovered that during the overflow of coolant through outlet a, the central area near outlet a tends to have rapid backflow, while the areas on both sides have relatively slow backflow, resulting in inconsistent cooling efficiency. To solve this problem, this embodiment provides an overflow funnel 10 at outlet a, which is connected to outlet a.

[0043] Reference Figure 4 , Figure 7 and Figure 8In this embodiment, the overflow funnel 10 is a semi-open structure composed of a pair of side plates 10-1 and a sloping plate 10-2. The overflow funnel 10 is wider at the top and narrower at the bottom. The side plates 10-1 are located on both sides of the sloping plate 10-2, and the sloping plate 10-2 is opposite to the liquid outlet a of the chassis 1. In this embodiment, the overflow funnel 10 is fixed to the wall panel of the chassis 1 with the liquid outlet a, and in this embodiment, it is fixed to the back plate. The top of the overflow funnel 10 is open, forming an overflow port. Coolant enters the overflow funnel 10 from the overflow port, is collected by the overflow funnel 10, and then flows out from the liquid outlet a. The overflow outlet formed at the top of the overflow funnel 10 is higher than the lowest edge of the outlet hole a, and the height of the overflow outlet is below the coolant surface inside the chassis 1. The projected area of ​​the overflow funnel 10 on the plane where the outlet hole a is located is larger than the outlet hole a. The coolant first enters the overflow funnel 10 and then overflows from the outlet hole a. This ensures that the return rate of the coolant on the left and right sides and the middle area is consistent, thus ensuring consistent cooling efficiency and improving cooling efficiency. In this embodiment, the wall plate of the overflow funnel 10 opposite to the outlet hole a is set as an inclined plate, which can reduce the noise of liquid flow. In some embodiments, the side plate 10-1 can also be set as an inclined plate.

[0044] In this embodiment, one cold plate corresponds to one first electronic component A. That is, one first electronic component A and one cold plate are respectively arranged on one cold plate mounting component 3, and one cold plate dissipates heat for one first electronic component A. The first electronic component A is vertically arranged on the cold plate mounting component 3. In other embodiments, one cold plate may correspond to two first electronic components, such as the first electronic components being respectively arranged on both sides of one cold plate, and one cold plate dissipating heat for two first electronic components. After the coolant flows out from the outlet pipe 6a, it flows into the chassis 1. The chassis 1 is a closed chassis, and the coolant will form a certain liquid level inside the chassis 1. The vertically arranged first electronic component A is at least partially immersed in the coolant, that is, the first electronic component A is at least partially located below the liquid surface of the coolant. By partially immersing the first electronic component A in the coolant, heat dissipation for the first electronic component A can be further achieved.

[0045] In this embodiment, the first electronic component A is arranged in an array at the rear of the chassis 1, that is, the first electronic component A is concentrated on the side of the chassis 1 near the liquid outlet a. In this embodiment, a mounting bracket 4 is provided inside the chassis 1, and the mounting bracket 4 is fixed to the chassis 1 by fasteners. The cold plate mounting component 3 is provided on the mounting bracket 4. In this embodiment, the mounting bracket 4 is an L-shaped frame with a base plate 4-1 and a back plate 4-2 connected together. The base plate 4-1 has several receiving slots 4-1a. The power supply component c3 is mounted on the base plate of the chassis 1 and received in the receiving slots 4a of the mounting bracket 4. The power supply component c3 is received below the base plate 4-1, and the cold plate mounting component 3 is provided above, forming two-layer mounting spaces.

[0046] To facilitate the installation of the cold plate mounting component 3, this embodiment has a snap-fit ​​groove 4-2a machined on the back plate 4-2 of the mounting bracket 4, and a snap-fit ​​plate 3-1 is provided at one end of the cold plate mounting component 3. The bottom of the snap-fit ​​plate 3-1 can be inserted into the snap-fit ​​groove 4-2a of the back plate 4-2, thereby inserting the cold plate mounting component 3 onto the mounting bracket 4. Furthermore, to better fix the cold plate mounting component 3, the top of the snap-fit ​​plate 3-1 has a fixing part 3-1a that bends outward to a horizontal position, and an assembly hole 3-1b is machined on the fixing part 3-1a. A corresponding assembly hole (not shown) is provided on the mounting bracket 4. After the cold plate mounting component 3 is installed on the mounting bracket 4, screws can be passed through the assembly hole 3-1b on the fixing part 3-1a and the assembly hole on the mounting bracket 4 and tightened to securely install the cold plate mounting component 3 onto the mounting bracket 4. The network card c2, as the third electronic component C, can also be installed on the mounting bracket 4 for heat dissipation through a semi-immersion method.

[0047] In addition to the power supply component c3, the motherboard c1 is also mounted on the base plate of the chassis 1. The CPU (second electronic component B) is further away from the coolant outlet a than the GPU (first electronic component A). The CPU is mounted on the motherboard c1 and enclosed within the cooling chamber 5. The cooling chamber 5 is connected to a cold plate in the cold plate module via a connecting pipe 6. The coolant flow in this heat dissipation branch is as follows: after entering the distribution chamber 7 through the inlet hole, it enters a branch within the fluid distribution pipe 2, and then sequentially enters the two cold plates connected in series via the connecting pipe 6. It then sequentially enters the two cooling chambers 5 (which are also connected by a connecting pipe 6). After exchanging heat with the CPU within the cooling chambers 5, the coolant flows out through the outlet pipe 6a into the chassis 1.

[0048] In this embodiment, the electronic components are arranged in the chassis 1 as follows: the first electronic component A is located on the side of the chassis 1 near the coolant outlet and arranged in an array. The cold plate and the first electronic component A are vertically mounted on the mounting bracket 4 via the cold plate mounting bracket 3. The motherboard c1 and power supply component c3 of the third electronic component C are located on the bottom plate of the chassis 1, with the power supply component c3 located below the first electronic component A. The second electronic component B (CPU) is located further away from the coolant outlet of the chassis 1 than the first electronic component A. The second electronic component B is located on the motherboard c1 and is enclosed in the cooling cavity 5. This specific layout, designed according to the heat dissipation requirements of electronic components with different heat outputs, allows each component to be effectively cooled. The coolant first provides localized and strong heat dissipation to the high-heat-generating electronic components through the cold plate and other heat sinks. After flowing out of the heat sink into the chassis, the coolant directly contacts the electronic components immersed in the coolant in the chassis as it flows towards the coolant outlet. By using different heat exchange methods, the coolant is fully utilized, improving heat exchange efficiency and ensuring better heat exchange performance.

[0049] In some embodiments, to facilitate the assembly of electronic components and maintenance after liquid flushing, a semi-open mounting shell 9 is provided inside the chassis 1. The mounting shell 9 can be fixedly installed inside the chassis 1 by screws or other fasteners. The motherboard c1, power supply component c3, etc. are all mounted on the base plate of the mounting shell 9, and the mounting bracket 4 is also fixed together with the mounting shell 9.

[0050] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An immersion cooling device, characterized in that, include: The chassis is provided with a liquid inlet and a liquid outlet, the liquid outlet being located in the middle of the chassis wall panel. The chassis is provided with a first electronic component and a third electronic component, the heat generated by the first electronic component being greater than the heat generated by the third electronic component. An overflow funnel, located inside the chassis and connected to the liquid outlet, allows coolant to flow into the liquid outlet through the overflow funnel. A heat sink module is disposed inside the chassis, the heat sink module including a heat sink attached to the surface of the first electronic component; A fluid distribution pipe is installed inside the chassis and is fluidly connected to the liquid inlet. The fluid distribution pipe has multiple branches, each of which is fluidly connected to a radiator module. After the coolant enters the radiator through the fluid distribution pipe and completes heat exchange, it is discharged from the radiator to the side of the chassis away from the liquid outlet. The first electronic component is vertically arranged and arrayed on one side of the chassis near the liquid outlet. The third electronic component is directly or indirectly disposed on the bottom plate of the chassis. The heated surface of the third electronic component is within the area covered by the flow path of the coolant in the chassis. The first electronic component is partially immersed in the coolant in the chassis.

2. The immersion cooling device as described in claim 1, characterized in that: The top of the overflow funnel is open to form an overflow port, which is located below the coolant level inside the chassis and above the lowest edge of the outlet hole.

3. The immersion cooling device as described in claim 2, characterized in that: The overflow funnel is disposed on the wall panel where the liquid outlet is located. The overflow funnel includes an inclined plate opposite to the liquid outlet and two side plates respectively disposed on both sides of the inclined plate. The bottom of the inclined plate and the side plates are connected to the wall panel where the liquid outlet is located.

4. The immersion cooling device as described in claim 1, characterized in that: The liquid outlet and the liquid inlet are located on the same side of the chassis.

5. The immersion cooling device as described in claim 1, characterized in that: The chassis has a flow distribution chamber located at the liquid inlet and communicating with the liquid inlet. The fluid distribution pipe is connected to the flow distribution chamber and is a manifold.

6. The immersion cooling device as described in claim 1, characterized in that: It also includes a second electronic component disposed on the third electronic component. The heat generated by the second electronic component is less than that generated by the first electronic component. The second electronic component is located on the side of the chassis away from the liquid outlet and is covered in a cooling chamber. The cooling chamber is fluidly connected to the heat sink module through a connecting pipe. After the coolant that has completed heat exchange in the heat sink module enters the cooling chamber for heat exchange, it is discharged from the cooling chamber to the side of the chassis away from the liquid outlet.

7. The immersion cooling device as described in claim 1, characterized in that: The outlet of the radiator at the end of the radiator module is connected to a liquid outlet pipe. The outlet of the liquid outlet pipe is set horizontally or downward and is located below the liquid level of the coolant inside the chassis.

8. The immersion cooling device as described in claim 6, characterized in that: The outlet of the cooling chamber is connected to a liquid outlet pipe, which is horizontal or downward and located below the coolant level inside the chassis.

9. The immersion cooling device as described in claim 1, characterized in that: It also includes a mounting bracket and a cold plate mounting component disposed within the chassis. The heat sink is a cold plate. The mounting bracket includes a base plate and a back plate connected together. The base plate forms a receiving groove for accommodating the third electronic component. The cold plate mounting component is inserted into the mounting bracket and located above the receiving groove. The cold plate and the first electronic component are disposed on the cold plate mounting component.

10. The immersion cooling device as described in claim 9, characterized in that: The first electronic component is a GPU, and the third electronic component includes a motherboard, a power supply component, and a network card. The motherboard is mounted on the bottom plate of the chassis and located inside the chassis on the side away from the liquid outlet. The power supply component is mounted on the bottom plate of the chassis and housed in the receiving slot. The motherboard and the power supply component are in a fully submerged state, and the network card is inserted into the mounting bracket and is in a semi-submerged state.

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