An immersion cooling device

Abstract

The utility model provides an immersion cooling device, including: the cabinet, be provided with first electronic component and third electronic component in the cabinet, be provided with radiator module in the cabinet, and the radiator module includes at least two radiators that are connected through the communicating tube, and the radiator is attached to the surface of first electronic component, be provided with fluid distribution pipe in the cabinet and with liquid inlet hole fluid connection, and fluid distribution pipe has a plurality of branches, and each branch and a radiator module are connected, and cooling liquid enters the radiator through fluid distribution pipe and completes heat exchange after, and from the radiator is discharged to the side that is far away from liquid outlet hole in the cabinet, first electronic component vertically sets up and sets up in the cabinet near liquid outlet hole one side in array arrangement mode, and third electronic component sets up on the bottom plate of cabinet, and first electronic component and third electronic component are soaked in the cooling liquid in the cabinet, the utility model discloses through the flow distribution of differentiation, has guaranteed the heat dissipation effect, has improved the heat dissipation efficiency.

Description

Technical Field

[0001] This utility model belongs to the technical field of liquid cooling devices for electronic equipment, specifically relating to an immersion cooling device for electronic equipment such as servers. Background Technology

[0002] With the rapid development of technologies such as artificial intelligence and big data, data centers are facing an ever-increasing demand for high-density computing. In the past, the industry generally adopted air cooling or cold plate liquid cooling technology as the main heat dissipation solutions. However, these traditional heat dissipation methods have gradually shown limitations in high power density scenarios. For example, air cooling systems are limited by air convection efficiency and cannot cope with the heat dissipation needs of racks exceeding 30kW; although cold plate liquid cooling can improve local heat dissipation capacity, it still relies on air-assisted heat dissipation, and the overall energy efficiency improvement is limited.

[0003] Immersion liquid cooling is an emerging liquid cooling technology in recent years. Immersion liquid cooling features direct contact cooling, theoretically providing higher heat dissipation efficiency. However, existing full immersion liquid cooling solutions still have some shortcomings in practical applications: for example, the natural flow of coolant within a sealed cavity is poor, resulting in low heat exchange efficiency and ineffective control of the operating temperature of high-power chips such as GPUs. Furthermore, the poor flow of the immersion method easily leads to uneven temperature distribution, highlighting localized hotspots and affecting the reliability of equipment operation. Moreover, the full immersion design consumes a large amount of coolant, increasing not only the construction cost of data centers but also adding an extra burden of coolant maintenance and replacement. These issues restrict the large-scale application of immersion liquid cooling technology in data centers. Utility Model Content

[0004] The purpose of this invention is to provide an immersion liquid cooling device with good heat dissipation effect and high heat dissipation efficiency.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] An immersion cooling device includes: a chassis with a liquid inlet and a liquid outlet; a first electronic component and a third electronic component disposed within the chassis, wherein the heat generated by the first electronic component is greater than that generated by the third electronic component; a heat sink module disposed within the chassis, the heat sink module including at least two heat sinks connected in series via a connecting pipe, the heat sinks being attached to the surface of the first electronic component; a fluid distribution pipe disposed within the chassis and fluidly connected to the liquid inlet, the fluid distribution pipe having multiple branches, each branch being fluidly connected to a heat sink module, coolant entering the heat sink through the fluid distribution pipe, completing heat exchange, and then being discharged from the heat sink to a side of the chassis away from the liquid outlet; the first electronic component is vertically arranged and arranged in an array within the chassis near the liquid outlet, the third electronic component is directly or indirectly disposed on the bottom plate of the chassis, and the first electronic component and the third electronic component are immersed in the coolant within the chassis.

[0007] In some embodiments, a second electronic component is further disposed on the third electronic component. The heat generated by the second electronic component is less than that generated by the first electronic component. The second electronic component is located on the side of the chassis away from the liquid outlet and is covered in a cooling chamber. The cooling chamber is fluidly connected to the radiator located at the end of the cold plate module through a connecting pipe. After the coolant that has completed heat exchange in the radiator module enters the cooling chamber for heat exchange, it is discharged from the cooling chamber to the side of the chassis away from the liquid outlet.

[0008] In some embodiments, the liquid outlet and the liquid inlet are located on the same side of the chassis.

[0009] In some embodiments, a flow distribution chamber communicating with the liquid inlet is provided inside the chassis at the liquid inlet, and the fluid distribution pipe is fluidly connected to the flow distribution chamber, wherein the fluid distribution pipe is a manifold.

[0010] In some embodiments, the outlet of the radiator at the end of the radiator module is connected to a liquid outlet pipe, the outlet of which is horizontally or downwardly positioned and located below the coolant level inside the chassis.

[0011] In some embodiments, the outlet of the cooling chamber is connected to a liquid outlet pipe, the outlet of which is horizontal or downward and located below the coolant level inside the chassis.

[0012] In some embodiments, the height of the liquid outlet is 1 / 3 to 2 / 3 of the height of the chassis, and the first electronic component is in a semi-submerged state inside the chassis.

[0013] In some embodiments, the device further includes a mounting bracket and a cold plate mounting member disposed within the chassis. The heat sink is a cold plate. The mounting bracket includes a base plate and a back plate connected together. The base plate forms a receiving groove for accommodating the third electronic component. The cold plate mounting member is inserted into the mounting bracket and located above the receiving groove. The cold plate and the first electronic component are disposed on the cold plate mounting member.

[0014] In some embodiments, the first electronic component is a GPU, and the third electronic component includes a motherboard, a power supply component, and a network card. The motherboard is disposed on the bottom plate of the chassis and located on the side of the chassis away from the liquid outlet. The power supply component is disposed on the bottom plate of the chassis and housed in the receiving slot. The motherboard and the power supply component are in a fully submerged state, and the network card is inserted into the mounting bracket and is in a semi-submerged state.

[0015] In some embodiments, an overflow funnel with an inner cavity communicating with the liquid outlet is provided at the liquid outlet.

[0016] As can be seen from the above technical solution, this utility model adopts a design scheme of direct connection of fluid distribution pipe to heat sink. The coolant is distributed and transported through the fluid distribution pipe. At the same time, the first heat sink is concentrated in the chassis near the outlet hole in an array arrangement. The coolant first passes through the heat sink to enhance the heat dissipation and cooling of the electronic components with high heat generation, meeting the heat dissipation requirements of the high heat generation electronic components. The coolant starts from the fluid distribution pipe and flows through each heat sink of the heat sink module in sequence to complete heat exchange before flowing into the chassis. It flows from far to near to the outlet hole and flows out from the outlet hole. In this process, the electronic components on the return path can be cooled, including the electronic components that have been cooled by the heat sink first, which enhances the heat dissipation effect. Moreover, this utility model can form a differentiated flow velocity distribution in the system. The return liquid maintains a basic flow velocity, while the liquid flowing through the heat sink reaches an enhanced flow velocity. This flow velocity gradient design not only effectively avoids the accumulation of local hot spots, but also optimizes the resource utilization efficiency while ensuring heat dissipation performance. In a further technical solution, this utility model not only controls the flow rate of coolant in the heat dissipation branch through the fluid distribution pipe to match the heat load inside the branch, but also sets the positions of different electronic components in the branch according to the different heat flux densities of the electronic components. For example, electronic components with low heat flux density, such as the CPU, are placed at the end of the branch, while electronic components with high heat flux density, such as the GPU, are placed at the beginning of the branch. This can ensure that the temperature rise of each component is within a reasonable range, and can also reduce the overall flow rate and reduce the power consumption of the system. Attached Figure Description

[0017] To more clearly illustrate the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the immersion cooling device after removing the top cover plate according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of the internal structure of the immersion cooling device according to an embodiment of the present invention;

[0020] Figure 3 This is a top view of the immersion cooling device according to an embodiment of the present invention after removing the top cover plate;

[0021] Figure 4 This is an exploded view of the immersion server according to an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of the cold plate mounting bracket according to an embodiment of the present utility model;

[0023] Figure 6 This is a structural schematic diagram of the cold plate mounting bracket from another angle according to an embodiment of this utility model;

[0024] Figure 7 This is a schematic diagram of the overflow funnel according to an embodiment of the present invention;

[0025] Figure 8 This is a structural schematic diagram of the overflow funnel from another angle, according to an embodiment of the present invention.

[0026] The specific embodiments of this utility model will be further described in detail below with reference to the accompanying drawings. Detailed Implementation

[0027] The present invention will now be described in detail with reference to the accompanying drawings. In the detailed description of the embodiments of the present invention, for ease of explanation, the drawings illustrating the device structure will be partially enlarged without adhering to the general scale. Furthermore, the schematic diagrams are merely examples and should not limit the scope of protection of the present invention. It should be noted that the drawings are in a simplified form and use non-precise scales, solely for the purpose of conveniently and clearly illustrating the embodiments of the present invention. Additionally, in the description of this application, terms such as "first" and "second" are used only to distinguish descriptions and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Terms such as "positive," "negative," "bottom," "upper," "lower," "front," "rear," "left," and "right" indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0028] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can also refer to the internal connection of two components; and they can refer to a wireless connection or a wired connection. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0029] like Figure 1 As shown, the immersion cooling device in this embodiment includes a casing 1, a fluid distribution pipe 2, a cold plate mounting component 3, a mounting bracket 4, a cooling chamber 5, several connecting pipes 6, and a cold plate (not shown). The immersion cooling device is connected to an external coolant circulation system via pipes (not shown). The coolant is introduced into the immersion cooling device by a fluid drive unit such as a circulation pump, and returns to the coolant circulation system after heat exchange.

[0030] In this embodiment, the chassis 1 is a closed structure, forming an internal space to accommodate electronic components. The chassis 1 can also be filled with coolant. The chassis 1 has a coolant inlet (not shown) and a coolant outlet a. The coolant inlet is connected to a coolant circulation system via a pipe, allowing coolant to enter the chassis 1. The coolant outlet a is also connected to the coolant circulation system via a pipe, allowing the cooled coolant to exit the chassis 1 after heat exchange.

[0031] The chassis 1 has a front end and a rear end. The front end of chassis 1 typically houses components such as switches or handles, while the rear end is opposite to the front end. The front end usually faces the operator for ease of use. In this embodiment, both the liquid inlet and outlet a are located at the rear end of chassis 1, on the back panel of chassis 1. Furthermore, in this embodiment, the liquid inlet is positioned above the outlet a. Even further, in this embodiment, the outlet a is positioned at half the height of chassis 1.

[0032] The fluid distribution pipe 2 is connected to the inlet hole, and the coolant enters the fluid distribution pipe 2 through the inlet hole. In this embodiment, a flow divider 7 is provided at the inlet hole, and the flow divider 7 is connected to the inlet hole. The fluid distribution pipe 2 is connected to the flow divider 7. The coolant enters the flow divider 7 through the inlet hole, and then enters the fluid distribution pipe 2 connected to the flow divider 7.

[0033] In this embodiment, the fluid distribution pipe 2 is a manifold, which is a fluid conduit commonly used to control the flow path and flow rate distribution of fluids such as liquids or gases. The fluid distribution pipe 2 in this embodiment has three branches, through which the coolant can dissipate heat from the electronic components located on each branch.

[0034] The chassis 1 houses various electronic components, such as the GPU, CPU, motherboard, network card, and power supply components (battery, power supply). These components generate varying amounts of heat and have different cooling requirements. In this embodiment, the electronic components are broadly categorized into three groups: the first group consists of high-heat-generating components (A), such as the GPU; the second group consists of high-heat-generating components (B), such as the CPU; and the third group consists of relatively low-heat-generating components (C), such as the motherboard, network card, and power supply components. The heat generation of the first electronic component A is greater than that of the second electronic component B, which in turn is greater than or equal to that of the third electronic component C. The cooling requirements of each component correspond to its heat generation, with the first electronic component A having the highest cooling requirement.

[0035] For electronic components with high heat dissipation requirements, this embodiment employs a combination of localized enhanced heat dissipation via a cold plate and immersion cooling. The first electronic component A is mounted on a cold plate mounting component 3, which also houses a cold plate with coolant channels for circulating coolant. The cold plate, mounted on the cold plate mounting component 3, is attached to the surface of the first electronic component A. As the coolant flows through the coolant channels within the cold plate, it carries away the heat generated by the first electronic component A, thus providing localized enhanced heat dissipation for the heat-generating first electronic component A.

[0036] like Figure 5 and Figure 6As shown, the cold plate mounting component 3 in this embodiment is equipped with a liquid inlet / outlet module 3-1. The cold plate is connected to the fluid distribution pipe 2 and / or the connecting pipe 6 through the liquid inlet / outlet module 3-1. The cold plate serves as a radiator, and multiple cold plates are connected in series through the connecting pipe 6 to form a cold plate module (radiator module). The fluid distribution pipe 2 is connected to one of the cold plates in the cold plate module. After the coolant flows into the fluid distribution pipe 2, it enters the coolant flow channel in the cold plate through the liquid inlet / outlet module 3-1, then flows out of the cold plate through the connecting pipe 6, and enters another cold plate connected in series with the cold plate. This process continues, with the coolant flowing through each cold plate in the cold plate module in sequence, and then flowing out from the connecting pipe 6 connected to the last cold plate (the end cold plate).

[0037] In this embodiment, a total of eight GPUs (first electronic component A), two CPUs (second electronic component B), and a third electronic component C, including a motherboard c1, a network card c2, and a power supply component c3, are installed inside the chassis 1. The fluid distribution pipe 2 in this embodiment has three heat dissipation branches for cooling the eight GPUs and two CPUs. Each heat dissipation branch is connected to a cold plate module. Two of the cold plate modules on each branch include three cold plates connected in series via a connecting pipe 6, each cooling one of the three GPUs. The cold plate module on the third branch includes two cold plates connected in series via a connecting pipe 6, each cooling one of the two GPUs, and a cooling cavity 5 for cooling the two CPUs. The cooling cavity 5 is located after the cold plates, meaning the coolant passes through the cold plates first and then through the cooling cavity 5. In other embodiments, the types and quantities of electronic components can vary depending on the actual situation, and the branches of the fluid distribution pipe can also be varied accordingly. This is not limited here.

[0038] To better guide the flow and prevent liquid from spraying randomly, the outlet of the end cold plate (the last cold plate in the coolant flow path of the cold plate module) or the outlet of the cooling cavity is connected to a liquid outlet pipe 6a. After the coolant flows in the heat dissipation branch and completes heat exchange, it flows out from the liquid outlet pipe 6a and into the chassis 1. When the outlet end of the liquid outlet pipe 6a is set upward, it will generate noise from liquid scouring. In order to reduce noise, the outlet of the liquid outlet pipe 6a is preferably set horizontally or downward, and the outlet of the liquid outlet pipe 6a is located below the coolant level in the chassis 1.

[0039] In this embodiment, one cold plate corresponds to one first electronic component A. That is, one first electronic component A and one cold plate are respectively disposed on one cold plate mounting component 3, and one cold plate dissipates heat for one first electronic component A. The first electronic component A is vertically disposed on the cold plate mounting component 3. In other embodiments, one cold plate may correspond to two first electronic components, such as the first electronic components being disposed on both sides of one cold plate, and one cold plate dissipating heat for two first electronic components. After the coolant flows out from the outlet pipe 6a, it flows into the chassis 1. The chassis 1 is a closed chassis, and the coolant will form a certain liquid level inside the chassis 1. The vertically disposed first electronic component A is at least partially immersed in the coolant, that is, the first electronic component A is at least partially located below the liquid level of the coolant. By partially immersing the first electronic component A in the coolant, heat dissipation for the first electronic component A can be further achieved.

[0040] In this embodiment, the first electronic component A is arranged in an array at the rear of the chassis 1, that is, the first electronic component A is located on the side of the chassis 1 closest to the liquid outlet a. In this embodiment, a mounting bracket 4 is provided inside the chassis 1, and the mounting bracket 4 is fixed to the chassis 1 by fasteners. The cold plate mounting component 3 is mounted on the mounting bracket 4. In this embodiment, the mounting bracket 4 is an L-shaped frame with a base plate 4-1 and a back plate 4-2 connected together. The base plate 4-1 has several receiving slots 4-1a. The power supply component c3 is mounted on the base plate of the chassis 1 and received within the receiving slots 4a of the mounting bracket 4. The power supply component c3 is received below the base plate 4-1, and the cold plate mounting component 3 is provided above, forming two-layer mounting spaces.

[0041] To facilitate the installation of the cold plate mounting component 3, this embodiment has a snap-fit ​​groove 4-2a machined on the back plate 4-2 of the mounting bracket 4, and a snap-fit ​​plate 3-1 is provided at one end of the cold plate mounting component 3. The bottom of the snap-fit ​​plate 3-1 can be inserted into the snap-fit ​​groove 4-2a of the back plate 4-2, thereby inserting the cold plate mounting component 3 onto the mounting bracket 4. Furthermore, to better fix the cold plate mounting component 3, the top of the snap-fit ​​plate 3-1 has a fixing part 3-1a that bends outward to a horizontal position, and an assembly hole 3-1b is machined on the fixing part 3-1a. A corresponding assembly hole (not shown) is provided on the mounting bracket 4. After the cold plate mounting component 3 is installed on the mounting bracket 4, screws can be passed through the assembly hole 3-1b on the fixing part 3-1a and the assembly hole on the mounting bracket 4 and tightened to securely install the cold plate mounting component 3 onto the mounting bracket 4. The network card c2, as the third electronic component C, can also be installed on the mounting bracket 4 for heat dissipation through a semi-immersion method.

[0042] In addition to the power supply component c3, the motherboard c1 is also mounted on the base plate of the chassis 1. The CPU (second electronic component B) is further away from the coolant outlet a than the GPU (first electronic component A). The CPU is mounted on the motherboard c1 and enclosed within the cooling chamber 5. The cooling chamber 5 is connected to a cold plate in the cold plate module via a connecting pipe 6. The coolant flow in this heat dissipation branch is as follows: after entering the distribution chamber 7 through the inlet hole, it enters a branch within the fluid distribution pipe 2, and then sequentially enters the two cold plates connected in series via the connecting pipe 6. It then sequentially enters the two cooling chambers 5 (which are also connected by a connecting pipe 6). After exchanging heat with the CPU within the cooling chambers 5, the coolant flows out through the outlet pipe 6a into the chassis 1.

[0043] In this embodiment, the electronic components are arranged in the chassis 1 as follows: the first electronic component A is located on the side of the chassis 1 near the coolant outlet and arranged in an array. The cold plate and the first electronic component A are vertically mounted on the mounting bracket 4 via the cold plate mounting bracket 3. The motherboard c1 and power supply component c3 of the third electronic component C are located on the bottom plate of the chassis 1, with the power supply component c3 located below the first electronic component A. The second electronic component B (CPU) is located further away from the coolant outlet of the chassis 1 than the first electronic component A. The second electronic component B is located on the motherboard c1 and is enclosed in the cooling cavity 5. This specific layout, designed according to the heat dissipation requirements of electronic components with different heat outputs, allows each component to be effectively cooled. The coolant first provides localized and strong heat dissipation to the high-heat-generating electronic components through the cold plate and other heat sinks. After flowing out of the heat sink into the chassis, the coolant directly contacts the electronic components immersed in the coolant in the chassis as it flows towards the coolant outlet. By using different heat exchange methods, the coolant is fully utilized, improving heat exchange efficiency and ensuring better heat exchange performance.

[0044] Since the coolant outlet a of chassis 1 is located in the middle of chassis 1, i.e., at a certain distance from the bottom plate, the coolant discharged from the outlet pipe 6a will accumulate inside chassis 1 and form a certain liquid level, which can submerge the third electronic component C. That is, the heated surface of the third electronic component C is within the area covered by the coolant discharge trajectory, so the third electronic component C can directly exchange heat with the coolant for heat dissipation. The outlet pipe 6a is located at the last section of the heat dissipation branch. The coolant discharged from the outlet pipe 6a will flow from far to near towards the outlet a (the part farthest from the outlet a is the far end). When the liquid level in chassis 1 reaches the height of the outlet a, the coolant will naturally flow outward and enter the external coolant circulation pipeline. After being temperature controlled by the heat exchange equipment, it will then circulate back to the inlet.

[0045] In this embodiment, the coolant outlet a is positioned at half the height of the chassis, i.e., in the middle of the chassis (e.g., at 1 / 3 to 2 / 3 of the chassis height). This ensures that the electronic components inside the chassis 1 are at least partially submerged. The electronic components submerged in the coolant can directly exchange heat with the coolant for heat dissipation. Furthermore, after the coolant exits from each heat dissipation branch, it naturally flows towards the outlet a from far to near, maintaining good flow within the chassis 1. This flowability is better than that of a fully submerged system, avoiding uneven temperature distribution caused by poor flowability. Moreover, for the first electronic component with high heat generation and high heat dissipation requirements, a cold plate is used to enhance heat dissipation, preventing the formation of prominent local hot spots. Simultaneously, thanks to the cold plate's heat dissipation for the high-heat-generating electronic components, the semi-submerged approach within the chassis is sufficient to meet the heat dissipation needs of other electronic components, reducing coolant consumption and lowering costs.

[0046] In some embodiments, to facilitate the assembly of electronic components and maintenance after liquid flushing, a semi-open mounting shell 9 is provided inside the chassis 1. The mounting shell 9 can be fixedly installed inside the chassis 1 by screws or other fasteners. The motherboard c1, power supply component c3, etc. are all mounted on the base plate of the mounting shell 9, and the mounting bracket 4 is also fixed together with the mounting shell 9.

[0047] In practical applications, the inventors discovered that during the overflow of coolant through outlet a, the central region near outlet a tends to experience rapid backflow, while the backflow on both sides is relatively slow, resulting in inconsistent cooling efficiency. To address this issue, this embodiment preferably includes an overflow funnel 10 at outlet a, with the inner cavity of the overflow funnel 10 connected to outlet a.

[0048] Reference Figure 4 , Figure 7 and Figure 8In this embodiment, the overflow funnel 10 is a semi-open structure composed of a pair of side plates 10-1 and a sloping plate 10-2. The overflow funnel 10 is wider at the top and narrower at the bottom. The side plates 10-1 are located on both sides of the sloping plate 10-2, and the sloping plate 10-2 is opposite to the liquid outlet a of the chassis 1. In this embodiment, the overflow funnel 10 is fixed to the wall panel of the chassis 1 with the liquid outlet a, and in this embodiment, it is fixed to the back plate. The top of the overflow funnel 10 is open, forming an overflow port. Coolant enters the overflow funnel 10 from the overflow port, is collected by the overflow funnel 10, and then flows out from the liquid outlet a. The overflow outlet formed at the top of the overflow funnel 10 is higher than the lowest edge of the outlet hole a, and the height of the overflow outlet is below the coolant surface inside the chassis 1. The projected area of ​​the overflow funnel 10 on the plane where the outlet hole a is located is larger than the outlet hole a. The coolant first enters the overflow funnel 10 and then overflows from the outlet hole a. This ensures that the return rate on the left and right sides and the middle area is consistent, thus ensuring consistent cooling efficiency and improving cooling efficiency. In this embodiment, the wall plate of the overflow funnel 10 opposite to the outlet hole a is set as an inclined plate, which can reduce the noise of liquid flow. In some embodiments, the side plate 10-1 can also be set as an inclined plate.

[0049] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An immersion cooling device, characterized in that, include: The chassis is provided with a liquid inlet and a liquid outlet. A first electronic component and a third electronic component are provided inside the chassis. The heat generation of the first electronic component is greater than that of the third electronic component. A heat sink module is disposed in the chassis, the heat sink module includes at least two heat sinks connected in series by a connecting pipe, and the heat sinks are attached to the surface of the first electronic component. A fluid distribution pipe is installed inside the chassis and is fluidly connected to the liquid inlet. The fluid distribution pipe has multiple branches, each of which is fluidly connected to a radiator module. After the coolant enters the radiator through the fluid distribution pipe and completes heat exchange, it is discharged from the radiator to the side of the chassis away from the liquid outlet. The first electronic component is vertically arranged and arrayed on one side of the chassis near the liquid outlet. The third electronic component is directly or indirectly disposed on the bottom plate of the chassis. The first electronic component and the third electronic component are immersed in the coolant inside the chassis.

2. The immersion cooling device as described in claim 1, characterized in that: It also includes a second electronic component disposed on the third electronic component. The heat generated by the second electronic component is less than that generated by the first electronic component. The second electronic component is located on the side of the chassis away from the liquid outlet and is covered in a cooling chamber. The cooling chamber is fluidly connected to the heat sink at the end of the heat sink module through a connecting pipe. After the coolant that has completed heat exchange in the heat sink module enters the cooling chamber for heat exchange, it is discharged from the cooling chamber to the side of the chassis away from the liquid outlet.

3. The immersion cooling device as described in claim 1, characterized in that: The liquid outlet and the liquid inlet are located on the same side of the chassis.

4. The immersion cooling device as described in claim 1, characterized in that: The chassis has a flow distribution chamber located at the liquid inlet and communicating with the liquid inlet. The fluid distribution pipe is fluidly connected to the flow distribution chamber and is a manifold.

5. The immersion cooling device as described in claim 1, characterized in that: The outlet of the radiator at the end of the radiator module is connected to a liquid outlet pipe. The outlet of the liquid outlet pipe is set horizontally or downward and is located below the liquid level of the coolant inside the chassis.

6. The immersion cooling device as described in claim 2, characterized in that: The outlet of the cooling chamber is connected to a liquid outlet pipe, which is horizontal or downward and located below the coolant level inside the chassis.

7. The immersion cooling device as described in claim 1, characterized in that: The height of the liquid outlet is 1 / 3 to 2 / 3 of the height of the chassis, and the first electronic component is in a semi-submerged state inside the chassis.

8. The immersion cooling device as described in claim 1, characterized in that: It also includes a mounting bracket and a cold plate mounting component disposed within the chassis. The heat sink is a cold plate. The mounting bracket includes a base plate and a back plate connected together. The base plate forms a receiving groove for accommodating the third electronic component. The cold plate mounting component is inserted into the mounting bracket and located above the receiving groove. The cold plate and the first electronic component are disposed on the cold plate mounting component.

9. The immersion cooling device as described in claim 8, characterized in that: The first electronic component is a GPU, and the third electronic component includes a motherboard, a power supply component, and a network card. The motherboard is mounted on the bottom plate of the chassis and located inside the chassis on the side away from the liquid outlet. The power supply component is mounted on the bottom plate of the chassis and housed in the receiving slot. The motherboard and the power supply component are in a fully submerged state, and the network card is inserted into the mounting bracket and is in a semi-submerged state.

10. The immersion cooling device as described in claim 1, characterized in that: An overflow funnel with an inner cavity connected to the liquid outlet is provided at the liquid outlet.

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