TEC temperature control integrated device and rapid heat dissipation structure of QCL laser module

Abstract

The utility model provides QCL laser module's TEC temperature control integrated device and quick heat radiation structure, including heat dissipation mechanism, it includes: mounting cover, the copper sheet of setting in the mounting cover inside, the cold -conducting plate of setting in copper sheet one side, the refrigeration wafer of setting in the mounting cover inside, the alloy plate of setting in the mounting cover inside one side, the alloy heat dissipation column of setting in alloy plate one side, the utility model discloses when using, through multilayer structure cooperation realizes efficient heat dissipation, copper sheet and cold -conducting plate constitute high heat conduction path, quickly absorbs and conducts heat source heat, combines the active peltier refrigeration effect of refrigeration wafer, forms " heat conduction + active cooling " dual mechanism, accurately reduces core area temperature, and alloy heat dissipation column cooperates fan and the out -of -wind board structure constructs the solid wind heat exchange system.

Description

Technical Field

[0001] This utility model relates to the field of TEC temperature control integration technology, and in particular to a TEC temperature control integration device and a rapid heat dissipation structure for a QCL laser module. Background Technology

[0002] In many fields such as optical communication, laser processing, and scientific research, QCL (specific wavelength band depends on the application scenario, such as the O-band 1260-1360nm often involved in optical communication) laser modules play a crucial role. When a laser is working, its performance is extremely sensitive to temperature. Even a small temperature fluctuation can cause wavelength drift and unstable output power, thus affecting the operating accuracy and reliability of the entire system. For example, in high-precision optical communication systems, slight wavelength drift can cause signal crosstalk and reduce communication quality. TEC (thermal cooler) has become a common solution for temperature control of QCL laser modules due to its precise temperature control, rapid response, and ease of control. However, traditional TEC temperature control integrated devices are insufficient in terms of integration and temperature control accuracy, making it difficult to meet the current stringent requirements for miniaturization and high performance of laser modules. At the same time, lasers generate a lot of heat when working. If this heat cannot be dissipated in time, it will not only exacerbate the negative impact of temperature on laser performance but may also shorten the lifespan of the laser.

[0003] Existing rapid heat dissipation structures have difficulty dissipating heat from the bottom to the outside during prolonged use, which affects their lifespan.

[0004] To address this, a TEC temperature control integrated device and a rapid heat dissipation structure for QCL laser modules are proposed. Utility Model Content

[0005] In view of this, the present invention aims to provide a TEC temperature control integrated device and a rapid heat dissipation structure for QCL laser modules to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial option.

[0006] The technical solution of this utility model embodiment is implemented as follows: a rapid heat dissipation structure includes a heat dissipation mechanism, which includes: a mounting sleeve, a copper sheet disposed inside the mounting sleeve, a cold conductive plate disposed on one side of the copper sheet, a cooling chip disposed inside the mounting sleeve, an alloy plate disposed on one side of the mounting sleeve, an alloy heat dissipation column disposed on one side of the alloy plate, a mounting cylinder disposed on one side of the mounting sleeve, a fan disposed inside the mounting cylinder, and an air outlet plate disposed on one side of the mounting cylinder.

[0007] In some embodiments, the main body includes: a device body, a support leg disposed at the bottom of the device body, a base plate disposed at the bottom of the support leg, and reinforcing plates disposed on both sides of the top of the base plate.

[0008] In some embodiments, the outer wall of the device body is provided with a mating ring, and the four corners of the mating ring are provided with openings.

[0009] In some embodiments, a mating plate is provided on one side of the mating ring, threaded holes are provided at the four corners of the mating plate, a mounting plate is provided on one side of the mating plate, and a heat dissipation box is provided on one side of the mounting plate.

[0010] In some embodiments, a heat dissipation cylinder is provided on one side of the heat dissipation box, and a mounting groove is provided inside the heat dissipation cylinder, and a cooling fan is provided inside the mounting groove.

[0011] The present invention has the following advantages due to the adoption of the above technical solution:

[0012] 1. The QCL laser module's TEC temperature control integrated device and rapid heat dissipation structure achieve efficient heat dissipation through multi-layer synergy during use. Copper sheets and cold conductive plates form a high thermal conductivity path, quickly absorbing and conducting heat from the heat source. Combined with the active Peltier cooling effect of the cooling chip, a dual mechanism of "heat conduction + active cooling" is formed, precisely reducing the temperature of the core area. Alloy heat sinks, together with fans and exhaust plates, construct a three-dimensional air-heat exchange system, increasing the heat dissipation area and accelerating heat dissipation through forced convection, significantly improving heat dissipation efficiency.

[0013] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is an overall structural diagram of the present invention;

[0016] Figure 2 This is a structural diagram of the main body of the device of this utility model;

[0017] Figure 3This is a cross-sectional structural diagram of the heat dissipation mechanism of this utility model;

[0018] Figure 4 This is a cross-sectional view of the heat dissipation box of this utility model.

[0019] Figure label:

[0020] 100. Heat dissipation mechanism; 101. Mounting sleeve; 102. Copper sheet; 103. Cooling plate; 104. Alloy plate; 105. Mounting cylinder; 106. Alloy heat dissipation column; 107. Fan; 108. Air outlet plate; 109. Cooling chip; 200. Main body mechanism; 201. Main body of the device; 202. Support leg; 203. Reinforcing plate; 204. Base plate; 205. Connecting ring; 206. Opening; 207. Connecting plate; 208. Threaded hole; 209. Mounting plate; 210. Heat dissipation box; 211. Heat dissipation cylinder; 212. Mounting slot; 213. Cooling fan. Detailed Implementation

[0021] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0022] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0023] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0024] Example 1:

[0025] like Figure 1-4As shown, the TEC temperature control integrated device and rapid heat dissipation structure of the QCL laser module includes a heat dissipation mechanism 100, which includes: a mounting sleeve 101, a copper sheet 102 disposed inside the mounting sleeve 101, a cold conductive plate 103 disposed on one side of the copper sheet 102, a cooling chip 109 disposed inside the mounting sleeve 101, an alloy plate 104 disposed on one side inside the mounting sleeve 101, an alloy heat dissipation column 106 disposed on one side of the alloy plate 104, a mounting cylinder 105 disposed on one side of the mounting sleeve 101, a fan 107 disposed inside the mounting cylinder 105, and an air outlet plate 108 disposed on one side of the mounting cylinder 105.

[0026] In this embodiment, the main body 200 includes: a device body 201, a support leg 202 disposed at the bottom of the device body 201, a base plate 204 disposed at the bottom of the support leg 202, and reinforcing plates 203 disposed on both sides of the top of the base plate 204. A mating ring 205 is disposed on the outer wall of the device body 201, with openings 206 at the four corners of the mating ring 205. A mating plate 207 is disposed on one side of the mating ring 205, with threaded holes 208 at the four corners of the mating plate 207. A mounting plate 209 is provided on one side of the 07, a heat dissipation box 210 is provided on one side of the mounting plate 209, a heat dissipation cylinder 211 is provided on one side of the heat dissipation box 210, a mounting groove 212 is provided inside the heat dissipation cylinder 211, and a cooling fan 213 is provided inside the mounting groove 212. The heat dissipation box 210 is fixed after being connected to the docking ring 205 on the outer side of the device body 201 through the docking plate 207. The cooling fan 211 inside the heat dissipation cylinder 211 on one side of the heat dissipation box 210 provides air cooling for the inside of the device body 201.

[0027] In this embodiment: When in use, efficient heat dissipation is achieved through the synergistic effect of the multi-layer structure. The copper sheet 102 and the cold conduction plate 103 form a high thermal conductivity path, which quickly absorbs and conducts heat from the heat source. Combined with the active Peltier cooling effect of the cooling chip 109, a dual mechanism of "heat conduction + active cooling" is formed to accurately reduce the temperature of the core area. The alloy heat dissipation column 106, together with the fan 107 and the air outlet plate 108, constructs a three-dimensional air heat exchange system, which increases the heat dissipation area and accelerates the heat dissipation through forced convection, significantly improving the heat dissipation efficiency.

[0028] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A rapid heat dissipation structure, comprising a heat dissipation mechanism (100), characterized in that: The heat dissipation mechanism (100) includes: a mounting sleeve (101), a copper sheet (102) disposed inside the mounting sleeve (101), a heat-conducting plate (103) disposed on one side of the copper sheet (102), a cooling chip (109) disposed inside the mounting sleeve (101), an alloy plate (104) disposed on one side inside the mounting sleeve (101), an alloy heat dissipation column (106) disposed on one side of the alloy plate (104), a mounting cylinder (105) disposed on one side of the mounting sleeve (101), a fan (107) disposed inside the mounting cylinder (105), and an air outlet plate (108) disposed on one side of the mounting cylinder (105).

2. A TEC temperature control integrated device for a QCL laser module, comprising the rapid heat dissipation structure as described in claim 1, characterized in that: The main structure (200) includes: a device body (201), a support leg (202) disposed at the bottom of the device body (201), a base plate (204) disposed at the bottom of the support leg (202), and a reinforcing plate (203) disposed on both sides of the top of the base plate (204).

3. The TEC temperature control integrated device for the QCL laser module according to claim 2, characterized in that: The outer wall of the main body (201) of the device is provided with a docking ring (205), and the four corners of the docking ring (205) are provided with openings (206).

4. The TEC temperature control integrated device for the QCL laser module according to claim 3, characterized in that: A docking plate (207) is provided on one side of the docking ring (205), and threaded holes (208) are provided at the four corners of the docking plate (207). A mounting plate (209) is provided on one side of the docking plate (207), and a heat dissipation box (210) is provided on one side of the mounting plate (209).

5. The TEC temperature control integrated device for the QCL laser module according to claim 4, characterized in that: A heat sink (211) is provided on one side of the heat sink (210), and a mounting groove (212) is provided inside the heat sink (211), and a cooling fan (213) is provided inside the mounting groove (212).

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