A PD fast charging circuit suitable for a LEV vehicle
By designing a PD fast charging circuit suitable for LEV vehicles, the problem of low voltage withstand and high power consumption of existing fast charging chips in LEV vehicles is solved. It achieves high voltage withstand and low power consumption fast charging function, and has intelligent identification function that automatically recognizes insertion and closing, making it suitable for a variety of systems.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI PYTES ENERGY CO LTD
- Filing Date
- 2025-04-21
- Publication Date
- 2026-05-29
AI Technical Summary
Existing fast charging chips have low voltage withstand capability, high power consumption, and complex circuitry in LEV vehicles, and cannot meet the power supply requirements of LEV vehicles' 36V, 48V, 60V, and 72V power systems.
A PD fast charging circuit suitable for LEV vehicles was designed, including a power control module, a DC-DC power module, a PD protocol chip module, a Type-C female connector, an insertion identification module, an op-amp-output current detection module, an op-amp power control module, an LDO buck module, and an MCU control module. Through modular design and component fine-tuning, high voltage withstand and low power consumption fast charging function is achieved.
It enables high-voltage, low-power fast charging in LEV vehicles, features automatic plug-in and plug-out recognition, is highly adaptable, and can be rapidly developed for use in most systems.
Smart Images
Figure CN224305494U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LEV vehicle technology, specifically a PD fast charging circuit suitable for LEV vehicles. Background Technology
[0002] In recent years, electronic products have been updated and iterated at an increasingly rapid pace, and fast charging technology is also advancing rapidly. More and more e-bike products are now equipped with an external USB port for charging smart devices. However, most manufacturers only provide a standard 5V 2A output, which is not fast charging and therefore cannot quickly replenish the power of smart devices. Traditional fast charging chips are mostly used in power banks, and these chips have relatively low voltage tolerance, generally only up to 32V, making them unsuitable for LEV power systems with 36V, 48V, 60V, and 72V power supplies. Separate fast charging protocol chips are used in charging heads, but since charging heads are connected to AC power, many protocol chips have relatively high power consumption and are not used in BMS power systems. Utility Model Content
[0003] To address the problems mentioned in the background art, this utility model provides a PD fast charging circuit suitable for LEV vehicles, including a power control module, a DC-DC power module, a PD protocol chip module, a Type-C female connector, an insertion identification module, an operational amplifier-output current detection module, an operational amplifier power control module, an LDO buck module, and an MCU control module. The voltage input terminals are connected to the power control module and the LDO buck module respectively. The output terminal of the power control module is connected to the DC-DC power module via the DC-IN pin. The DC-DC power module is connected to the PD protocol chip module via the DC-VOUT and DC-FB pins. The PD protocol chip module is connected to the Type-C female connector via the CC1, CC2, and VOUTC pins. One C-ID pin of the Type-C female connector is connected to the insertion identification module. The insertion identification module transmits a detection signal to the MCU control module. The differential voltage signal from the PD protocol chip module is transmitted to the operational amplifier-output current detection module. The operational amplifier-output current detection module transmits a detection signal to the MCU control module. The output terminal of the LDO buck module is connected to the operational amplifier power control module. The MCU control module is connected to the power control module via the DC_EN pin.
[0004] The power control module includes a C18 capacitor, R1 resistor, R3 resistor, R4 resistor, R8 resistor, Q4 power transistor, Q1 power transistor, and ZD3 Zener diode. One pin of the MCU control module is connected to R4 resistor. The other end of R4 resistor is connected to R8 resistor and the gate of Q4 power transistor. The other end of R8 resistor and the source of Q4 power transistor are grounded together. The drain of Q4 power transistor is connected to R3 resistor. The other end of R3 resistor is connected to the gate of Q1. The voltage input terminal is connected to the C18 capacitor, ZD3 Zener diode, R1 resistor, and the source of Q1. The other end of C18 capacitor, the other end of ZD3 Zener diode, the other end of R1 resistor, and the gate of Q1 are grounded together. The drain of Q1 is connected to the DC-DC power module.
[0005] The DC-DC power module includes a U1 chip, capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C30, C31, C41, C42, and C43, resistors R2, R5, R7, R9, R11, R14, R17, R22, R80, resistors RV1 and RV2, resistors RC1, RF1, RF2, RS1, RA1, RA2, RA3, and RA7, and a Q2 power supply. The circuit consists of a transistor, a power transistor (Q3), an inductor (L1), diodes (D2 and D3), and an LED1 light-emitting diode. The U1 chip is model JWH6346. The EP, AGND, and PGND pins of the U1 chip are connected to ground. The SS pin of the U1 chip is connected to capacitor C41, with the other end of C41 grounded. The VIN pin of the U1 chip is connected to the drain of the Q2 power transistor, resistor RV1, capacitors C1, C2, C3, C4, C42, and C43. The other ends of capacitors C1, C2, C3, C4, C42, and C43 are connected to ground. The EN pin of the U1 chip is connected to the other end of resistor RV1 and then connected to RV1. 2. Resistor RV2 has one end grounded. The VCC pin of chip U1 is connected to capacitor C5 and resistor R5 respectively. The other end of capacitor C5 is grounded. The other end of resistor R5 is connected to LED1. The other end of LED1 is connected to the PG pin of chip U1. The VCCSET pin of chip U1 is connected to resistor RC1. The RT pin of chip U1 is connected to resistor RF1. The COMP pin of chip U1 is connected to resistor RF2. The other ends of resistors RC1, RF1, and RF2 are combined and grounded. The COMP pin of chip U1 is connected to resistor R11 and capacitor C30 respectively. The other end of resistor R11 is connected to capacitor C31. Capacitors C30 and C31 are combined and connected to the FB pin of chip U1. Resistor RA2, the HGATE pin of chip U1 is connected to diode D2 and resistor R2 respectively. The other ends of diode D2 and resistor R2 are connected to resistor R6 and the gate of power transistor Q2 respectively. The BST pin of chip U1 is connected to capacitor C6. The other end of capacitor C6 is connected to pin SW. The SW pin of chip U1 is connected to capacitor C6, resistor R6, power transistor Q2, power transistor Q3, resistor R7, and inductor L1 respectively. The other end of inductor L1 is connected to capacitors C7, C8, C9, C10, C12, C13, C14, and resistor RA1 respectively. The LGATE pin of chip U1 is connected to diode D3 and resistor R9 respectively.The other ends of diode D3 and resistor R9 are connected together to resistor R12 and the gate of power transistor Q3, respectively. The other end of resistor R12 is connected to capacitor C11 and the source of power transistor Q3. The drain of power transistor Q3 is connected to the source of power transistor Q2. Capacitor C11 is connected to resistor R7. The ILIM pin of chip U1 is connected to capacitor C15, resistor R80, and resistor R17, respectively. The other end of capacitor C15 is grounded. The other end of resistor R80 is connected to resistor RS1, and the other end of resistor RS1 is grounded. The other end of resistor R17 is connected together to inductor L1. The other ends of capacitors C7, C8, C9, C10, C12, and C13 are connected together to ground. The other end of capacitor C14 is connected to resistor R14. The other ends of resistors RA1 and R14 are connected together to resistor RA2. The other end of resistor RA2 is connected to resistor RA3. The other end of resistor RA3 is connected to resistor RA7, and resistor RA7 is grounded.
[0006] The PD protocol chip module includes a U5 chip, resistors R42, R44, R46, R50, R51, R52, RS3, capacitors C48, C49, C50, C51, C52, and C53, a Q7 power transistor, a Q9 power transistor, and a Q13 transistor. The U5 chip is model CH237D. The PGND and NMOS# pins of the U5 chip are grounded together. The HPD pin of the U5 chip is connected to resistor R48, the other end of which is connected to the CHVCC voltage. The VDD pin is connected to capacitor C49 and the CHVCC voltage, the other end of which is grounded. The NMOSC pins of the U5 chip are connected to resistor R42 and the gate of power transistor Q9. The drain of power transistor Q9 is connected to the Type-C female connector. The source of power transistor Q9 and the other end of resistor R42 are connected to the source of power transistor Q7. The other end of resistor R42 is connected to power transistor Q7. The gate of the power transistor and the VHV pin of the U5 chip are connected to capacitor C50. The other end of capacitor C50 is grounded. The AO pin of the U5 chip is connected to capacitors C52 and C51 and resistor R50 respectively. The VFB pin of the U5 chip is connected to the other end of capacitor C52. The IFB pin of the U5 chip is connected to the other end of capacitor C51. The other end of resistor R50 is connected to transistor Q13 and resistor R46 respectively. The other end of resistor R46 is connected to resistor R44. The other end of resistor R44, the drain of power transistor Q7, and the VHV and VBUS pins of the U5 chip are connected together to the DC-VOUT pin of the DC-DC power module. The ISP pin of the U5 chip is connected to capacitor C53 and resistor R51 respectively. The other end of resistor R51 is connected to resistor RS3 and Type-C female connector respectively. The ISN pin of the U5 chip is connected to the other end of capacitor C53 and resistor R52 respectively. The other end of resistor R52 and the other end of resistor RS3 are connected together to ground.
[0007] The Type-C female connector and insertion identification module include a diode D1, a resistor R10, a resistor R56, and a resistor R59. The DP1 and DP2 pins of the Type-C female connector are connected together to the resistor R56. The DP1, DP2, DN1, and DN2 pins of the Type-C female connector are connected together to the resistor R59. The other end of the resistor R56 is connected to the CHVCC voltage, and the other end of the resistor R59 is grounded. The C-ID pin of the Type-C female connector is connected to the diode D1. The other end of the diode D1 is connected to the resistor R10. The other end of the resistor R10 is connected to the 3V3 voltage. The VBUS pins of the Type-C female connector are connected to the power supply and the PD protocol chip module, respectively. The shield and GND pins of the Type-C female connector are grounded together.
[0008] The MCU control module includes a U3 chip, capacitors C22, C23, C24, C26, and C27, resistors R26, R27, and R31. The U3 chip is model MA82G5B32AD32. The P3.2 pin of the U3 chip is connected to one end of resistor R27, the other end of resistor R27 is connected to resistor R26, and the other end of resistor R26 is connected to a 3V3 voltage. The RST pin is split into two paths connected to capacitor C27 and resistor R31, and the other end of capacitor C27 is connected to a 3V3 voltage. The VDD pin is split into three paths connected to capacitors C22 and C23 and a 3V3 voltage. The VR0 pin is split into two paths connected to capacitors C24 and C26. The VSS pin, the other end of resistor R31, the other end of capacitor C22, the other end of capacitor C23, the other end of capacitor C24, and the other end of capacitor C26 are grounded together.
[0009] The LDO step-down module includes a Q5 transistor, a U2 chip, a D5 diode, a Q8 transistor, a ZD2A Zener diode, a R16 resistor, a R21 resistor, a C16 capacitor, a C17 capacitor, a C19 capacitor, and a C20 capacitor. The U2 chip is model HT7533-1. The input pin of the U2 chip is connected to the D5 diode and the C20 capacitor in two paths. The other end of the D5 diode is connected to the Q5 transistor, and the other end of the Q5 transistor is connected to the Q8 transistor. The Q8 transistor is connected to R16, R2, and the ZD2A Zener diode. The R16 resistor, R21 resistor, and Q5 transistor are connected together to the VIN voltage. The output pin of the U2 chip is connected to the C16 capacitor, C17 capacitor, C19 capacitor, 3V3 voltage, and the op-amp power control module. The ground pin of the U2 chip, the other end of the C16 capacitor, the other end of the C17 capacitor, the other end of the C19 capacitor, the other end of the C20 capacitor, and the other end of the ZD2A Zener diode are connected together to ground.
[0010] The operational amplifier power supply control module includes a Q6 power transistor, a Q10 power transistor, resistors R13, R15, R18, R19, R20, and capacitor C21. The drain of the Q6 power transistor is connected to resistor R15 and the YF-3V3 voltage. The source of the Q6 power transistor is connected to resistor R13, the 3V3 voltage, and the LDO buck module. The gate of the Q6 power transistor and the other end of R13 are connected to the drain of the Q10 power transistor. The gate of the Q10 power transistor is connected to resistors R18 and R20. The other end of R20 and the source of the Q10 power transistor are grounded together. The other end of resistor R15 is connected to resistor R19, capacitor C21, and the VF-VREF reference voltage. The other end of resistor R19 and the other end of capacitor C21 are grounded together.
[0011] The operational amplifier-output current detection module includes a U4A chip, a U4B chip, resistors R23, R24, R25, R28, R29, R30, R31, R33, R34, and a C25 capacitor. The U4A and U4B chips are model SGM8956XS8G / TR. The positive terminal of the U4A chip is connected to resistor R24, which is then connected to capacitor C25, resistor R23, and resistor R25. Resistor R23 and the positive terminal of the U4A chip are connected together in a Y-junction. With voltage F-3V3, the other end of resistor R25 and capacitor C25 are connected to ground. The negative terminal of chip U4A is grounded. The negative terminal of chip U4A is connected to resistor R28. Resistor R28 is connected to resistor R29 and the output terminal of chip U4B. The negative terminal of chip U4B is connected to the other end of resistor R29 and resistor R30. The positive terminal of chip U4B is connected to resistors R32, R33 and R34. The other end of resistor R33 is grounded. The other end of resistor R34 is connected to the YF-VREF reference voltage. The output terminal of chip U4A is connected to the MCU control module.
[0012] Compared with existing technologies, this invention overcomes the shortcomings of fast charging protocol chips, such as low voltage withstand capability, high power consumption, and complex circuitry. It features high voltage withstand capability, extremely low power consumption, and automatic insertion and shutdown detection. This circuit is highly versatile; only minor adjustments to key components are needed to adapt it to most systems, allowing for rapid modular development. Attached Figure Description
[0013] Figure 1 This is a schematic diagram of the overall circuit framework of this utility model;
[0014] Figure 2 This is a circuit diagram of the power control module and the DC-DC power supply module in this utility model;
[0015] Figure 3 This is a circuit diagram of the PD protocol chip module, Type-C female connector, and insertion identification module in this utility model;
[0016] Figure 4 This is a circuit diagram of the MCU control module in this utility model;
[0017] Figure 5 This is a circuit diagram of the LDO step-down module and the operational amplifier power supply control module in this utility model;
[0018] Figure 6 This is the circuit diagram of the operational amplifier-output current detection module in this utility model. Detailed Implementation
[0019] The present invention will be further described below with reference to the accompanying drawings.
[0020] like Figures 1 to 6 A PD fast charging circuit suitable for LEV vehicles includes a power control module, a DC-DC power module, a PD protocol chip module, a Type-C female connector, an insertion identification module, an operational amplifier-output current detection module, an operational amplifier power control module, an LDO buck module, and an MCU control module. The voltage input terminals are connected to the power control module and the LDO buck module respectively. The output terminal of the power control module is connected to the DC-DC power module via the DC-IN pin. The DC-DC power module is connected to the PD protocol chip module via the DC-VOUT and DC-FB pins. The PD protocol chip module is connected to the Type-C female connector via the CC1, CC2, and VOUTC pins. One C-ID pin of the Type-C female connector is connected to the insertion identification module, which transmits a detection signal to the MCU control module. The differential voltage signal from the PD protocol chip module is transmitted to the operational amplifier-output current detection module, which transmits a detection signal to the MCU control module. The output terminal of the LDO buck module is connected to the operational amplifier power control module, and the MCU control module is connected to the power control module via the DC_EN pin.
[0021] The power control module includes capacitor C18, resistors R1, R3, R4, R8, power transistors Q4 and Q1, and a Zener diode ZD3. The P3.5 pin of the MCU control module is connected to resistor R4. The other end of resistor R4 is connected to resistor R8 and the gate of power transistor Q4. The other end of resistor R8 is connected to the source of power transistor Q4 and grounded. The drain of power transistor Q4 is connected to resistor R3. The other end of resistor R3 is connected to the gate of Q1. The voltage input terminal is connected to capacitor C18, Zener diode ZD3, resistor R1, and the source of Q1. The other ends of capacitor C18, Zener diode ZD3, resistor R1, and the gate of Q1 are connected to grounded. The drain of Q1 is connected to the DC-DC power module. The power control module controls the power-on of the DC-DC power module's input terminal.
[0022] The DC-DC power module includes a U1 chip, capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C30, C31, C41, C42, and C43, resistors R2, R5, R7, R9, R11, R14, R17, R22, R80, resistors RV1 and RV2, resistors RC1, RF1, RF2, RS1, RA1, RA2, RA3, and RA7, and a Q2 power transistor. The circuit consists of power transistor Q3, inductor L1, diodes D2 and D3, LED1, and chip U1 (model JWH6346). The EP, AGND, PGND, and EP pins of chip U1 are connected to ground. The SS pin of chip U1 is connected to capacitor C41, with the other end of capacitor C41 grounded. The VIN pin of chip U1 is connected to the drain of power transistor Q2, resistor RV1, capacitors C1, C2, C3, C4, C42, and C43. The other ends of capacitors C1, C2, C3, C4, C42, and C43 are connected to ground. The EN pin of chip U1 is connected to the other end of resistor RV1 and then connected to resistor RV2. The U1 chip's VCC pin is connected to capacitor C5 and resistor R5, with the other end of capacitor C5 grounded. The other end of resistor R5 is connected to LED1, and the other end of LED1 is connected to the PG pin of the U1 chip. The U1 chip's VCCSET pin is connected to resistor RC1, the U1 chip's RT pin is connected to resistor RF1, and the U1 chip's COMP pin is connected to resistor RF2. The other ends of resistors RC1, RF1, and RF2 are combined and grounded. The U1 chip's COMP pin is connected to resistor R11 and capacitor C30, with the other end of resistor R11 connected to capacitor C31. Capacitors C30 and C31 are combined and connected to the U1 chip's FB pin and R... Resistor A2, the HGATE pin of chip U1 is connected to diode D2 and resistor R2 respectively. The other ends of diode D2 and resistor R2 are connected to resistor R6 and the gate of power transistor Q2 respectively. The BST pin of chip U1 is connected to capacitor C6. The other end of capacitor C6 is connected to pin SW. The SW pin of chip U1 is connected to capacitor C6, resistor R6, power transistor Q2, power transistor Q3, resistor R7, and inductor L1 respectively. The other end of inductor L1 is connected to capacitors C7, C8, C9, C10, C12, C13, C14, and resistor RA1 respectively. The LGATE pin of chip U1 is connected to diode D3 and resistor R9 respectively.The other ends of diode D3 and resistor R9 are connected together to resistor R12 and the gate of power transistor Q3, respectively. The other end of resistor R12 is connected to capacitor C11 and the source of power transistor Q3. The drain of power transistor Q3 is connected to the source of power transistor Q2. Capacitor C11 is connected to resistor R7. The ILIM pin of chip U1 is connected to capacitor C15, resistor R80, and resistor R17, respectively. The other end of capacitor C15 is grounded. The other end of resistor R80 is connected to resistor RS1, and the other end of resistor RS1 is grounded. The other end of resistor R17 is connected together to inductor L1. The other ends of capacitors C7, C8, C9, C10, C12, and C13 are connected together to ground. The other end of capacitor C14 is connected to resistor R14. The other ends of resistors RA1 and R14 are connected together to resistor RA2. The other end of resistor RA2 is connected to resistor RA3. The other end of resistor RA3 is connected to resistor RA7, and resistor RA7 is grounded.
[0023] The PD protocol chip module includes a U5 chip, resistors R42, R44, R46, R50, R51, R52, RS3, capacitors C48, C49, C50, C51, C52, and C53, power transistors Q7 and Q9, and transistor Q13. The U5 chip is model CH237D. The PGND pin and NMOS# pin of the U5 chip are grounded together. The HPD pin of the U5 chip is connected to R42. 8 resistors, the other end of resistor R48 is connected to the CHVCC voltage, the VDD pin is connected to capacitor C49 and the CHVCC voltage respectively, the other end of capacitor C49 is grounded, the NMOSC pin of U5 chip is connected to resistor R42 and the gate of power transistor Q9 respectively, the drain of power transistor Q9 is connected to the Type-C female connector, the source of power transistor Q9 and the other end of resistor R42 are combined and connected to the source of power transistor Q7, the other end of resistor R42 is connected to the gate of power transistor Q7, and the VHV pin of U5 chip... Connect capacitor C50, with the other end of capacitor C50 grounded. Connect the AO pin of the U5 chip to capacitors C52 and C51, and resistor R50 respectively. Connect the VFB pin of the U5 chip to the other end of capacitor C52. Connect the IFB pin of the U5 chip to the other end of capacitor C51. Connect the other end of resistor R50 to transistor Q13 and resistor R46 respectively. Connect the other end of resistor R46 to resistor R44. Connect the other end of resistor R44, the drain of power transistor Q7, and the VHV and VBUS pins of the U5 chip together to the DC-VOUT pin of the DC-DC power supply module. Connect the ISP pin of the U5 chip to capacitor C53 and resistor R51 respectively. Connect the other end of resistor R51 to resistor RS3 and Type-C female connector respectively. Connect the ISN pin of the U5 chip to the other end of capacitor C53 and resistor R52 respectively. Connect the other end of resistor R52 and the other end of resistor RS3 together to ground. The differential voltage signal of resistor RS3 is transmitted to the op-amp-output current detection module. The PD protocol chip module partially identifies the voltage and current required by the smart device, and then adjusts the output voltage of the DC-DC power module to provide the appropriate voltage to charge the smart device.
[0024] The Type-C female connector and insertion identification module include diode D1, resistor R10, resistor R56, and resistor R59. The DP1 and DP2 pins of the Type-C female connector are connected together to resistor R56. The DP1, DP2, DN1, and DN2 pins of the Type-C female connector are connected together to resistor R59. The other end of resistor R56 is connected to the CHVCC voltage, and the other end of resistor R59 is grounded. The C-ID pin of the Type-C female connector is connected to diode D1. The other end of diode D1 is connected to resistor R10. The other end of resistor R10 is connected to 3V3 voltage. The VBUS pins of the Type-C female connector are connected to the power supply and the PD protocol chip module, respectively. The shield and GND pins of the Type-C female connector are grounded together.
[0025] The MCU control module includes a U3 chip, capacitors C22, C23, C24, C26, and C27, resistors R26, R27, and R31. The U3 chip model is MA82G5B32AD32. The P3.2 pin of the U3 chip is connected to one end of resistor R27, the other end of resistor R27 is connected to resistor R26, and the other end of resistor R26 is connected to a 3V3 voltage. The RST pin is split into two paths connected to capacitor C27 and resistor R31, and the other end of capacitor C27 is connected to a 3V3 voltage. The VDD pin is split into three paths connected to capacitors C22 and C23 and a 3V3 voltage. The VR0 pin is split into two paths connected to capacitors C24 and C26. The VSS pin, the other end of resistor R31, the other end of capacitor C22, the other end of capacitor C23, the other end of capacitor C24, and the other end of capacitor C26 are combined and grounded.
[0026] The LDO step-down module includes a Q5 transistor, a U2 chip, a D5 diode, a Q8 transistor, a ZD2A Zener diode, a R16 resistor, a R21 resistor, a C16 capacitor, a C17 capacitor, a C19 capacitor, and a C20 capacitor. The U2 chip is model HT7533-1. The input pin of the U2 chip is connected to the D5 diode and the C20 capacitor in two paths. The other end of the D5 diode is connected to the Q5 transistor, and the other end of the Q5 transistor is connected to the Q8 transistor. The Q8 transistor is connected to R16, R2, and the ZD2A Zener diode. The R16 resistor, R21 resistor, and Q5 transistor are connected together to the VIN voltage. The output pin of the U2 chip is connected to the C16 capacitor, C17 capacitor, C19 capacitor, 3V3 voltage, and the op-amp power control module. The ground pin of the U2 chip, the other end of the C16 capacitor, the other end of the C17 capacitor, the other end of the C19 capacitor, the other end of the C20 capacitor, and the other end of the ZD2A Zener diode are connected together to ground.
[0027] The operational amplifier power supply control module includes a Q6 power transistor, a Q10 power transistor, resistors R13, R15, R18, R19, R20, and a C21 capacitor. The drain of the Q6 power transistor is connected to resistor R15 and the YF-3V3 voltage. The source of the Q6 power transistor is connected to resistor R13, the 3V3 voltage, and the LDO buck module. The gate of the Q6 power transistor and the other end of R13 are connected to the drain of the Q10 power transistor. The gate of the Q10 power transistor is connected to resistors R18 and R20. The other end of R20 and the source of the Q10 power transistor are grounded together. The other end of resistor R15 is connected to resistor R19, capacitor C21, and the VF-VREF reference voltage. The other end of resistor R19 and the other end of capacitor C21 are grounded together.
[0028] The op-amp-output current detection module includes a U4A chip, a U4B chip, resistors R23, R24, R25, R28, R29, R30, R31, R33, R34, and a C25 capacitor. The U4A and U4B chips are model SGM8956XS8G / TR. The positive terminal of the U4A chip is connected to resistor R24, which is then connected to capacitor C25, resistor R23, and resistor R25. Resistor R23 and the positive terminal of the U4A chip are connected together to a YF-3V3 voltage source. This YF-3V3 voltage is supplied by the op-amp power control module's YF-3V3 voltage source. This is a voltage taper connection. The other end of resistor R25 and capacitor C25 are connected to ground. The negative terminal of chip U4A is grounded. The negative terminal of chip U4A is connected to resistor R28. Resistor R28 is connected to resistor R29 and the output terminal of chip U4B. The negative terminal of chip U4B is connected to the other end of resistor R29 and resistor R30. The positive terminal of chip U4B is connected to resistors R32, R33, and R34. The other ends of resistors R30 and R32 receive the differential voltage signal from the PD protocol chip module. The other end of resistor R33 is grounded. The other end of resistor R34 is connected to the YF-VREF reference voltage. The output terminal of chip U4A is connected to the MCU control module. This is used for detecting the output current of the Type-C female connector, enabling low-current disconnection of the output.
[0029] In operation, the DC-DC power module is off by default, while the LDO step-down module and MCU control module are active. A GND pin (C-ID) on the Type-C female connector is used as the insertion identification pin, pulled up by 3.3V. When the data cable is inserted, the male connector shorts the C-ID pin to another GND pin. The MCU detects this change and recognizes the insertion. Upon detection, the MCU control module initiates the power control module, subsequently triggering the labeled DC-DC power module, PD protocol chip module, op-amp-output current detection module, and op-amp power control module to enter operational mode, completing the system startup and power supply process. When the smart device is fully charged, or when the device is unplugged but the data cable remains connected, the op-amp-output current detection module detects that the discharge current is less than a set threshold. At this point, the system determines that the charging or communication process is complete, the op-amp sends a signal back to the power control module, and the MCU control module shuts down the DC-DC power module, putting the system into a low-power state. If a device is inserted again, the system will start a new detection cycle, the control module will re-identify the insertion action and control the relevant circuits to resume working.
Claims
1. A PD fast charging circuit suitable for LEV vehicles, comprising a power control module, a DC-DC power module, a PD protocol chip module, a Type-C female connector, an insertion identification module, an MCU control module, an LDO buck module, an operational amplifier power control module, and an operational amplifier-output current detection module, characterized in that: The voltage input terminals are connected to the power control module and the LDO buck module respectively. The output terminal of the power control module is connected to the DC-DC power module through the DC-IN pin. The DC-DC power module is connected to the PD protocol chip module through the DC-VOUT and DC-FB pins. The PD protocol chip module is connected to the Type-C female connector through the CC1, CC2, and VOUTC pins. One C-ID pin of the Type-C female connector is connected to the insertion identification module. The insertion identification module transmits the detection signal to the MCU control module. The differential voltage signal of the PD protocol chip module is transmitted to the op-amp-output current detection module. The op-amp-output current detection module transmits the detection signal to the MCU control module. The output terminal of the LDO buck module is connected to the op-amp power control module. The MCU control module is connected to the power control module through the DC_EN pin.
2. The PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The power control module includes a C18 capacitor, R1 resistor, R3 resistor, R4 resistor, R8 resistor, Q4 power transistor, Q1 power transistor, and ZD3 Zener diode. One pin of the MCU control module is connected to R4 resistor. The other end of R4 resistor is connected to R8 resistor and the gate of Q4 power transistor. The other end of R8 resistor and the source of Q4 power transistor are grounded together. The drain of Q4 power transistor is connected to R3 resistor. The other end of R3 resistor is connected to the gate of Q1. The voltage input terminal is connected to the C18 capacitor, ZD3 Zener diode, R1 resistor, and the source of Q1. The other end of C18 capacitor, the other end of ZD3 Zener diode, the other end of R1 resistor, and the gate of Q1 are grounded together. The drain of Q1 is connected to the DC-DC power module.
3. A PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The DC-DC power module includes a U1 chip, capacitors C1, C2, C3, C4, C5, C6, C7, C8, C9, C10, C11, C12, C13, C14, C15, C30, C31, C41, C42, and C43, resistors R2, R5, R7, R9, R11, R14, R17, R22, R80, resistors RV1 and RV2, resistors RC1, RF1, RF2, RS1, RA1, RA2, RA3, and RA7, and a Q2 power supply. The circuit consists of a transistor, a power transistor (Q3), an inductor (L1), diodes (D2 and D3), and an LED1 light-emitting diode. The U1 chip is model JWH6346. The EP, AGND, and PGND pins of the U1 chip are connected to ground. The SS pin of the U1 chip is connected to capacitor C41, with the other end of C41 grounded. The VIN pin of the U1 chip is connected to the drain of the Q2 power transistor, resistor RV1, capacitors C1, C2, C3, C4, C42, and C43. The other ends of capacitors C1, C2, C3, C4, C42, and C43 are connected to ground. The EN pin of the U1 chip is connected to the other end of resistor RV1 and then connected to RV1.
2. Resistor RV2 has one end grounded. The VCC pin of chip U1 is connected to capacitor C5 and resistor R5 respectively. The other end of capacitor C5 is grounded. The other end of resistor R5 is connected to LED1. The other end of LED1 is connected to the PG pin of chip U1. The VCCSET pin of chip U1 is connected to resistor RC1. The RT pin of chip U1 is connected to resistor RF1. The COMP pin of chip U1 is connected to resistor RF2. The other ends of resistors RC1, RF1, and RF2 are combined and grounded. The COMP pin of chip U1 is connected to resistor R11 and capacitor C30 respectively. The other end of resistor R11 is connected to capacitor C31. Capacitors C30 and C31 are combined and connected to the FB pin of chip U1. Resistor RA2, the HGATE pin of chip U1 is connected to diode D2 and resistor R2 respectively. The other ends of diode D2 and resistor R2 are connected to resistor R6 and the gate of power transistor Q2 respectively. The BST pin of chip U1 is connected to capacitor C6. The other end of capacitor C6 is connected to pin SW. The SW pin of chip U1 is connected to capacitor C6, resistor R6, power transistor Q2, power transistor Q3, resistor R7, and inductor L1 respectively. The other end of inductor L1 is connected to capacitors C7, C8, C9, C10, C12, C13, C14, and resistor RA1 respectively. The LGATE pin of chip U1 is connected to diode D3 and resistor R9 respectively.The other ends of diode D3 and resistor R9 are connected together and then connected to resistor R12 and the gate of power transistor Q3, respectively. The other end of resistor R12 is connected to capacitor C11 and the source of power transistor Q3. The drain of power transistor Q3 is connected to the source of power transistor Q2. Capacitor C11 is connected to resistor R7. The ILIM pin of chip U1 is connected to capacitor C15, resistor R80, and resistor R17, respectively. The other end of capacitor C15 is grounded. The other end of resistor R80 is connected to resistor RS1, and the other end of resistor RS1 is grounded. The other end of resistor R17 is connected together to inductor L1. The other ends of capacitors C7, C8, C9, C10, C12, and C13 are connected together and then grounded. The other end of capacitor C14 is connected to resistor R14. The other ends of resistors RA1 and R14 are connected together to resistor RA2. The other end of resistor RA2 is connected to resistor RA3. The other end of resistor RA3 is connected to resistor RA7, and resistor RA7 is grounded.
4. A PD fast charging circuit suitable for LEV vehicles according to claim 1, characterized in that: The PD protocol chip module includes a U5 chip, resistors R42, R44, R46, R50, R51, R52, RS3, capacitors C48, C49, C50, C51, C52, and C53, a Q7 power transistor, a Q9 power transistor, and a Q13 transistor. The U5 chip is model CH237D. The PGND and NMOS# pins of the U5 chip are grounded together. The HPD pin of the U5 chip is connected to resistor R48, the other end of which is connected to the CHVCC voltage. The VDD pin is connected to capacitor C49 and the CHVCC voltage, the other end of which is grounded. The NMOSC pins of the U5 chip are connected to resistor R42 and the gate of power transistor Q9. The drain of power transistor Q9 is connected to the Type-C female connector. The source of power transistor Q9 and the other end of resistor R42 are connected to the source of power transistor Q7. The other end of resistor R42 is connected to power transistor Q7. The gate of the power transistor and the VHV pin of the U5 chip are connected to capacitor C50. The other end of capacitor C50 is grounded. The AO pin of the U5 chip is connected to capacitors C52 and C51 and resistor R50 respectively. The VFB pin of the U5 chip is connected to the other end of capacitor C52. The IFB pin of the U5 chip is connected to the other end of capacitor C51. The other end of resistor R50 is connected to transistor Q13 and resistor R46 respectively. The other end of resistor R46 is connected to resistor R44. The other end of resistor R44, the drain of power transistor Q7, and the VHV and VBUS pins of the U5 chip are connected together to the DC-VOUT pin of the DC-DC power module. The ISP pin of the U5 chip is connected to capacitor C53 and resistor R51 respectively. The other end of resistor R51 is connected to resistor RS3 and Type-C female connector respectively. The ISN pin of the U5 chip is connected to the other end of capacitor C53 and resistor R52 respectively. The other end of resistor R52 and the other end of resistor RS3 are connected together to ground.
5. A PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The Type-C female connector and insertion identification module include a diode D1, a resistor R10, a resistor R56, and a resistor R59. The DP1 and DP2 pins of the Type-C female connector are connected together to the resistor R56. The DP1, DP2, DN1, and DN2 pins of the Type-C female connector are connected together to the resistor R59. The other end of the resistor R56 is connected to the CHVCC voltage, and the other end of the resistor R59 is grounded. The C-ID pin of the Type-C female connector is connected to the diode D1. The other end of the diode D1 is connected to the resistor R10. The other end of the resistor R10 is connected to the 3V3 voltage. The VBUS pins of the Type-C female connector are connected to the power supply and the PD protocol chip module, respectively. The shield pin and GND pin of the Type-C female connector are grounded together.
6. A PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The MCU control module includes a U3 chip, capacitors C22, C23, C24, C26, and C27, resistors R26, R27, and R31. The U3 chip is model MA82G5B32AD32. The P3.2 pin of the U3 chip is connected to one end of resistor R27, the other end of resistor R27 is connected to resistor R26, and the other end of resistor R26 is connected to a 3V3 voltage. The RST pin is split into two paths connected to capacitor C27 and resistor R31, and the other end of capacitor C27 is connected to a 3V3 voltage. The VDD pin is split into three paths connected to capacitors C22 and C23 and a 3V3 voltage. The VR0 pin is split into two paths connected to capacitors C24 and C26. The VSS pin, the other end of resistor R31, the other end of capacitor C22, the other end of capacitor C23, the other end of capacitor C24, and the other end of capacitor C26 are grounded together.
7. A PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The LDO step-down module includes a Q5 transistor, a U2 chip, a D5 diode, a Q8 transistor, a ZD2A Zener diode, a R16 resistor, a R21 resistor, a C16 capacitor, a C17 capacitor, a C19 capacitor, and a C20 capacitor. The U2 chip is model HT7533-1. The input pin of the U2 chip is connected to the D5 diode and the C20 capacitor in two paths. The other end of the D5 diode is connected to the Q5 transistor, and the other end of the Q5 transistor is connected to the Q8 transistor. The Q8 transistor is connected to R16, R2, and the ZD2A Zener diode. The R16 resistor, R21 resistor, and Q5 transistor are connected together to the VIN voltage. The output pin of the U2 chip is connected to the C16 capacitor, C17 capacitor, C19 capacitor, 3V3 voltage, and the op-amp power control module. The ground pin of the U2 chip, the other end of the C16 capacitor, the other end of the C17 capacitor, the other end of the C19 capacitor, the other end of the C20 capacitor, and the other end of the ZD2A Zener diode are connected together to ground.
8. A PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The operational amplifier power supply control module includes a Q6 power transistor, a Q10 power transistor, resistors R13, R15, R18, R19, R20, and capacitor C21. The drain of the Q6 power transistor is connected to resistor R15 and the YF-3V3 voltage. The source of the Q6 power transistor is connected to resistor R13, the 3V3 voltage, and the LDO buck module. The gate of the Q6 power transistor and the other end of R13 are connected to the drain of the Q10 power transistor. The gate of the Q10 power transistor is connected to resistors R18 and R20. The other end of R20 and the source of the Q10 power transistor are grounded together. The other end of resistor R15 is connected to resistor R19, capacitor C21, and the VF-VREF reference voltage. The other end of resistor R19 and the other end of capacitor C21 are grounded together.
9. A PD fast charging circuit for LEV vehicles according to claim 1, characterized in that: The operational amplifier-output current detection module includes a U4A chip, a U4B chip, resistors R23, R24, R25, R28, R29, R30, R31, R33, R34, and a C25 capacitor. The U4A and U4B chips are model SGM8956XS8G / TR. The positive terminal of the U4A chip is connected to resistor R24, which is then connected to capacitor C25, resistor R23, and resistor R25. Resistor R23 and the positive terminal of the U4A chip are connected together in a Y-junction. With voltage F-3V3, the other end of resistor R25 and capacitor C25 are connected to ground. The negative terminal of chip U4A is grounded. The negative terminal of chip U4A is connected to resistor R28. Resistor R28 is connected to resistor R29 and the output terminal of chip U4B. The negative terminal of chip U4B is connected to the other end of resistor R29 and resistor R30. The positive terminal of chip U4B is connected to resistors R32, R33 and R34. The other end of resistor R33 is grounded. The other end of resistor R34 is connected to the YF-VREF reference voltage. The output terminal of chip U4A is connected to the MCU control module.