Battery protection plate, battery and electronic device

Abstract

The present disclosure relates to a battery protection plate, a battery and an electronic device. The battery protection plate comprises a first circuit board, a cell connecting layer and an encapsulation layer. The cell connecting layer and the encapsulation layer are arranged on a first surface of the first circuit board. The encapsulation layer has a first projected pattern on the first surface. The cell connecting layer has a second projected pattern on the first surface. The first projected pattern and the second projected pattern do not overlap. In the present disclosure, the cell connecting layer and the encapsulation layer are arranged on the same side of the first circuit board without overlapping. The overall thickness of the battery protection plate is the sum of the thicknesses of the first circuit board and the cell connecting layer, or the sum of the thicknesses of the first circuit board and the encapsulation layer. Thus, the overall thickness of the battery protection plate is greatly reduced, which facilitates the arrangement of a larger capacity cell without changing the size of the battery compartment. Without reducing the charging power, the battery life of the electronic device can be improved to ensure the charging speed, thereby improving the user experience.

Description

Technical Field

[0001] This disclosure relates to the field of electronic equipment technology, and in particular to a battery protection board, a battery, and an electronic device. Background Technology

[0002] As consumer demands continue to rise, electronic devices are evolving towards longer battery life and smaller size.

[0003] Currently, the size of electronic devices is gradually decreasing, resulting in relatively large battery protection boards. Larger battery protection boards not only affect battery capacity but also restrict the layout of other components within the electronic device. Utility Model Content

[0004] To overcome the problems existing in related technologies, this disclosure provides a battery protection board, a battery, and an electronic device.

[0005] According to a first aspect of this disclosure, a battery protection board is provided, comprising:

[0006] First circuit board;

[0007] An encapsulation layer is disposed on the first side of the first circuit board;

[0008] A cell connection layer is disposed on the first side of the first circuit board;

[0009] The encapsulation layer has a first projected pattern on the first side of the first circuit board, and the cell connection layer has a second projected pattern on the first side of the first circuit board. The first projected pattern and the second projected pattern do not overlap.

[0010] In some embodiments, in the stacking direction of the encapsulation layer and the first circuit board, the height of the encapsulation layer is greater than the height of the cell connection layer;

[0011] The encapsulation layer and the cell connection layer enclose each other to form a receiving groove, which is used to install the electrode tabs of the cell.

[0012] In some embodiments, the first circuit board includes:

[0013] A substrate, wherein the encapsulation layer and the cell connection layer are disposed on the substrate;

[0014] An electronic component is disposed on the substrate, and the encapsulation layer covers the electronic component.

[0015] In some embodiments, a first surface of the substrate is provided with metal traces and an insulating region located between adjacent metal traces, the encapsulation layer covers the metal traces and the insulating region, and the encapsulation layer is in direct contact with the metal traces and the insulating region.

[0016] In some embodiments, the battery protection board further includes a second circuit board, which is connected to the edge of a first side of the first circuit board.

[0017] In some embodiments, a portion of the surface of the second circuit board facing the first circuit board has a window structure that exposes a portion of the internal circuitry of the second circuit board, the exposed circuitry of the second circuit board being electrically connected to the first circuit board.

[0018] In some embodiments, the second circuit board includes a flexible circuit board.

[0019] According to a second aspect of this disclosure, a battery is provided, including a battery cell and a battery protection board as described in the first aspect;

[0020] The electrode tab of the battery cell is connected to the battery cell connection layer of the battery protection board.

[0021] In some embodiments, the tab is disposed within a receiving groove formed by the encapsulation layer and the cell connection layer.

[0022] According to a third aspect of this disclosure, an electronic device is provided, including a battery protection board as described in the first aspect, or including a battery as described in the second aspect.

[0023] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: by disposing the cell connection layer and the encapsulation layer on the same side of the first circuit board without overlapping, the overall thickness of the battery protection board is the sum of the thickness of the first circuit board and the cell connection layer, or the sum of the thickness of the first circuit board and the encapsulation layer, thereby significantly reducing the overall thickness of the battery protection board. This facilitates the placement of larger capacity cells without changing the size of the battery compartment, and does not require reducing the charging power. It improves the battery life of electronic devices while ensuring the charging speed, thereby enhancing the user experience.

[0024] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0026] Figure 1 This is a schematic diagram of a battery in related technologies.

[0027] Figure 2 This is a schematic diagram of a battery according to an exemplary embodiment of the present disclosure. Detailed Implementation

[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0029] See Figure 1 This illustration shows a battery 100' with a battery protection board 10' in the related art. Along the y-direction, the battery protection board 10' includes a sequentially stacked encapsulation layer 12', a solder resist ink layer 17', a first circuit board 11', a solder pad 16', a second circuit board 15', and a cell connection layer 13'. Figure 1 It can be determined that the overall thickness of the battery protection board 10' is the sum of the thicknesses of the encapsulation layer 12', the solder resist ink layer 17', the first circuit board 11', the solder pad 16', the second circuit board 15', and the cell connection layer 13'.

[0030] For example, the thickness of the encapsulation layer 12' is 0.52 mm, the thickness of the solder resist ink layer 17' is 0.05 mm, the thickness of the first circuit board 11' is 0.76 mm, the thickness of the solder pad 16' is 0.1 mm, the thickness of the second circuit board 15' is 0.17 mm, and the thickness of the cell connection layer 13' is 0.5 mm, so that the overall thickness of the battery protection board 10' is approximately 2.09 mm.

[0031] As can be seen from the above, with the battery compartment size remaining unchanged, the battery protection board occupies a lot of space in the battery, which prevents the battery cell from being made larger. Furthermore, currently, the only way to reduce the size of the battery protection board is to reduce the charging power, rather than reducing the size of the battery protection board to increase the battery cell capacity while ensuring the charging power.

[0032] To address the aforementioned technical problems, this disclosure provides a battery protection board, a battery, and an electronic device. The battery protection board includes a first circuit board, a cell connection layer, and an encapsulation layer. Both the cell connection layer and the encapsulation layer are disposed on a first side of the first circuit board. The encapsulation layer has a first projected pattern on the first side, and the cell connection layer has a second projected pattern on the first side. The first and second projected patterns do not overlap. In this disclosure, by non-overlappingly disposing the cell connection layer and the encapsulation layer on the same side of the first circuit board, the overall thickness of the battery protection board is either the sum of the thicknesses of the first circuit board and the cell connection layer, or the sum of the thicknesses of the first circuit board and the encapsulation layer. This significantly reduces the overall thickness of the battery protection board, allowing for the placement of larger capacity cells without changing the battery compartment size, and without reducing charging power. This improves the battery life of the electronic device while maintaining charging speed, thereby enhancing the user experience.

[0033] According to an exemplary embodiment, such as Figure 1 As shown, this embodiment provides a battery protection board 10, which is applied to a battery 100 (such as a lithium-ion battery). The battery protection board 10 is an integrated circuit board that plays a protective role during the charging and discharging process of the battery 100 to prevent the battery 100 from overcharging, over-discharging, short circuits, high temperatures, etc.

[0034] like Figure 1 As shown, the battery protection board 10 includes a first circuit board 11, which serves as the main body of the battery protection board 10. Various electronic components can be mounted on the first circuit board 11, such as a power management chip (PMIC), MOSFET switches, and capacitors. These components work together to control the on / off state of the charging and discharging path, thereby protecting the battery 100. In addition, the battery protection board 10 also functions to mount and support other structures within the battery protection board 10, such as the cell connection layer 13 and the encapsulation layer 12. In one example, the first circuit board 11 can be a printed circuit board (PCB).

[0035] like Figure 1 As shown, the encapsulation layer 12 is disposed on the first surface 10a of the first circuit board 11. The encapsulation layer 12 is used to improve the impact resistance, waterproofing, and heat dissipation capabilities of the first surface 10a of the first circuit board 11. In one example, the first surface 10a of the first circuit board 11 has various electronic components. The encapsulation layer 12 covers the electronic components to prevent them from being impacted by external objects and corroded by moisture, and to improve the heat exchange capability between the electronic components and the external environment. The material of the encapsulation layer 12 is, for example, epoxy resin (EMC) or other molding materials. The encapsulation layer 12 can be formed on the first surface 10a of the first circuit board 11 by injection molding.

[0036] like Figure 1 As shown, the cell connection layer 13 is disposed on the first surface 10a of the first circuit board 11, and the cell connection layer 13 is used to electrically connect the first circuit board 11 and the cell of the battery 100. The cell connection layer 13 is made of conductive metals such as copper, and can be electrically connected to the first circuit board 11 through a soldering process. In one example, the cell connection layer 13 includes two cell connection structures, one of which is connected to the positive electrode tab 21 of the cell 20, and the other of which is connected to the negative electrode tab 21 of the cell 20. In this embodiment, the specific placement of the cell connection layer 13 is not limited too much, and can be adaptively set according to the position of the solder pads on the first circuit board 11 used for connecting with the tabs 21.

[0037] Among them, see Figure 1 The encapsulation layer 12 has a first projection pattern on the first surface 10a of the first circuit board 11, and the cell connection layer 13 has a second projection pattern on the first surface 10a of the first circuit board 11. The first projection pattern and the second projection pattern do not overlap.

[0038] As can be seen from the above, the encapsulation layer 12 and the cell connection layer 13 are disposed on the first surface 10a of the first circuit board 11 without overlapping. When the thickness of the encapsulation layer 12 is greater than that of the cell connection layer 13, the overall thickness of the battery protection board 10 is the sum of the thicknesses of the first circuit board 11 and the encapsulation layer 12; when the thickness of the encapsulation layer 12 is less than that of the cell connection layer 13, the overall thickness of the battery protection board 10 is the sum of the thicknesses of the first circuit board 11 and the cell connection layer 13. It can be determined that, compared with the battery protection board 10' in the related art (see...),... Figure 1 Compared to the previous method, the stacking method provided in this embodiment significantly reduces the overall thickness of the battery protection board 10.

[0039] In this embodiment, by disposing the cell connection layer and the encapsulation layer on the same side of the first circuit board without overlapping, the overall thickness of the battery protection board is the sum of the thicknesses of the first circuit board and the cell connection layer, or the sum of the thicknesses of the first circuit board and the encapsulation layer. This significantly reduces the overall thickness of the battery protection board, allowing for the placement of larger capacity cells without changing the battery compartment size. Furthermore, it eliminates the need to reduce charging power, thereby improving the battery life of electronic devices while ensuring charging speed and enhancing the user experience.

[0040] In one exemplary embodiment, such as Figure 1 As shown, this embodiment provides a battery protection board 10, which includes a first circuit board 11, a cell connection layer 13, and an encapsulation layer 12. The cell connection layer 13 and the encapsulation layer 12 are both disposed on the first surface 10a of the first circuit board 11. The encapsulation layer 12 has a first projection pattern on the first surface 10a, and the cell connection layer 13 has a second projection pattern on the first surface 10a. The first projection pattern and the second projection pattern do not overlap.

[0041] Among them, such as Figure 1 As shown, in the stacking direction of the encapsulation layer 12 and the first circuit board 11 ( Figure 1 In the y-direction shown, the height of the encapsulation layer 12 is greater than the height of the cell connection layer 13. (See also...) Figure 1The encapsulation layer 12 has through holes to expose the pads on the first circuit board 11 for connection with the tabs 21. The cell connection layer 13 is disposed within the through holes of the encapsulation layer 12, so that the top surface of the cell connection layer 13 and the inner wall of the through holes of the encapsulation layer 12 form a receiving groove 14. In the assembled state, the tabs 21 of the cell 20 can be placed in the receiving groove 14, thereby reducing the distance between the encapsulation layer 12 and the cell 20, improving the integration of the battery protection board 10 and the cell 20 of the battery 100, and thus reducing the overall size of the battery 100 in the y direction. In this example, a solder layer can be formed on the pads of the first circuit board 11 using spot soldering or spray soldering processes, and then the cell connection layer 13 can be mounted on the first circuit board 11 through the solder layer. After mounting, the first circuit board 11 and the cell connection layer 13 can be reflowed in a reflow oven to enhance mounting reliability.

[0042] Among them, such as Figure 1 As shown, the first circuit board 11 includes a substrate and electronic components stacked together. The substrate is used to support the electronic components, the encapsulation layer 12 and the cell connection layer 13. The encapsulation layer 12 covers the electronic components to protect them and improve the heat dissipation performance of the large electronic components.

[0043] In some embodiments, see Figure 1 The first surface 10a of the substrate (i.e., the first surface 10a of the first circuit board 11) is provided with an insulating region. This insulating region is a structure located between the pads and the metal traces. The metal traces are used for electrical connection of electronic components, and the insulating region is used to carry the metal traces and maintain insulation between adjacent metal traces. (Continue reading...) Figure 1 The encapsulation layer 12 covers the metal traces and the insulating area, and the encapsulation layer 12 is in direct contact with the metal traces and the insulating area.

[0044] See Figure 1 The illustration shows a battery protection board 10' in the related art. In the related art, a solder resist ink layer 17' is provided on the first circuit board 11' of the battery protection board 10'. The solder resist ink layer 17' covers the insulating area and metal traces of the first circuit board 11. Compared with the related art, this embodiment omits the solder resist ink layer 17', thereby reducing the overall thickness of the battery protection board 10.

[0045] In one exemplary embodiment, such as Figure 1 As shown, this embodiment provides a battery protection board 10, which includes a first circuit board 11, a cell connection layer 13, and an encapsulation layer 12. The cell connection layer 13 and the encapsulation layer 12 are both disposed on the first surface 10a of the first circuit board 11. The encapsulation layer 12 has a first projection pattern on the first surface 10a, and the cell connection layer 13 has a second projection pattern on the first surface 10a. The first projection pattern and the second projection pattern do not overlap.

[0046] The battery protection board 10 provided in this embodiment may include any structural device of the battery protection board 10 provided in any of the above embodiments.

[0047] Among them, such as Figure 1 As shown, the battery protection board 10 also includes a second circuit board 15. The second circuit board 15 is connected to the edge of the first surface 10a of the first circuit board 11. The second circuit board 15 is used to realize the electrical connection between the battery protection board 10 and other structures of the electronic device, so that the battery 100 can power the electronic device. In one example, the second circuit board 15 can be a flexible printed circuit board (FPC). A flexible circuit board is a printed circuit board with high reliability and flexibility made of polyimide or polyester film as a substrate. By bending the flexible circuit board, it is convenient to realize the electrical connection between the battery 100 and various components (such as the motherboard) in the electronic device. The electrical connection method is, for example, to form a connection through a board-to-board connector (BTB connector). In this embodiment, by setting the second circuit board 15, the encapsulation layer 12 and the cell connection layer 13 on the same side of the first circuit board 11, the overall thickness of the battery protection board 10 is the sum of the thickness of the thickest structure in the second circuit board 15, the encapsulation layer 12 and the cell connection layer 13 and the thickness of the first circuit board 11, thereby reducing the overall thickness of the battery protection board 10.

[0048] In some embodiments, see Figure 1 The second circuit board 15 has a window structure (not shown in the figures) on its surface facing the first circuit board 11. This window structure exposes a portion of the internal circuitry of the second circuit board 15, and the exposed circuitry is electrically connected to the first circuit board 11. For example, see [reference needed]. Figure 1 Solder pads 16 (also known as solder paste) can be formed at the edge of the first surface 10a of the first circuit board 11, and the exposed circuit of the second circuit board 15 is electrically connected to the first circuit board 11 through the solder pads 16.

[0049] See Figure 1 In related technologies, double-sided openings (i.e., through-holes) are typically provided on the second circuit board 15'. The solder pads 16' on the first circuit board 11' penetrate the through-holes on the second circuit board 15' along the y-direction, and photosensitive adhesive (UV glue) is applied to the solder pads 16' to prevent them from contacting the external environment. The solder pads 16' and the photosensitive adhesive penetrating the second circuit board 15' result in a relatively thick section between the second circuit board 15 and the first circuit board 11. In one example, the thickness of the photosensitive adhesive is approximately 0.6 mm. However, in the solution provided in this embodiment, see [reference needed]. Figure 2Since the connection between the second circuit board 15 and the first circuit board 11 is a single-sided opening, the solder pad 16 will not penetrate the second circuit board 15, so there is no need to set photosensitive adhesive, which can reduce the thickness by about 0.3mm and save the cost of photosensitive adhesive.

[0050] In some embodiments, the overall thickness of the battery protection board 10 having the aforementioned technical features of this disclosure is the sum of the thicknesses of the encapsulation layer 12 and the first circuit board 11, i.e., 0.52mm + 0.76mm = 1.28mm, which significantly reduces the thickness of the battery protection board 10 compared to related technologies.

[0051] According to an exemplary embodiment of this disclosure, such as Figure 1 As shown, this embodiment provides a battery 100, which includes a battery cell 20 and a battery protection board 10 provided in any of the foregoing embodiments of this disclosure. The tabs 21 of the battery cell 20 are connected to the battery cell connection layer 13 of the battery protection board 10, and are then electrically connected to the first circuit board 11 of the battery protection board 10 through the battery cell connection layer 13.

[0052] The battery provided in this embodiment has all the technical features and effects of the battery protection board, which will not be repeated here. For example, the tab 21 of the cell 20 is disposed in the receiving groove 14 formed by the encapsulation layer 12 and the cell connection layer 13 of the battery protection board 10, so that the encapsulation layer 12 is closer to the cell 20, thereby improving the integration of the cell 20 and the battery protection board 10.

[0053] According to an exemplary embodiment of this disclosure, this embodiment provides an electronic device, such as a smartphone, tablet computer, laptop computer, smart wearable device, etc. The electronic device is equipped with a battery protection board 10 or a battery provided in any of the foregoing embodiments of this disclosure. In the electronic device provided in this embodiment, because the thickness of the battery protection board 10 is reduced, a larger capacity battery can be installed, improving the battery life of the electronic device; furthermore, when the battery protection board 10 is thinned, there is no need to reduce the charging and discharging power of the battery, thereby improving the charging speed of the electronic device and enhancing the user experience.

[0054] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the embodiments disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following claims.

[0055] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A battery protection board, characterized in that, include: First circuit board; An encapsulation layer is disposed on the first side of the first circuit board; A cell connection layer is disposed on the first side of the first circuit board; The encapsulation layer has a first projected pattern on the first side of the first circuit board, and the cell connection layer has a second projected pattern on the first side of the first circuit board. The first projected pattern and the second projected pattern do not overlap.

2. The battery protection board according to claim 1, characterized in that, In the stacking direction of the encapsulation layer and the first circuit board, the height of the encapsulation layer is greater than the height of the cell connection layer; The encapsulation layer and the cell connection layer enclose each other to form a receiving groove, which is used to install the electrode tabs of the cell.

3. The battery protection board according to claim 1, characterized in that, The first circuit board includes: A substrate, wherein the encapsulation layer and the cell connection layer are disposed on the substrate; An electronic component is disposed on the substrate, and the encapsulation layer covers the electronic component.

4. The battery protection board according to claim 3, characterized in that, The first surface of the substrate is provided with metal traces and an insulating region located between adjacent metal traces. The encapsulation layer covers the metal traces and the insulating region, and the encapsulation layer is in direct contact with the metal traces and the insulating region.

5. The battery protection board according to claim 1, characterized in that, The battery protection board also includes a second circuit board, which is connected to the edge of the first side of the first circuit board.

6. The battery protection board according to claim 5, characterized in that, The second circuit board has a window structure on the surface facing the first circuit board, which exposes a portion of the internal circuitry of the second circuit board, and the exposed circuitry of the second circuit board is electrically connected to the first circuit board.

7. The battery protection board according to claim 5 or 6, characterized in that, The second circuit board includes a flexible circuit board.

8. A battery, characterized in that, Includes battery cells, and a battery protection board as described in any one of claims 1-7; The electrode tab of the battery cell is connected to the battery cell connection layer of the battery protection board.

9. The battery according to claim 8, characterized in that, The electrode tab is disposed within the receiving groove formed by the encapsulation layer and the cell connection layer.

10. An electronic device, characterized in that, It includes the battery protection board as described in any one of claims 1-7, or the battery as described in claim 8 or 9.

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