Copper bonding sheet for multi-electrode simultaneous coppering of chip surfaces and chip assembly

Abstract

The utility model relates to copper welding piece and chip assembly for the multi -electrode of chip surface simultaneously covering copper T , the second surface of copper welding piece is provided with at least two closed grooves apart, each closed groove is in the copper welding piece and has the closed bottom and the opening in the closed groove depth t The vertical distance between the closed bottom and the second surface is limited, t With T Satisfy the following: (1) when 5mu m <= T <8mu m, t >=14.20% T ; (2) when 8mu m <= T <15mu m, t >=12.50% T ; (3) when 15mu m <= T <50mu m, t >=10.20% T ; 4) when 50mu m <= T <150mu m, t >=8.24% T ; (5) when 150mu m <= T <400mu m, t >=7.04% T ; (6) when 400mu m <= T <500mu m, t >=6.01% T .

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