A semiconductor package film material packaging fixing plate

Abstract

The utility model provides a kind of film material packaging fixing plate for semiconductor packaging, it include: fixed plate, protection mechanism, wherein, protection mechanism includes packaging shell, protection plate, fixed shell and pivot, wherein, packaging shell is installed on fixed plate;Protection plate is installed on packaging shell;Fixed shell is set on packaging shell;Pivot is set in the inside of fixed shell.The utility model of a kind of film material packaging fixing plate for semiconductor packaging, by the setting of protection plate, semiconductor can be protected, avoid semiconductor in the interference and damage of external environment in packaging process, improve the performance of semiconductor.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductors, and in particular to a thin film material packaging and fixing plate for semiconductor packaging. Background Technology

[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. After semiconductors are manufactured, they need to be packaged to protect them from the influence of the external environment. Thin film packaging plates are used in the packaging process.

[0003] Currently, traditional semiconductor packaging mounting plates encapsulate semiconductor materials by fixing them to the mounting plate using materials such as plastic. However, this encapsulation method leaves the semiconductor exposed, making it susceptible to interference and damage from the external environment, which in turn affects the semiconductor's performance and lifespan. Utility Model Content

[0004] This utility model aims to at least partially solve one of the technical problems in the above-mentioned technologies.

[0005] Therefore, one objective of this utility model is to provide a thin film material packaging and fixing plate for semiconductor packaging. By setting up the protective plate, the semiconductor can be protected, avoiding interference and damage from the external environment during the packaging process, thereby improving the performance and lifespan of the semiconductor.

[0006] To achieve the above objectives, the first aspect of this utility model provides a thin film material packaging fixing plate for semiconductor packaging, characterized in that it includes: a fixing plate and a protective mechanism, wherein the protective mechanism includes a packaging shell, a protective plate, a fixing shell, and a rotating shaft, wherein the packaging shell is mounted on the fixing plate; the protective plate is mounted on the packaging shell; the fixing shell is disposed on the packaging shell; and the rotating shaft is disposed inside the fixing shell.

[0007] In addition, the semiconductor packaging thin film material fixing plate proposed above according to this utility model may also have the following additional technical features:

[0008] Specifically, the outer wall of the protective plate is fixed with clips.

[0009] Specifically, a first bolt is provided on the fixed shell, and the first bolt passes through the packaging shell and is connected to the fixed plate.

[0010] Specifically, the inner wall of the protective plate is equipped with a sealing ring.

[0011] Specifically, the bottom wall of the fixed plate is provided with a splicing mechanism, which includes a splicing plate and a clamping plate. The splicing plate is set on the bottom wall of the fixed plate. A fixing groove is opened inside the splicing plate. The clamping plate is slidably connected inside the splicing plate, and the outer wall size of the clamping plate matches the inner wall size of the fixing groove.

[0012] Specifically, fixing holes are provided on the splicing plate.

[0013] Specifically, a lever is fixed to the outer wall of the card plate.

[0014] Specifically, a second bolt is provided on the outer wall of the splicing plate, and the second bolt passes through the splicing plate and is connected to the fixing plate.

[0015] Compared with existing technologies, this utility model has the following advantages: The semiconductor packaging film material fixing plate of this utility model, through the setting of the protective plate, can protect the semiconductor, avoiding interference and damage from the external environment during the packaging process, thus improving the semiconductor's performance and lifespan. Simultaneously, through the splicing mechanism, the fixing plate can be spliced ​​according to usage requirements, improving its practicality and flexibility. In specific operation, the fixing plate can be quickly spliced ​​simply by moving a lever.

[0016] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, in which:

[0018] Figure 1 This is a schematic diagram of a semiconductor packaging film material fixing plate structure according to an embodiment of the present invention;

[0019] Figure 2 This is a schematic diagram of a protective mechanism for a thin film material packaging and fixing plate for semiconductor packaging, according to an embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the structure of a semiconductor packaging thin film material fixing plate and a splicing plate used in conjunction, according to an embodiment of the present invention;

[0021] Figure 4 This is a schematic diagram of a semiconductor packaging thin film material packaging fixing plate splicing plate and a second bolt used in conjunction with an embodiment of the present invention;

[0022] Figure 5 This is a schematic diagram of a semiconductor packaging film material fixing plate splicing mechanism according to an embodiment of the present invention.

[0023] Reference numerals: 1. Fixing plate; 2. Protective mechanism; 21. Packaging shell; 22. Protective plate; 23. Clamping block; 24. Fixing shell; 25. Rotating shaft; 26. First bolt; 3. Sealing ring; 4. Splicing mechanism; 41. Splicing plate; 42. Fixing hole; 43. Fixing groove; 44. Clamping plate; 45. Pulling block; 5. Second bolt. Detailed Implementation

[0024] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0025] The following description, with reference to the accompanying drawings, describes a semiconductor packaging film material fixing plate according to an embodiment of the present invention.

[0026] like Figures 1-5 As shown in the figure, a semiconductor packaging film material fixing plate according to an embodiment of the present invention includes: a fixing plate 1 and a protective mechanism 2.

[0027] The protective mechanism 2 includes a packaging shell 21, a protective plate 22, a fixed shell 24, and a rotating shaft 25.

[0028] The packaging shell 21 is mounted on the fixing plate 1, the protective plate 22 is mounted on the packaging shell 21, the fixing shell 24 is set on the packaging shell 21, and the rotating shaft 25 is set inside the fixing shell 24.

[0029] The outer wall of the protective plate 22 is fixed with a clip 23.

[0030] A first bolt 26 is provided on the fixed shell 24, and the first bolt 26 passes through the packaging shell 21 and is connected to the fixed plate 1.

[0031] Specifically, the semiconductor is placed on the fixed plate 1, and the semiconductor is initially packaged by the packaging shell 21. Then, the protective plate 22 is covered, and the locking block 23 on the protective plate 22 engages with the packaging shell 21 to complete the further packaging of the semiconductor. The first bolt 26 passes through the packaging shell 21 and is connected to the fixed plate 1, so that the protective mechanism 2 is stably installed on the fixed plate 1, avoiding interference and damage to the semiconductor from the external environment during the packaging process, and improving the performance and life of the semiconductor.

[0032] In one embodiment of this application, such as Figure 1 As shown, a sealing ring 3 is provided on the inner wall of the protective plate 22.

[0033] It is understandable that the inner wall of the protective plate 22 is equipped with a sealing ring 3, which enhances the sealing of the packaging and further protects the semiconductor.

[0034] In one embodiment of this application, such as Figure 1 As shown, the bottom wall of the fixed plate 1 is provided with a splicing mechanism 4.

[0035] The splicing mechanism 4 includes a splicing plate 41 and a clamping plate 44.

[0036] The splicing plate 41 is set on the bottom wall of the fixed plate 1. The splicing plate 41 has a fixed groove 43 inside. The splicing plate 41 is slidably connected to the inside of the splicing plate 41, and the outer wall size of the clamping plate 44 matches the inner wall size of the fixed groove 43.

[0037] The splicing plate 41 has fixing holes 42.

[0038] A lever 45 is fixed to the outer wall of the card plate 44.

[0039] Specifically, when it is necessary to splice two fixed plates 1 together, first move the lever 45 to drive the locking plate 44 inside the splicing plate 41 on the bottom wall of one fixed plate 1 to slide inside the splicing plate 41, so that the locking plate 44 is inserted into the splicing plate 41 on the bottom wall of the other fixed plate 1, until the locking plate 44 is inserted into the fixing groove 43, thus completing the splicing of the two fixed plates 1.

[0040] In one embodiment of this application, such as Figure 1 As shown, the outer wall of the splicing plate 41 is provided with a second bolt 5, and the second bolt 5 passes through the splicing plate 41 and is connected to the fixing plate 1.

[0041] Understandably, the fixing plate 1 can be further fixed by the fixing hole 42 and the second bolt 5, which improves the practicality of the fixing plate 1 and makes it easier to assemble the fixing plate 1 according to the usage requirements.

[0042] Working principle: In use, the semiconductor is first placed on the fixed plate 1, and the packaging shell 21 performs preliminary packaging of the semiconductor. Then, the protective plate 22 is covered, and the locking block 23 on the protective plate 22 engages with the packaging shell 21 to complete the further packaging of the semiconductor. Then, the first bolt 26 passes through the packaging shell 21 and is connected to the fixed plate 1, so that the protective mechanism 2 is stably installed on the fixed plate 1, avoiding interference and damage to the semiconductor from the external environment during the packaging process, and improving the performance and life of the semiconductor. When it is necessary to splice two fixing plates 1 together, first move the lever 45 to drive the locking plate 44 inside the splicing plate 41 on the bottom wall of one fixing plate 1 to slide within the splicing plate 41, so that the locking plate 44 is inserted into the splicing plate 41 on the bottom wall of the other fixing plate 1, until the locking plate 44 is engaged in the fixing groove 43, thus completing the splicing of the two fixing plates 1. Finally, the spliced ​​fixing plate 1 can be further fixed by the cooperation of the fixing hole 42 and the second bolt 5, which facilitates the splicing of the fixing plate 1 according to the usage requirements and improves the practicality of the fixing plate 1.

[0043] In summary, the semiconductor packaging film material fixing plate of this utility model, through the setting of the protective plate 22, can protect the semiconductor and avoid interference and damage from the external environment during the packaging process, thereby improving the performance and lifespan of the semiconductor. Simultaneously, through the setting of the splicing mechanism 4, the fixing plate 1 can be spliced ​​according to usage requirements, improving the practicality and flexibility of the fixing plate 1. In specific operation, the fixing plate 1 can be quickly spliced ​​simply by moving the lever 45.

[0044] In the description of this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0045] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A thin-film material packaging and fixing plate for semiconductor packaging, characterized in that, include: Fixed plate (1), protective mechanism (2), wherein, The protective mechanism (2) includes a packaging shell (21), a protective plate (22), a fixing shell (24), and a rotating shaft (25), wherein, The packaging shell (21) is mounted on the fixing plate (1); The protective plate (22) is installed on the packaging shell (21); The fixing shell (24) is disposed on the packaging shell (21); The rotating shaft (25) is disposed inside the fixed housing (24).

2. The semiconductor packaging thin film material packaging and fixing plate according to claim 1, characterized in that, The outer wall of the protective plate (22) is fixed with a clip (23).

3. The semiconductor packaging thin film material packaging and fixing plate according to claim 1, characterized in that, The fixing shell (24) is provided with a first bolt (26), and the first bolt (26) passes through the packaging shell (21) and is connected to the fixing plate (1).

4. The semiconductor packaging thin film material packaging and fixing plate according to claim 1, characterized in that, The inner wall of the protective plate (22) is provided with a sealing ring (3).

5. A thin-film material packaging and fixing plate for semiconductor packaging according to claim 1, characterized in that, The bottom wall of the fixed plate (1) is provided with a splicing mechanism (4), wherein, The splicing mechanism (4) includes a splicing plate (41) and a clamping plate (44), wherein, The splicing plate (41) is disposed on the bottom wall of the fixing plate (1); The splicing plate (41) has a fixing groove (43) inside; The splicing plate (41) is internally slidably connected to a retaining plate (44), and the outer wall dimensions of the retaining plate (44) match the inner wall dimensions of the fixing groove (43).

6. A thin-film material packaging and fixing plate for semiconductor packaging according to claim 5, characterized in that, The splicing plate (41) has fixing holes (42).

7. A thin-film material packaging and fixing plate for semiconductor packaging according to claim 5, characterized in that, A lever (45) is fixed to the outer wall of the card plate (44).

8. A thin-film material packaging and fixing plate for semiconductor packaging according to claim 5, characterized in that, The outer wall of the splicing plate (41) is provided with a second bolt (5), and the second bolt (5) passes through the splicing plate (41) and is connected to the fixing plate (1).

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