Stripping apparatus

Abstract

The utility model relates to a kind of stripping device, comprising: electroplating bath, stripping anode and stripping cathode.Electroplating bath includes: outer tank and the inner tank received in outer tank.Outer tank and inner tank are all insulation tank body.Stripping anode is located at the outside of inner tank and is used to contact material belt to realize the electrical connection between material belt and power supply anode.Stripping cathode includes: erecting on the electrically-conductive frame of inner tank and the stripping plate of connecting electrically-conductive frame.Electrically-conductive frame is used to realize the electrical connection between stripping plate and power supply cathode.Stripping plate is located in inner tank and is immersed in the electroplating solution of inner tank.Build stripping structure, using the mode opposite to electroplating, the surface of material belt is stripped and handled, not only solve the problem of local plating layer over-thickness, but also adjust the distribution uniformity of plating layer thickness of each area on material belt, to solve the problem of local plating layer over-thickness in electroplating processing.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, and in particular to a stripping device. Background Technology

[0002] Electroplating is a process of applying a metal plating layer to the surface of a product. Taking the electroplating of metal terminals as an example, to increase the conductivity of the metal terminals, tin plating is required on their surface. During operation, a strip carrying multiple metal terminals is connected to the electroplating cathode, while tin balls connected to the electroplating anode are placed in the electroplating bath. Under the influence of an electric field, tin ions on the tin balls migrate to the metal terminals and adhere to their surface to form a tin plating layer. Because the structural distribution of the metal terminals is uneven, for example, some areas are narrower (tip areas), the current is higher in these narrower areas during electroplating, resulting in a much thicker tin plating layer in these areas compared to other areas. This leads to the problem of excessively thick tin plating in certain areas of the metal terminal. When the tin plating layer in a certain area of ​​the metal terminal is too thick, it is not only prone to burrs (due to the low hardness of tin) during transportation and use, potentially causing short circuits between electronic components, but the uneven thickness distribution of the tin plating layer across the entire metal terminal will also lead customers to reject the product as a defective item.

[0003] Therefore, it is necessary to propose corresponding solutions to the problem of excessively thick local coatings in electroplating processes. Utility Model Content

[0004] Based on this, the present invention provides a stripping device, which constructs a stripping structure and adopts the opposite method to electroplating to strip the surface of the material strip. This not only solves the problem of excessive local plating thickness, but also adjusts the uniformity of plating thickness distribution in various areas of the material strip, thereby solving the problem of excessive local plating thickness that occurs in electroplating.

[0005] A plating stripping device, comprising:

[0006] An electroplating solution tank; the electroplating solution tank includes: an outer tank and an inner tank housed within the outer tank; both the outer tank and the inner tank are insulated tanks; the outer tank is used to recover the electroplating solution overflowing from the inner tank and to return the electroplating solution to the mother tank; the inner tank is used to load the electroplating solution and to obtain the electroplating solution from the mother tank;

[0007] The stripping anode is located in the electroplating bath; the stripping anode is located outside the inner tank and is used to contact the strip to achieve electrical connection between the strip and the positive terminal of the power supply; and

[0008] A stripping cathode is installed in an electroplating bath; the stripping cathode includes: a conductive frame mounted on an inner tank and a stripping plate connected to the conductive frame; the conductive frame is used to realize the electrical connection between the stripping plate and the negative terminal of the power supply; the stripping plate is located in the inner tank and is immersed in the electroplating solution of the inner tank.

[0009] In the aforementioned stripping device, during operation, the strip is connected to the stripping anode to the positive terminal of the power supply, while the stripping plate of the electroplating cathode is immersed in the electroplating solution in the inner tank and connected to the negative terminal of the power supply via a conductive frame. When the power is turned on, the metal ions of the plating layer attached to the surface of the strip move towards the electroplating cathode under the action of the electric field and adhere to the surface of the stripping plate, thereby stripping the plating layer on the surface of the strip. Furthermore, similar to the principle of strip electroplating, during the stripping process, the current is higher in the narrower areas of the strip, resulting in a much faster stripping speed in these areas. This corresponds to the areas with thicker plating layers during electroplating; the thicker the original plating layer on the strip, the faster the stripping speed. Therefore, after stripping, not only can the problem of excessively thick plating layers in certain areas be solved, but the uniformity of plating thickness distribution in different areas of the strip can also be adjusted. Through the above design, a stripping structure is built, and the surface of the material strip is stripped using the opposite method to electroplating. This not only solves the problem of excessively thick local plating, but also adjusts the uniformity of plating thickness distribution in various areas of the material strip, thereby solving the problem of excessively thick local plating that occurs during electroplating.

[0010] In one embodiment, the inner tank includes an interconnected storage layer and an electroplating working layer, with the electroplating working layer located above the storage layer. The electroplating working layer has openings at both ends for the feed strip to enter and exit. A stripping plate is located within the electroplating working layer. The storage layer is connected to a mother tank via a feed pump to obtain the electroplating solution and transport it to the electroplating working layer. During operation, the feed strip enters the inner tank through the openings at both ends of the electroplating working layer and is immersed in the electroplating solution. Simultaneously, since the electroplating solution continuously overflows from the openings into the outer tank, the storage layer, with the assistance of the feed pump, continuously draws electroplating solution from the mother tank to replenish the electroplating working layer, thereby maintaining the liquid level of the electroplating solution.

[0011] In one embodiment, the outer tank is connected to the mother tank via a return pump to return the electroplating solution overflowing from the inner tank to the mother tank. The return pump quickly returns the electroplating solution overflowing into the outer tank to the mother tank, preventing large amounts of electroplating solution from remaining in the outer tank and improving the efficiency of solution utilization.

[0012] In one embodiment, the top of the inner groove is provided with a slot for engaging the conductive frame. During assembly, the conductive frame is simply engaged with the top of the inner groove, making the operation simple and the assembly / disassembly process highly efficient.

[0013] In one embodiment, the stripping anode includes: a conductive seat located outside the inner tank and two conductive rollers pivotally connected to the conductive seat; the conductive seat is used for electrical connection to the positive terminal of the power supply; a gap is formed between the two conductive rollers for the feed strip to pass through, and each conductive roller is used to contact the surface of the feed strip to provide guidance and conductivity. When the feed strip moves in the inner tank, the conductive rollers not only provide guidance but also enable electrical connection between the feed strip and the positive terminal of the power supply. The structure is simple and easy to use.

[0014] In one embodiment, the stripping plate is detachably connected to the bottom of the conductive frame by screws, which facilitates the disassembly and assembly of the stripping plate and reduces the difficulty of maintaining and cleaning it.

[0015] In one embodiment, the stripping plate is made of stainless steel. Stainless steel has high hardness, making it less prone to damage during subsequent plating removal, and it is both low-cost and durable.

[0016] In one embodiment, the stripping plate is a plate with wavy folds. The wavy folds can increase the surface area of ​​the stripping plate, providing a larger area for coating adhesion, extending the service life of the stripping plate, and reducing the frequency of coating cleaning of the stripping plate. Attached Figure Description

[0017] Figure 1 This is a perspective view of a plating stripping device according to an embodiment of the present invention;

[0018] Figure 2 for Figure 1 A partial view of the plating stripping apparatus shown;

[0019] Figure 3 for Figure 1 A perspective view of the stripping anode in the stripping apparatus shown;

[0020] Figure 4 for Figure 1 A perspective view of the stripping cathode in the stripping apparatus shown;

[0021] Figure 5 for Figure 4 A perspective view of the cathode plate in the cathode stripping process shown;

[0022] Figure 6 for Figure 5 An enlarged view of part A in the cathode plate shown;

[0023] Figure 7 for Figure 1 The diagram shown illustrates the working principle of the stripping device.

[0024] The meanings of the labels in the attached diagram are as follows:

[0025] 100-Removal plating device;

[0026] 10-Electroplating solution tank, 11-Outer tank, 12-Inner tank, 121-Reservoir layer, 122-Electroplating working layer, 1221-Opening, 1222-Card slot, 13-Inlet pipe;

[0027] 20 - Stripped anode, 21 - Conductive base, 22 - Conductive roller shaft;

[0028] 30-Removal cathode, 31-Conductive frame, 311-Lumber, 32-Removal plate;

[0029] 200-material strip. Detailed Implementation

[0030] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0031] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0035] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0036] like Figures 1 to 7 As shown, it is a stripping device 100 according to an embodiment of the present invention.

[0037] like Figure 1 As shown, the stripping apparatus 100 includes: an electroplating bath 10, a stripping anode 20 located in the electroplating bath 10, and a stripping cathode 30 installed in the electroplating bath 10. The electroplating bath 10 is used to hold the electroplating solution (taking the stripping of a tin plating layer as an example, in this embodiment, the electroplating solution can be alkyl sulfonic acid). An electric field is formed between the stripping anode 20 and the stripping cathode 30 in the electroplating solution, causing the plating layer attached to the surface of the strip 200 to be transferred to the stripping cathode 30, thereby adjusting the plating thickness on the surface of the strip 200 and regulating the uniformity of the plating thickness distribution.

[0038] The following text, combined with Figures 1 to 7 The above-mentioned stripping device 100 will be further described.

[0039] likeFigure 1 As shown, the electroplating solution tank 10 includes an outer tank 11 and an inner tank 12 housed within the outer tank 11. Both the outer tank 11 and the inner tank 12 are insulated tanks (for example, in this embodiment, both the outer tank 11 and the inner tank 12 are made of PVC). The outer tank 11 is used to collect the electroplating solution overflowing from the inner tank 12 and to return the electroplating solution to the main tank (in electroplating processing, the main tank used to store the electroplating solution is called the main tank, while the tank used to perform each electroplating operation is called the sub-tank; that is, the electroplating solution tank 10 in this embodiment is also one of the sub-tanks). The inner tank 12 is used to load the electroplating solution and to obtain the electroplating solution from the main tank.

[0040] Combination Figure 2 and Figure 7 As shown, in this embodiment, the inner tank 12 includes a liquid storage layer 121 and an electroplating working layer 122 that are interconnected, with the electroplating working layer 122 located above the liquid storage layer 121. The electroplating working layer 122 has openings 1221 at both ends for the feed belt 200 to enter and exit. The stripping plate 32 is located in the electroplating working layer 122, and the liquid storage layer 121 is supplied by a liquid pump (not shown, for example, via...). Figure 2 The inlet pipe 13 connects the supply pump and the storage layer 121 to the main tank to obtain the electroplating solution and transport it to the electroplating working layer 122. During operation, the material strip 200 enters the inner tank 12 through the openings 1221 at both ends of the electroplating working layer 122 and is immediately immersed in the electroplating solution. Simultaneously, since the electroplating solution continuously overflows from the openings 1221 into the outer tank 11, the storage layer 121, assisted by the supply pump, continuously draws electroplating solution from the main tank to replenish the electroplating working layer 122, thus maintaining the liquid level of the electroplating solution. It should be noted that by adjusting the width of the openings 1221, the surface tension of the liquid can be used to ensure that the liquid level is higher than the bottom of the openings 1221. This ensures that the material strip 200 is below the liquid surface of the inner tank 12 after entering through the openings 1221, meaning the material strip 200 can be immersed in the electroplating solution.

[0041] Furthermore, in this embodiment, the outer tank 11 is connected to the mother tank via a reflux pump (not shown) to return the electroplating solution overflowing from the inner tank 12 to the mother tank. By using the reflux pump to quickly return the electroplating solution overflowing into the outer tank 11 to the mother tank, a large amount of electroplating solution is prevented from remaining in the outer tank 11, and the efficiency of electroplating solution circulation is improved.

[0042] like Figure 1As shown, the stripping anode 20 is located outside the inner tank 12 and is used to contact the strip 200 to achieve an electrical connection between the strip 200 and the positive terminal of the power supply. In this scheme, the function of the stripping anode 20 is to achieve an electrical connection between the strip 200 and the power supply. Therefore, the specific structural configuration of the stripping anode 20 is not limited, provided that conductivity is satisfied.

[0043] For example, such as Figure 3 As shown, in this embodiment, the stripping anode 20 may include: a conductive seat 21 located on the outside of the inner tank 12 and two conductive rollers 22 pivotally connected to the conductive seat 21. The conductive seat 21 is used to electrically connect to the positive terminal of the power supply and conduct current to the conductive rollers 22. A gap is formed between the two conductive rollers 22 for the feed strip 200 to pass through, and each conductive roller 22 is used to contact the surface of the feed strip 200 to provide guidance and conductivity. When the feed strip 200 moves in the inner tank 12, the conductive rollers 22 not only provide guidance but also enable electrical connection between the feed strip 200 and the positive terminal of the power supply. The structure is simple and easy to use.

[0044] Combination Figure 2 and Figure 4 As shown, the stripping cathode 30 includes: a conductive frame 31 mounted on the inner tank 12 and a stripping plate 32 connected to the conductive frame 31. The conductive frame 31 is used to achieve an electrical connection between the stripping plate 32 and the negative terminal of the power supply (e.g., in...). Figure 4 In the middle, the conductive frame 31 is provided with a lug 311 for connecting to the negative terminal of the power supply. For example... Figure 7 As shown, during operation, the stripping plate 32 is located in the inner tank 12 and immersed in the electroplating solution of the inner tank 12.

[0045] To facilitate the installation of the stripped cathode 30, such as Figure 2 As shown, in this embodiment, the top of the inner groove 12 is provided with a slot 1222 for engaging the conductive frame 31 (for example, in this embodiment, the slot 1222 is located on the top of the electroplating working layer 122). During assembly, the conductive frame 31 can be engaged on the top of the inner groove 12, which is simple to operate and has high assembly and disassembly efficiency.

[0046] Considering that the plating layer adhering to the surface of the stripping plate 32 will become thicker as the stripping process progresses, it is necessary to clean the surface of the stripping plate 32 in a timely manner. To facilitate cleaning, such as... Figure 4 As shown, in this embodiment, the stripping plate 32 is detachably connected to the bottom of the conductive frame 31 by screws, which facilitates the disassembly and assembly of the stripping plate 32 and reduces the difficulty of maintaining and cleaning the stripping plate 32.

[0047] For durability, in this embodiment, the stripping plate 32 can be made of stainless steel. Stainless steel has high hardness, making it less prone to damage during subsequent plating removal from the surface of the stripping plate 32, and it is both low-cost and durable.

[0048] like Figure 5 and Figure 6 As shown, in this embodiment, the stripping plate 32 is a plate with wavy folds. The wavy folds can increase the surface area of ​​the stripping plate 32, providing a larger area for coating adhesion, extending the service life of the stripping plate 32, and reducing the frequency of coating cleaning of the stripping plate 32.

[0049] Brief description of working principle:

[0050] like Figure 7 As shown, during operation, the strip 200 is connected to the stripping anode 20 to be connected to the positive terminal of the power supply, while the stripping plate 32 of the electroplating cathode is immersed in the electroplating solution in the inner tank 12 and connected to the negative terminal of the power supply via the conductive frame 31. When the power is turned on, the metal ions of the plating layer attached to the surface of the strip 200 move to the electroplating cathode under the action of the electric field and attach to the surface of the stripping plate 32, thereby stripping the plating layer on the surface of the strip 200. Furthermore, similar to the principle of electroplating strip 200, during the stripping process, the current is higher in the narrower areas of strip 200, resulting in a much faster stripping speed in these areas compared to other areas. This corresponds to the areas with thicker plating layers during electroplating. The thicker the original plating layer on strip 200, the faster the stripping speed; conversely, the thinner the original plating layer on strip 200, the slower the stripping speed. Therefore, after stripping, not only can the problem of excessively thick plating layers in certain areas be solved, but the uniformity of plating thickness distribution in various areas of strip 200 can also be adjusted.

[0051] It should be emphasized that in this solution, the stripping process does not completely remove the surface plating of the metal terminals on the strip, but rather reduces the thickness of the plating.

[0052] The aforementioned stripping device 100 constructs a stripping structure and uses the opposite method to electroplating to strip the surface of the strip 200. This not only solves the problem of excessively thick local plating, but also adjusts the uniformity of plating thickness distribution in various areas of the strip 200, thereby solving the problem of excessively thick local plating that occurs during electroplating.

[0053] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0054] The above embodiments only illustrate preferred implementations of this utility model, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A stripping device, characterized in that, include: Electroplating bath; The electroplating solution tank includes an outer tank and an inner tank housed within the outer tank; both the outer tank and the inner tank are insulating tanks; the outer tank is used to recover the electroplating solution overflowing from the inner tank and to return the electroplating solution to the mother tank; the inner tank is used to load the electroplating solution and to obtain the electroplating solution from the mother tank. A stripping anode located in the electroplating bath; the stripping anode is located outside the inner tank and is used to contact the strip to achieve an electrical connection between the strip and the positive terminal of the power supply; and A stripping cathode is installed in the electroplating bath; the stripping cathode includes: a conductive frame mounted on the inner tank and a stripping plate connected to the conductive frame; the conductive frame is used to realize the electrical connection between the stripping plate and the negative terminal of the power supply; the stripping plate is located in the inner tank and is immersed in the electroplating solution in the inner tank.

2. The stripping device according to claim 1, characterized in that, The inner tank includes: a liquid storage layer and an electroplating working layer that are interconnected, with the electroplating working layer located above the liquid storage layer; the electroplating working layer has openings at both ends for the feeding belt to enter and exit; the stripping plate is located in the electroplating working layer; the liquid storage layer is connected to the mother tank through a liquid supply pump to obtain the electroplating solution and transport it to the electroplating working layer.

3. The stripping device according to claim 1, characterized in that, The outer tank is connected to the mother tank via a reflux pump to return the electroplating solution overflowing from the inner tank to the mother tank.

4. The stripping device according to claim 1, characterized in that, The top of the inner groove is provided with a slot for engaging the conductive frame.

5. The stripping apparatus according to claim 1, characterized in that, The stripping anode includes: a conductive seat located on the outside of the inner tank and two conductive rollers pivotally connected to the conductive seat; the conductive seat is used for electrical connection to the positive terminal of the power supply; a gap is formed between the two conductive rollers for the feed strip to pass through, and each conductive roller is used to contact the surface of the feed strip to play a guiding and conductive role.

6. The stripping apparatus according to claim 1, characterized in that, The deplating plate is detachably connected to the bottom of the conductive frame by screws.

7. The stripping apparatus according to claim 1, characterized in that, The stripped plate is made of stainless steel.

8. The stripping apparatus according to claim 1, characterized in that, The stripped plate is a plate with wavy folds.

Images