Thermal conductive components and electronic devices

Abstract

This application relates to the field of thermal conductive device technology, aiming to solve the technical problem of poor thermal conductivity in some known thermal conductive elements, and to provide thermal conductive components and electronic devices. The thermal conductive component is used to conduct heat from a heat source to a heat sink, and includes a covering and a thermally conductive medium. The covering is disposed between the heat source and the heat sink, and includes a first covering portion, a second covering portion, and an extension portion. The first and second covering portions are spaced apart along a first direction, and the extension portion connects the first and second covering portions. The thermally conductive medium has a solid state and a flowing state; when the thermally conductive medium is in a solid state, the first covering portion, the second covering portion, and the extension portion define a first space, in which the thermally conductive medium is disposed; after being heated, the thermally conductive medium can switch from a solid state to a flowing state, and the extension portion forms a second space to limit leakage of the thermally conductive medium. The beneficial effect of this application is to simultaneously improve thermal conductivity efficiency and ensure thermal conductivity reliability.

Description

Technical Field

[0001] This application relates to the field of thermal conductive device technology, and more specifically, to thermal conductive components and electronic devices. Background Technology

[0002] In some known electronic devices, the heat source components are connected to the heat sink components via heat-conducting components. Some of these heat-conducting components either have low thermal conductivity or are prone to damage, which can even affect the operation of the heat source components. Utility Model Content

[0003] This application provides thermally conductive components and electronic devices to solve the technical problem that some known thermally conductive components are difficult to balance improving thermal conductivity and operational reliability.

[0004] This application provides a heat-conducting component for transferring heat from a heat source to a heat sink. The heat-conducting component includes a covering and a heat-conducting medium. The covering includes a first covering portion, a second covering portion, and an extension portion. The first covering portion and the second covering portion are spaced apart along a first direction. One end of the extension portion along the first direction is connected to the first covering portion, and the other end of the extension portion along the first direction is connected to the second covering portion. The heat-conducting medium has a solid state and a flowing state. When the heat-conducting medium is in the solid state, the first covering portion, the second covering portion, and the extension portion define a first space, and the heat-conducting medium is disposed in the first space. When heated, the heat-conducting medium can switch from the solid state to the flowing state. When the heat-conducting medium in the flowing state is compressed, it can squeeze the extension portion, causing the extension portion to deform outward along a second direction and form a second space. The second space communicates with the first space to limit leakage of the heat-conducting medium.

[0005] According to the thermal conductive assembly of this application, when the thermally conductive medium is in a solid state, it can be stably contained within the first space of the covering member, thereby allowing the thermal conductive assembly to be conveniently placed between the heat source and the heat sink, ensuring ease of assembly. After the heat source operates and generates heat, the thermally conductive medium is heated and switches to a flowing state. When the flowing thermally conductive medium applies pressure to the extension, the deformation of the extension forms a second space that can contain a portion of the flowing thermally conductive medium, preventing leakage or overflow. The liquid formed by the thermally conductive medium is confined within the first and second spaces, ensuring the operational reliability of the thermal conductive assembly. Simultaneously, the contact area between the flowing thermally conductive medium and the heat sink is significantly increased, as is the contact area between the flowing thermally conductive medium and the heat source, thereby improving the thermal conductivity of the thermal conductive assembly.

[0006] Thus, the thermal conductive component of this application can simultaneously improve thermal conductivity and ensure the operational reliability of the thermal conductive component.

[0007] In one possible implementation:

[0008] The extension includes a first extension segment and a second extension segment. One end of the first extension segment is connected to the first covering portion, one end of the second extension segment is connected to the second covering portion, and the other end of the first extension segment is connected to the other end of the second extension segment. The first extension segment has a first surface facing the second extension segment, and the second extension segment has a second surface facing the first extension segment. When the thermally conductive medium is in the solid state, the first surface adheres to the second surface. During the process of the thermally conductive medium switching from the solid state to the flowing state, the thermally conductive medium can squeeze the extension to separate the first surface and the second surface and form the second space.

[0009] In one possible implementation:

[0010] The heat source component has a first contact surface with a heat-generating area, and the heat sink component has a second contact surface; the first covering portion has a first through hole, and the orthographic projection of the first through hole along a first direction onto the first contact surface corresponds to the heat-generating area; and / or, the second covering portion has a second through hole, and the orthographic projection of the second through hole along the first direction onto the first contact surface is located within the edge of the second contact surface; wherein, at least one of the first contact surface and the second contact surface, together with the inner surface of the covering component, forms the first space.

[0011] In one possible implementation:

[0012] The slot is an annular slot, which extends circumferentially along the first through hole.

[0013] In one possible implementation:

[0014] The thickness of the first covering portion is less than or equal to 0.01 mm; and / or, the thickness of the second covering portion is less than or equal to 0.01 mm; and / or, the thickness of the extension portion is less than or equal to 0.01 mm.

[0015] In one possible implementation:

[0016] When the thermally conductive medium is in the solid state, the distance between the first covering part and the second covering part along the first direction is H1; when the thermally conductive medium is in the flowing state, the distance between the first covering part and the second covering part along the first direction is H2; wherein, H1≥H2.

[0017] In one possible implementation:

[0018] The material of the thermally conductive medium is a phase change material; and / or, the material of the covering is a thermally conductive metal.

[0019] This application also provides an electronic device, including a heat source, a heat sink, and the aforementioned thermally conductive component. The thermally conductive component is disposed between the heat source and the heat sink.

[0020] In one possible implementation:

[0021] The orthographic projection of the first space onto the heat source component along the first direction does not extend beyond the edge of the heat source component.

[0022] In one possible implementation:

[0023] The orthographic projection of the extension in the first direction is located between the edge of the orthographic projection of the heat sink along the first direction and the edge of the orthographic projection of the heat source along the first direction. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the internal structure of an electronic device according to an embodiment of this application, wherein the heat-conducting medium is in a solid state.

[0026] Figure 2 This is a schematic diagram of the internal structure of an electronic device according to an embodiment of this application, wherein the heat-conducting medium is in a flowing state.

[0027] Figure 3 This is a three-dimensional structural diagram of a heat-conducting component according to an embodiment of this application.

[0028] Figure 4 for Figure 3 A cross-sectional view at point AA, where the heat-conducting medium is in a solid state.

[0029] Figure 5 This is a schematic diagram of the structure of a heat-conducting component according to an embodiment of this application, wherein the heat-conducting medium is in a flowing state.

[0030] Explanation of key component symbols:

[0031] Thermal conductive component 100

[0032] Covering 10

[0033] First covering part 11

[0034] Second covering part 12

[0035] Extension 13

[0036] First extension section 131

[0037] Second extension section 132

[0038] Thermal medium 20

[0039] Electronic equipment 200

[0040] Heat source component 201

[0041] Heat sink 202

[0042] Clamping part 205

[0043] Elastic element 205a

[0044] Connector 206

[0045] Stud 2061

[0046] Nut 2062

[0047] Circuit board 204

[0048] First contact surface P1

[0049] Second contact surface P2

[0050] First surface P3

[0051] Second surface P4

[0052] First Space Q1

[0053] Second Space Q2

[0054] First through hole K1

[0055] Second through hole K2

[0056] K6 clearance hole

[0057] First direction X

[0058] Second direction Y

[0059] Fever area L1

[0060] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0061] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0062] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. When a component is said to be "set on" another component, it can be directly set on the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0063] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "or / and" as used herein includes any and all combinations of one or more of the associated listed items.

[0064] Some embodiments of this application are described in detail. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0065] See Figure 1 This embodiment provides an electronic device 200. The electronic device 200 can be various network devices or computer devices such as laptops, computers, servers, switches, and base stations. The electronic device 200 includes a circuit board 204, a heat source 201, a heat sink 202, and a heat-conducting assembly 100. The heat source 201 is detachably connected to the circuit board 204. The heat source 201 can be any component that generates heat during operation and requires liquid cooling. For example, the heat source 201 can be any electrical component such as a CPU, power supply chip, processor chip, control chip, various functional chips, circuits, memory modules (memory chips), or a graphics card. The heat-conducting assembly 100 is disposed between the heat source 201 and the heat sink 202. The heat-conducting assembly 100 is used to conduct the heat generated by the heat source 201 to the heat sink 202. The heat sink 202 is used to exchange heat with the external environment or cooling devices to conduct heat. The electronic device 200 may also include a housing (not shown in the figure), and the circuit board 204, heat source 201, heat sink 202 and heat conduction component 100 are all disposed inside the housing.

[0066] In this embodiment, the heat source 201 can be specifically configured as a processor, and the circuit board 204 is a motherboard. The processor is located on the motherboard. The heat sink 202 can include heat sink fins, and the heat sink fins can be equipped with cooling devices such as cooling fans or liquid cooling plates (not shown in the figure).

[0067] In this embodiment, see Figure 1 and Figure 2 The heat source component 201 has a first contact surface P1. The first contact surface P1 has a heat-generating region L1. The heat-generating region L1 corresponds to the main heat-generating structure inside the heat source component 201. When the heat source component 201 is a CPU, the heat-generating region L1 corresponds to the chip portion of the CPU. The heat sink component 202 has a second contact surface P2. The first contact surface P1 and the second contact surface P2 are spaced apart along a first direction X. The first direction X is parallel to the thickness direction of the heat source component 201. The direction perpendicular to or intersecting the first contact surface P1 is defined as the second direction Y.

[0068] See Figures 1 to 3 In this embodiment, the heat-conducting component 100 includes a covering 10 and a heat-conducting medium 20. The covering 10 includes a first covering portion 11, a second covering portion 12, and an extension portion 13. The first covering portion 11 and the second covering portion 12 are spaced apart along a first direction X. One end of the extension portion 13 along the first direction X is connected to the first covering portion 11, and the other end of the extension portion 13 along the first direction X is connected to the second covering portion 12. The heat-conducting medium 20 has both a solid state and a flow state. See also... Figure 1 When the heat-conducting medium 20 is in a solid state, the first covering portion 11, the second covering portion 12, and the extension portion 13 define a first space Q1, and the heat-conducting medium 20 is disposed in the first space Q1. (See also...) Figure 2 When heated, the heat-conducting medium 20 can switch from a solid state to a flowing state. When the heat-conducting medium 20 in the flowing state is compressed, it can squeeze the extension 13 so that the extension 13 deforms outward along the second direction Y and forms a second space Q2. The second space Q2 is connected to the first space Q1 to limit the leakage of the heat-conducting medium 20.

[0069] According to the heat-conducting component 100 of this application, when the heat-conducting medium 20 is in a solid state, the heat-conducting medium 20 can be stably contained in the first space Q1 of the covering member 10, thereby allowing the heat-conducting component 100 to be conveniently placed between the heat source member 201 and the heat sink member 202, thus ensuring the ease of assembly of the heat-conducting component 100. After the heat source member 201 operates and generates heat, the heat-conducting medium 20 is heated and switches to a flowing state. After the flowing heat-conducting medium 20 applies pressure to the extension 13, the second space Q2 formed by the deformation of the extension 13 can be used to contain part of the flowing heat-conducting medium 20, thereby preventing leakage or overflow of the heat-conducting medium 20, and confining the liquid formed by the heat-conducting medium 20 within the first space Q1 and the second space Q2, thereby ensuring the operational reliability of the heat-conducting component 100. At the same time, the contact area between the flowing heat-conducting medium 20 and the heat sink 202 is greatly increased, and the contact area between the flowing heat-conducting medium 20 and the heat source 201 is also greatly increased, thereby improving the heat conduction efficiency of the heat-conducting component 100.

[0070] Thus, the heat-conducting component 100 of this application can simultaneously improve heat conduction efficiency and ensure the operational reliability of the heat-conducting component 100.

[0071] In some embodiments, the heat-conducting medium 20 may specifically be a phase change medium, such as a phase change metal. The phase change metal may be a gallium alloy, a bismuth-lead alloy, or other metals with a low melting point. The flow state may be liquid, gas, or other states.

[0072] In some embodiments, the material of the covering 10 can be a thermally conductive metal, such as copper or aluminum. Specifically, the thermally conductive metal is a metal with a high thermal conductivity. For example, the thermal conductivity of the material of the covering 10 can be set to be higher than a preset value, such as 200 W / m². -1 K -1 The specific value of the preset value can be adjusted according to the actual heat conduction requirements, and is not limited here.

[0073] In some embodiments, see Figure 4 When the thermally conductive medium 20 is in a solid state, the distance between the first covering portion 11 and the second covering portion 12 along the first direction X is H1. (See also...) Figure 5 When the heat-conducting medium 20 is in a flowing state, the distance between the first covering part 11 and the second covering part 12 along the first direction X is H2. Where H1 ≥ H2. This improves heat transfer efficiency.

[0074] Specifically, H2 can be at least the sum of the thickness of the first covering part 11 and the thickness of the second covering part 12, thereby further improving the heat transfer efficiency of the heat-conducting medium 20. For example, when the thickness of the first covering part 11 and the thickness of the second covering part 12 are the same, H2 can be at least twice the thickness of the material of the covering part 10, such as 0.02 mm.

[0075] In some embodiments, see Figure 1 and Figure 2 The electronic device 200 also includes a clamping member 205. One end of the clamping member 205 is connected to the circuit board 204, and the other end is connected to the heat sink 202. The clamping member 205 applies a force close to the circuit board 204 to the heat sink 202, so that the heat sink 202 keeps pushing the heat-conducting component 100 against the heat source component 201. Thus, when the heat-conducting medium 20 switches from a solid state to a flowing state, the force applied by the clamping member 205 to the heat sink 202 can compress the heat-conducting medium 20, thereby reducing the distance between the first covering portion 11 and the second covering portion 12 along the first direction X.

[0076] In other embodiments, the other end of the clamping member 205 may also be connected to the housing (not shown) to reduce the possibility of damage to the circuit board 204.

[0077] Optionally, see Figure 1 and Figure 2 The clamping member 205 can be constructed as an elastic member 205a. The elastic member 205a elastically connects the heat sink 202 and the circuit board 204. The elastic member 205a can apply a relatively gentle elastic force to the heat sink 202, thereby ensuring the protection of the heat sink 202 and the circuit board 204 while clamping the heat-conducting medium 20.

[0078] Optionally, see Figure 1 and Figure 2 The electronic device 200 also includes a connector 206. The connector 206 connects the heat sink 202 to the circuit board 204. The heat sink 202 is movably coupled to the connector 206. For example, the connector 206 passes through the heat sink 202 along a first direction X. An elastic member 205a is sleeved on the connector 206. Thus, the connector 206 can guide the elastic deformation of the elastic member 205a.

[0079] Optionally, the connector 206 can be a bolt. The bolt includes a stud 2061 and a nut 2062. One end of the stud 2061 is connected to the circuit board 204, and the other end of the stud 2061 passes through the heat sink 202. The nut 2062 connects to the stud 2061 and is located on the side of the heat sink 202 away from the circuit board 204. An elastic member 205a is sleeved on the stud 2061 of the bolt. The two ends of the elastic member 205a abut against the nut 2062 of the bolt and the heat sink 202, respectively.

[0080] Optionally, two or more clamping members 205 may be provided. The clamping members 205 are arranged around the edge of the heat sink 202 to ensure a stable clamping force on the heat conduction medium 20, thereby causing a more uniform topographic deformation of the heat conduction medium 20.

[0081] In some embodiments, the surface shape of the first covering portion 11 is contoured to the first contact surface P1. The surface shape of the second covering portion 12 is also contoured to the first contact surface P1. This allows the heat-conducting assembly 100 to be more reasonably adapted to the shape of the first contact surface P1 of the heat source component 201, thereby further improving heat conduction efficiency. For example, the cross-section of the first covering portion 11 is rectangular, and the cross-section of the first through hole K1 is rectangular. The cross-section of the second covering portion 12 is rectangular, and the cross-section of the second through hole K2 is rectangular.

[0082] In some embodiments, see Figure 1 The orthographic projection of the first space Q1 along the first direction X onto the heat source 201 does not exceed the edge of the heat source 201.

[0083] In this way, the main part of the heat-conducting medium 20 can be ensured to be in the first space Q1, and a reliable heat conduction effect can be provided to the heat source component 201.

[0084] In some embodiments, see Figure 1 and Figure 2 The extension 13 is located between the edge of the heat sink 202 along the first direction X and the edge of the heat source 201 along the first direction X when projected onto the first direction X.

[0085] In this way, the extension 13 remains between the edge of the heat source 201 and the edge of the heat dissipation component 202 during the deformation process, which can prevent the extension 13 from being squeezed by the heat source 201 during the deformation process, thereby reducing the risk of breakage of the extension 13 and improving the limiting effect of the extension 13 on the heat exchange medium.

[0086] In some embodiments, see Figure 4 and Figure 5The extension 13 includes a first extension segment 131 and a second extension segment 132. One end of the first extension segment 131 is connected to the first covering portion 11, one end of the second extension segment 132 is connected to the second covering portion 12, and the other end of the first extension segment 131 is connected to the other end of the second extension segment 132. The first extension segment 131 has a first surface P3 facing the second extension segment 132, and the second extension segment 132 has a second surface P4 facing the first extension segment 131. When the thermally conductive medium 20 is in a solid state, the first surface P3 is in contact with the second surface P4. During the process of the thermally conductive medium 20 switching from a solid state to a flowing state, the thermally conductive medium 20 can compress the extension 13 to separate the first surface P3 and the second surface P4 and form a second space Q2.

[0087] Thus, when the heat source 201 is not conducting heat to the heat-conducting component 100, the gap between the first extension 131 and the second extension 132 is extremely small. This allows the solid heat-conducting medium 20 to be positioned after the first space Q1, resulting in minimal excess space within the first space Q1 and significantly reducing the air content. During the process of the heat-conducting medium 20 being heated and transitioning to a flowing state, the volume ratio of the heat-conducting medium 20 to the sum of the volumes of the first space Q1 and the second space Q2 can be maintained close to 100%, thereby avoiding the negative impact of stagnant air in the first space Q1 and the second space Q2 on the heat conduction efficiency of the heat-conducting medium 20 and further ensuring heat conduction efficiency.

[0088] Meanwhile, by additionally providing the first extension segment 131 and the second extension segment 132, the deformation of the extension portion 13 in the thickness direction is minimized. This ensures that the extension portion 13 has sufficient strength to cover the heat-conducting medium 20, thereby further reducing the possibility of the heat-conducting medium 20 overflowing. Furthermore, it facilitates an appropriate reduction in the thickness of the covering component 10, thereby improving thermal conductivity. Thus, both improved thermal conductivity and guaranteed covering effect can be achieved.

[0089] In addition, the construction of the first extension 131 and the second extension 132 facilitates the processing of the extension 13, making the heat conduction component 100 easier to manufacture and easier to assemble with the heat source component 201 and the heat sink component 202.

[0090] In other embodiments, the extension 13 may also be made of an elastic material. In this way, when the flowing heat-conducting medium 20 compresses the extension 13, the extension 13 can be deformed in a direction away from the first space Q1, thereby forming the second space Q2.

[0091] Specifically, the first covering portion 11 and the first extension 131 are integrally formed first components. The second covering portion 12 and the second extension 132 are integrally formed second components. The manufacturing process of the heat-conducting assembly 100 can be such that, when the heat-conducting medium 20 is in a solid state, the first component and the second component are respectively fixed to both sides of the heat-conducting medium 20 by hot pressing, and the edges of the first extension 131 and the second extension 132 are aligned and sealed together. In this way, air bubbles can be avoided between the first extension 131 and the second extension 132, thereby greatly reducing the possibility of air bubbles in the second space Q2 after the heat-conducting medium 20 switches to a flowing state, so as to ensure the reliability of heat conduction.

[0092] In some embodiments, see Figure 4 and Figure 5 The first covering part 11 has a first through hole K1, and the orthographic projection of the first through hole K1 along the first direction X onto the first contact surface P1 corresponds to the heating area L1; and / or, the second covering part 12 has a second through hole K2, and the orthographic projection of the second through hole K2 along the first direction X onto the first contact surface P1 is located within the edge of the second contact surface P2; wherein at least one of the first contact surface P1 and the second contact surface P2 together with the inner surface of the covering part 10 forms a first space Q1.

[0093] In this way, a portion of the heat-conducting medium 20 can be exposed through the first through-hole K1 and / or the second through-hole K2, and directly contact the first contact surface P1 and / or the second contact surface P2, thereby improving the heat conduction efficiency between the heat-conducting medium 20 and the heat source component 201 and / or the heat dissipation component 202. Specifically, after the heat-conducting medium 20 is heated, the flowing heat-conducting medium 20 can flow into the first through-hole K1 and / or the second through-hole K2, and release from the first contact surface P1 and / or the second contact surface P2, thereby improving the heat conduction efficiency of the heat-conducting assembly 100.

[0094] For example, Figure 1 In the embodiment shown, the first covering part 11 has a first through hole K1, and the second covering part 12 has a second through hole K2.

[0095] Optionally, the number of first through holes K1 can be one or more. When there is only one first through hole K1, the orthographic projection of the first through hole K1 along the first direction X onto the first contact surface P1 covers the heating area L1. When there are two or more first through holes K1, a portion of the orthographic projection of the plurality of first through holes K1 along the first direction X onto the first contact surface P1 is located inside the heating area L1.

[0096] In some embodiments, the first space Q1 extends circumferentially along the first through hole K1. This ensures that the extension 13 forms the first space Q1 at all points circumferentially along the first through hole K1, thereby increasing the volume of the first space Q1 and further reducing the risk of leakage of the flowing heat-conducting medium 20, thus further improving the reliability of the heat-conducting assembly 100.

[0097] In other embodiments, the number of first spaces Q1 can also be set to multiple, and the multiple first spaces Q1 are arranged at circumferential intervals along the first through hole K1.

[0098] In some embodiments, the thickness of the first covering portion 11 is less than or equal to 0.01 mm. And / or, the thickness of the second covering portion 12 is less than or equal to 0.01 mm. And / or, the thickness of the extension portion 13 is less than or equal to 0.01 mm.

[0099] In this way, the size of the covering 10 along the first direction X can be further reduced, the heat conduction efficiency of the heat conduction component 100 can be improved, and the heat conduction component 100 can be placed in a narrower environment, thereby improving the applicability of the heat conduction component 100.

[0100] The above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A heat-conducting component for conducting heat from a heat source to a heat sink, characterized in that: The thermally conductive component includes a covering and a thermally conductive medium; The covering is used to be disposed between the heat source and the heat dissipation component. The covering includes a first covering part, a second covering part and an extension part. The first covering part and the second covering part are spaced apart along a first direction. One end of the extension part along the first direction is connected to the first covering part, and the other end of the extension part along the first direction is connected to the second covering part. The heat-conducting medium has both a solid state and a flow state; When the thermally conductive medium is in the solid state, the first covering portion, the second covering portion, and the extension portion define a first space, and the thermally conductive medium is disposed in the first space; When heated, the thermally conductive medium can switch from the solid state to the flowing state. When the thermally conductive medium in the flowing state is compressed, it can squeeze the extension, so that the extension deforms outward in the second direction and forms a second space. The second space is connected to the first space to limit the leakage of the thermally conductive medium.

2. The thermally conductive component according to claim 1, characterized in that: The extension includes a first extension segment and a second extension segment. One end of the first extension segment is connected to the first covering portion, one end of the second extension segment is connected to the second covering portion, and the other end of the first extension segment is connected to the other end of the second extension segment. The first extension segment has a first surface facing the second extension segment, and the second extension segment has a second surface facing the first extension segment. When the thermally conductive medium is in the solid state, the first surface is in contact with the second surface; During the process of the thermally conductive medium switching from the solid state to the flowing state, the thermally conductive medium can squeeze the extension to separate the first surface and the second surface and form the second space.

3. The thermally conductive component according to claim 1, characterized in that: The heat source component has a first contact surface, the first contact surface has a heat-generating area, and the heat dissipation component has a second contact surface; The first covering portion has a first through hole, and the orthographic projection of the first through hole along the first direction onto the first contact surface covers the heating area; and / or, the second covering portion has a second through hole, and the orthographic projection of the second through hole along the first direction onto the first contact surface is located within the edge of the second contact surface; Wherein, at least one of the first contact surface and the second contact surface together with the inner surface of the covering component forms the first space.

4. The thermally conductive component according to claim 3, characterized in that: The first space extends circumferentially along the first through hole.

5. The thermally conductive component according to claim 1, characterized in that: The thickness of the first covering portion is less than or equal to 0.01 mm; And / or, the thickness of the second covering portion is less than or equal to 0.01 mm; And / or, the thickness of the extension is less than or equal to 0.01 mm.

6. The thermally conductive component according to claim 1, characterized in that: When the thermally conductive medium is in the solid state, the distance between the first covering part and the second covering part along the first direction is H1; When the thermally conductive medium is in the flow state, the distance between the first covering part and the second covering part along the first direction is H2; Where H1≥H2.

7. The thermally conductive component according to claim 1, characterized in that: The material of the heat-conducting medium is a phase change material; And / or, the material of the covering is a thermally conductive metal.

8. An electronic device, comprising: include: Heat source components; Heat dissipation components; The thermally conductive component as described in any one of claims 1 to 7, wherein the thermally conductive component is disposed between the heat source component and the heat dissipation component.

9. The electronic device according to claim 8, characterized in that: The orthographic projection of the first space onto the heat source component along the first direction does not extend beyond the edge of the heat source component.

10. The electronic device according to claim 8, characterized in that: The orthographic projection of the extension in the first direction is located between the edge of the orthographic projection of the heat sink along the first direction and the edge of the orthographic projection of the heat source along the first direction.

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